CN211529917U - Semiconductor device shaping device - Google Patents
Semiconductor device shaping device Download PDFInfo
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- CN211529917U CN211529917U CN201922080650.2U CN201922080650U CN211529917U CN 211529917 U CN211529917 U CN 211529917U CN 201922080650 U CN201922080650 U CN 201922080650U CN 211529917 U CN211529917 U CN 211529917U
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Abstract
The utility model provides a semiconductor device shaping device, includes preliminary plastic mechanism, preliminary plastic mechanism be connected with and carry plastic mechanism, transport plastic mechanism still be connected with ejection of compact control mechanism, semiconductor device gets into by preliminary plastic mechanism, carries out the semiconductor plastic through carrying plastic mechanism, the components and parts that the plastic was accomplished are via ejection of compact control mechanism transport. The utility model discloses a semiconductor components and parts are swept into in the clearance between holding down plate and the lower slideway by the plastic brush, again by the height that clamp plate lift rotary drive servo drove holding down plate adjustment clearance, accomplish the automatic plastic to semiconductor components and parts, when the plastic reaches the certain degree, through the position that targets in place of ejection of compact detection sensor detection semiconductor components and parts ware, open the cylinder switching door and evenly spill the semiconductor components and parts that the plastic is good on the tool tray, realize the automation of semiconductor plastic, personnel's cost has been reduced, and the stability of product quality has been improved, production efficiency also obtains promoting thereupon.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor material technique and specifically relates to a semiconductor device shaping device.
Background
In the manufacturing process of a semiconductor device, the shaping work of pins is usually required to be carried out, however, most of the existing semiconductor shaping processes are completed by adopting mechanical equipment to assist workers, the shaping processing mode is low in efficiency, the reject ratio of the shaped semiconductor device is high, the stability and the regularity of the product quality are poor, and due to the participation of workers, the instability of the shaping of the device exists in the manual operation of production workers, and the personnel cost is increased.
Therefore, in order to overcome the defects of the semi-automatic semiconductor shaping device, an automatic semiconductor shaping device with high production efficiency and stable product quality needs to be designed.
Disclosure of Invention
An object of the utility model is to overcome prior art not enough, provide a semiconductor device shaping device that pneumatic vibration and machinery combined together.
The utility model provides a its technical problem take following technical scheme to realize:
the utility model provides a semiconductor device shaping device, includes preliminary plastic mechanism, preliminary plastic mechanism be connected with and carry plastic mechanism, transport plastic mechanism still be connected with ejection of compact control mechanism, preliminary plastic mechanism include plastic brush mounting panel, plastic brush mounting panel on be fixed with the plastic brush, transport plastic mechanism include the glide slope, the edge of glide slope be provided with the tool tray, the glide slope on be provided with the glide slope bottom plate, the glide slope bottom plate on be connected with the fixed clamp plate of glide slope, the fixed clamp plate of glide slope on be provided with the detection sensor, the glide slope bottom plate on still be provided with the vibrator.
Preferably, the shaping brush is connected with a shaping brush coupler, and the shaping brush coupler is connected with a brushless speed regulating motor.
Preferably, the fixed pressing plate of the lower slideway is connected with a pressing plate lifting rotating shaft, one end of the pressing plate lifting rotating shaft is connected with a pressing plate lifting coupler, and the pressing plate lifting coupler is connected with a pressing plate lifting and rotating driving server.
Preferably, the upper surface of the lower slideway fixed pressure plate is provided with a pressure plate pressing guide and horizontal adjustment component.
Preferably, the horizontal adjusting assembly is fixed with a lower glass fixing plate, and the lower glass fixing plate is positioned at the lower side of the pressing plate lifting rotating shaft.
Preferably, the pressing plate is connected with the lower slideway fixing pressing plate through a lower pressing guide penetrating through the lower pressing glass fixing plate.
Preferably, a pressing plate upper cam and a pressing plate lower cam are arranged between the pressing glass fixing plate and the pressing plate lifting rotating shaft.
Preferably, the bottom plate of the lower slideway is also provided with an upper guide rail supporting column and a lower guide rail supporting column, the upper guide rail supporting column and the lower guide rail supporting column are connected with an upper sliding block module and a lower sliding block module, the upper sliding block module and the lower sliding block module are provided with an upper detection sensor and a lower detection sensor, and the upper sliding block module and the lower sliding block module are covered with upper guide rail dust covers and.
Preferably, the discharge control mechanism comprises a downward pressing glass plate, the downward pressing glass plate is connected with the lower slideway bottom plate, the downward pressing glass plate is provided with an air cylinder opening and closing door, and the air cylinder opening and closing door is provided with a discharge detection sensor.
The utility model has the advantages that:
1. the utility model discloses a brushless buncher drives the motion of plastic brush, and clamp plate lifting and drop rotating drive server drives the plastic motion of its semiconductor of clamp plate lifting and drop rotating shaft control, and carries out the device through sensor parts such as upper and lower detection sensor and target in place and detect the judgement, and the equal automatic feedback action form of every control motion part to realize interlocking interactive contact through the inside software program of control machine, the process of plastic is looked over in real time to the position of discernment semiconductor device that can be accurate.
2. The utility model discloses a semiconductor components and parts are swept into in the clearance between holding down plate and the lower slideway by the plastic brush, again by the height that clamp plate lift rotary drive servo drove holding down plate adjustment clearance, accomplish the automatic plastic to semiconductor components and parts, when the plastic reaches the certain degree, through the position that targets in place of ejection of compact detection sensor detection semiconductor components and parts ware, open the cylinder switching door and evenly spill the semiconductor components and parts that the plastic is good on the tool tray, realize the automation of semiconductor plastic, personnel's cost has been reduced, and the stability of product quality has been improved, production efficiency also obtains promoting thereupon.
Drawings
Fig. 1 is a schematic side view of the present invention;
fig. 2 is a rear view structure diagram of the present invention;
fig. 3 is a schematic top view of the present invention;
fig. 4 is a schematic view of the overall structure of the present invention.
In the figure: 1. the cylinder opens and closes the door; 2. a discharge detection sensor; 3. upper and lower guide rail support columns; 4. a vibrator; 5. a lower chute floor; 6. a lower slideway fixed pressing plate; 7. shaping a hairbrush; 8. a shaping brush coupler; 9. the pressing plate drives the servo in a lifting and rotating way; 10. a shaping brush mounting plate; 11. pressing and guiding the pressing plate; 12. dust covers for the upper and lower guide rails; 13. the pressing plate lifts the rotating shaft; 14. pressing the glass fixing plate; 15. a detection sensor; 16. a brushless speed-regulating motor; 17. a pressing plate lifting coupler; 18. a lower slideway; 19. a horizontal adjustment assembly; 20. pressing the glass plate; 21. a jig tray; 22. an up-down detection sensor; 23. an upper and lower slider module; 24. the pressing plate is provided with an upper cam and a lower cam.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The embodiments of the present invention will be described in detail with reference to the accompanying drawings:
as shown in fig. 1-4, a semiconductor device shaping device, including preliminary plastic mechanism, preliminary plastic mechanism be connected with and carry plastic mechanism, transport plastic mechanism still be connected with ejection of compact control mechanism, semiconductor device gets into by preliminary plastic mechanism, carries out the semiconductor plastic through carrying plastic mechanism, the components and parts that the plastic was accomplished are via ejection of compact control mechanism transport out.
Further, preliminary plastic mechanism include plastic brush mounting panel 10, plastic brush mounting panel 10 on be fixed with plastic brush 7, carry plastic mechanism include glide slope 18, the edge of glide slope 18 be provided with tool tray 21, during semiconductor device gets into glide slope 18 via plastic brush 7, carry the tool tray 21 with semiconductor device after the plastic is accomplished on. Lower slide 18 on be provided with lower slide bottom plate 5, lower slide bottom plate 5 on be connected with lower slide fixed pressing plate 6, lower slide fixed pressing plate 6 on be provided with detection sensor 15, detection sensor 15 can detect the position of semiconductor device in lower slide 18, lower slide bottom plate 5 on still be provided with vibrator 4.
Further, the shaping brush 7 is connected with a shaping brush coupler 8, the shaping brush coupler 8 is connected with a brushless speed regulating motor 16, the brushless speed regulating motor 16 drives the shaping brush 7 to work through the shaping brush coupler 8, and a semiconductor device is swept into a lower slideway 18 for shaping.
Further, the fixed pressing plate 6 of lower slideway is connected with pressing plate lift rotation axis 13, one end of pressing plate lift rotation axis 13 be connected with pressing plate lift shaft coupling 17, pressing plate lift shaft coupling 17 be connected with pressing plate lift rotary drive server 9, pressing plate lift rotary drive server 9 drive pressing plate lift rotation axis 13 through pressing plate lift shaft coupling 17 and rotate, drive lower slideway fixed pressing plate 6 by pressing plate lift rotation axis 13 and carry out the oscilaltion motion again.
Further, the upper surface of the lower slideway fixed pressure plate 6 is provided with a pressure plate pressing guide 11 and a horizontal adjusting component 19. The horizontal adjusting component 19 is fixed with a lower glass fixing plate 14, and the lower glass fixing plate 14 is positioned at the lower side of the pressing plate lifting rotating shaft 13. The pressing plate pressing guide 11 penetrates through the pressing glass fixing plate 14 and is connected with the lower slideway fixing pressing plate 6.
In addition, a pressing plate up-down cam 24 is arranged between the pressing plate lifting rotating shaft 13 and the pressing plate fixing plate 14, and the pressing plate up-down cam 24 can drive the pressing plate lifting rotating shaft 13 to move up and down.
Further, the bottom plate 5 of the lower slideway is also provided with an upper and lower guide rail supporting column 3, the upper and lower guide rail supporting column 3 is connected with an upper and lower sliding block module 23, the upper and lower sliding block module 23 is provided with an upper and lower detection sensor 22, and the upper and lower sliding block module 23 is covered with an upper and lower guide rail dust cover 12.
Further, the discharge control mechanism comprises a lower pressing glass plate 20, the lower pressing glass plate 20 is connected with the lower slideway bottom plate 5, an air cylinder opening and closing door 1 is arranged on the lower pressing glass plate 20, a discharge detection sensor 2 is arranged on the air cylinder opening and closing door 1, the air cylinder opening and closing door 1 can be opened and closed according to the position of a semiconductor device in the shaping device, and when the semiconductor device reaches the lower pressing glass plate 20, the air cylinder opening and closing door 1 is opened, so that the semiconductor device is transported to the jig tray 21.
Furthermore, pushing down glass fixed plate 14 and adopting the transparent material of PC, being convenient for observe semiconductor device's the plastic condition, its size slightly is less than lower slideway stationary platen 6, the front end of lower slideway bottom plate 5 do 22 slope processings, the ejection of compact of the semiconductor product after the plastic of being convenient for, lower slideway 18 adopts the toughened glass material, prevents the production of mar.
During the specific implementation, the semiconductor device falls into the lower slideway 18 from the front end of the shaping brush 7, the semiconductor device is swept into a gap between the lower glass pressing plate 20 and the lower slideway 18 through the shaping brush 7, a worker can drive the pressing plate lifting rotating shaft 13 to adjust the distance between the lower glass pressing fixing plate 14 and the lower slideway 18 through the pressing plate lifting rotating driving servo 9 according to the semiconductor devices with different sizes so as to finish the shaping work of the semiconductor device, in the shaping process, the detection sensor 15 can detect the position of the semiconductor device and control the opening of the cylinder opening and closing door 1, and when the semiconductor device reaches the lower glass pressing plate 20, the cylinder opening and closing door 1 is opened, so that the semiconductor device is transported to the jig tray 21, the shaping work of the semiconductor device is finished, and the shaping automation is realized.
The utility model uses the brushless speed regulating motor 16 to drive the shaping brush 7 to move, the pressure plate lifting and rotating drive servo 9 drives the pressure plate lifting and rotating shaft 13 to control the shaping movement of the semiconductor, and the components are detected and judged in place through the sensor components such as the upper and lower detection sensors 22 and the detection sensor 15, each control movement component automatically feeds back the action form, and the interlocking interaction connection is realized through the software program in the control machine, and the semiconductor component is swept into the gap between the lower pressure plate and the lower slide way 18 by the shaping brush 7, then the pressure plate lifting and rotating drive servo 9 drives the lower pressure plate to adjust the height of the gap, the automatic shaping of the semiconductor component is completed, when the shaping reaches a certain degree, the in-place position of the semiconductor component is detected through the discharging detection sensor 2, the opening and closing cylinder 1 is opened to uniformly scatter the shaped semiconductor component on the jig tray 21, the automation of semiconductor shaping is realized, the personnel cost is reduced, the stability of the product quality is improved, and the production efficiency is improved accordingly.
It should be emphasized that the embodiments described herein are illustrative and not restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but also falls within the scope of the present invention, in any other embodiments derived by those skilled in the art according to the technical solutions of the present invention.
Claims (9)
1. A semiconductor device shaping apparatus characterized in that: including preliminary plastic mechanism, preliminary plastic mechanism be connected with and carry plastic mechanism, carry plastic mechanism still be connected with ejection of compact control mechanism, preliminary plastic mechanism include plastic brush mounting panel (10), plastic brush mounting panel (10) on be fixed with plastic brush (7), carry plastic mechanism include glide slope (18), the edge of glide slope (18) be provided with tool tray (21), glide slope (18) on be provided with glide slope bottom plate (5), glide slope bottom plate (5) on be connected with down glide slope fixed pressing plate (6), glide slope fixed pressing plate (6) on be provided with detection sensor (15), glide slope bottom plate (5) on still be provided with vibrator (4).
2. A semiconductor device reshaping apparatus according to claim 1, wherein: the shaping brush (7) is connected with a shaping brush coupler (8), and the shaping brush coupler (8) is connected with a brushless speed regulating motor (16).
3. A semiconductor device reshaping apparatus according to claim 1, wherein: the fixed clamp plate (6) of glide slope be connected with clamp plate lift rotation axis (13), the one end of clamp plate lift rotation axis (13) be connected with clamp plate lift shaft coupling (17), clamp plate lift shaft coupling (17) be connected with clamp plate lift rotation drive server (9).
4. A semiconductor device reshaping apparatus according to claim 3, wherein: the upper surface of the lower slideway fixed pressure plate (6) is provided with a pressure plate pressing guide (11) and a horizontal adjusting component (19).
5. A semiconductor device reshaping apparatus according to claim 4, wherein: the horizontal adjusting component (19) is fixed with a lower glass fixing plate (14), and the lower glass fixing plate (14) is positioned at the lower side of the pressing plate lifting rotating shaft (13).
6. A semiconductor device reshaping apparatus according to claim 5, wherein: the pressing plate downward pressing guide (11) penetrates through the downward pressing glass fixing plate (14) and is connected with the lower slideway fixing pressing plate (6).
7. A semiconductor device reshaping apparatus according to claim 5, wherein: a pressing plate upper cam and a pressing plate lower cam (24) are arranged between the pressing glass fixing plate (14) and the pressing plate lifting rotating shaft (13).
8. A semiconductor device reshaping apparatus according to claim 1, wherein: the lower slideway bottom plate (5) on still be provided with upper and lower guide rail support column (3), upper and lower slider module (23) be connected with on upper and lower guide rail support column (3), upper and lower slider module (23) on be provided with from top to bottom and detect sensor (22), upper and lower slider module (23) on be stamped upper and lower guide rail dust cover (12).
9. A semiconductor device reshaping apparatus according to claim 1, wherein: the discharging control mechanism comprises a downward-pressing glass plate (20), the downward-pressing glass plate (20) is connected with the lower slideway bottom plate (5), an air cylinder opening and closing door (1) is arranged on the downward-pressing glass plate (20), and a discharging detection sensor (2) is arranged on the air cylinder opening and closing door (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922080650.2U CN211529917U (en) | 2019-11-27 | 2019-11-27 | Semiconductor device shaping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922080650.2U CN211529917U (en) | 2019-11-27 | 2019-11-27 | Semiconductor device shaping device |
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| Publication Number | Publication Date |
|---|---|
| CN211529917U true CN211529917U (en) | 2020-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922080650.2U Active CN211529917U (en) | 2019-11-27 | 2019-11-27 | Semiconductor device shaping device |
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| CN (1) | CN211529917U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582310A (en) * | 2020-12-28 | 2021-03-30 | 无锡中微腾芯电子有限公司 | Direct-insertion type packaged integrated circuit pin shaping equipment |
-
2019
- 2019-11-27 CN CN201922080650.2U patent/CN211529917U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582310A (en) * | 2020-12-28 | 2021-03-30 | 无锡中微腾芯电子有限公司 | Direct-insertion type packaged integrated circuit pin shaping equipment |
| CN112582310B (en) * | 2020-12-28 | 2024-03-19 | 无锡中微腾芯电子有限公司 | Direct-insertion type packaging integrated circuit pin shaping equipment |
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