CN211741682U - 光学*** - Google Patents

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Publication number
CN211741682U
CN211741682U CN202020309885.4U CN202020309885U CN211741682U CN 211741682 U CN211741682 U CN 211741682U CN 202020309885 U CN202020309885 U CN 202020309885U CN 211741682 U CN211741682 U CN 211741682U
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China
Prior art keywords
optical
module
adjusting
optical module
axis
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CN202020309885.4U
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English (en)
Inventor
胡朝彰
翁智伟
陈树山
叶永县
宋欣忠
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TDK Taiwan Corp
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TDK Taiwan Corp
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Priority claimed from EP19218896.9A external-priority patent/EP3674768B1/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • G—PHYSICS
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    • G02B7/003—Alignment of optical elements
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    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • G—PHYSICS
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    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
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    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
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    • G03B5/04—Vertical adjustment of lens; Rising fronts
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Abstract

一种光学***，包括：一定位装置定位一第一光学模块；一测量装置测量该第一光学模块的一主轴与该第一光学模块所承载的一光学元件的一光轴之间的角度差，并得出一测量信息；一调整装置根据该测量信息改变该第一光学模块的一调整组件的外型；以及将该第一光学模块与一光学物件进行组装，其中该光学元件的该光轴平行于该光学物件的一中心轴。

Description

光学***
技术领域
本实用新型涉及一种光学***，特别涉及一种具有调整组件的光学***。
背景技术
随着科技的发展，人们对于电子产品的高效能、高规格视觉享受的追求越来越高，以丰富更棒的产品使用体验。现今许多电子装置(例如平板电脑或智能手机)都配有镜头模块而具有照相或录影的功能。当使用者使用配有镜头模块的电子装置时，可能会有晃动的情形发生，进而使得镜头模块所拍摄的影像产生模糊。然而，人们对于影像品质的要求日益增高，故镜头模块的防震功能亦日趋重要，此外也追求产品的小型化、轻便化，以便使用者使用。如何提供一种具高品质的摄像模块是为一重要课题。
一些摄像模块内配置有复数个镜头元件，面对高分辨率需求，使得需要更高水准的光学驱动、稳定度与对准性。一些镜头元件的光圈性能，因为低照度(low light)品质要求，需要大光圈型的产品，但是对焦(through of focus，TOF)的焦深(depth of focus)范围会变窄。相关零组件的组装，镜头元件与感光元件若无法实现垂直正交,意即跟光轴有倾斜角度(tilt)存在，若其倾斜角度过大，则TOF的曲线分散，造成影像失焦而模糊。因此，控制镜头元件与感光元件的倾斜角度是一重要课题。
实用新型内容
本实用新型的一实施例提供一种光学***，包括：一定位装置定位一第一光学模块；一测量装置测量该第一光学模块的一主轴与该第一光学模块所承载的一光学元件的一光轴之间的角度差，并得出一测量信息；一调整装置根据该测量信息改变该第一光学模块的一调整组件的外型；以及将该第一光学模块与一光学物件进行组装，其中该光学元件的该光轴平行于该光学物件的一中心轴。
于一实施例中，前述调整组件包含复数个调整柱，且调整装置根据测量信息改变第一光学模块的调整组件的外型的步骤包含：调整装置使前述调整柱的自由端的连线的一平面垂直于光轴。
于一实施例中，前述调整装置为一焊热件，且调整装置根据测量信息改变第一光学模块的调整组件的外型的步骤包含：焊热件熔化至少一部分的调整组件。
于一实施例中，前述在调整装置使调整柱的自由端的连线的平面垂直于光轴的步骤之后，移除调整装置，并使光学模块与光学物件进行组装。
于一实施例中，前述定位装置定位一第一光学模块至一第一位置，且在调整装置使调整柱的自由端的连线的平面垂直于光轴的步骤之后，定位装置移动第一光学模块从第一位置至第二位置，使光轴平行于中心轴。
于一实施例中，前述调整装置设置于光学物件并面对调整组件。
于一实施例中，在前述调整装置改变调整组件的外型的步骤之后，仍持续与调整组件相接触。
于一实施例中，前述调整装置包含一平面金属板，对应调整组件。
于一实施例中，前述调整装置包含一加热电路，且光学***还包括：通过加热电路连接一热源以对平面金属板加热，且平面金属板改变调整组件的外型。
于一实施例中，前述光学物件为一感光模块，且通过改变调整组件的外型，使第一光学模块的光轴平行于感光模块的中心轴。
于一实施例中，前述光学物件为一第二光学模块，第二光学模块用以承载一第二光学元件，且通过调整装置改变调整组件的外型并使第二光学模块组装于第一光学模块时，第二光学模块的中心轴平行于第一光学元件的光轴。
于一实施例中，前述测量装置为相对于第一光学模块的外部的一外部测量装置。
于一实施例中，前述测量装置属于光学模块的一部分，测量装置为一位置感测组件，设置于第一光学模块的一基座。
于一实施例中，前述定位装置包含一限位件，沿垂直于主轴的方向观察，调整组件凸出于限位件。
于一实施例中，前述感光模块包含一滤光元件，当第一光学模块与光学物件进行组装时，在主轴的方向上，滤光元件与调整组件的至少一部分重叠。
于一实施例中，前述调整装置设置于光学物件，该光学物件通过调整装置与第一光学模块相接触。
于一实施例中，前述光学物件为一第二光学模块，第二光学模块用以承载一第二光学元件，且调整装置设置于第二光学模块的上表面。
本实用新型的一实施例提供一种光学***，包括：一定位装置定位一第一光学模块与一第二光学模块；一测量装置测量第一光学模块的一主轴与第一光学模块所承载的一第一光学元件的一第一光轴之间的角度差，并得出一第一测量信息；一调整装置根据第一测量信息改变连接于第一光学模块的一调整组件的一第一调整子组件的外型；以及将第一光学模块与一第二光学模块所承载的一第二光学元件的一第二光轴进行组装，其中第一光学元件的第一光轴平行于第二光学元件的一第二光轴。
于一实施例中，光学***还包括：测量装置测量第二光轴与一感光模块的一中心轴之间的角度差，并得出一第二测量信息；以及定位装置根据第二测量信息将已组装的第一光学模块与第二光学模块定位至一对准位置，使第一光轴与第二光轴平行中心轴。
于一实施例中，使前述第一光轴与第二光轴平行于感光模块的中心轴的步骤包含：通过调整装置调整调整组件的一第二调整子组件的外型，并使第二光学模块与感光模块组装。
附图说明
图1是表示本实用新型一实施例的光学模块、调整组件、感光模块的剖面示意图。
图2是表示图1中的光学模块的底侧示意图。
图3A、图3B、图3C、图3D是表示本实用新型一实施例的光学***的组装与调整的示意图。
图4是表示本实用新型一实施例的调整光学***的方法的流程图。
图5A、图5B是表示本实用新型另一实施例的调整光学***。
图6是表示本实用新型另一实施例的调整光学***。
图7A、图7B、图7C是表示本实用新型另一实施例的光学***的组装与调整的示意图。
图8是表示本实用新型另一实施例的调整光学***的方法的流程图。
附图标记说明：
24-100、24-200 光学***
24-10 基座
24-20 框架
24-30 承载件
24-40 底板
24-56 组合与调节机构
24-501 测量装置
24-601 定位装置
24-6011 夹持件
24-6012 限位件
24-6012F、24-6012F1、24-6012F2 限位面
24-800 调整光学***的方法
24-802、24-804、24-806 步骤
24-900 调整光学***的方法
24-902、24-904、24-906、24-908、24-910 步骤
24-AS 调整组件
24-A1、24-A2 调整柱
24-C 线圈
24-D1 第一方向
24-D2 第二方向
24-ES 弹性组件
24-E1 第一弹性元件
24-E2 第二弹性元件
24-FL 滤光元件
24-H 外壳
24-IM 感光模块(光学物件)
24-IMM 感光元件
24-JA、24-JA’ 调整装置
24-JA’1 平面金属板
24-LS、24-LS1、24-LS2 光学元件、第一光学元件、第二光学元件
24-M 磁性元件
24-MC 驱动组件
24-O、24-O1、24-O2 光轴、第一光轴、第二光轴
24-OM、24-OM1、24-OM2 光学模块、第一光学模块、第二光学模块(光学物件)
24-OMB 底面
24-P 主轴
24-Q 中心轴
24-S1、24-S2 测量信息、第一测量信息、第二测量信息
24-UB1 上表面
24-UB2 下表面
24-V 活动部
24-θ 角度差
具体实施方式
有关本实用新型的装置适用的其他范围将于接下来所提供的详述中清楚易见。必须了解的是，下列的详述以及具体的实施例，当提出有关光学***与调整光学***的方法的示范实施例时，仅作为描述的目的以及并非用以限制本实用新型的范围。
除非另外定义，在此使用的全部用语(包括技术及科学用语)，具有与此篇公开所属的一般技艺者所通常理解的相同涵义。能理解的是，这些用语，例如在通常使用的字典中定义的用语，应被解读成具有一与相关技术及本公开的背景或上下文一致的意思，而不应以一理想化或过度正式的方式解读，除非在此特别定义。
请参阅图1，图1是表示本实用新型一实施例的光学***24-100的示意图。如图1所示，光学***24-100可设置于一电子装置(例如相机、平板电脑或手机)内部，作为摄像单元以提供拍摄、录影功能。举例而言，当来自外界的光线沿光入射方向进入光学***24-100后，光线得以穿过其中的一光学元件24-LS(例如镜头组件)并至感光元件24-IM，以获取影像。以下将详细说明光学***24-100的详细结构。
前述光学***24-100包括一光学模块24-OM、一感光模块24-IM与一调整组件24-AS，调整组件24-AS位于光学模块24-OM与感光模块24-IM之间，并设置于光学模块24-OM的一设置表面24-OMB上，且沿垂直于光学***24-100的一主轴24-P(或光学元件24-LS的光轴24-O)的一第一方向24-D1观察，调整组件24-AS与光学模块24-OM不重叠。
前述光学模块24-OM可为一镜头驱动模块，包含一外壳24-H、一活动部24-V与一基座24-10，外壳24-H和活动部24-V设置于基座24-10上，且外壳24-H与基座24-10形成一容纳空间，活动部24-V设置于容纳空间中。前述活动部24-V包含一框架24-20、一承载件24-30、一驱动组件24-MC与一弹性组件24-ES。外壳24-H连接并设置于基座24-10上，并与基座24-10形成有一容纳空间，用以容置前述活动部24-30(包含承载件24-30、驱动组件24-MC与弹性组件24-ES)，可提供保护作用。
承载件24-30用以承载一光学元件24-LS，并通过弹性组件24-ES活动地连接基座24-10和框架24-20。驱动组件24-MC设置于承载件24-30和框架24-20上，用以驱动承载件24-30和光学元件24-LS相对于基座24-10、框架24-20移动，以调整光学元件的姿态或位置，进而达光学自动对焦(Auto-Focusing，AF)或光学防手震(Optical Image Stabilization，OIS)的目的。
关于弹性组件24-ES的详细而言，弹性组件24-ES包含一第一弹性元件24-E1和一第二弹性元件24-E2，分别设置于承载件24-30的上、下两侧，活动地连接承载件24-30和基座24-10与框架24-20，使得承载件24-30可相对于基座24-10与框架24-20活动。
关于驱动组件24-MC之详细而言，其可为一电磁驱动组件(ElectromagneticDriving Assembly)，包含一线圈24-C和一磁性元件24-M，两者分别设置于承载件24-30和框架24-20。其中，磁性元件24-M与线圈24-C两者相互对应。当对驱动组件24-MC施加一施加驱动信号(例如通过一外部电源施加电流至线圈24-C)，磁性元件24-M与线圈24-C之间产生磁力，进而可带动承载件24-30相对于基座24-10移动，以达到光学影像防手震或自动对焦的技术效果。本实施例中的驱动组件24-MC为动磁式，于另一实施例中则可为动圈式。此外，在施加驱动信号之前，前述弹性组件24-ES可让承载件24-30相对基座24-10保持在一初始位置。
参阅图1、2，前述调整组件24-AS包含复数个调整柱24-A1，设置于基座24-10的底面24-OMB并沿一第二方向延伸24-D2(第二方向24-D2不与光轴24-O垂直)，用以调整光学模块24-OM与感光模块24-IM的相对位置，具体而言，其是调整光学模块24-OM内设置的光学元件24-LS的光轴24-O与感光模块24-IM的中心轴24-Q，以使其重叠或平行。
于本实施例中，调整组件24-AS包含四个调整柱24-A1，设置于光学模块24-OM的底面24-OMB的边缘处，并位于底面24-OMB的不同侧。需注意的是，于其他实施例中，调整组件24-AS可包含三个调整柱24-A1，设置于光学模块24-OM的底面24-OMB的边缘处，三者皆位于底面24-OMB的不同侧。
参阅图3A，欲执行光学模块24-OM与感光模块24-IM组装，本实施例通过一定位装置24-601将光学模块24-OM定位置至一第一位置。其中，定位装置24-601包含一夹持件24-6011与一限位件24-6012，夹持件24-6011用以夹持光学模块24-OM的顶部，限位件24-6012设置夹持件24-6011或光学模块24-OM两侧，用以限位光学模块24-OM，以避免于组装程序中有过大的晃动而造成伤害，此外，沿垂直主轴24-P的方向观察，调整组件24-AS凸出于限位件24-6012的一限位面24-6012F，且限位面24-6012F是凸出于光学模块24-OM的基座24-10。
如图3A，当光学元件24-LS放置于光学模块24-OM中，且光学元件24-LS的光轴24-O与光学模块24-OM的主轴24-P存在角度差(即未重合、未平行)时，通过一测量装置24-501(例如一角度测量器)得出两者之间的角度差24-θ，以提供一测量信息24-S1。接着，测量装置24-501传递测量信息24-S1予一调整装置24-JA，调整装置24-JA根据前述测量信息24-S1来改变调整组件24-AS的外型，如图3B所示，调整装置24-JA可为一焊热件，如一热压焊接头，利用热熔的方式来改变调整组件24-AS的外型。此外，由于限位件24-6012的限位面24-6012F凸出于光学模块24-OM的基座24-10，使得当调整装置24-JA压向调整组件24-AS和光学模块24-OM时，能够避免伤害到光学模块24-OM，以保护光学模块24-OM。
于本实施例中，由于通过测量装置24-501得知光轴24-O的倾斜角度(相对于主轴24-P)，使得调整装置24-JA改变调整柱24-A1的外型，以使其在调整柱24-A1的自由端点的连线24-CL垂直于光轴24-O，或者说三个以上的调整柱24-A1的自由端点连线所构成的一对齐表面24-CP垂直于光轴24-O。
如图3B～3C所示，左边的调整柱24-A1在Z轴上的高度相较于右边的调整柱24-A1在Z轴上的高度减少较多，使对齐表面24-CP垂直于光轴24-O，接着，移开调整装置24-JA。如此一来，再把感光模块IM放置于此些被调整过外型的调整柱24-A1上，如图3D所示，即可使感光模块24-IM的中心轴24-Q平行或重合光轴24-O，以模块之间达良好的对齐。
于一些实施例中，测量装置24-501可通过光经过光学模块24-OM至感光模块24-IM所产生的影像，根据影像的模糊、对焦程度来判别光学模块24-OM内的光轴24-O与感光模块24-IM的中心轴24-Q的之间是否存在角度差异。
于一些实施例中，感光模块24-IM包含一滤光元件24-FL，设置于感光元件24-IMM上，其可为一红外线滤光片(infrared filter)，可过滤红外光线至感光元件24-IMM。在垂直主轴24-P的方向上，滤光元件24-FL位于前述调整柱24-A1之中，不与调整柱24-A1重叠。于一些实施例中，在垂直于主轴24-P的方向上，滤光元件24-FL是嵌至基座24-10内并可与至少部分的调整柱24-A1重叠。
根据上述实施例，本实用新型提供一种调整光学***的方法24-800，如图4，首先，由定位装置定位光学模块(步骤24-802)，再通过测量装置测量第一光学模块的主轴与第一光学模块所承载的光学元件的一光轴之间的角度差，并得出测量信息(步骤804)，接着，调整装置根据测量信息改变第一光学模块的调整组件的外型(步骤24-806)，再将第一光学模块与光学物件(如感光模块，或图7A的第二光学模块)进行组装，其中光学元件的光轴平行于光学物件的中心轴(步骤24-808)。
如此一来，调整光学***的方法24-800通过在光学模块24-OM与感光组件24-IM之间设置调整组件24-AS，且调整组件24-AS的外型得以被改变，使得感光组件24-IM和光学模块24-OM组装能够精准地调校，以让中心轴24-Q与光轴24-O平行或重合，以提升装置所获取的影像品质。
于一些实施例中，如图5所示，另一调整装置24-JA’可设在感光模块24-IM的底板24-40上，其包含一平面金属板24-JA’1，是面对调整组件24-AS，并可通过其一加热电路连接至一外部热源，以使其加热升温。如此，即可在感光模块24-IM与光学模块24-OM组装时，通过调整装置24-JA’的加热平面金属板24-JA’1而可改变调整柱24-A1的外型。如此，相较于图3B中的一个外部独立的调整装置24-JA，本实施例在在调整装置24-JA’改变该调整组件24-AS的外型的步骤之后，仍持续与调整组件24-AS相接触，可节省移除调整装置24-JA的程序。
于一些实施例中，在调整装置根据测量信息改变第一光学模块的调整组件的外型(步骤24-904)之后，可通过定位装置24-601来调整光学模块24-OM的位置，如图3C、5A所示，图5A中显示了光学模块24-OM通过定位装置24-601的定位而从第一位置(图3C)至第二位置(图5A)，以使光轴平行于中心轴，再进行光学模块24-OM与感光模块24-IM的组装，如图5B所示，而本实施例为光学模块24-OM放置于感光模块上。
如图6所示，于一些实施例中，测量装置24-501’属于光学模块24-OM的一部分，可为一位置感测组件，设置于该光学模块的基座24-10上。于一些实施例中，其可与驱动组件24-MC共用位置检测的功能。如此可节省外接一外部测量装置。
图7A～7C是表示本实用新型另一实施例的调整光学***24-200，与图1中的光学***24-100不同的是，本实施例的光学***24-200具有两个光学模块：一第一光学模块24-OM1和一第二光学模块24-OM2，两者可为相同或类似的组件，或是外型、比例大小不同的组件，而调整组件24-AS具有复数个第一调整柱24-A1(第一调整子组件)和复数个第二调整柱24-A2(第二调整子组件)。第一光学模块24-OM1、第一调整柱24-A1、一第二光学模块24-OM1、第二调整柱24-A2和感光模块24-IM是沿第一光学元件24-LS1的第一光轴24-O1(或者第二光学元件24-LS2的第二光轴24-O2、主轴24-Q)按序排列。
当欲使第一、第二光学模块24-OM1、24-OM2、感光模块24-IM三者组装时，首先，如图7A所示，定位装置24-601的夹持件24-6011A夹持第一学模块24-OM1而作定位，当第一光学元件24-LS1与第一光学模块24-OM1有相对倾斜时，通过测量装置24-501测量出主轴24-P与第一光轴24-O1的角度差，并得出第一测量信号。
接着，如图7B所示，第二光学模块24-OM2的上表面24-UB1压向第一光学模块24-OM1的底座24-10的底面24-OMB上的第一调整子组件24-A1，并依据前述第一测量信号24-S1而改变各第一调整柱24-A1的形状，例如通过图5A中的设在光学物件上的调整装置24-JA’(或者如图3B中的外部调整装置24-501，使第一调整柱24-A1受热而改变外型)，其中受到限位件24-6012的限位面24-6012F1可避免伤害到第一光学模块24-OM1，而使第一、第二光学模块24-OM1、24-OM2的第一、第二光轴24-O1、24-O2对齐。
接着，如图7C所示，根据测量装置24-501测量第二光轴24-O2与感光模块24-IM的一中心轴24-Q之间的角度差，并得出一第二测量信息24-S2，定位装置24-601再根据第二测量信息24-S2将已组装的第一、第二光学模块24-OM1、24-OM2移动至一对准位置，使其第一、第二光轴24-O1、24-O2能够与感光模块24-IM的中心轴24-Q平行或重合，并将第一、第二光学模块24-OM1、24-OM2与感光模块24-IM组装，其中位在第二光学模块24-OM1的下表面24-UB2的第二调整柱子组件24-A2可受到感光模块24-IM接触而改变外型(例如利用图5A中的方法)，其中受到限位件24-6012的限位面24-6012F2可避免伤害到第二光学模块24-OM2。如此一来，可使第一、第二光轴24-O1、24-O2、中心轴24-Q三者平行或重合，让光学***200具有优良的模块间的对准度。
根据上述实施例，本实用新型提供一种调整光学***的方法24-900，首先，定位装置定位第一光学模块与第二光学模块(步骤24-902)，测量装置测量第一光学模块的主轴与第一光学模块所承载的第一光学元件的第一光轴之间的角度差，并得出第一测量信息(步骤24-904)，将第一光学模块与第二光学模块进行组装，其中第一光学元件的第一光轴平行于第二光学元件的第二光轴(步骤24-906)。
于一些实施例中，调整光学***的方法24-900还包括：测量装置测量第二光轴与感光模块的中心轴之间的角度差，并得出一第二测量信息(步骤24-908)，定位装置根据第二测量信息将已组装的第一光学模块与第二光学模块定位至一对准位置，使第一光轴与第二光轴平行中心轴(步骤24-910)。其中在步骤24-910中包含：通过调整装置调整调整组件的一第二调整子组件的外型，并使第二光学模块与感光模块组装。
以上各实施例间的特征只要不违背本实用新型公开构思或互相冲突，均可混合搭配使用。此外，有关图1～8中的调整柱、第一、第二调整柱，其构造可使用如图6、7中所公开的调整柱的构造，且第一、第二光学模块24-OM1、24-OM2与感光模块24-IM可具有图5中所公开的对手件20-OB1～20-OB3的构造。
综上所述，本实用新型的实施例提供一种光学***，包括：一定位装置定位一第一光学模块；一测量装置测量该第一光学模块的一主轴与该第一光学模块所承载的一光学元件的一光轴之间的角度差，并得出一测量信息；一调整装置根据该测量信息改变该第一光学模块的一调整组件的外型；以及将该第一光学模块与一光学物件进行组装，其中该光学元件的该光轴平行于该光学物件的一中心轴。
本实用新型实施例至少具有以下其中一个优点或技术效果，通过调整组件可调整数个光学模块相互对齐，以及一或数个光学模块与感光模块相互对齐，以提高装置的优良性。此外，由于调整组件可在调整时改变其外型(通常为被挤压而在垂直方向上高度减少)，让光学模块与感光模块之间的调校能够更细致、更精准，大幅提升产品品质。
在本说明书以及权利要求中的序数，例如“第一”、“第二”等等，彼此之间并没有顺序上的先后关系，其仅用于标示区分两个具有相同名字的不同元件。
上述的实施例以足够的细节叙述使所属技术领域的技术人员能通过上述的描述实施本实用新型所公开的装置，以及必须了解的是，在不脱离本实用新型的构思以及范围内，当可做些许变动与润饰，因此本实用新型的保护范围当视权利要求所界定者为准。

Claims (20)

1.一种光学***，其特征在于，该光学***包括：
一定位装置，定位一第一光学模块；
一测量装置，测量该第一光学模块的一主轴与该第一光学模块所承载的一光学元件的一光轴之间的角度差，并得出一测量信息；
一调整装置，根据该测量信息改变该第一光学模块的一调整组件的外型；以及
将该第一光学模块与一光学物件进行组装，其中该光学元件的该光轴平行于该光学物件的一中心轴。
2.如权利要求1所述的光学***，其特征在于，该调整组件包含复数个调整柱，且其中该调整装置根据该测量信息改变该第一光学模块的该调整组件的外型包含：
该调整装置使该些调整柱的自由端的连线的一平面垂直于该光轴。
3.如权利要求1所述的光学***，其特征在于，该调整装置为一焊热件，且其中该调整装置根据该测量信息改变该第一光学模块的该调整组件的外型包含：
该焊热件熔化至少一部分的该调整组件。
4.如权利要求2所述的光学***，其特征在于，在该调整装置使该些调整柱的自由端的连线的该平面垂直于该光轴之后，移除该调整装置，并使该光学模块与该光学物件进行组装。
5.如权利要求2所述的光学***，其特征在于，该定位装置定位一第一光学模块至一第一位置，且在该调整装置使该些调整柱的自由端的连线的该平面垂直于该光轴之后，该定位装置移动该第一光学模块从该第一位置至第二位置，使该光轴平行于该中心轴。
6.如权利要求1所述的光学***，其特征在于，该调整装置设置于该光学物件并面对该调整组件。
7.如权利要求6所述的光学***，其特征在于，在该调整装置改变该调整组件的外型之后，仍持续与该调整组件相接触。
8.如权利要求6所述的光学***，其特征在于，该调整装置包含一平面金属板，对应该调整组件。
9.如权利要求8所述的光学***，其特征在于，该调整装置包含一加热电路，且该光学***还包括：
通过该加热电路连接一热源以对该平面金属板加热，且该平面金属板改变该调整组件的外型。
10.如权利要求1所述的光学***，其特征在于，该光学物件为一感光模块，且通过改变该调整组件的外型，使该第一光学模块的该光轴平行于该感光模块的该中心轴。
11.如权利要求1所述的光学***，其特征在于，该光学物件为一第二光学模块，该第二光学模块用以承载一第二光学元件，且通过该调整装置改变该调整组件的外型并使该第二光学模块组装于该第一光学模块时，该第二光学模块的该中心轴平行于该第一光学模块所承载的第一光学元件的光轴。
12.如权利要求1所述的光学***，其特征在于，该测量装置为相对于该第一光学模块的外部的一外部测量装置。
13.如权利要求1所述的光学***，其特征在于，该测量装置属于该光学模块的一部分，该测量装置为一位置感测组件，设置于该第一光学模块的一基座上。
14.如权利要求1所述的光学***，其特征在于，该定位装置包含一限位件，沿垂直于该主轴的方向观察，该调整组件凸出于该限位件。
15.如权利要求10所述的光学***，其特征在于，该感光模块包含一滤光元件，当该第一光学模块与该光学物件进行组装时，在主轴的方向上，该滤光元件与该调整组件的至少一部分重叠。
16.如权利要求1所述的光学***，其特征在于，该调整装置设置于该光学物件，该光学物件通过该调整装置与该第一光学模块相接触。
17.如权利要求1所述的光学***，其特征在于，该光学物件为一第二光学模块，该第二光学模块用以承载一第二光学元件，且该调整装置设置于该第二光学模块的上表面。
18.一种光学***，其特征在于，该光学***包括：
一定位装置，定位一第一光学模块与一第二光学模块；
一测量装置，测量该第一光学模块的一主轴与该第一光学模块所承载的一第一光学元件的一第一光轴之间的角度差，并得出一第一测量信息；
一调整装置，根据该第一测量信息改变连接于该第一光学模块的一调整组件的一第一调整子组件的外型；以及
将该第一光学模块与一第二光学模块所承载的一第二光学元件的一第二光轴进行组装，其中该第一光学元件的该第一光轴平行于该第二光学元件的一第二光轴。
19.如权利要求18所述的光学***，其特征在于，还包括：
该测量装置测量该第二光轴与一感光模块的一中心轴之间的角度差，并得出一第二测量信息；以及
该定位装置根据该第二测量信息将已组装的该第一光学模块与该第二光学模块定位至一对准位置，使该第一光轴与该第二光轴平行该中心轴。
20.如权利要求19所述的光学***，其特征在于，使该第一光轴与该第二光轴平行于该感光模块的该中心轴包含：
通过该调整装置调整该调整组件的一第二调整子组件的外型，并使该第二光学模块与该感光模块组装。
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698693B (zh) * 2018-12-28 2020-07-11 大陽科技股份有限公司 鏡頭驅動模組及電子裝置
CN211826653U (zh) * 2019-07-26 2020-10-30 台湾东电化股份有限公司 光学元件驱动机构以及光学***
US11867925B2 (en) * 2019-08-30 2024-01-09 Tdk Taiwan Corp. Driving mechanism for optical element
US11698525B2 (en) 2019-09-06 2023-07-11 Tdk Taiwan Corp. Optical member driving mechanism
CN214503997U (zh) * 2020-03-06 2021-10-26 台湾东电化股份有限公司 光学元件驱动机构
CN113156608B (zh) * 2021-04-16 2022-11-01 南昌欧菲光电技术有限公司 棱镜支架、棱镜组件、摄像模组和电子设备

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920010947B1 (ko) * 1989-05-24 1992-12-24 가부시끼가이샤 히다찌세이사꾸쇼 광결합장치와 그 제조방법, 발광장치와 그 조립방법 및 렌즈홀더
WO2006064876A1 (ja) * 2004-12-17 2006-06-22 Matsushita Electric Industrial Co., Ltd. 光学ユニット及びその製造方法
KR100667291B1 (ko) * 2005-07-27 2007-01-12 삼성전자주식회사 마이크로 미러 소자 패키지 및 그 제조방법
JP2008028143A (ja) * 2006-07-21 2008-02-07 Sumitomo Electric Ind Ltd 光モジュール
JP2008109099A (ja) * 2006-09-26 2008-05-08 Sumitomo Electric Ind Ltd ステムと被溶接部材の溶接部構造、その溶接部構造を有する半導体デバイス、光モジュール、およびその製造方法
JP5846346B2 (ja) * 2009-08-21 2016-01-20 ミツミ電機株式会社 カメラの手振れ補正装置
CN105934698B (zh) * 2013-01-11 2019-04-16 英特尔公司 镜驱动装置
JP5998962B2 (ja) * 2013-01-31 2016-09-28 三菱電機株式会社 半導体光装置
WO2016006168A1 (ja) * 2014-07-11 2016-01-14 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール、及びカメラ搭載装置
US9772506B2 (en) * 2014-11-12 2017-09-26 Tdk Taiwan Corp. Configuration of flexible connections used in a lens driving module
JP6708920B2 (ja) * 2015-11-16 2020-06-10 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール及びカメラ搭載装置
US10732376B2 (en) * 2015-12-02 2020-08-04 Ningbo Sunny Opotech Co., Ltd. Camera lens module and manufacturing method thereof
KR20180059301A (ko) * 2016-11-25 2018-06-04 주식회사 탑 엔지니어링 틸트 보정이 가능한 카메라 모듈 하우징, 카메라 모듈 제조장치 및 제조방법
KR102275684B1 (ko) * 2017-04-18 2021-07-13 삼성전자주식회사 반도체 패키지
US11327333B2 (en) * 2017-06-30 2022-05-10 Lg Innotek Co., Ltd. Lens driving device, and camera module and optical device comprising same
EP3748956B1 (en) * 2018-02-01 2023-09-27 Sony Semiconductor Solutions Corporation Solid-state imaging device and method for manufacturing same, and electronic apparatus
TW201942615A (zh) * 2018-04-04 2019-11-01 日商索尼半導體解決方案公司 攝像裝置
CN209858825U (zh) 2018-05-11 2019-12-27 台湾东电化股份有限公司 光学元件驱动机构

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