CN204442690U - Mems microphone - Google Patents
Mems microphone Download PDFInfo
- Publication number
- CN204442690U CN204442690U CN201520057434.5U CN201520057434U CN204442690U CN 204442690 U CN204442690 U CN 204442690U CN 201520057434 U CN201520057434 U CN 201520057434U CN 204442690 U CN204442690 U CN 204442690U
- Authority
- CN
- China
- Prior art keywords
- line plate
- wiring board
- solder joint
- glue hole
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003292 glue Substances 0.000 claims abstract description 48
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Micromachines (AREA)
Abstract
The utility model discloses a kind of MEMS microphone, comprise the encapsulating structure of first line plate and the second wiring board composition, described second wiring board in described encapsulating structure is provided with MEMS acoustics chip and asic chip, the described first line plate of described encapsulating structure outside is provided with pad, described second wiring board is provided with acoustic aperture, be provided with between the power pad of described first line plate and output solder joint and lead glue hole, the glue of leading glue hole can fill the space around solder joint tin ball, increase the contact area of first line plate and the second wiring board, add the mechanical strength of solder joint, while effectively protecting solder joint, the firmness of wiring board welding can be increased, ensure that the stability of product function, improve the performance of product.The utility model microphone has resistance to pressure and stable performance, advantage that reliability is high.
Description
Technical field
The utility model relates to acoustic-electric product technical field, especially relates to a kind of MEMS microphone.
Background technology
Along with the progress of society and the development of technology, in recent years, the volume of the electronic products such as mobile phone, panel computer, notebook computer is more and more less, and the performance requirement of people to these electronic products is also more and more higher, thus also requires that the performance of the volume of electronic component supporting with it improves constantly.MEMS (Micro-Electro-Mechanical System, Micro Electro Mechanical System) microphone is energy converter voice signal being converted into the signal of telecommunication, it is the microphone manufactured based on MEMS technology, Surface Mount technique can be adopted to manufacture, and there is good noise removing performance and good radio frequency and electromagnetic interference rejection ability, MEMS microphone is widely used in portable with its above-mentioned advantage just.
The encapsulating structure of MEMS microphone generally comprises first line plate and the second wiring board, the structure that first line plate can be formed in one, also can form for circuit board structure pressing, on first line plate and the second wiring board, all correspondence is provided with solder joint, generally welded together by techniques such as Reflow Solderings, constitute the encapsulating structure holding MEMS acoustics chip and asic chip, but MEMS package structure is when being subject to external impacts, isolated solder joint tin ball easily ftractures, have impact on the performance of product, even cause product function to lose efficacy.
Therefore, be necessary to propose a kind of improvement, to overcome the defect of traditional MEMS microphone.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of MEMS microphone of function admirable.
To achieve these goals, the utility model is by the following technical solutions:
A kind of MEMS microphone, comprise the encapsulating structure of first line plate and the second wiring board composition, the described first line plate of described encapsulating structure outside is provided with pad, described second wiring board in described encapsulating structure is provided with MEMS acoustics chip and asic chip, described first line plate is provided with groove, form the cavity holding described MEMS acoustics chip and asic chip, described second wiring board is provided with acoustic aperture, described first line plate and the second wiring board are provided with the power pad and output solder joint that are welded to each other, and: be provided with between the described power pad of described first line plate and output solder joint and lead glue hole.
As a kind of excellent technical scheme, described in lead in glue hole and be filled with glue.
As a kind of excellent technical scheme, described in lead glue hole be column, and described in lead the described pad side of solder joint side to described first line plate of the non-through described first line plate in glue hole.
As a kind of excellent technical scheme, described in lead glue hole be column, and described in lead the described pad side of solder joint side to described first line plate of the through described first line plate in glue hole.
As a kind of excellent technical scheme, the inwall of described first line plate is provided with metal level, has insulating barrier in the arranged outside of metal level.
MEMS microphone of the present utility model, arrange between the power pad and output solder joint of first line plate and lead glue hole, leading glue hole is column, lead glue hole and can not be through to the side of first line plate solder joint to pad side, the inner injecting glue in glue hole was being led before first line plate and the second wiring board prepare to weld, the glue of leading glue hole after welding can flow out automatically, and the space around tin ball filled by glue, lead glue hole and also can run through first line plate solder joint side to pad side, while first line plate welds with the second wiring board, glue hole injecting glue is led from first line plate, glue can fill the space around tin ball, increase the bonding area of first line plate and the second wiring board, add the mechanical strength of solder joint, make the solder joint by glue wraps up can bear larger pressure and impulsive force, this design is while effectively protecting solder joint, the firmness of two wiring board welding can be increased, ensure that the stability of product function, improve the performance of product.Therefore, the utility model microphone there is resistance to pressure and stable performance, advantage that reliability is high.
Accompanying drawing explanation
Fig. 1 shows the structural representation of the utility model MEMS microphone first line plate and the second wiring board solder side.
Fig. 2 shows a kind of preferred embodiment along A-A line cutaway view in Fig. 1.
Fig. 3 shows the encapsulating structure schematic diagram of the MEMS microphone of Fig. 2 embodiment.
Fig. 4 shows the another kind of preferred embodiment along A-A line cutaway view in Fig. 1.
Fig. 5 shows the encapsulating structure schematic diagram of the MEMS microphone of Fig. 4 embodiment.
Embodiment
The technical problem solved to make the utility model, the technical scheme of employing, the technique effect easy to understand obtained, below in conjunction with concrete accompanying drawing, be described further embodiment of the present utility model.
As shown in Figure 1 to Figure 3, the utility model MEMS microphone comprises the encapsulating structure of first line plate 1 and the second wiring board 2 composition, described second wiring board 2 in described encapsulating structure is provided with MEMS acoustics chip 3 and asic chip 4, be electrically connected by the mode of metal lead wire 5 by routing between MEMS acoustics chip 3 and asic chip 4, described first line plate 1 is provided with groove, form the cavity holding described MEMS acoustics chip 3 and asic chip 4, the described first line plate 1 of described encapsulating structure is provided with pad 9, described first line plate 1 and the second wiring board 2 are provided with the power pad and output solder joint 7 that are welded to each other, described second wiring board 2 is provided with acoustic aperture 6, voice signal enters MEMS microphone inside by acoustic aperture 6, the change of MEMS acoustics chip 3 collected sound signal is also converted into the signal of telecommunication, the signal that MEMS acoustics chip 3 gathers is carried out preliminary treatment and is passed to external electronic circuits through described pad 9 by asic chip 4.
As shown in Figure 1, the first line plate 1 of the utility model MEMS microphone be provided with power pad and export solder joint 7, the centre position of two solder joints 7 is provided with leads glue hole 8, as shown in Figures 2 and 3, lead pad 9 side of solder joint 7 side to first line plate 1 that first line plate 1 is not run through in glue hole 8, the inner injecting glue in glue hole 8 was being led before first line plate 1 prepares to weld with the second wiring board 2, the glue of leading glue hole 8 after welding can flow out automatically, the space around tin ball filled by glue, increase the contact area of first line plate and the second wiring board, add the mechanical strength of solder joint, make the solder joint by glue wraps up can bear larger pressure and impulsive force.In addition, while effectively protecting solder joint, the firmness of wiring board welding can be increased, ensure that the stability of product function, improve the performance of product, there is resistance to pressure and stable performance, advantage that reliability is high.
As shown in Figure 4 and Figure 5, lead the side that the pad 9 of solder joint 7 to the first line plate 1 of first line plate 1 can also be run through in glue hole 8, while first line plate 1 welds with the second wiring board 2, glue hole 8 injecting glue is led from first line plate 1, equally, glue can fill the space around tin ball, increases the contact area of first line plate and the second wiring board, add the mechanical strength of solder joint, make the solder joint by glue wraps up can bear larger pressure and impulsive force.In addition, while effectively protecting solder joint, the firmness of wiring board welding can be increased, ensure that the stability of product function, improve the performance of product.
As shown in Figures 2 to 5, in order to prevent the chip in external environmental interference MEMS package, metal level can also be set on the inwall of described first line plate 1, such as copper product.Metal level is formed on the inwall of first line plate by techniques such as chemical vapour deposition (CVD), physical vapour deposition (PVD), plating, and this all belongs to the common practise of those skilled in the art.In the utility model, also be provided with insulating barrier 11 in the outside of described metal level, such as resin bed, arranging of this insulating barrier 14 can prevent when crossing Reflow Soldering, the scolding tin of weld zone swashes along inwall, causes the scolding tin due to weld zone to reduce the problem such as rosin joint, open circuit brought.
To sum up, in the utility model, in order to improve the properties of product of MEMS microphone, prevent the solder joint cracking that MEMS microphone causes because of the situation such as to be stressed, increase the unfailing performance of MEMS microphone, arrange between the power pad and output solder joint of the first line plate of MEMS microphone and lead glue hole, the glue of leading glue hole can fill the space around solder joint tin ball, increase the contact area of first line plate and the second wiring board, add the mechanical strength of solder joint, make the solder joint by glue wraps up can bear larger pressure and impulsive force.In addition, while effectively protecting solder joint, the firmness of wiring board welding can be increased, ensure that the stability of product function, improve the performance of product.The utility model microphone has resistance to pressure and stable performance, advantage that reliability is high.
Range of application of the present utility model is not limited to specific embodiment described above, those skilled in the art can according to practical application to lead glue hole size, shape and position adjust.
The utility model is by preferred embodiment having carried out detailed explanation.But, by studying carefully above, concerning the change of each execution mode with to increase be apparent for one of ordinary skill in the art.Being intended that these changes all and increasing of applicant has all dropped in scope that the utility model claim protects.
Claims (5)
1. a MEMS microphone, comprise the encapsulating structure of first line plate and the second wiring board composition, the described first line plate of described encapsulating structure outside is provided with pad, described second wiring board in described encapsulating structure is provided with MEMS acoustics chip and asic chip, described first line plate is provided with groove, form the cavity holding described MEMS acoustics chip and asic chip, described second wiring board is provided with acoustic aperture, described first line plate and the second wiring board are provided with the power pad and output solder joint that are welded to each other, it is characterized in that: be provided with between the described power pad of described first line plate and output solder joint and lead glue hole.
2. MEMS microphone according to claim 1, is characterized in that: described in lead in glue hole and be filled with glue.
3. MEMS microphone according to claim 2, is characterized in that: described in lead glue hole be column, and described in lead the described pad side of solder joint side to described first line plate of the non-through described first line plate in glue hole.
4. MEMS microphone according to claim 2, is characterized in that: described in lead glue hole be column, and described in lead the described pad side of solder joint side to described first line plate of the through described first line plate in glue hole.
5. the MEMS microphone according to the arbitrary claim of Claims 1-4, is characterized in that: on the inwall of described first line plate, be provided with metal level, have insulating barrier in the arranged outside of metal level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520057434.5U CN204442690U (en) | 2015-01-27 | 2015-01-27 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520057434.5U CN204442690U (en) | 2015-01-27 | 2015-01-27 | Mems microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204442690U true CN204442690U (en) | 2015-07-01 |
Family
ID=53610500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520057434.5U Active CN204442690U (en) | 2015-01-27 | 2015-01-27 | Mems microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204442690U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106346154A (en) * | 2015-07-17 | 2017-01-25 | 基胜工业(上海)有限公司 | Metal assembly welding method |
| CN108282731A (en) * | 2018-03-07 | 2018-07-13 | 钰太芯微电子科技（上海）有限公司 | A kind of acoustic sensor and micro-electro-mechanical microphone packaging structure |
| CN111757230A (en) * | 2020-08-31 | 2020-10-09 | 潍坊歌尔微电子有限公司 | MEMS microphone and electronic equipment |
| WO2022104930A1 (en) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems sensor |
-
2015
- 2015-01-27 CN CN201520057434.5U patent/CN204442690U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106346154A (en) * | 2015-07-17 | 2017-01-25 | 基胜工业(上海)有限公司 | Metal assembly welding method |
| CN108282731A (en) * | 2018-03-07 | 2018-07-13 | 钰太芯微电子科技（上海）有限公司 | A kind of acoustic sensor and micro-electro-mechanical microphone packaging structure |
| CN108282731B (en) * | 2018-03-07 | 2024-01-16 | 钰太芯微电子科技（上海）有限公司 | Acoustic sensor and micro-electromechanical microphone packaging structure |
| CN111757230A (en) * | 2020-08-31 | 2020-10-09 | 潍坊歌尔微电子有限公司 | MEMS microphone and electronic equipment |
| WO2022104930A1 (en) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |