CN205609569U - 覆有荧光体层的光半导体元件 - Google Patents

覆有荧光体层的光半导体元件 Download PDF

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Publication number
CN205609569U
CN205609569U CN201521063247.4U CN201521063247U CN205609569U CN 205609569 U CN205609569 U CN 205609569U CN 201521063247 U CN201521063247 U CN 201521063247U CN 205609569 U CN205609569 U CN 205609569U
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China
Prior art keywords
luminescent coating
led
clear layer
sealed
resin composition
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CN201521063247.4U
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English (en)
Chinese (zh)
Inventor
松田广和
常诚
吉田直子
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Epistar Corp
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Nitto Denko Corp
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Priority to CN201620978690.2U priority Critical patent/CN206003825U/zh
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  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201521063247.4U 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件 Active CN205609569U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620978690.2U CN206003825U (zh) 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014255110 2014-12-17
JP2014-255110 2014-12-17
JP2015-217792 2015-11-05
JP2015217792A JP2016119454A (ja) 2014-12-17 2015-11-05 蛍光体層被覆光半導体素子およびその製造方法

Related Child Applications (1)

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CN201620978690.2U Division CN206003825U (zh) 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件

Publications (1)

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CN205609569U true CN205609569U (zh) 2016-09-28

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CN201521063247.4U Active CN205609569U (zh) 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件
CN201620978690.2U Active CN206003825U (zh) 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件

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JP (1) JP2016119454A (ja)
CN (2) CN205609569U (ja)
TW (3) TW202027302A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6776859B2 (ja) * 2016-12-09 2020-10-28 日本電気硝子株式会社 波長変換部材の製造方法、波長変換部材及び発光デバイス
WO2019021926A1 (ja) * 2017-07-28 2019-01-31 東レ・ダウコーニング株式会社 光学部材用樹脂シート、それを備える光学部材、積層体又は発光デバイス、及び光学部材用樹脂シートの製造方法
CN112563382A (zh) * 2019-09-25 2021-03-26 昆山科技大学 白光发光二极管结构及其制造方法
JP7239840B2 (ja) 2020-08-31 2023-03-15 日亜化学工業株式会社 発光装置の製造方法
TWI789740B (zh) * 2021-04-13 2023-01-11 光感動股份有限公司 發光二極體封裝結構及發光二極體封裝結構製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5104490B2 (ja) * 2007-04-16 2012-12-19 豊田合成株式会社 発光装置及びその製造方法
JP5512515B2 (ja) * 2008-05-30 2014-06-04 シャープ株式会社 発光装置、面光源および液晶表示装置
JP2010183035A (ja) * 2009-02-09 2010-08-19 Toyoda Gosei Co Ltd 発光装置
JP2013115088A (ja) * 2011-11-25 2013-06-10 Citizen Holdings Co Ltd 半導体発光装置
KR102183516B1 (ko) * 2012-07-05 2020-11-27 루미리즈 홀딩 비.브이. 투명한 스페이서에 의해 ｌｅｄ로부터 분리된 인광체

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Publication number Publication date
TWI692126B (zh) 2020-04-21
TWM537717U (zh) 2017-03-01
TW201628219A (zh) 2016-08-01
CN206003825U (zh) 2017-03-08
JP2016119454A (ja) 2016-06-30
TW202027302A (zh) 2020-07-16

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C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180116

Address after: No. five, No. 5, Lixing Road, science and Industrial Park, Hsinchu, Taiwan, China

Patentee after: Jingyuan Optoelectronics Co., Ltd.

Address before: Osaka Japan

Patentee before: Nitto Denko Corp.