DE3889563D1 - Halbleiteranordnung mit Schmelzsicherung. - Google Patents
Halbleiteranordnung mit Schmelzsicherung.Info
- Publication number
- DE3889563D1 DE3889563D1 DE3889563T DE3889563T DE3889563D1 DE 3889563 D1 DE3889563 D1 DE 3889563D1 DE 3889563 T DE3889563 T DE 3889563T DE 3889563 T DE3889563 T DE 3889563T DE 3889563 D1 DE3889563 D1 DE 3889563D1
- Authority
- DE
- Germany
- Prior art keywords
- fuse
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
- H01H2085/0283—Structural association with a semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fuses (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62054098A JP2593471B2 (ja) | 1987-03-11 | 1987-03-11 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3889563D1 true DE3889563D1 (de) | 1994-06-23 |
DE3889563T2 DE3889563T2 (de) | 1994-09-29 |
Family
ID=12961144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3889563T Expired - Fee Related DE3889563T2 (de) | 1987-03-11 | 1988-03-09 | Halbleiteranordnung mit Schmelzsicherung. |
Country Status (4)
Country | Link |
---|---|
US (2) | US4943842A (de) |
EP (1) | EP0282025B1 (de) |
JP (1) | JP2593471B2 (de) |
DE (1) | DE3889563T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0627959Y2 (ja) * | 1988-10-20 | 1994-07-27 | ローム株式会社 | ダイオード |
JPH0864750A (ja) * | 1994-08-23 | 1996-03-08 | Toshiba Corp | 半導体装置 |
JP3754197B2 (ja) * | 1997-12-22 | 2006-03-08 | 三洋電機株式会社 | 混成集積回路装置 |
DE19805785C1 (de) * | 1998-02-12 | 1999-06-17 | Siemens Ag | Leistungshalbleiter-Modul mit thermischer Laststromsicherung |
US6242789B1 (en) * | 1999-02-23 | 2001-06-05 | Infineon Technologies North America Corp. | Vertical fuse and method of fabrication |
US6252292B1 (en) * | 1999-06-09 | 2001-06-26 | International Business Machines Corporation | Vertical electrical cavity-fuse |
US6166421A (en) * | 1999-08-18 | 2000-12-26 | National Semiconductor Corporation | Polysilicon fuse that provides an open current path when programmed without exposing the fuse to the environment |
DE10005183A1 (de) * | 2000-02-05 | 2001-08-09 | Bosch Gmbh Robert | Gleichrichteranordnung |
DE10007209A1 (de) | 2000-02-17 | 2001-09-06 | Bosch Gmbh Robert | Halbleiter-Leistungsbauelement mit Schmelzsicherung |
US6507264B1 (en) | 2000-08-28 | 2003-01-14 | Littelfuse, Inc. | Integral fuse for use in semiconductor packages |
DE10065301A1 (de) * | 2000-12-29 | 2002-07-04 | Bosch Gmbh Robert | Elektrische Sicherung für elektrische Maschinen |
DE10122363B4 (de) * | 2001-05-09 | 2007-11-29 | Infineon Technologies Ag | Halbleitermodul |
US6444503B1 (en) | 2002-02-07 | 2002-09-03 | Taiwan Semiconductor Manufacturing Company | Fabricating electrical metal fuses without additional masking |
JP3881660B2 (ja) * | 2004-02-12 | 2007-02-14 | 株式会社東芝 | 半導体装置及びその製造方法 |
US7098534B2 (en) * | 2004-03-31 | 2006-08-29 | Intel Corporation | Sacrificial component |
US10600902B2 (en) * | 2008-02-13 | 2020-03-24 | Vishay SIliconix, LLC | Self-repairing field effect transisitor |
JP5602703B2 (ja) * | 2011-10-21 | 2014-10-08 | 三菱電機株式会社 | パワー半導体モジュール |
JP6660278B2 (ja) * | 2016-10-26 | 2020-03-11 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
DE102017101295B3 (de) * | 2017-01-24 | 2018-05-09 | Lisa Dräxlmaier GmbH | Sicherungsvorrichtung |
CN110998777B (zh) * | 2017-08-30 | 2022-09-20 | 三菱电机株式会社 | 功率转换装置 |
DE112017007994T5 (de) * | 2017-08-30 | 2020-06-10 | Mitsubishi Electric Corporation | Elektrische Leistungswandlungsvorrichtung |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2486202A (en) * | 1948-12-30 | 1949-10-25 | Bell Telephone Labor Inc | Electrical fuse element |
DE808854C (de) * | 1949-06-26 | 1951-07-19 | Erich Siemoneit | Hohlraumschmelzkoerper fuer elektrische Schmelzsicherungen in Hoch- und Niederspannungsanlagen |
US3236976A (en) * | 1961-06-22 | 1966-02-22 | Gen Electric | Fuse device |
DE1189607B (de) * | 1961-11-27 | 1965-03-25 | Merlin Gerin | Daempfungswiderstand fuer elektrische Schalter |
GB1054514A (de) * | 1963-04-05 | 1900-01-01 | ||
US3340430A (en) * | 1965-03-05 | 1967-09-05 | Keith H Jenkins | Diode and protection fuse unit |
DE1932427A1 (de) * | 1968-06-28 | 1970-01-02 | Weber Ag | Schmelzsicherung |
US3601737A (en) * | 1969-10-09 | 1971-08-24 | Gen Electrie Co | Fuse elements for dc interruption |
US3710295A (en) * | 1971-06-01 | 1973-01-09 | Gen Electric | Current limiting fuse |
US3832606A (en) * | 1973-02-15 | 1974-08-27 | Gen Motors Corp | Semiconductor diode package with protection fuse |
JPS563872Y2 (de) * | 1976-10-18 | 1981-01-28 | ||
JPS5393781A (en) * | 1977-01-27 | 1978-08-17 | Toshiba Corp | Semiconductor device |
US4091353A (en) * | 1977-03-30 | 1978-05-23 | General Electric Company | Current limiting fuse |
US4107759A (en) * | 1977-05-16 | 1978-08-15 | Sprague Electric Company | Fused monolithic ceramic capacitor package |
JPS5596667U (de) * | 1978-12-25 | 1980-07-04 | ||
DE3033323A1 (de) * | 1979-09-11 | 1981-03-26 | Rohm Co. Ltd., Kyoto | Schutzvorrichtung fuer eine halbleitervorrichtung |
JPS6177353A (ja) * | 1984-09-25 | 1986-04-19 | Toshiba Corp | 半導体整流装置 |
US4740485A (en) * | 1986-07-22 | 1988-04-26 | Monolithic Memories, Inc. | Method for forming a fuse |
US4845545A (en) * | 1987-02-13 | 1989-07-04 | International Rectifier Corporation | Low profile semiconductor package |
JPS63250036A (ja) * | 1987-04-06 | 1988-10-17 | 矢崎総業株式会社 | ヒユ−ズ用材 |
-
1987
- 1987-03-11 JP JP62054098A patent/JP2593471B2/ja not_active Expired - Lifetime
-
1988
- 1988-03-09 DE DE3889563T patent/DE3889563T2/de not_active Expired - Fee Related
- 1988-03-09 US US07/166,002 patent/US4943842A/en not_active Expired - Fee Related
- 1988-03-09 EP EP88103706A patent/EP0282025B1/de not_active Expired - Lifetime
-
1990
- 1990-02-12 US US07/478,536 patent/US5068706A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5068706A (en) | 1991-11-26 |
DE3889563T2 (de) | 1994-09-29 |
US4943842A (en) | 1990-07-24 |
JP2593471B2 (ja) | 1997-03-26 |
JPS63221657A (ja) | 1988-09-14 |
EP0282025B1 (de) | 1994-05-18 |
EP0282025A3 (en) | 1989-04-05 |
EP0282025A2 (de) | 1988-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |