DE1084542B - Process for the production of solder connections on metal layers produced on carrier bodies by thermal decomposition of metal carbonyls - Google Patents
Process for the production of solder connections on metal layers produced on carrier bodies by thermal decomposition of metal carbonylsInfo
- Publication number
- DE1084542B DE1084542B DER20454A DER0020454A DE1084542B DE 1084542 B DE1084542 B DE 1084542B DE R20454 A DER20454 A DE R20454A DE R0020454 A DER0020454 A DE R0020454A DE 1084542 B DE1084542 B DE 1084542B
- Authority
- DE
- Germany
- Prior art keywords
- metal
- thermal decomposition
- production
- carrier bodies
- sulfur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims description 19
- 229910052751 metal Inorganic materials 0.000 title claims description 19
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 title claims description 10
- 238000000034 method Methods 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000005979 thermal decomposition reaction Methods 0.000 title claims description 5
- 229910000679 solder Inorganic materials 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 9
- 229910052717 sulfur Inorganic materials 0.000 claims description 9
- 239000011593 sulfur Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical compound C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 1
- PQJUJGAVDBINPI-UHFFFAOYSA-N 9H-thioxanthene Chemical compound C1=CC=C2CC3=CC=CC=C3SC2=C1 PQJUJGAVDBINPI-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- -1 aromatic halogen hydrocarbons Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 229910052945 inorganic sulfide Inorganic materials 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Verfahren zur Herstellung von Lötverbindungen an auf Trägerkörpern durch thermische Zersetzung von Metall-Carbonylen erzeugten Metallschichten Es ist seit vielen Jahrzehnten bekannt, durch thermische Zersetzung von Metall-Carbonylen auf ausreichend temperaturfesten Trägerkörpern dünne Metallniederschläge zu erzeugen. Praktische Anwendung im technischen Großeinsatz hat jedoch dieses Metallisierungsverfahren, von Einzelausnahmen abgesehen, bisher nicht gefunden. Unter anderem hat dies seinen Grund darin, daß die erzeugten Metallniederschläge, etwa aus Nickel bestehend, eine für hohe Anforderungen zu geringe mechanische Haftfestigkeit, speziell auch nach erfolgter Lötung, hatten.Process for the production of soldered connections on support bodies Metal layers produced by thermal decomposition of metal carbonyls It is known for many decades due to thermal decomposition of metal carbonyls to generate thin metal deposits on sufficiently temperature-resistant substrates. However, this metallization process has practical application in large-scale technical operations, Apart from a few exceptions, not yet found. Among other things, this has his The reason is that the generated metal deposits, such as nickel, a Mechanical adhesive strength too low for high requirements, especially after after soldering.
Durch Versuche, die abschließend zu der erfindungsgemäßen Verbesserung führten, wurde festgestellt, daß sich optimale Eigenschaften bei diesen Metallschichten nicht erreichen lassen, wenn reine Metall-Carbonyle bzw. reine Metall-Carbonyl-Lösungen als Ausgangsmaterial verwendet werden.Through experiments that conclude with the improvement according to the invention it was found that these metal layers had optimal properties can not be achieved if pure metal carbonyls or pure metal carbonyl solutions can be used as starting material.
Es ist auch schon bekannt, zur Herstellung von durch thermische Zersetzung von Metall-Carbonylen erzeugten Überzügen auf Trägerkörpern den Metall-Carbonylen vor der Zersetzung schwefelbaltige Verbindungen beizugeben. Bezweckt wird hierbei, diese Körper wetterfest, nichtleitend oder photoelektrisch zu machen. Diese Überzüge können daher nur Metallverbindungen, nicht aber Metallegierungen sein, weil anderenfalls das Ziel, die Oberfläche nichtleitend zu machen, nicht erreicht würde. Im Gegensatz hierzu handelt es sich im Erfindungsfall um die Aufgabe, einwandfreie Lötverbindungen herzustellen. Dies setzt Schichten aus reinem Metall, vorzugsweise Nickel, voraus, weil nur reines Metall einwandfrei lötbar ist und zugleich die Leitfähigkeit gewährleistet, die nach diesem bekannten Verfahren gerade vermieden werden soll.It is also already known for the production of by thermal decomposition Coatings produced by metal carbonyls on carrier bodies, the metal carbonyls to add sulfur-containing compounds before decomposition. The aim here is to make these bodies weatherproof, non-conductive or photoelectric. These coatings can therefore only be metal compounds, but not metal alloys, because otherwise the goal of making the surface non-conductive would not be achieved. In contrast in the case of the invention, this involves the task of making perfect soldered connections to manufacture. This requires layers of pure metal, preferably nickel, because only pure metal can be soldered properly and at the same time ensures conductivity, which is to be avoided by this known method.
