DE3788546D1 - Halbleiterlasermodul. - Google Patents
Halbleiterlasermodul.Info
- Publication number
- DE3788546D1 DE3788546D1 DE87113344T DE3788546T DE3788546D1 DE 3788546 D1 DE3788546 D1 DE 3788546D1 DE 87113344 T DE87113344 T DE 87113344T DE 3788546 T DE3788546 T DE 3788546T DE 3788546 D1 DE3788546 D1 DE 3788546D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor laser
- laser module
- module
- semiconductor
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Revoked
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4233—Active alignment along the optical axis and passive alignment perpendicular to the optical axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61216482A JPS6370589A (ja) | 1986-09-12 | 1986-09-12 | 半導体レ−ザモジユ−ル |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3788546D1 true DE3788546D1 (de) | 1994-02-03 |
DE3788546T2 DE3788546T2 (de) | 1994-04-21 |
Family
ID=16689121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87113344T Revoked DE3788546T2 (de) | 1986-09-12 | 1987-09-11 | Halbleiterlasermodul. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4803689A (de) |
EP (1) | EP0259888B1 (de) |
JP (1) | JPS6370589A (de) |
DE (1) | DE3788546T2 (de) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3244882A1 (de) * | 1982-12-03 | 1984-06-07 | Siemens AG, 1000 Berlin und 8000 München | Sende- oder empfangsvorrichtung mit einer mittels eines traegers gehalterten diode |
GB2208962B (en) * | 1987-08-19 | 1991-05-08 | Plessey Co Plc | Power supply |
NL8800140A (nl) * | 1988-01-22 | 1989-08-16 | Philips Nv | Laserdiode module. |
EP0331436B1 (de) * | 1988-03-01 | 2004-12-29 | Kabushiki Kaisha Toshiba | Optische Übertragungsvorrichtung |
WO1989008277A1 (en) * | 1988-03-02 | 1989-09-08 | Fujitsu Limited | Semiconductor laser module and positioning method thereof |
JPH01302214A (ja) * | 1988-05-30 | 1989-12-06 | Sumitomo Electric Ind Ltd | チップキャリア |
US5049762A (en) * | 1988-09-14 | 1991-09-17 | Fuji Photo Film Co., Ltd. | Optical wavelength converter system |
GB2227102B (en) * | 1989-01-13 | 1993-03-24 | Ferranti Int Signal | Optical coupler with a fibre link between transceivers |
KR920010947B1 (ko) * | 1989-05-24 | 1992-12-24 | 가부시끼가이샤 히다찌세이사꾸쇼 | 광결합장치와 그 제조방법, 발광장치와 그 조립방법 및 렌즈홀더 |
NL8901523A (nl) * | 1989-06-16 | 1991-01-16 | Philips Nv | Laserdiode module. |
JP2684219B2 (ja) * | 1989-07-05 | 1997-12-03 | 三菱電機株式会社 | 光半導体モジュール |
JPH0392805A (ja) * | 1989-09-06 | 1991-04-18 | Matsushita Electric Ind Co Ltd | 光半導体装置および光半導体素子の検査装置 |
NL9000027A (nl) * | 1990-01-05 | 1991-08-01 | Philips Nv | Opto-elektronische inrichting met een, een lens omvattende koppeling tussen een optische transmissievezel en een halfgeleiderlaserdiode. |
JP2570879B2 (ja) * | 1990-02-08 | 1997-01-16 | 三菱電機株式会社 | 光半導体モジュールの組立方法 |
GB2242307B (en) * | 1990-02-09 | 1994-09-07 | Omega Universal Tech Ltd | Laser probe for biomodulation of tissue nerve and immune systems |
US5029968A (en) * | 1990-03-05 | 1991-07-09 | Hughes Aircraft Company | Optoelectronic hybrid package assembly including integral, self-aligned fiber optic connector |
US5156999A (en) * | 1990-06-08 | 1992-10-20 | Wai-Hon Lee | Packaging method for semiconductor laser/detector devices |
JP3035852B2 (ja) * | 1990-07-18 | 2000-04-24 | 富士通株式会社 | 半導体レーザモジュール |
US5124281A (en) * | 1990-08-27 | 1992-06-23 | At&T Bell Laboratories | Method of fabricating a photonics module comprising a spherical lens |
JP2695995B2 (ja) * | 1991-01-14 | 1998-01-14 | 株式会社東芝 | 光半導体装置 |
US5100507A (en) * | 1991-01-31 | 1992-03-31 | At&T Bell Laboratories | Finishing techniques for lensed optical fibers |
JPH04105572U (ja) * | 1991-02-26 | 1992-09-10 | ソニー株式会社 | レーザ装置 |
NL9100367A (nl) * | 1991-02-28 | 1992-09-16 | Philips Nv | Opto-electronische inrichting bevattende een halfgeleiderlaser en een optische isolator. |
US5195102A (en) * | 1991-09-13 | 1993-03-16 | Litton Systems Inc. | Temperature controlled laser diode package |
US5197076A (en) * | 1991-11-15 | 1993-03-23 | Davis James G | Temperature stabilizable laser apparatus |
JP2763980B2 (ja) * | 1992-01-14 | 1998-06-11 | 富士通株式会社 | 光半導体モジュール |
JPH05323165A (ja) * | 1992-05-18 | 1993-12-07 | Sumitomo Electric Ind Ltd | レンズ保持ブロック |
DE4232327A1 (de) * | 1992-09-26 | 1994-03-31 | Sel Alcatel Ag | Halbleiter-Lasermodul |
JP2661521B2 (ja) * | 1993-09-25 | 1997-10-08 | 日本電気株式会社 | 半導体受光装置 |
US5469456A (en) * | 1994-03-31 | 1995-11-21 | Opto Power Corporation | Laser device and method of manufacture using non-metalized fiber |
US5646674A (en) * | 1994-04-29 | 1997-07-08 | Eastman Kodak Company | Optical print head with flexure mounted optical device |
JP3596029B2 (ja) | 1994-06-06 | 2004-12-02 | 住友電気工業株式会社 | 半導体レーザモジュール |
DE4422322C1 (de) * | 1994-06-27 | 1995-09-14 | Ant Nachrichtentech | Lasermodul |
US5500911A (en) * | 1994-08-05 | 1996-03-19 | The Whitaker Corporation | Lensed optical fiber assembly and process for alignment with an active device |
DE4431285C1 (de) * | 1994-09-02 | 1995-12-07 | Ant Nachrichtentech | Lasermodul |
JPH08195528A (ja) * | 1995-01-13 | 1996-07-30 | Fujitsu Ltd | レーザダイオードモジュール |
EP0755528A1 (de) * | 1995-02-10 | 1997-01-29 | Koninklijke Philips Electronics N.V. | Optoelektronisches bauelement mit kopplung zwischen einem halbleiterlaser modulator oder verstärker und zwei optischen glasfasern |
EP0755529A1 (de) * | 1995-02-10 | 1997-01-29 | Koninklijke Philips Electronics N.V. | Optoelektronisches bauelement mit kopplung zwischen einem halbleiterlaser modulator oder verstärker und zwei optischen glasfasern |
JP2851810B2 (ja) * | 1995-03-22 | 1999-01-27 | 三菱電機株式会社 | 光半導体素子モジュールの組立方法 |
US5640407A (en) * | 1995-04-28 | 1997-06-17 | Accu-Sort Systems, Inc. | Temperature regulating laser diode assembly |
JP3461632B2 (ja) * | 1995-08-28 | 2003-10-27 | 三菱電機株式会社 | 半導体レーザ装置 |
KR0171374B1 (ko) * | 1995-11-17 | 1999-05-01 | 양승택 | 광집속렌즈를 포함하는 레이저 모듈 및 그 렌즈 고정방법 |
JP3076246B2 (ja) * | 1996-08-13 | 2000-08-14 | 日本電気株式会社 | ペルチェクーラ内蔵半導体レーザモジュール |
AT405776B (de) * | 1997-11-24 | 1999-11-25 | Femtolasers Produktions Gmbh | Kühlvorrichtung für einen laserkristall |
DE69801648T2 (de) | 1998-05-25 | 2002-04-18 | Alcatel, Paris | Optoelektronisches Modul mit wenigstens einem optoelektronischen Bauelement und Verfahren zur Temperaturstabilisierung |
EP1140626B1 (de) * | 1998-12-21 | 2003-03-05 | AlliedSignal Inc. | Hochleistungslampe mit infrarot-diode |
DE19944042A1 (de) * | 1999-09-14 | 2001-04-12 | Siemens Ag | Beleuchtungseinheit für eine Vorrichtung für Anwendungen im Bereich der Medizin |
JP3518491B2 (ja) * | 2000-06-26 | 2004-04-12 | 株式会社日立製作所 | 光結合装置 |
US6799902B2 (en) | 2000-12-26 | 2004-10-05 | Emcore Corporation | Optoelectronic mounting structure |
JP3929705B2 (ja) | 2001-02-05 | 2007-06-13 | ユーディナデバイス株式会社 | 半導体装置及びチップキャリア |
GB0105651D0 (en) * | 2001-03-08 | 2001-04-25 | Siemens Plc | Temperature stabilised laser diode and gas reference package |
EP1368872A2 (de) * | 2001-03-08 | 2003-12-10 | Siemens Plc | Wellenlängenstabilisierte laserquelle |
US6860651B2 (en) * | 2001-06-26 | 2005-03-01 | Derosa Michael E. | Method and device for removing heat from a fiber-optic package |
JP2003110180A (ja) * | 2001-07-25 | 2003-04-11 | Furukawa Electric Co Ltd:The | 半導体レーザモジュール並びに光測定方法及び光測定装置 |
US6868104B2 (en) * | 2001-09-06 | 2005-03-15 | Finisar Corporation | Compact laser package with integrated temperature control |
US6861641B1 (en) * | 2002-03-26 | 2005-03-01 | Optical Communication Products, Inc. | Hermetically sealed optical subassembly |
US6869231B2 (en) * | 2002-05-01 | 2005-03-22 | Jds Uniphase Corporation | Transmitters, receivers, and transceivers including an optical bench |
US6973106B1 (en) | 2002-10-11 | 2005-12-06 | Corvis Corporation | Optical package and optical systems apparatuses, and methods of use therein |
US8811439B2 (en) * | 2009-11-23 | 2014-08-19 | Seminex Corporation | Semiconductor laser assembly and packaging system |
US8821042B2 (en) * | 2011-07-04 | 2014-09-02 | Sumitomo Electic Industries, Ltd. | Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1454188A (de) * | 1973-12-03 | 1976-10-27 | ||
JPS5642389A (en) * | 1979-09-13 | 1981-04-20 | Fujitsu Ltd | Light semiconductor light emitting device |
JPS58134489A (ja) * | 1982-02-04 | 1983-08-10 | Mitsubishi Electric Corp | レ−ザダイオ−ドモジユ−ル |
US4615031A (en) * | 1982-07-27 | 1986-09-30 | International Standard Electric Corporation | Injection laser packages |
US4616899A (en) * | 1984-08-31 | 1986-10-14 | Gte Laboratories Incorporated | Methods of and apparatus for coupling an optoelectronic component to an optical fiber |
US4767171A (en) * | 1986-03-27 | 1988-08-30 | Siemens Aktiengesellschaft | Transmission and reception module for a bidirectional communication network |
JP2935179B2 (ja) * | 1997-06-11 | 1999-08-16 | 青山機工株式会社 | 削孔装置におけるロッド部材間通信構造 |
-
1986
- 1986-09-12 JP JP61216482A patent/JPS6370589A/ja active Pending
-
1987
- 1987-09-11 EP EP87113344A patent/EP0259888B1/de not_active Revoked
- 1987-09-11 DE DE87113344T patent/DE3788546T2/de not_active Revoked
- 1987-09-14 US US07/095,711 patent/US4803689A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6370589A (ja) | 1988-03-30 |
EP0259888B1 (de) | 1993-12-22 |
EP0259888A3 (en) | 1989-05-17 |
US4803689A (en) | 1989-02-07 |
EP0259888A2 (de) | 1988-03-16 |
DE3788546T2 (de) | 1994-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8331 | Complete revocation |