DE3784636D1 - Tauchgekuehltes schaltungsmodul mit verbesserten rippen. - Google Patents

Tauchgekuehltes schaltungsmodul mit verbesserten rippen.

Info

Publication number
DE3784636D1
DE3784636D1 DE8787117305T DE3784636T DE3784636D1 DE 3784636 D1 DE3784636 D1 DE 3784636D1 DE 8787117305 T DE8787117305 T DE 8787117305T DE 3784636 T DE3784636 T DE 3784636T DE 3784636 D1 DE3784636 D1 DE 3784636D1
Authority
DE
Germany
Prior art keywords
submersible
cooled module
ribs
improved
improved ribs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787117305T
Other languages
English (en)
Other versions
DE3784636T2 (de
Inventor
Gregory Martin Chrysler
Richard Chao-Fan Chu
Robert Eduard Simons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3784636D1 publication Critical patent/DE3784636D1/de
Application granted granted Critical
Publication of DE3784636T2 publication Critical patent/DE3784636T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/903—Convection

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE8787117305T 1986-11-28 1987-11-24 Tauchgekuehltes schaltungsmodul mit verbesserten rippen. Expired - Fee Related DE3784636T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/935,680 US4765397A (en) 1986-11-28 1986-11-28 Immersion cooled circuit module with improved fins

Publications (2)

Publication Number Publication Date
DE3784636D1 true DE3784636D1 (de) 1993-04-15
DE3784636T2 DE3784636T2 (de) 1993-09-23

Family

ID=25467507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787117305T Expired - Fee Related DE3784636T2 (de) 1986-11-28 1987-11-24 Tauchgekuehltes schaltungsmodul mit verbesserten rippen.

Country Status (4)

Country Link
US (1) US4765397A (de)
EP (1) EP0269065B1 (de)
JP (1) JPS63138799A (de)
DE (1) DE3784636T2 (de)

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Also Published As

Publication number Publication date
US4765397A (en) 1988-08-23
EP0269065B1 (de) 1993-03-10
EP0269065A3 (en) 1988-08-03
JPS63138799A (ja) 1988-06-10
DE3784636T2 (de) 1993-09-23
EP0269065A2 (de) 1988-06-01
JPH0563119B2 (de) 1993-09-09

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