DE3853456D1 - Harzzusammensetzung für gedruckte Schaltungen. - Google Patents

Harzzusammensetzung für gedruckte Schaltungen.

Info

Publication number
DE3853456D1
DE3853456D1 DE3853456T DE3853456T DE3853456D1 DE 3853456 D1 DE3853456 D1 DE 3853456D1 DE 3853456 T DE3853456 T DE 3853456T DE 3853456 T DE3853456 T DE 3853456T DE 3853456 D1 DE3853456 D1 DE 3853456D1
Authority
DE
Germany
Prior art keywords
resin composition
printed circuits
printed
circuits
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3853456T
Other languages
English (en)
Other versions
DE3853456T2 (de
Inventor
Masakazu Inoue
Kuniaki Asai
Kazuo Hieda
Tadayasu Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Application granted granted Critical
Publication of DE3853456D1 publication Critical patent/DE3853456D1/de
Publication of DE3853456T2 publication Critical patent/DE3853456T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
DE3853456T 1987-09-01 1988-08-22 Harzzusammensetzung für gedruckte Schaltungen. Expired - Fee Related DE3853456T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218610A JPS6461087A (en) 1987-09-01 1987-09-01 Resin composition for printed wiring board

Publications (2)

Publication Number Publication Date
DE3853456D1 true DE3853456D1 (de) 1995-05-04
DE3853456T2 DE3853456T2 (de) 1995-09-28

Family

ID=16722652

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3853456T Expired - Fee Related DE3853456T2 (de) 1987-09-01 1988-08-22 Harzzusammensetzung für gedruckte Schaltungen.

Country Status (5)

Country Link
US (1) US4943606A (de)
EP (1) EP0305846B1 (de)
JP (1) JPS6461087A (de)
CA (1) CA1312160C (de)
DE (1) DE3853456T2 (de)

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JPS61231525A (ja) * 1985-04-08 1986-10-15 Hitachi Ltd 強誘電性液晶素子とその製造方法
KR960013793B1 (ko) * 1987-01-28 1996-10-10 니혼샤신인사츠 가부시키가이샤 컬러필터의 제조방법
JP2513728B2 (ja) * 1987-10-09 1996-07-03 ポリプラスチックス株式会社 液晶性ポリエステル樹脂成形品の表面処理法
US5409979A (en) * 1989-02-08 1995-04-25 Polyplastics Co., Ltd. Liquid-crystal polyester resin composition containing specified mold release agents
US5085807A (en) * 1989-05-15 1992-02-04 Toray Industries, Inc. Flame-retardant liquid crystal polyester composition, process for preparation thereof and injection-molded article composed thereof
JP2714440B2 (ja) * 1989-06-06 1998-02-16 ポリプラスチックス株式会社 精密細線回路用基板の製造方法
JPH0724328B2 (ja) * 1989-07-03 1995-03-15 ポリプラスチックス株式会社 精密細線回路用成形品の製造方法
JP2816864B2 (ja) * 1989-07-07 1998-10-27 大塚化学株式会社 搬送用ウエーハバスケット及び収納ケース
DE3932882A1 (de) * 1989-10-02 1991-04-11 Siemens Ag Gut waermeleitender verbundwerkstoff
JP2505643B2 (ja) * 1989-11-06 1996-06-12 東レ株式会社 液晶ポリエステル樹脂組成物
JP3074696B2 (ja) * 1990-03-30 2000-08-07 住友化学工業株式会社 液晶ポリエステル樹脂組成物
DE4028210A1 (de) * 1990-09-06 1992-03-12 Basf Ag Verfahren zur oberflaechenbehandlung von formkoerpern auf der basis von fluessigkristallinen polymeren
US5115080A (en) * 1990-10-24 1992-05-19 E. I. Du Pont De Nemours And Company Thermotropic liquid crystalline polyesters from 2-methylhydroquinone
US5401911A (en) * 1992-04-03 1995-03-28 International Business Machines Corporation Via and pad structure for thermoplastic substrates and method and apparatus for forming the same
US5397502A (en) * 1993-06-10 1995-03-14 E. I. Du Pont De Nemours And Company Heat resistant liquid crsytalline polymers
EP0639613B1 (de) * 1993-08-19 2004-04-21 General Electric Company Mineralgefüllte thermoplastische Formmasse
GB9411101D0 (en) * 1994-06-03 1994-07-27 Rennie Stephen A Polyamide compositions
DE69623858T2 (de) * 1995-06-09 2003-08-07 Sumitomo Chemical Co Verwendung anorganischer Oxide oder Hydroxide in flüssigkristallinen Polyesterharzen
JP4035861B2 (ja) 1997-07-08 2008-01-23 住友化学株式会社 芳香族ポリエステル組成物
BE1011624A4 (fr) * 1997-12-17 1999-11-09 Laude Lucien Diego Supports de circuit electrique.
US6190759B1 (en) 1998-02-18 2001-02-20 International Business Machines Corporation High optical contrast resin composition and electronic package utilizing same
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6593255B1 (en) 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6608760B2 (en) 1998-05-04 2003-08-19 Tpl, Inc. Dielectric material including particulate filler
US6616794B2 (en) * 1998-05-04 2003-09-09 Tpl, Inc. Integral capacitance for printed circuit board using dielectric nanopowders
US20040109298A1 (en) * 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
TW539614B (en) * 2000-06-06 2003-07-01 Matsushita Electric Works Ltd Laminate
JP2002080724A (ja) * 2000-09-04 2002-03-19 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物およびその成形体
JP4753470B2 (ja) * 2000-12-27 2011-08-24 イビデン株式会社 コンデンサ、多層プリント配線板および多層プリント配線板の製造方法
US6916527B2 (en) * 2001-01-18 2005-07-12 Matsushita Electric Works, Ltd. Resin moldings
US6989412B2 (en) 2001-06-06 2006-01-24 Henkel Corporation Epoxy molding compounds containing phosphor and process for preparing such compositions
US8062746B2 (en) * 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
US20060074164A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Structured composite dielectrics
US20060074166A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Title And Interest In An Application Moldable high dielectric constant nano-composites
US20080128961A1 (en) * 2003-12-19 2008-06-05 Tpl, Inc. Moldable high dielectric constant nano-composites
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
JP2008300238A (ja) * 2007-05-31 2008-12-11 Nitto Denko Corp 配線回路基板および燃料電池
KR101552716B1 (ko) * 2008-06-13 2015-09-11 삼성전기주식회사 서모셋 모노머 가교제, 이를 포함하는 인쇄회로기판 형성용조성물 및 이를 이용한 인쇄회로기판
JP2010050378A (ja) * 2008-08-25 2010-03-04 Nitto Denko Corp 配線回路基板および燃料電池
JP2011091030A (ja) * 2009-09-25 2011-05-06 Nitto Denko Corp 配線回路基板および燃料電池
WO2014081650A1 (en) * 2012-11-21 2014-05-30 Ticona Llc Liquid crystalline polymer composition for melt-extruded substrates
US11345811B2 (en) 2016-11-18 2022-05-31 Sumitomo Chemical Company, Limited Liquid crystal polymer composition for foam molding, method for producing foam molded body, and foam molded body
CN109937230B (zh) * 2016-11-18 2022-04-22 住友化学株式会社 发泡成形体及发泡成形体的制造方法
WO2021173408A1 (en) 2020-02-26 2021-09-02 Ticona Llc Electronic device
WO2021173693A1 (en) * 2020-02-26 2021-09-02 Ticona Llc Electronic device
CN115700014A (zh) 2020-02-26 2023-02-03 提克纳有限责任公司 电路结构
WO2021173411A1 (en) 2020-02-26 2021-09-02 Ticona Llc Polymer composition for an electronic device
US11728065B2 (en) 2020-07-28 2023-08-15 Ticona Llc Molded interconnect device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5298084A (en) * 1976-02-12 1977-08-17 Hitachi Ltd Unsaturated polyester resin compositions for pressure molding
EP0044147B1 (de) * 1980-07-16 1987-05-20 Imperial Chemical Industries Plc Aus zur Bildung anisotropischer Schmelzen fähigen Polymeren hergestellter Formkörper
US4425457A (en) * 1980-08-06 1984-01-10 Celanese Corporation High gloss polyethylene terephthalate reinforced resin compositions
US4487877A (en) * 1981-12-07 1984-12-11 Matsushita Electric Industrial Co., Ltd. Diaphragm for loudspeaker
US4375530A (en) * 1982-07-06 1983-03-01 Celanese Corporation Polyester of 2,6-naphthalene dicarboxylic acid, 2,6-dihydroxy naphthalene, terephthalic acid, and hydroquinone capable of forming an anisotropic melt
US4431770A (en) * 1982-07-29 1984-02-14 Celanese Corporation Wholly aromatic polyester comprising 4-oxy-4'-carboxybiphenyl moiety which is capable of forming an anisotropic melt phase
US4540737A (en) * 1983-02-07 1985-09-10 Celanese Corporation Method for the formation of composite articles comprised of thermotropic liquid crystalline polymers and articles produced thereby
JPS61316A (ja) * 1984-06-13 1986-01-06 住友化学工業株式会社 オ−ブンウエア
US4719250A (en) * 1984-06-18 1988-01-12 Hoechst Celanese Corporation Encapsulation of electronic components
JPS6130031A (ja) * 1984-07-21 1986-02-12 Rohm Co Ltd 半導体装置の製造方法
JPS61255957A (ja) * 1985-05-10 1986-11-13 Mitsui Petrochem Ind Ltd 強化ポリエステル組成物
JPH0765154B2 (ja) * 1985-09-02 1995-07-12 ポリプラスチックス株式会社 表面金属処理した樹脂成形品
JPS6298792A (ja) * 1985-10-25 1987-05-08 旭化成株式会社 フレキシブルプリント配線用基板
JPH0739534B2 (ja) * 1986-12-10 1995-05-01 ポリプラスチックス株式会社 表面特性の良好な液晶性ポリエステル樹脂組成物
JP2506352B2 (ja) * 1986-12-29 1996-06-12 株式会社クラレ 全芳香族ポリエステル及びそれを用いた射出成形品の製造法
JPS63178166A (ja) * 1987-01-16 1988-07-22 Sumitomo Chem Co Ltd 芳香族ポリスルフォン樹脂組成物

Also Published As

Publication number Publication date
EP0305846A2 (de) 1989-03-08
US4943606A (en) 1990-07-24
EP0305846A3 (en) 1990-06-20
EP0305846B1 (de) 1995-03-29
JPS6461087A (en) 1989-03-08
DE3853456T2 (de) 1995-09-28
CA1312160C (en) 1992-12-29
JPH0529155B2 (de) 1993-04-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SUMITOMO CHEMICAL CO. LTD., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee