DE3889563D1 - Halbleiteranordnung mit Schmelzsicherung. - Google Patents

Halbleiteranordnung mit Schmelzsicherung.

Info

Publication number
DE3889563D1
DE3889563D1 DE3889563T DE3889563T DE3889563D1 DE 3889563 D1 DE3889563 D1 DE 3889563D1 DE 3889563 T DE3889563 T DE 3889563T DE 3889563 T DE3889563 T DE 3889563T DE 3889563 D1 DE3889563 D1 DE 3889563D1
Authority
DE
Germany
Prior art keywords
fuse
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3889563T
Other languages
English (en)
Other versions
DE3889563T2 (de
Inventor
Naomasa C O Patent Divi Sugita
Yoshiharu Yotumoto
Kouji Moriguchi
Toshinobu C O Patent Di Sekiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE3889563D1 publication Critical patent/DE3889563D1/de
Application granted granted Critical
Publication of DE3889563T2 publication Critical patent/DE3889563T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0283—Structural association with a semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fuses (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE3889563T 1987-03-11 1988-03-09 Halbleiteranordnung mit Schmelzsicherung. Expired - Fee Related DE3889563T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62054098A JP2593471B2 (ja) 1987-03-11 1987-03-11 半導体装置

Publications (2)

Publication Number Publication Date
DE3889563D1 true DE3889563D1 (de) 1994-06-23
DE3889563T2 DE3889563T2 (de) 1994-09-29

Family

ID=12961144

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3889563T Expired - Fee Related DE3889563T2 (de) 1987-03-11 1988-03-09 Halbleiteranordnung mit Schmelzsicherung.

Country Status (4)

Country Link
US (2) US4943842A (de)
EP (1) EP0282025B1 (de)
JP (1) JP2593471B2 (de)
DE (1) DE3889563T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627959Y2 (ja) * 1988-10-20 1994-07-27 ローム株式会社 ダイオード
JPH0864750A (ja) * 1994-08-23 1996-03-08 Toshiba Corp 半導体装置
JP3754197B2 (ja) * 1997-12-22 2006-03-08 三洋電機株式会社 混成集積回路装置
DE19805785C1 (de) * 1998-02-12 1999-06-17 Siemens Ag Leistungshalbleiter-Modul mit thermischer Laststromsicherung
US6242789B1 (en) * 1999-02-23 2001-06-05 Infineon Technologies North America Corp. Vertical fuse and method of fabrication
US6252292B1 (en) * 1999-06-09 2001-06-26 International Business Machines Corporation Vertical electrical cavity-fuse
US6166421A (en) * 1999-08-18 2000-12-26 National Semiconductor Corporation Polysilicon fuse that provides an open current path when programmed without exposing the fuse to the environment
DE10005183A1 (de) * 2000-02-05 2001-08-09 Bosch Gmbh Robert Gleichrichteranordnung
DE10007209A1 (de) 2000-02-17 2001-09-06 Bosch Gmbh Robert Halbleiter-Leistungsbauelement mit Schmelzsicherung
US6507264B1 (en) 2000-08-28 2003-01-14 Littelfuse, Inc. Integral fuse for use in semiconductor packages
DE10065301A1 (de) * 2000-12-29 2002-07-04 Bosch Gmbh Robert Elektrische Sicherung für elektrische Maschinen
DE10122363B4 (de) * 2001-05-09 2007-11-29 Infineon Technologies Ag Halbleitermodul
US6444503B1 (en) 2002-02-07 2002-09-03 Taiwan Semiconductor Manufacturing Company Fabricating electrical metal fuses without additional masking
JP3881660B2 (ja) * 2004-02-12 2007-02-14 株式会社東芝 半導体装置及びその製造方法
US7098534B2 (en) * 2004-03-31 2006-08-29 Intel Corporation Sacrificial component
US10600902B2 (en) * 2008-02-13 2020-03-24 Vishay SIliconix, LLC Self-repairing field effect transisitor
JP5602703B2 (ja) * 2011-10-21 2014-10-08 三菱電機株式会社 パワー半導体モジュール
JP6660278B2 (ja) * 2016-10-26 2020-03-11 三菱電機株式会社 樹脂封止型半導体装置
DE102017101295B3 (de) * 2017-01-24 2018-05-09 Lisa Dräxlmaier GmbH Sicherungsvorrichtung
CN110998777B (zh) * 2017-08-30 2022-09-20 三菱电机株式会社 功率转换装置
DE112017007994T5 (de) * 2017-08-30 2020-06-10 Mitsubishi Electric Corporation Elektrische Leistungswandlungsvorrichtung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2486202A (en) * 1948-12-30 1949-10-25 Bell Telephone Labor Inc Electrical fuse element
DE808854C (de) * 1949-06-26 1951-07-19 Erich Siemoneit Hohlraumschmelzkoerper fuer elektrische Schmelzsicherungen in Hoch- und Niederspannungsanlagen
US3236976A (en) * 1961-06-22 1966-02-22 Gen Electric Fuse device
DE1189607B (de) * 1961-11-27 1965-03-25 Merlin Gerin Daempfungswiderstand fuer elektrische Schalter
GB1054514A (de) * 1963-04-05 1900-01-01
US3340430A (en) * 1965-03-05 1967-09-05 Keith H Jenkins Diode and protection fuse unit
DE1932427A1 (de) * 1968-06-28 1970-01-02 Weber Ag Schmelzsicherung
US3601737A (en) * 1969-10-09 1971-08-24 Gen Electrie Co Fuse elements for dc interruption
US3710295A (en) * 1971-06-01 1973-01-09 Gen Electric Current limiting fuse
US3832606A (en) * 1973-02-15 1974-08-27 Gen Motors Corp Semiconductor diode package with protection fuse
JPS563872Y2 (de) * 1976-10-18 1981-01-28
JPS5393781A (en) * 1977-01-27 1978-08-17 Toshiba Corp Semiconductor device
US4091353A (en) * 1977-03-30 1978-05-23 General Electric Company Current limiting fuse
US4107759A (en) * 1977-05-16 1978-08-15 Sprague Electric Company Fused monolithic ceramic capacitor package
JPS5596667U (de) * 1978-12-25 1980-07-04
DE3033323A1 (de) * 1979-09-11 1981-03-26 Rohm Co. Ltd., Kyoto Schutzvorrichtung fuer eine halbleitervorrichtung
JPS6177353A (ja) * 1984-09-25 1986-04-19 Toshiba Corp 半導体整流装置
US4740485A (en) * 1986-07-22 1988-04-26 Monolithic Memories, Inc. Method for forming a fuse
US4845545A (en) * 1987-02-13 1989-07-04 International Rectifier Corporation Low profile semiconductor package
JPS63250036A (ja) * 1987-04-06 1988-10-17 矢崎総業株式会社 ヒユ−ズ用材

Also Published As

Publication number Publication date
US5068706A (en) 1991-11-26
DE3889563T2 (de) 1994-09-29
US4943842A (en) 1990-07-24
JP2593471B2 (ja) 1997-03-26
JPS63221657A (ja) 1988-09-14
EP0282025B1 (de) 1994-05-18
EP0282025A3 (en) 1989-04-05
EP0282025A2 (de) 1988-09-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee