CN204442690U - Mems麦克风 - Google Patents
Mems麦克风 Download PDFInfo
- Publication number
- CN204442690U CN204442690U CN201520057434.5U CN201520057434U CN204442690U CN 204442690 U CN204442690 U CN 204442690U CN 201520057434 U CN201520057434 U CN 201520057434U CN 204442690 U CN204442690 U CN 204442690U
- Authority
- CN
- China
- Prior art keywords
- line plate
- wiring board
- solder joint
- glue hole
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003292 glue Substances 0.000 claims abstract description 48
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Micromachines (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520057434.5U CN204442690U (zh) | 2015-01-27 | 2015-01-27 | Mems麦克风 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520057434.5U CN204442690U (zh) | 2015-01-27 | 2015-01-27 | Mems麦克风 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204442690U true CN204442690U (zh) | 2015-07-01 |
Family
ID=53610500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520057434.5U Active CN204442690U (zh) | 2015-01-27 | 2015-01-27 | Mems麦克风 |
Country Status (1)
Country | Link |
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CN (1) | CN204442690U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106346154A (zh) * | 2015-07-17 | 2017-01-25 | 基胜工业(上海)有限公司 | 金属组件的焊接方法 |
CN108282731A (zh) * | 2018-03-07 | 2018-07-13 | 钰太芯微电子科技(上海)有限公司 | 一种声学传感器及微机电麦克风封装结构 |
CN111757230A (zh) * | 2020-08-31 | 2020-10-09 | 潍坊歌尔微电子有限公司 | Mems麦克风和电子设备 |
WO2022104930A1 (zh) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | 一种mems传感器 |
-
2015
- 2015-01-27 CN CN201520057434.5U patent/CN204442690U/zh active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106346154A (zh) * | 2015-07-17 | 2017-01-25 | 基胜工业(上海)有限公司 | 金属组件的焊接方法 |
CN108282731A (zh) * | 2018-03-07 | 2018-07-13 | 钰太芯微电子科技(上海)有限公司 | 一种声学传感器及微机电麦克风封装结构 |
CN108282731B (zh) * | 2018-03-07 | 2024-01-16 | 钰太芯微电子科技(上海)有限公司 | 一种声学传感器及微机电麦克风封装结构 |
CN111757230A (zh) * | 2020-08-31 | 2020-10-09 | 潍坊歌尔微电子有限公司 | Mems麦克风和电子设备 |
WO2022104930A1 (zh) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | 一种mems传感器 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
TR01 | Transfer of patent right |