DE3886329D1 - Halbleiteranordnung mit Luftbrücken-Verbindungen. - Google Patents
Halbleiteranordnung mit Luftbrücken-Verbindungen.Info
- Publication number
- DE3886329D1 DE3886329D1 DE88114947T DE3886329T DE3886329D1 DE 3886329 D1 DE3886329 D1 DE 3886329D1 DE 88114947 T DE88114947 T DE 88114947T DE 3886329 T DE3886329 T DE 3886329T DE 3886329 D1 DE3886329 D1 DE 3886329D1
- Authority
- DE
- Germany
- Prior art keywords
- airlift
- connections
- semiconductor device
- semiconductor
- airlift connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5221—Crossover interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240017A JPS6481343A (en) | 1987-09-24 | 1987-09-24 | Manufacture of integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3886329D1 true DE3886329D1 (de) | 1994-01-27 |
DE3886329T2 DE3886329T2 (de) | 1994-06-30 |
Family
ID=17053224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3886329T Expired - Fee Related DE3886329T2 (de) | 1987-09-24 | 1988-09-13 | Halbleiteranordnung mit Luftbrücken-Verbindungen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4916520A (de) |
EP (1) | EP0309805B1 (de) |
JP (1) | JPS6481343A (de) |
DE (1) | DE3886329T2 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5216490A (en) * | 1988-01-13 | 1993-06-01 | Charles Stark Draper Laboratory, Inc. | Bridge electrodes for microelectromechanical devices |
JP2856778B2 (ja) * | 1989-09-07 | 1999-02-10 | 株式会社東芝 | 半導体装置の配線構造 |
FR2653595B1 (fr) * | 1989-10-25 | 1992-02-14 | Valtronic France | Circuit electronique a grille d'interconnexion. |
US5144184A (en) * | 1990-01-26 | 1992-09-01 | The Charles Stark Draper Laboratory, Inc. | Micromechanical device with a trimmable resonant frequency structure and method of trimming same |
US5126812A (en) * | 1990-02-14 | 1992-06-30 | The Charles Stark Draper Laboratory, Inc. | Monolithic micromechanical accelerometer |
US5473945A (en) * | 1990-02-14 | 1995-12-12 | The Charles Stark Draper Laboratory, Inc. | Micromechanical angular accelerometer with auxiliary linear accelerometer |
JP3031966B2 (ja) * | 1990-07-02 | 2000-04-10 | 株式会社東芝 | 集積回路装置 |
US5605598A (en) * | 1990-10-17 | 1997-02-25 | The Charles Stark Draper Laboratory Inc. | Monolithic micromechanical vibrating beam accelerometer with trimmable resonant frequency |
US5408119A (en) * | 1990-10-17 | 1995-04-18 | The Charles Stark Draper Laboratory, Inc. | Monolithic micromechanical vibrating string accelerometer with trimmable resonant frequency |
JPH04268750A (ja) * | 1991-02-25 | 1992-09-24 | Toshiba Corp | 半導体集積回路 |
US5129983A (en) * | 1991-02-25 | 1992-07-14 | The Charles Stark Draper Laboratory, Inc. | Method of fabrication of large area micromechanical devices |
US5203208A (en) * | 1991-04-29 | 1993-04-20 | The Charles Stark Draper Laboratory | Symmetrical micromechanical gyroscope |
US5331852A (en) * | 1991-09-11 | 1994-07-26 | The Charles Stark Draper Laboratory, Inc. | Electromagnetic rebalanced micromechanical transducer |
US5635639A (en) * | 1991-09-11 | 1997-06-03 | The Charles Stark Draper Laboratory, Inc. | Micromechanical tuning fork angular rate sensor |
US5408877A (en) * | 1992-03-16 | 1995-04-25 | The Charles Stark Draper Laboratory, Inc. | Micromechanical gyroscopic transducer with improved drive and sense capabilities |
US5767405A (en) * | 1992-04-07 | 1998-06-16 | The Charles Stark Draper Laboratory, Inc. | Comb-drive micromechanical tuning fork gyroscope with piezoelectric readout |
US5349855A (en) * | 1992-04-07 | 1994-09-27 | The Charles Stark Draper Laboratory, Inc. | Comb drive micromechanical tuning fork gyro |
US5650568A (en) * | 1993-02-10 | 1997-07-22 | The Charles Stark Draper Laboratory, Inc. | Gimballed vibrating wheel gyroscope having strain relief features |
JP3267049B2 (ja) * | 1994-05-25 | 2002-03-18 | 株式会社村田製作所 | エアブリッジ配線を有するスパイラルインダクタの製造方法 |
US5461003A (en) * | 1994-05-27 | 1995-10-24 | Texas Instruments Incorporated | Multilevel interconnect structure with air gaps formed between metal leads |
US5581035A (en) * | 1994-08-29 | 1996-12-03 | The Charles Stark Draper Laboratory, Inc. | Micromechanical sensor with a guard band electrode |
US5646348A (en) * | 1994-08-29 | 1997-07-08 | The Charles Stark Draper Laboratory, Inc. | Micromechanical sensor with a guard band electrode and fabrication technique therefor |
US5725729A (en) * | 1994-09-26 | 1998-03-10 | The Charles Stark Draper Laboratory, Inc. | Process for micromechanical fabrication |
JP3359780B2 (ja) * | 1995-04-12 | 2002-12-24 | 三菱電機株式会社 | 配線装置 |
US5817942A (en) * | 1996-02-28 | 1998-10-06 | The Charles Stark Draper Laboratory, Inc. | Capacitive in-plane accelerometer |
US5892153A (en) * | 1996-11-21 | 1999-04-06 | The Charles Stark Draper Laboratory, Inc. | Guard bands which control out-of-plane sensitivities in tuning fork gyroscopes and other sensors |
US5911156A (en) * | 1997-02-24 | 1999-06-08 | The Charles Stark Draper Laboratory, Inc. | Split electrode to minimize charge transients, motor amplitude mismatch errors, and sensitivity to vertical translation in tuning fork gyros and other devices |
US5783973A (en) * | 1997-02-24 | 1998-07-21 | The Charles Stark Draper Laboratory, Inc. | Temperature insensitive silicon oscillator and precision voltage reference formed therefrom |
US5952574A (en) * | 1997-04-29 | 1999-09-14 | The Charles Stark Draper Laboratory, Inc. | Trenches to reduce charging effects and to control out-of-plane sensitivities in tuning fork gyroscopes and other sensors |
US6798064B1 (en) | 2000-07-12 | 2004-09-28 | Motorola, Inc. | Electronic component and method of manufacture |
TW577152B (en) * | 2000-12-18 | 2004-02-21 | Hitachi Ltd | Semiconductor integrated circuit device |
WO2003083492A1 (en) * | 2002-03-26 | 2003-10-09 | The Charles Stark Draper Laboratory, Inc. | Microelectromechanical sensors having reduced signal bias errors and methods of manufacturing the same |
US6812810B2 (en) * | 2002-06-19 | 2004-11-02 | Intel Corporation | Bridges for microelectromechanical structures |
US8187902B2 (en) * | 2008-07-09 | 2012-05-29 | The Charles Stark Draper Laboratory, Inc. | High performance sensors and methods for forming the same |
US8796904B2 (en) | 2011-10-31 | 2014-08-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer |
US9243316B2 (en) | 2010-01-22 | 2016-01-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of fabricating piezoelectric material with selected c-axis orientation |
US8962443B2 (en) * | 2011-01-31 | 2015-02-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Semiconductor device having an airbridge and method of fabricating the same |
US9490771B2 (en) | 2012-10-29 | 2016-11-08 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator comprising collar and frame |
US9401692B2 (en) | 2012-10-29 | 2016-07-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator having collar structure |
US9490418B2 (en) | 2011-03-29 | 2016-11-08 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator comprising collar and acoustic reflector with temperature compensating layer |
US9385684B2 (en) | 2012-10-23 | 2016-07-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator having guard ring |
US10132712B1 (en) | 2016-09-14 | 2018-11-20 | Northrop Grumman Systems Corporation | Micro hermetic sensor |
CN116495697B (zh) * | 2023-06-26 | 2023-09-08 | 南京睿芯峰电子科技有限公司 | 含空气桥芯片的sip塑封件及其制作方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3681134A (en) * | 1968-05-31 | 1972-08-01 | Westinghouse Electric Corp | Microelectronic conductor configurations and methods of making the same |
NL7608901A (nl) * | 1976-08-11 | 1978-02-14 | Philips Nv | Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze. |
JPS6080264A (ja) * | 1983-10-07 | 1985-05-08 | Toshiba Corp | 半導体装置 |
IT1184723B (it) * | 1985-01-28 | 1987-10-28 | Telettra Lab Telefon | Transistore mesfet con strato d'aria tra le connessioni dell'elettrodo di gate al supporto e relativo procedimento difabbricazione |
-
1987
- 1987-09-24 JP JP62240017A patent/JPS6481343A/ja active Pending
-
1988
- 1988-09-13 US US07/243,974 patent/US4916520A/en not_active Expired - Lifetime
- 1988-09-13 DE DE3886329T patent/DE3886329T2/de not_active Expired - Fee Related
- 1988-09-13 EP EP88114947A patent/EP0309805B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4916520A (en) | 1990-04-10 |
JPS6481343A (en) | 1989-03-27 |
DE3886329T2 (de) | 1994-06-30 |
EP0309805B1 (de) | 1993-12-15 |
EP0309805A1 (de) | 1989-04-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |