CN112582310A - Direct-insertion type packaged integrated circuit pin shaping equipment - Google Patents
Direct-insertion type packaged integrated circuit pin shaping equipment Download PDFInfo
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- CN112582310A CN112582310A CN202011577888.7A CN202011577888A CN112582310A CN 112582310 A CN112582310 A CN 112582310A CN 202011577888 A CN202011577888 A CN 202011577888A CN 112582310 A CN112582310 A CN 112582310A
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- 238000007493 shaping process Methods 0.000 title claims abstract description 34
- 238000003780 insertion Methods 0.000 title abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 62
- 238000009434 installation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 230000006872 improvement Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a pin shaping device for a direct-insertion packaged integrated circuit, which comprises a supporting base, wherein an adjusting mechanism is arranged on the supporting base, an actuating mechanism and an elastic baffle matching device are arranged on the adjusting mechanism, the supporting base comprises a supporting table board, two sides of the supporting table board are respectively connected with a left vertical board and a right vertical board, and the adjusting mechanism comprises an adjusting base and an adjusting screw mounting plate. The invention has simple structure, easy realization and lower cost; the method for shaping the pins of the direct-insertion type packaged integrated circuit is realized by utilizing the driving mechanism to drive the horizontal sliding table cylinder of the actuating mechanism to move back and forth, the vertical sliding table cylinder to move up and down and the elastic mechanism matching device on the front side to be matched.
Description
Technical Field
The invention belongs to the technical field of pin shaping of a direct-insert packaged integrated circuit, and particularly relates to a pin shaping device of the direct-insert packaged integrated circuit.
Background
The direct-insert type package Integrated Circuit (IC) package test is finished, and finally, the appearance of the IC package is required to be checked when the IC package reaches a terminal customer. The appearance inspection standard mainly aims at: 1. whether the main body is damaged, broken or deformed; 2. whether the pins are oxidized, rusted, fallen off and deformed or not; 3. whether the character to be brushed is fuzzy or not and falls off; 4. whether the positive and negative marks are correct or not. Especially, the probability of pin deformation is high due to the long pin, and thus, the characteristics of military industry, high-end resistor and capacitor, multiple batches and less quantization are determined, and automatic mass production operation cannot be realized. The deformation of the pins is finished manually, so that the efficiency is low, and the consistency after finishing is poor.
Reshaping an interposer packaged integrated circuit pin requires that the trimmed IC device not be exposed to secondary damage, such as: 1. the pin can not be scratched on the surface; 2. the packaging body can not be damaged, cracked or deformed; 3. antistatic treatment is required to prevent the damage to the inside of the IC device caused by electrostatic charge.
Once the quality problems occur, especially in the military industry, the quality accidents are serious quality accidents, which not only affect the image of an enterprise and bring economic damage, but also are degraded and penalized, and even worse, detection qualification is cancelled.
Disclosure of Invention
The invention aims to solve the defects of the prior art and provide the pin shaping equipment for the direct-insert type packaged integrated circuit, which solves the problems that the pin shaping of the direct-insert type packaged integrated circuit is time-consuming and labor-consuming in related production.
According to the technical scheme provided by the invention: the pin shaping equipment for the direct-insertion packaged integrated circuit comprises a supporting base, wherein an adjusting mechanism is installed on the supporting base, and an executing mechanism and an elastic baffle matching device are arranged on the adjusting mechanism.
As a further improvement of the invention, the supporting base comprises a supporting table top, and the two sides of the supporting table top are respectively connected with a left vertical plate and a right vertical plate.
As a further improvement of the invention, the adjusting mechanism comprises an adjusting base and an adjusting screw mounting plate, the adjusting base is placed on the supporting table top, the adjusting screw mounting plate is vertically mounted on the side surface of the supporting table top, the adjusting screw is mounted in the adjusting screw mounting plate in a threaded manner, the tail end of the adjusting screw is connected with the adjusting base in a threaded manner, the adjusting base is provided with an adjusting waist groove, the supporting table top is provided with a fixing screw hole, the fixing screw hole is positioned below the adjusting waist groove, an adjusting fastening screw is arranged in the adjusting waist groove, the tail part of the adjusting fastening screw enters the fixing screw hole, and the head part of the adjusting fastening screw is positioned above the adjusting waist groove.