Entsprechend der Erfindung ergibt es Metallschichten, von auch nach der Lötung einwandfreier Haftfestigkeit, wenn Metall-Carbonyle, etwa Nickeltetra-Carbonyl, allein oder in Lösung zusammen mit aliphatischen oder aromatischen Kohlenwasserstoffen bzw. mit aliphatischen oder aromatischen Halogen-Kohlenwasserstoffen, zusammen mit Alkoholen oder Äthern oder Estern verwendet werden, denen vor der Zersetzunganorganischeund/oderorganische, schwefelhaltige Verbindungen allein oder in Mischungen zugesetzt sind. Die schwefelhaltigen Zusätze bewirken, schon rein äußerlich erkennbar, ein durchaus metallisches Aussehen der Schicht, auf der dann unter Verwendung üblicher Lötmittel sehr feste Lötungen angebracht werden können. Als geeignete schwefelhaltige Stoffe kommen unter anderem organische und anorganische Sulfide, Disulfide, Mercaptane, Schwefelwasserstoff, Schwefellösungen in Schwefel-Koblenstoff sowie letzterer allein in Frage. Auch Zusätze in Form von Verbindungen mit ringförmig gebundenem Schwefel, wie Thiophen, Thionaphthen, Thiazol, Thioxanthen, Thiatren und ihre Derivate, sind in der gewünschten Weise wirksam. Zugesetzt werden diese schwefelhaltigen Stoffe je nach Art in Konzentrationen Ton 0,001 bis 1019/0.According to the invention it gives metal layers, from also to the soldering of perfect adhesive strength when metal carbonyls, e.g. nickel tetra-carbonyl, alone or in solution together with aliphatic or aromatic hydrocarbons or with aliphatic or aromatic halogen hydrocarbons, together with Alcohols or ethers or esters are used which, before decomposition, contain inorganic and / or organic, sulfur-containing compounds are added alone or in mixtures. The sulphurous Additives, which can already be seen from the outside, create a thoroughly metallic appearance the layer on which very strong soldering is then carried out using conventional soldering agents can be attached. Suitable sulfur-containing substances include organic and inorganic sulfides, disulfides, mercaptans, hydrogen sulfide, Sulfur solutions in sulfur-Koblenstoff as well as the latter alone in question. Also additives in the form of compounds with ring-shaped sulfur, such as thiophene, thionaphthene, Thiazole, thioxanthene, thiatrene, and their derivatives, are in the desired manner effective. These sulfur-containing substances are added in concentrations depending on the type Tone 0.001 to 1019/0.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DER20454A DE1084542B (en) | 1957-01-31 | 1957-01-31 | Process for the production of solder connections on metal layers produced on carrier bodies by thermal decomposition of metal carbonyls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DER20454A DE1084542B (en) | 1957-01-31 | 1957-01-31 | Process for the production of solder connections on metal layers produced on carrier bodies by thermal decomposition of metal carbonyls |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1084542B true DE1084542B (en) | 1960-06-30 |
Family
ID=7400668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DER20454A Pending DE1084542B (en) | 1957-01-31 | 1957-01-31 | Process for the production of solder connections on metal layers produced on carrier bodies by thermal decomposition of metal carbonyls |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE1084542B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3214288A (en) * | 1961-12-14 | 1965-10-26 | Nat Steel Corp | Process for the deposition of metallic aluminum |
| US3251712A (en) * | 1962-09-21 | 1966-05-17 | Berger Carl | Metal plating with a heated hydrocarbon solution of a group via metal carbonyl |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2671739A (en) * | 1949-06-22 | 1954-03-09 | Bell Telephone Labor Inc | Plating with sulfides, selenides, and tellurides of chromium, molybdenum, and tungsten |
-
1957
- 1957-01-31 DE DER20454A patent/DE1084542B/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2671739A (en) * | 1949-06-22 | 1954-03-09 | Bell Telephone Labor Inc | Plating with sulfides, selenides, and tellurides of chromium, molybdenum, and tungsten |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3214288A (en) * | 1961-12-14 | 1965-10-26 | Nat Steel Corp | Process for the deposition of metallic aluminum |
| US3251712A (en) * | 1962-09-21 | 1966-05-17 | Berger Carl | Metal plating with a heated hydrocarbon solution of a group via metal carbonyl |
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