DE60123706D1 - Leiterplattenherstellung und entsprechende herstellungsvorrichtung - Google Patents

Leiterplattenherstellung und entsprechende herstellungsvorrichtung

Info

Publication number: DE60123706D1
Authority: DE; Germany
Prior art keywords: manufacturing; pcb plate; manufacturing device; plate manufacturing; corresponding manufacturing
Prior art date: 2000-01-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60123706T

Other languages

English (en)

Other versions

DE60123706T2 (de

Inventor

Kazutomo Higa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-01-11

Filing date

2001-01-11

Publication date

2006-11-23

2000-01-11 Priority claimed from JP2000002193A external-priority patent/JP3649071B2/ja

2000-01-11 Priority claimed from JP2000002192A external-priority patent/JP3630054B2/ja

2000-01-11 Priority claimed from JP2000002191A external-priority patent/JP3661536B2/ja

2000-01-11 Priority claimed from JP2000002189A external-priority patent/JP2001196723A/ja

2000-01-11 Priority claimed from JP2000002190A external-priority patent/JP2001190995A/ja

2001-01-11 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

2006-11-23 Application granted granted Critical

2006-11-23 Publication of DE60123706D1 publication Critical patent/DE60123706D1/de

2007-01-25 Publication of DE60123706T2 publication Critical patent/DE60123706T2/de

2021-01-12 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
ing And Chemical Polishing (AREA)
Spray Control Apparatus (AREA)

DE60123706T 2000-01-11 2001-01-11 Leiterplattenherstellung und entsprechende herstellungsvorrichtung Expired - Lifetime DE60123706T2 (de)

Applications Claiming Priority (11)

Application Number	Priority Date	Filing Date	Title
JP2000002192		2000-01-11
JP2000002190		2000-01-11
JP2000002193A JP3649071B2 (ja)	2000-01-11	2000-01-11	プリント配線板の製造装置およびそれを用いたプリント配線板の製造方法
JP2000002191		2000-01-11
JP2000002192A JP3630054B2 (ja)	2000-01-11	2000-01-11	プリント配線板の製造装置およびそれを用いたプリント配線板の製造方法
JP2000002191A JP3661536B2 (ja)	2000-01-11	2000-01-11	プリント配線板の製造装置およびそれを用いたプリント配線板の製造方法
JP2000002189A JP2001196723A (ja)	2000-01-11	2000-01-11	プリント配線板の製造装置
JP2000002190A JP2001190995A (ja)	2000-01-11	2000-01-11	プリント配線板の製造装置およびそれを用いたプリント配線板の製造方法
JP2000002189		2000-01-11
JP2000002193		2000-01-11
PCT/JP2001/000085 WO2001052610A1 (fr)	2000-01-11	2001-01-11	Dispositif de fabrication pour plaquette de circuit imprime et plaquette de circuit imprime ainsi obtenu

Publications (2)

Publication Number	Publication Date
DE60123706D1 true DE60123706D1 (de)	2006-11-23
DE60123706T2 DE60123706T2 (de)	2007-01-25

Family

ID=27531373

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60123706T Expired - Lifetime DE60123706T2 (de)	2000-01-11	2001-01-11	Leiterplattenherstellung und entsprechende herstellungsvorrichtung

Country Status (6)

Country	Link
US (1)	US6918989B2 (de)
EP (1)	EP1168899B1 (de)
CN (1)	CN100387104C (de)
DE (1)	DE60123706T2 (de)
TW (1)	TW579664B (de)
WO (1)	WO2001052610A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101364889B1 (ko)	2003-04-10	2014-02-19	가부시키가이샤 니콘	액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
EP1611486B1 (de)	2003-04-10	2016-03-16	Nikon Corporation	Umweltsystem mit einer transportregion für eine immersionslithographievorrichtung
TW201816844A (zh)	2004-03-25	2018-05-01	日商尼康股份有限公司	曝光裝置、曝光方法、及元件製造方法
CN101113523B (zh)	2006-07-28	2010-10-06	富葵精密组件(深圳)有限公司	蚀刻液喷射装置及蚀刻方法
KR100782486B1 (ko) *	2006-08-21	2007-12-05	삼성전자주식회사	세정물질 분사유니트 및 이를 갖는 웨이퍼 세정장치
US8557328B2 (en) *	2009-10-02	2013-10-15	Ppg Industries Ohio, Inc.	Non-orthogonal coater geometry for improved coatings on a substrate
CN102256447B (zh) *	2010-05-20	2013-08-07	富葵精密组件(深圳)有限公司	蚀刻装置及蚀刻电路板的方法
CN102447162B (zh) *	2010-09-30	2014-08-27	汉王科技股份有限公司	电磁式触控板的天线板及其制作工艺
JP5902896B2 (ja) *	2011-07-08	2016-04-13	東京エレクトロン株式会社	基板処理装置
CN102887001A (zh) *	2012-11-12	2013-01-23	江苏汉印机电科技发展有限公司	一种印制电路版的喷印方法及印刷机
JP2015017315A (ja) *	2013-07-15	2015-01-29	イビデン株式会社	表面処理装置および表面処理基板の製造方法
CN104144575A (zh) *	2014-08-21	2014-11-12	江苏迪飞达电子有限公司	Pcb板蚀刻机
CN105714296B (zh) *	2014-12-03	2018-06-05	北大方正集团有限公司	蚀刻介质的流量调节装置和蚀刻介质的流量调节方法
CN104888996B (zh) *	2015-06-29	2017-08-11	深圳市华星光电技术有限公司	喷淋组件以及具有该喷淋组件的湿刻设备
CN105208781B (zh) *	2015-08-10	2018-07-06	江门崇达电路技术有限公司	一种厚铜板的外层蚀刻方法
CN111174362A (zh) *	2020-03-02	2020-05-19	郑州科技学院	一种纺织空调喷淋***及其恒压变流量控制方法
CN111508874A (zh) *	2020-04-27	2020-08-07	南昌欧菲显示科技有限公司	喷管安装组件及蚀刻装置
CN116528488B (zh) *	2023-05-30	2023-09-22	威海壹言自动化科技有限公司	一种线路板加工设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1309175A (en) *	1969-11-01	1973-03-07	Tokico Ltd	Fixed quantity liquid supplying apparatus
JPS5141638A (en) *	1974-10-05	1976-04-08	Kobe Steel Ltd	Renzokugaimensanaraihoho
JP2670835B2 (ja) *	1989-02-10	1997-10-29	日本シイエムケイ株式会社	微細パターン形成用エッチング方法とエッチング装置
JPH03277784A (ja) *	1990-03-26	1991-12-09	Dainippon Printing Co Ltd	エッチング装置
JP2573396B2 (ja) *	1990-06-15	1997-01-22	松下電工株式会社	エッチング並びに現像方法
JPH0575236A (ja) *	1991-09-13	1993-03-26	Matsushita Electric Works Ltd	金属張り積層板のエツチング装置
US5228949A (en) *	1991-11-07	1993-07-20	Chemcut Corporation	Method and apparatus for controlled spray etching
JP3108750B2 (ja) *	1992-04-09	2000-11-13	日本テック株式会社	基板のエッチング装置
JPH0722724B2 (ja) *	1992-05-11	1995-03-15	東京化工機株式会社	スプレー装置
US5378308A (en) *	1992-11-09	1995-01-03	Bmc Industries, Inc.	Etchant distribution apparatus
JPH07231155A (ja) *	1994-02-16	1995-08-29	Fujitsu Ltd	プリント配線板のエッチング装置及びエッチング方法
JPH08293660A (ja) *	1995-04-25	1996-11-05	Yoshisato Tsubaki	基板のエッチング装置、および、基板のエッチング処理方法
CA2211005C (en) *	1995-11-28	2006-11-21	Richard Kreiselmaier	Device for internal coating of pipes
JPH1018058A (ja) *	1996-07-05	1998-01-20	Sumitomo Metal Ind Ltd	フォトエッチング加工装置におけるエッチング液流量制御方法
CA2233837C (en) *	1997-04-03	2002-02-26	Ready Welder Co.	Speed control device for dc motors
JPH11279775A (ja) *	1998-03-27	1999-10-12	Hitachi Chem Co Ltd	エッチング方法及びエッチング装置
US6270620B1 (en) *	1999-09-14	2001-08-07	World Wiser Electronics Inc.	Etching device

2001
- 2001-01-10 TW TW090100564A patent/TW579664B/zh not_active IP Right Cessation
- 2001-01-11 US US09/936,324 patent/US6918989B2/en not_active Expired - Fee Related
- 2001-01-11 DE DE60123706T patent/DE60123706T2/de not_active Expired - Lifetime
- 2001-01-11 WO PCT/JP2001/000085 patent/WO2001052610A1/ja active IP Right Grant
- 2001-01-11 EP EP01900662A patent/EP1168899B1/de not_active Expired - Lifetime
- 2001-01-11 CN CNB018000452A patent/CN100387104C/zh not_active Expired - Fee Related

Also Published As

Publication number	Publication date
US20020157792A1 (en)	2002-10-31
EP1168899A1 (de)	2002-01-02
EP1168899B1 (de)	2006-10-11
EP1168899A4 (de)	2004-12-08
TW579664B (en)	2004-03-11
DE60123706T2 (de)	2007-01-25
WO2001052610A1 (fr)	2001-07-19
US6918989B2 (en)	2005-07-19
CN1358406A (zh)	2002-07-10
CN100387104C (zh)	2008-05-07

Legal Events

Date	Code	Title	Description
2007-10-31	8364	No opposition during term of opposition
2009-05-07	8327	Change in the person/name/address of the patent owner	Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

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