DE602005026033D1 - Wärmeisolations-stanzerstruktur - Google Patents
Wärmeisolations-stanzerstrukturInfo
- Publication number
- DE602005026033D1 DE602005026033D1 DE602005026033T DE602005026033T DE602005026033D1 DE 602005026033 D1 DE602005026033 D1 DE 602005026033D1 DE 602005026033 T DE602005026033 T DE 602005026033T DE 602005026033 T DE602005026033 T DE 602005026033T DE 602005026033 D1 DE602005026033 D1 DE 602005026033D1
- Authority
- DE
- Germany
- Prior art keywords
- stanzerstruktur
- heat insulation
- insulation
- heat
- insulation stanzerstruktur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2632—Stampers; Mountings thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/263—Preparing and using a stamper, e.g. pressing or injection molding substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2632—Stampers; Mountings thereof
- B29C2045/2634—Stampers; Mountings thereof mounting layers between stamper and mould or on the rear surface of the stamper
- B29C2045/2636—Stampers; Mountings thereof mounting layers between stamper and mould or on the rear surface of the stamper insulating layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/81—Sound record
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004306272A JP4554330B2 (ja) | 2004-10-21 | 2004-10-21 | 高耐久性を有する断熱スタンパ構造 |
PCT/JP2005/019642 WO2006043708A1 (en) | 2004-10-21 | 2005-10-19 | Heat insulating stamper structure |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005026033D1 true DE602005026033D1 (de) | 2011-03-03 |
Family
ID=36203115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005026033T Active DE602005026033D1 (de) | 2004-10-21 | 2005-10-19 | Wärmeisolations-stanzerstruktur |
Country Status (8)
Country | Link |
---|---|
US (1) | US7704066B2 (de) |
EP (1) | EP1800305B1 (de) |
JP (1) | JP4554330B2 (de) |
KR (1) | KR100763327B1 (de) |
CN (1) | CN1910676B (de) |
DE (1) | DE602005026033D1 (de) |
TW (1) | TWI334601B (de) |
WO (1) | WO2006043708A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4887041B2 (ja) * | 2005-12-28 | 2012-02-29 | 株式会社リコー | 高耐久性を有する断熱金型 |
WO2007123210A1 (ja) | 2006-04-20 | 2007-11-01 | Sumitomo Heavy Industries, Ltd. | 樹脂成形装置及び樹脂成形方法 |
JP4717699B2 (ja) * | 2006-04-21 | 2011-07-06 | 三菱化学メディア株式会社 | ディスク成形金型、鏡面盤及び鏡面盤の製造方法 |
WO2008053720A1 (fr) * | 2006-10-31 | 2008-05-08 | Konica Minolta Opto, Inc. | Gabarit et microréacteur |
JP4750681B2 (ja) * | 2006-12-07 | 2011-08-17 | 住友重機械工業株式会社 | 断熱金型、金型部品、成形機及び断熱金型の製造方法 |
JP2008251075A (ja) * | 2007-03-29 | 2008-10-16 | Fujifilm Corp | 光情報記録媒体用スタンパおよび磁気転写用マスター、ならびにこれらの製造方法 |
JP2008251076A (ja) * | 2007-03-29 | 2008-10-16 | Fujifilm Corp | 光情報記録媒体用スタンパおよび磁気転写用マスター、ならびにこれらの製造方法 |
JP5211597B2 (ja) * | 2007-09-13 | 2013-06-12 | 株式会社リコー | 断熱構造を有するスタンパの製造方法 |
KR101537619B1 (ko) * | 2009-09-09 | 2015-07-17 | 엘지전자 주식회사 | 사출금형용 스탬퍼 제작방법 |
CN102770254B (zh) * | 2010-02-24 | 2014-12-03 | 夏普株式会社 | 模具和模具的制造方法以及防反射膜的制造方法 |
TWI454370B (zh) * | 2011-11-04 | 2014-10-01 | Advanced Int Multitech Co Ltd | Production method of plate - like fiber reinforced product |
US9149958B2 (en) * | 2011-11-14 | 2015-10-06 | Massachusetts Institute Of Technology | Stamp for microcontact printing |
Family Cites Families (61)
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US3779684A (en) * | 1965-11-10 | 1973-12-18 | Dunlop Holdings Ltd | Continuous curing apparatus |
US3593376A (en) * | 1968-04-04 | 1971-07-20 | Clement Co J W | Apparatus for making multiple-image electrotype molds |
US3649144A (en) * | 1970-10-26 | 1972-03-14 | Louis William Breck Jr | Device for forming belt loop blanks |
US3925597A (en) * | 1974-05-09 | 1975-12-09 | Gen Electric | Electrical conductors with strippable insulation and method of making the same |
NL7415442A (nl) * | 1974-11-27 | 1976-05-31 | Philips Nv | Persinrichting voor het vervaardigen van kunst- stofvoorwerpen, in het bijzonder grammofoon- en beeldplaten. |
US4854845A (en) * | 1983-02-28 | 1989-08-08 | Elf Isolation | Apparatus for embossing sections of a cladding element for outer facades |
CH661683A5 (de) * | 1983-09-19 | 1987-08-14 | Landis & Gyr Ag | Einrichtung zum praegen von reliefmustern hoher aufloesung. |
US4784893A (en) * | 1986-02-17 | 1988-11-15 | Mitsubishi Denki Kabushiki Kaisha | Heat conductive circuit board and method for manufacturing the same |
CH675097A5 (de) * | 1988-03-28 | 1990-08-31 | De La Rue Giori Sa | |
US5206762A (en) * | 1988-12-01 | 1993-04-27 | Kabushiki Kaisha Toshiba | Viscoelastic substance and objective lens driving apparatus with the same |
JP2906282B2 (ja) * | 1990-09-20 | 1999-06-14 | 富士通株式会社 | ガラスセラミック・グリーンシートと多層基板、及び、その製造方法 |
US5368789A (en) * | 1990-09-28 | 1994-11-29 | Canon Kabushiki Kaisha | Method for forming substrate sheet for optical recording medium |
JP2673623B2 (ja) * | 1991-10-01 | 1997-11-05 | 旭化成工業株式会社 | 合成樹脂の成形法 |
US5202206A (en) * | 1991-10-04 | 1993-04-13 | Xerox Corporation | Process for simultaneous printing of fixed data and variable data |
JPH05200757A (ja) * | 1992-01-30 | 1993-08-10 | Canon Inc | フレキシブルスタンパー、ロール状スタンパー、および光情報記録媒体用基板の製造方法 |
DE4219667C2 (de) * | 1992-06-16 | 1994-12-01 | Kernforschungsz Karlsruhe | Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht |
US6276656B1 (en) * | 1992-07-14 | 2001-08-21 | Thermal Wave Molding Corp. | Mold for optimizing cooling time to form molded article |
CA2137347A1 (en) * | 1992-08-11 | 1994-03-03 | Per Just Andersen | Hydraulically settable containers |
JP3178126B2 (ja) * | 1992-10-30 | 2001-06-18 | 三菱重工業株式会社 | 金属断熱層の形成方法 |
JP3450027B2 (ja) * | 1993-05-07 | 2003-09-22 | 株式会社神戸製鋼所 | タイヤ加硫機における型交換台車 |
TW277152B (de) * | 1994-05-10 | 1996-06-01 | Hitachi Chemical Co Ltd | |
JP3656680B2 (ja) * | 1995-09-21 | 2005-06-08 | 株式会社リコー | 可逆性感熱発色組成物、およびそれを用いた可逆性記録媒体 |
GB9601289D0 (en) * | 1996-01-23 | 1996-03-27 | Nimbus Manufacturing Uk Limite | Manufacture of optical data storage disc |
DE19648844C1 (de) * | 1996-11-26 | 1997-09-18 | Jenoptik Jena Gmbh | Einrichtung und Verfahren zur Abformung mikrosystemtechnischer Strukturen |
JP3378162B2 (ja) * | 1997-01-21 | 2003-02-17 | シャープ株式会社 | 画像形成装置および誘電体シートの製造方法 |
TW474866B (en) * | 1997-03-31 | 2002-02-01 | Kuraray Co | Process for producing resin molded article and mold used in the process |
JP3780060B2 (ja) * | 1997-04-11 | 2006-05-31 | ウシオ電機株式会社 | 傾斜機能材料、ランプ用封止部材およびその製造方法 |
JPH1148291A (ja) * | 1997-08-04 | 1999-02-23 | Sony Corp | ディスク成形装置 |
US6068722A (en) * | 1998-01-08 | 2000-05-30 | Xerox Corporation | Seam stress release in flexible electrostatographic imaging belts |
US6635979B1 (en) * | 1998-02-09 | 2003-10-21 | Matsushita Electric Industrial Co., Ltd. | Electron emitting device, method of producing the same, and method of driving the same; and image display comprising the electron emitting device and method of producing the same |
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US6314879B1 (en) * | 1999-05-12 | 2001-11-13 | Hurletron Incorporated | Flexographic printing apparatus |
US6328922B1 (en) * | 1999-10-28 | 2001-12-11 | Xerox Corporation | Process for post treatment of a flexible imaging member belt |
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US6613715B2 (en) * | 1999-12-17 | 2003-09-02 | Ricoh Company, Ltd. | Method of using reversible thermosensitive recording medium and the reversible thermosensitive recording medium |
JP2001236698A (ja) | 2000-02-23 | 2001-08-31 | Ricoh Co Ltd | 断熱スタンパの製造方法及び製造装置 |
JP2001273685A (ja) | 2000-03-28 | 2001-10-05 | Ricoh Co Ltd | 光ディスク基板成形用スタンパの製造装置及び製造方法 |
JP3871494B2 (ja) | 2000-04-14 | 2007-01-24 | 株式会社リコー | スタンパの作成方法 |
JP3901437B2 (ja) | 2000-09-07 | 2007-04-04 | 株式会社リコー | 樹脂成形用断熱スタンパーおよびその製造方法 |
JP2002184046A (ja) * | 2000-10-02 | 2002-06-28 | Ricoh Co Ltd | 光ディスク基板成形用スタンパ及びその製造方法 |
JP3883375B2 (ja) | 2000-10-06 | 2007-02-21 | 株式会社リコー | 断熱スタンパ製造方法、断熱スタンパ、断熱スタンパ製造装置 |
JP3880032B2 (ja) * | 2000-11-10 | 2007-02-14 | 株式会社リコー | 光ディスク基板成形用スタンパの製造方法 |
JP2002150626A (ja) * | 2000-11-13 | 2002-05-24 | Mitsubishi Chemicals Corp | スタンパ及び情報記録媒体の製造方法 |
JP4125889B2 (ja) * | 2000-12-04 | 2008-07-30 | 日本板硝子株式会社 | 光学素子、成形型及びそれらの製造方法 |
US6422528B1 (en) * | 2001-01-17 | 2002-07-23 | Sandia National Laboratories | Sacrificial plastic mold with electroplatable base |
JP4717265B2 (ja) * | 2001-06-08 | 2011-07-06 | 三星モバイルディスプレイ株式會社 | 有機el装置及びその製造方法 |
US6787071B2 (en) * | 2001-06-11 | 2004-09-07 | General Electric Company | Method and apparatus for producing data storage media |
US20030006535A1 (en) * | 2001-06-26 | 2003-01-09 | Michael Hennessey | Method and apparatus for forming microstructures on polymeric substrates |
US7135734B2 (en) * | 2001-08-30 | 2006-11-14 | Micron Technology, Inc. | Graded composition metal oxide tunnel barrier interpoly insulators |
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KR100491144B1 (ko) * | 2001-12-26 | 2005-05-24 | 삼성에스디아이 주식회사 | 평판표시장치 및 그의 제조방법 |
JP4220963B2 (ja) * | 2002-05-31 | 2009-02-04 | ピレリ・タイヤ・ソチエタ・ペル・アツィオーニ | タイヤの製造方法およびかかる方法を実行するためのトロイダル支持体 |
KR100496287B1 (ko) * | 2002-08-03 | 2005-06-20 | 삼성에스디아이 주식회사 | 실리콘 박막의 결정화 방법, 이를 이용한 박막 트랜지스터및 상기 박막 트랜지스터를 구비한 평판 디스플레이 소자 |
JP2005005245A (ja) * | 2002-11-08 | 2005-01-06 | Fuji Photo Film Co Ltd | 転写素材の転写方法、形状転写方法及び転写装置 |
WO2004078446A1 (ja) * | 2003-03-03 | 2004-09-16 | Matsushita Electric Industrial Co. Ltd. | ディスク基板成形用金型およびディスク基板の製造方法 |
JP2005019393A (ja) * | 2003-06-05 | 2005-01-20 | Sharp Corp | 異方性導電物、表示装置、表示装置の製造方法および導電部材 |
ITTO20030473A1 (it) * | 2003-06-23 | 2004-12-24 | Infm Istituto Naz Per La Fisi Ca Della Mater | Procedimento litografico di nanoimpressione che prevede l'utilizzo di uno stampo presentante una regione atta a |
JP4059183B2 (ja) * | 2003-10-07 | 2008-03-12 | ソニー株式会社 | 絶縁体薄膜の製造方法 |
JP4016278B2 (ja) * | 2003-12-25 | 2007-12-05 | セイコーエプソン株式会社 | 成形型および成形品の製造方法 |
-
2004
- 2004-10-21 JP JP2004306272A patent/JP4554330B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-19 CN CN2005800020502A patent/CN1910676B/zh not_active Expired - Fee Related
- 2005-10-19 WO PCT/JP2005/019642 patent/WO2006043708A1/en active Application Filing
- 2005-10-19 KR KR1020067012232A patent/KR100763327B1/ko not_active IP Right Cessation
- 2005-10-19 EP EP05798992A patent/EP1800305B1/de not_active Not-in-force
- 2005-10-19 US US10/582,018 patent/US7704066B2/en not_active Expired - Fee Related
- 2005-10-19 DE DE602005026033T patent/DE602005026033D1/de active Active
- 2005-10-21 TW TW094136914A patent/TWI334601B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1800305B1 (de) | 2011-01-19 |
KR20060103267A (ko) | 2006-09-28 |
US20070126136A1 (en) | 2007-06-07 |
EP1800305A4 (de) | 2009-01-14 |
US7704066B2 (en) | 2010-04-27 |
JP2006120230A (ja) | 2006-05-11 |
TWI334601B (en) | 2010-12-11 |
CN1910676A (zh) | 2007-02-07 |
KR100763327B1 (ko) | 2007-10-05 |
CN1910676B (zh) | 2011-06-15 |
WO2006043708A1 (en) | 2006-04-27 |
EP1800305A1 (de) | 2007-06-27 |
JP4554330B2 (ja) | 2010-09-29 |
TW200629268A (en) | 2006-08-16 |
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