DE102018125682B4 - Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils - Google Patents

Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils Download PDF

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Publication number
DE102018125682B4
DE102018125682B4 DE102018125682.5A DE102018125682A DE102018125682B4 DE 102018125682 B4 DE102018125682 B4 DE 102018125682B4 DE 102018125682 A DE102018125682 A DE 102018125682A DE 102018125682 B4 DE102018125682 B4 DE 102018125682B4
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Prior art keywords
ejector
film
contact surface
opening
vacuum
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DE102018125682.5A
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German (de)
English (en)
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DE102018125682A1 (de
Inventor
Arno Stein
Stephanie Zoetl
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ASMPT GmbH and Co KG
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ASM Assembly Systems GmbH and Co KG
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Priority to DE102018125682.5A priority Critical patent/DE102018125682B4/de
Priority to CN201910965139.2A priority patent/CN111063653A/zh
Publication of DE102018125682A1 publication Critical patent/DE102018125682A1/de
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Publication of DE102018125682B4 publication Critical patent/DE102018125682B4/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
    • F04F5/14—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid
    • F04F5/16—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids
    • F04F5/20—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids for evacuating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
    • F04F5/54—Installations characterised by use of jet pumps, e.g. combinations of two or more jet pumps of different type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Jet Pumps And Other Pumps (AREA)
DE102018125682.5A 2018-10-16 2018-10-16 Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils Active DE102018125682B4 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102018125682.5A DE102018125682B4 (de) 2018-10-16 2018-10-16 Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils
CN201910965139.2A CN111063653A (zh) 2018-10-16 2019-10-11 用于促进布置在保持膜片上的部件脱离的顶脱器装置和方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018125682.5A DE102018125682B4 (de) 2018-10-16 2018-10-16 Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils

Publications (2)

Publication Number Publication Date
DE102018125682A1 DE102018125682A1 (de) 2020-04-16
DE102018125682B4 true DE102018125682B4 (de) 2023-01-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018125682.5A Active DE102018125682B4 (de) 2018-10-16 2018-10-16 Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils

Country Status (2)

Country Link
CN (1) CN111063653A (zh)
DE (1) DE102018125682B4 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10347543A1 (de) 2003-10-14 2005-05-25 Mühlbauer Ag Ablösevorrichtung zum Ablösen elektronischer Bauteile von einem Träger
DE102006025361A1 (de) 2006-05-31 2007-12-06 Siemens Ag Ausstoßeinheit zum Abtrennen von Bauelementen aus einer im Wesentlichen ebenen Anordnung von Bauelementen
US20100037445A1 (en) 2006-06-19 2010-02-18 Samsung Electronics Co., Ltd. Method of and apparatus for detaching semiconductor chips from a tape
US20100055878A1 (en) 2006-05-23 2010-03-04 Renesas Technology Corp. Fabrication Method of Semiconductor Device
US20170133259A1 (en) 2014-06-18 2017-05-11 Manufacturing Integration Technology Ltd System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876791A (en) * 1986-04-22 1989-10-31 Kulicke & Soffa Industries, Inc. Apparatus for and methods of die bonding
JPH11145162A (ja) * 1997-11-11 1999-05-28 Miyagi Oki Denki Kk Ｉｃチップのピックアップ装置
US8026126B2 (en) * 2002-11-27 2011-09-27 Asm Assembly Automation Ltd Apparatus and method for thin die detachment
JP4373175B2 (ja) * 2003-10-17 2009-11-25 オリンパス株式会社 基板搬送装置
JP4541824B2 (ja) * 2004-10-14 2010-09-08 リンテック株式会社 非接触型吸着保持装置
JP2007053277A (ja) * 2005-08-19 2007-03-01 Hugle Electronics Inc エア吹き上げ式フィルムシート用エキスパンダ
JP4318714B2 (ja) * 2006-11-28 2009-08-26 東京エレクトロン株式会社 塗布装置
JP2009073646A (ja) * 2007-09-21 2009-04-09 Myotoku Ltd 浮上方法及び浮上ユニット
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
CN101323152B (zh) * 2008-06-20 2010-07-21 艾逖恩机电(深圳)有限公司 一种顶针模块、使用该模块分离晶片和蓝膜的方法
JP2010161155A (ja) * 2009-01-07 2010-07-22 Canon Machinery Inc チップ転写方法およびチップ転写装置
EP2456694A2 (de) * 2009-07-22 2012-05-30 Zimmermann & Schilp Handhabungstechnik GmbH Vakuum-greifer
IT1398436B1 (it) * 2010-01-27 2013-02-22 Applied Materials Inc Dispositivo di manipolazione di substrati mediante aria compressa
CN102335985A (zh) * 2010-07-28 2012-02-01 日进教学器材(昆山)有限公司 模具间隙气辅顶针机构
JP5502788B2 (ja) * 2011-03-16 2014-05-28 東京エレクトロン株式会社 浮上式塗布装置
CH706280B1 (de) * 2012-03-30 2016-03-15 Esec Ag Verfahren zum Ablösen eines Halbleiterchips von einer Folie.
CN103481646B (zh) * 2013-08-16 2015-05-20 常州天合光能有限公司 丝网印刷装置
CN203959326U (zh) * 2013-12-24 2014-11-26 产台股份有限公司 气导式料件加速结构
KR102284149B1 (ko) * 2014-12-05 2021-07-30 세메스 주식회사 다이 이젝팅 장치
JP6605871B2 (ja) * 2015-08-03 2019-11-13 東レエンジニアリング株式会社 基板浮上搬送装置
CN205508797U (zh) * 2016-04-21 2016-08-24 钟伟 一种无接触输运与定位平台装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10347543A1 (de) 2003-10-14 2005-05-25 Mühlbauer Ag Ablösevorrichtung zum Ablösen elektronischer Bauteile von einem Träger
US20100055878A1 (en) 2006-05-23 2010-03-04 Renesas Technology Corp. Fabrication Method of Semiconductor Device
DE102006025361A1 (de) 2006-05-31 2007-12-06 Siemens Ag Ausstoßeinheit zum Abtrennen von Bauelementen aus einer im Wesentlichen ebenen Anordnung von Bauelementen
US20100037445A1 (en) 2006-06-19 2010-02-18 Samsung Electronics Co., Ltd. Method of and apparatus for detaching semiconductor chips from a tape
US20170133259A1 (en) 2014-06-18 2017-05-11 Manufacturing Integration Technology Ltd System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector

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Publication number Publication date
DE102018125682A1 (de) 2020-04-16
CN111063653A (zh) 2020-04-24

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Representative=s name: BALS & VOGEL PATENTANWAELTE PARTG MBB, DE

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R081 Change of applicant/patentee

Owner name: ASMPT GMBH & CO. KG, DE

Free format text: FORMER OWNER: ASM ASSEMBLY SYSTEMS GMBH & CO. KG, 81379 MUENCHEN, DE

R020 Patent grant now final