As a further improvement of the invention, the actuating mechanism comprises a horizontal sliding table cylinder, the horizontal sliding table cylinder is arranged on the top surface of the supporting table surface, a shaping push plate is arranged on the side surface of the piston end of the horizontal sliding table cylinder, a connecting seat is arranged at the top part of the horizontal sliding table cylinder, a vertical sliding table cylinder is vertically arranged on the connecting seat, and the piston end of the vertical sliding table cylinder is vertically downward and is provided with a shaping press plate.
As a further improvement of the invention, the elastic baffle matching mechanism comprises a slider mounting seat, a slider mounting seat groove is formed in the support table top, the slider mounting seat is positioned in the slider mounting seat groove, the upper part of the slider mounting seat is mounted on the side surface of the support table top, a track is arranged in the middle of the slider mounting seat, a slider is slidably arranged on the track, an elastic baffle is mounted on the slider, a spring seat is fixedly arranged at the lower part of the slider mounting seat, and a spring is arranged between the spring seat and the elastic baffle.
As a further improvement of the invention, the bottom of the elastic baffle is provided with a spring guide hole, and the upper end of the spring is positioned in the spring guide hole.
As a further improvement of the invention, the actuating mechanism is provided with a power source by a driving mechanism; the driving mechanism comprises a mechanical valve and a pressure reducing valve, and the output end of the mechanical valve is communicated with the input end of the pressure reducing valve.
Compared with the prior art, the method has the following advantages:
the invention has simple structure, easy realization and lower cost; the method for shaping the pins of the direct-insertion type packaged integrated circuit is realized by utilizing the driving mechanism to drive the horizontal sliding table cylinder of the actuating mechanism to move back and forth and the vertical sliding table cylinder to move up and down to be matched with the elastic mechanism matching device on the front side.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the pin shaping device for an in-line package integrated circuit provided by the invention.
Fig. 2 is a schematic diagram of an execution mechanism of the in-line packaged integrated circuit pin shaping device provided by the invention.
Fig. 3 is a schematic structural diagram of a supporting base plate and an adjusting mechanism provided in the present invention.
Fig. 4 is a schematic structural diagram of the elastic mechanism provided in the present invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
Fig. 1-4 include a supporting base 10, a driving mechanism 20, an actuator 30, an adjusting mechanism 40, an elastic baffle plate matching device 50, etc.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover such processes, methods, systems, articles, or apparatus that comprise a list of steps or elements, are not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.
In the embodiment, the pin shaping device for the in-line packaged integrated circuit comprises a supporting base 10, wherein an adjusting mechanism 40 is installed on the supporting base 10, and an actuating mechanism 30 and an elastic baffle matching device 50 are arranged on the adjusting mechanism 40.
The actuator 30 is powered by the drive mechanism 20.
The supporting base 10 comprises a supporting table-board 12, and the two sides of the supporting table-board 12 are respectively connected with a left vertical board 11 and a right vertical board 13.
The adjusting mechanism 40 comprises an adjusting base 41 and an adjusting screw rod mounting plate 44, the adjusting base 41 is placed on the supporting table board 12, the adjusting screw rod mounting plate 44 is vertically installed on the side surface of the supporting table board 12, an adjusting screw rod 42 is installed in the adjusting screw rod mounting plate 44 in a threaded mode, the tail end of the adjusting screw rod 42 is connected with the adjusting base 41 in a threaded mode, adjusting waist grooves are formed in the two sides of the adjusting base 41, fixing screw holes are formed in the supporting table board 12 and located below the adjusting waist grooves, adjusting fastening screws 43 are arranged in the adjusting waist grooves, the tail portions of the adjusting fastening screws 43 enter the fixing screw holes, and the heads of the adjusting fastening screws 43 are located.
The head of the adjusting screw 42 abuts against the adjusting screw mounting plate 44, the adjusting base 41 can be driven to move through the thread structure by rotating the head of the adjusting screw 42, and when the adjusting screw 43 is moved in place, the head of the adjusting screw 43 is pressed against the adjusting waist groove by rotating the adjusting screw, so that the fixing of the supporting table top 12 and the adjusting base 41 is completed.
As shown in fig. 2, the actuator 30 includes a horizontal sliding table cylinder 35, the horizontal sliding table cylinder 35 is installed on the top surface of the supporting table 12, a shaping push plate 33 is installed on the side surface of the piston end of the horizontal sliding table cylinder 35, a connecting base 34 is installed on the top, a vertical sliding table cylinder 31 is vertically installed on the connecting base 34, the piston end of the vertical sliding table cylinder 31 is vertically downward, and a shaping press plate 32 is installed.
As shown in fig. 2 and 3, the driving mechanism 20 includes a mechanical valve 21 and a pressure reducing valve 22. The output end of the mechanical valve 21 is communicated with the input end of the pressure reducing valve 22, and the output end of the pressure reducing valve 22 is respectively communicated with the vertical sliding table cylinder 31 and the horizontal sliding table cylinder 35.
As shown in fig. 4, the elastic baffle fitting mechanism 50 includes a slider mounting seat 56, a slider mounting seat groove is opened on the support table 12, the slider mounting seat 56 is located in the slider mounting seat groove, the upper portion of the slider mounting seat 56 is installed on the side surface of the support table 12, a rail is arranged in the middle of the slider mounting seat 56, a slider 55 is slidably arranged on the rail, an elastic baffle 51 is installed on the slider 55, a spring seat 54 is fixedly arranged on the lower portion of the slider mounting seat 56, and a spring 53 is arranged between the spring seat 54 and the elastic baffle 51.
In order to prevent the spring 53 from being displaced, the elastic baffle 51 is provided at the bottom thereof with a spring guide hole in which the upper end of the spring 53 is located.
The installation working process of the invention is as follows:
fig. 1 is a schematic structural diagram of an in-line package integrated circuit pin shaping device according to an embodiment of the present invention, as shown in fig. 1, including: the integrated circuit pin shaping device comprises a supporting base 10, wherein a driving mechanism 20, an actuating mechanism 30, an adjusting mechanism 40 and an elastic baffle matching device 50 are arranged on the supporting base 10, the driving mechanism 20 is connected with the actuating mechanism 30, the actuating mechanism 30 is driven to work through the operation of a manipulator valve of the driving mechanism 20, a sliding table cylinder is driven by the manipulator valve to realize the mutual operation of the front-and-back movement of a shaping push plate and the up-and-down movement of a shaping press plate, and the shaping of pins of an alignment-insertion type packaging integrated circuit is realized through the matching of the elastic baffle.
According to the pin shaping equipment for the direct-insertion type packaged integrated circuit, the driving mechanism is utilized to drive the horizontal sliding table air cylinder of the actuating mechanism to realize the forward and backward movement of the shaping push plate and the vertical sliding table air cylinder to realize the up and down movement of the shaping press plate, and the elastic baffle plate matching device is matched to realize the method for shaping the pin of the direct-insertion type packaged integrated circuit.
Specifically, as shown in fig. 2 and 3, the driving mechanism 20 includes a mechanical valve 21 and a pressure reducing valve 22, the actuator 30 includes a vertical slide cylinder 31, a horizontal slide cylinder 35, a shaping pressing plate 32, a shaping pushing plate 33, and a connecting seat 34 of the slide cylinder, the vertical slide cylinder 31 and the horizontal slide cylinder 35 are connected to an output end of the pressure reducing valve 21, and the vertical slide cylinder 31 and the horizontal slide cylinder 35 are used for transmitting the driving force output by the pressure reducing valve 21 to the actuator.
It can be understood that according to the working principle of the sliding table cylinder, the pressure reducing valve 21 is used for providing constant driving force to drive the vertical sliding table cylinder to move up and down, the horizontal sliding table cylinder is driven to move back and forth, and the pin of the direct-plug type packaged integrated circuit is shaped by matching with the elastic baffle plate matching device.
Specifically, as shown in fig. 2, the actuator includes a vertical slide cylinder 31, a horizontal slide cylinder 35, a slide cylinder connecting seat 34, a shaping press plate 32 and a shaping push plate 33, and the vertical slide cylinder 31 and the horizontal slide cylinder 35 are driven by the mechanical valve to move up and down and back and forth.
More specifically, the driving mechanism further includes a pressure reducing valve 21, and the pressure reducing valve 21 is connected to output ends of the vertical sliding table cylinder 31 and the horizontal sliding table cylinder 35.
According to the operating principle of the sliding block and the spring, the spring is installed on the sliding block, the operating principle of the spring is utilized (the spring is deformed by compressing or stretching the spring, when the spring restores to the original shape, a force can be generated, so that the sliding block is operated to move up and down, the sliding blocks on two sides are connected through the connecting rod in order to ensure that the sliding blocks on the two sides move up and down uniformly, and the sliding blocks on the two sides drive the sliding block baffles installed on the sliding block to move up and down synchronously.
Specifically, as shown in fig. 4, the elastic baffle fitting mechanism 50 includes an elastic baffle 51, an elastic baffle connecting rod 52, a spring 53, a spring seat 54, a slider 55 and a slider mounting seat 56, the elastic baffle 51 is mounted on the slider 55, the slider 55 is mounted on the slider mounting seat 56, and the spring 53 is mounted on the spring seat 54 and connected with the elastic baffle 51.
It should be understood that the resilient latch mating mechanism 50 functions in two ways, 1 to provide for edge-to-edge pin alignment and 2 to facilitate picking and placing of the shaped in-line packaged integrated circuit.
Specifically, as shown in fig. 3, the supporting base 10 includes a left vertical plate 11, a right vertical plate 13 and a supporting table 12.
Specifically, as shown in fig. 3, the support base 10 is provided with an adjusting mechanism 40 in addition to the driving mechanism 20 and the actuator 30.
Specifically, as shown in fig. 3, the adjustment mechanism 40 includes an adjustment base 41, an adjustment screw 42, and an adjustment fastening screw 43.
It should be appreciated that the adjustment mechanism 40 functions to adjust the position of the actuator 30 so that the device can accommodate a greater variety of in-line packaged integrated circuit pin geometries.
Specifically, as shown in fig. 1 and 3, the driving mechanism 30 is mounted on the adjusting mechanism 40, the distance between the driving mechanisms on both sides is adjusted by rotating the adjusting screw 42, and the adjusting screw 43 is used for locking and fixing the driving mechanism after the adjustment is completed.
In summary, the in-line package integrated circuit pin shaping device provided by the embodiment of the invention realizes the trimming of the in-line package integrated circuit pin by driving the shaping push plate to move back and forth through the horizontal sliding table cylinder, driving the shaping press plate to move up and down through the vertical sliding table cylinder and cooperating with the elastic baffle mechanism.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (7)
1. An in-line package integrated circuit pin shaping equipment, characterized by: the equipment comprises a supporting base (10), wherein an adjusting mechanism (40) is installed on the supporting base (10), and an executing mechanism (30) and an elastic baffle matching device (50) are arranged on the adjusting mechanism (40).
2. The in-line packaged integrated circuit pin reshaping device of claim 1, wherein: the supporting base (10) comprises a supporting table board (12), and the two sides of the supporting table board (12) are respectively connected with a left vertical board (11) and a right vertical board (13).
3. The in-line packaged integrated circuit pin reshaping device of claim 2, wherein: adjustment mechanism (40) are including adjusting base (41) and adjusting screw mounting panel (44), it places to adjust base (41) support on mesa (12), adjusting screw mounting panel (44) vertical install in support mesa (12) side, screw thread installation adjusting screw (42) in adjusting screw mounting panel (44), adjusting screw (42) tail end threaded connection adjusting base (41), it has the adjustment waist groove to adjust base (41) to open, be equipped with fixed screw on support mesa (12), fixed screw is located adjustment waist groove below, be equipped with adjustment fastening screw (43) in the adjustment waist groove, adjustment fastening screw (43) afterbody gets into in the fixed screw, adjustment fastening screw (43) head is located adjustment waist groove top.
4. The in-line packaged integrated circuit pin reshaping device of claim 2, wherein: actuating mechanism (30) are including horizontal slip table cylinder (35), horizontal slip table cylinder (35) are installed support mesa (12) top surface, horizontal slip table cylinder (35) piston end side-mounting plastic push pedal (33), top erection joint seat (34), perpendicular slip table cylinder (31) of vertical installation on connecting seat (34), perpendicular slip table cylinder (34) piston end is vertical downwards to install plastic clamp plate (35).
5. The in-line packaged integrated circuit pin reshaping device of claim 2, wherein: the elastic baffle matching mechanism (50) comprises a slider mounting seat (56), a slider mounting seat groove is formed in the supporting table board (12), the slider mounting seat (56) is located in the slider mounting seat groove, the upper portion of the slider mounting seat (56) is mounted on the side face of the supporting table board (12), a track is arranged in the middle of the slider mounting seat (56), a slider (55) is arranged on the track in a sliding mode, an elastic baffle (51) is mounted on the slider (55), a spring seat (54) is fixedly arranged on the lower portion of the slider mounting seat (56), and a spring (53) is arranged between the spring seat (54) and the elastic baffle (51).
6. The in-line packaged integrated circuit pin reshaping device of claim 5, wherein: the bottom of the elastic baffle (51) is provided with a spring guide hole, and the upper end of the spring (53) is positioned in the spring guide hole.
7. The in-line packaged integrated circuit pin reshaping device of claim 1, wherein: the actuating mechanism (30) is provided with a power source by a driving mechanism (20); the driving mechanism (20) comprises a mechanical valve (21) and a pressure reducing valve (22), and the output end of the mechanical valve (21) is communicated with the input end of the pressure reducing valve (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011577888.7A CN112582310B (en) | 2020-12-28 | 2020-12-28 | Direct-insertion type packaging integrated circuit pin shaping equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011577888.7A CN112582310B (en) | 2020-12-28 | 2020-12-28 | Direct-insertion type packaging integrated circuit pin shaping equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112582310A true CN112582310A (en) | 2021-03-30 |
| CN112582310B CN112582310B (en) | 2024-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011577888.7A Active CN112582310B (en) | 2020-12-28 | 2020-12-28 | Direct-insertion type packaging integrated circuit pin shaping equipment |
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| CN (1) | CN112582310B (en) |
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|---|---|---|---|---|
| EP0405301A2 (en) * | 1989-06-29 | 1991-01-02 | Applied Materials, Inc. | Apparatus for handling semiconductor wafers |
| CN2609116Y (en) * | 2003-03-05 | 2004-03-31 | 上海Jvc电器有限公司 | Display screen for DVD optical disk player |
| CN101758031A (en) * | 2010-03-02 | 2010-06-30 | 王晓军 | Novel integrated circuit testing and sorting method and device thereof |
| CN202363435U (en) * | 2011-12-15 | 2012-08-01 | 苏州工业园区恒越自动化科技有限公司 | Pin-shaping device for automatically adjusting chip pins |
| CN104332428A (en) * | 2014-08-29 | 2015-02-04 | 中国科学院长春光学精密机械与物理研究所 | Chip pin shaping device and method based on laser thermal stress forming |
| CN104505356A (en) * | 2014-12-30 | 2015-04-08 | 常州银河电器有限公司 | Shaping device for SMD (surface mount device) diode |
| CN204332917U (en) * | 2014-12-30 | 2015-05-13 | 常州银河电器有限公司 | A kind of apparatus for shaping of stamp-mounting-paper diode |
| CN207557931U (en) * | 2017-10-27 | 2018-06-29 | 达丰（重庆）电脑有限公司 | Automatic plug test machine |
| CN209563141U (en) * | 2018-12-12 | 2019-10-29 | 深圳市运泰利自动化设备有限公司 | A kind of mechanism of pair of electronic component pin shaping |
| CN211529917U (en) * | 2019-11-27 | 2020-09-18 | 天津志臻自动化设备有限公司 | Semiconductor device shaping device |
-
2020
- 2020-12-28 CN CN202011577888.7A patent/CN112582310B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0405301A2 (en) * | 1989-06-29 | 1991-01-02 | Applied Materials, Inc. | Apparatus for handling semiconductor wafers |
| CN2609116Y (en) * | 2003-03-05 | 2004-03-31 | 上海Jvc电器有限公司 | Display screen for DVD optical disk player |
| CN101758031A (en) * | 2010-03-02 | 2010-06-30 | 王晓军 | Novel integrated circuit testing and sorting method and device thereof |
| CN202363435U (en) * | 2011-12-15 | 2012-08-01 | 苏州工业园区恒越自动化科技有限公司 | Pin-shaping device for automatically adjusting chip pins |
| CN104332428A (en) * | 2014-08-29 | 2015-02-04 | 中国科学院长春光学精密机械与物理研究所 | Chip pin shaping device and method based on laser thermal stress forming |
| CN104505356A (en) * | 2014-12-30 | 2015-04-08 | 常州银河电器有限公司 | Shaping device for SMD (surface mount device) diode |
| CN204332917U (en) * | 2014-12-30 | 2015-05-13 | 常州银河电器有限公司 | A kind of apparatus for shaping of stamp-mounting-paper diode |
| CN207557931U (en) * | 2017-10-27 | 2018-06-29 | 达丰（重庆）电脑有限公司 | Automatic plug test machine |
| CN209563141U (en) * | 2018-12-12 | 2019-10-29 | 深圳市运泰利自动化设备有限公司 | A kind of mechanism of pair of electronic component pin shaping |
| CN211529917U (en) * | 2019-11-27 | 2020-09-18 | 天津志臻自动化设备有限公司 | Semiconductor device shaping device |
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| Publication number | Publication date |
|---|---|
| CN112582310B (en) | 2024-03-19 |
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