CN204011414U - 具有热沉结构的led钨丝灯支架 - Google Patents

具有热沉结构的led钨丝灯支架 Download PDF

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Publication number
CN204011414U
CN204011414U CN201420358935.2U CN201420358935U CN204011414U CN 204011414 U CN204011414 U CN 204011414U CN 201420358935 U CN201420358935 U CN 201420358935U CN 204011414 U CN204011414 U CN 204011414U
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led
support body
positive wire
left end
led support
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周文彬
林小接
邓烨
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JIANGXI JINGKE ELECTRONICS Co Ltd
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JIANGXI JINGKE ELECTRONICS Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种具有热沉结构的LED钨丝灯支架，包括用铜材基板制成的LED支架体，特征是：在LED支架体的左端固定有左焊盘和负极引线，在LED支架体的右端固定有右焊盘和正极引线，在LED支架体的外表面通过固晶底胶粘接有若干片LED芯片，在右焊盘的外表面中间设有一个由塑胶形成的中空功能区，LED支架体的右端和正极引线的左端分别伸入到中空功能区的左端和中部，且正极引线的左端与LED支架体的右端呈间隔相对放置，留有间隙，最右端的LED芯片的阳极通过金线与正极引线的正极引线焊点连接。本实用新型具有化生产工序、提高生产效率、提高产品散热性能、保障光源的可靠性、玻璃基板和支架之间粘接牢固等优点。

Description

具有热沉结构的LED钨丝灯支架
技术领域
本实用新型涉及LED钨丝灯丝生产，尤其是涉及一种具有热沉结构的LED钨丝灯支架。
背景技术
在生产常规LED钨丝灯，按照LED钨丝灯的灯丝的结构及生产工艺要求，要在支架的引线端点银胶，在治具对蓝宝石基板和支架定位后，让银胶、蓝宝石基板和金属支架有效结合，经过银胶的固化，使玻璃基板和支架完全粘接。但这种生产工艺比较繁琐，在生产过程中，容易出现玻璃基板和支架错位、脱落等现象。
发明内容
本实用新型的目的在于提供一种简化生产工序、提高生产效率、提高产品散热性能、保障光源的可靠性、玻璃基板和支架之间粘接牢固的具有热沉结构的LED钨丝灯支架。
本实用新型的目的是这样实现的：
一种具有热沉结构的LED钨丝灯支架，包括用铜材基板制成的LED支架体，特征是：在LED支架体的左端从右向左设有LED芯片固晶区、左焊盘和负极引线，在LED支架体的右端从左向右固定有右焊盘和正极引线，在LED支架体的外表面通过固晶底胶粘接有若干颗LED芯片，相邻两颗LED芯片之间通过金线串联在一起，最左端的LED芯片的阴极通过金线与负极引线连接，最右端的LED芯片的阳极通过金线与正极引线连接，在右焊盘的外表面中间设有一个由塑胶形成的中空功能区，LED支架体的右端伸入到中空功能区的左端，正极引线的左端伸入到中空功能区的中部，且正极引线的左端与LED支架体的右端呈间隔相对放置，留有间隙，在正极引线的左端上面设有正极引线焊点，最右端的LED芯片的阳极通过金线与正极引线的正极引线焊点连接。
在LED支架体的外表面和若干片LED芯片的上面涂覆有透明硅胶，使得LED支架体变成为长条形的LED光源。
在正极引线伸入到中空功能区的部分设有半圆弧。
本实用新型由于在常规LED支架体的基础上增设了由塑胶形成的中空功能区，在中空功能区中正极引线的左端与LED支架体的右端呈间隔相对放置，留有间隙，并置于一体化平面上，构成了热沉结构。本实用新型该采用热沉结构，相对玻璃基板粘接支架，免去了粘接工艺，简化了工序，提高了效率。由于LED钨丝灯在封装中对散热和出光的要求很高，LED芯片在通电后产生的热量必须及时地散出，以保持PN结的温度在允许范围内，本实用新型利用铜材较高的导热系数（铜材的导热系数为：280W/m-k，几乎接近银的导热系数，成本相对银要低很多）， 用铜材基板制成LED支架体，将LED芯片通过固晶底胶粘接在靠近负极引线这边的LED支架体上，采用阶梯型导热结构，将芯片的热能高效导出，这样就有利于LED芯片产生的热量通过热沉结构传递到光源以外的载体上，从而提高产品的散热性能，保证了光的稳定输出，保障了光源的可靠性。
因此，本实用新型具有化生产工序、提高生产效率、提高产品散热性能、保障光源的可靠性、玻璃基板和支架之间粘接牢固、制作简单、成本低廉的优点。
附图说明
图1为本实用新型的结构示意图；
图2为图1未涂覆透明硅胶的示意图；
图3为图2中A区域的放大示意图。
具体实施方式
下面结合实施例并对照附图对本实用新型作进一步详细说明。
一种具有热沉结构的LED钨丝灯支架，包括用铜材基板制成的LED支架体1，在LED支架体1的左端从右向左固定有左焊盘9和负极引线6，在LED支架体1的右端从左向右固定有右焊盘7和正极引线5，在LED支架体1的外表面通过固晶底胶8粘接有若干片LED芯片2，相邻两块LED芯片2之间通过金线3串联在一起，最左端的LED芯片2的阴极通过金线3与负极引线6连接，在右焊盘7的外表面中间设有一个由塑胶形成的中空功能区11，LED支架体1的右端伸入到中空功能区11的左端，正极引线5的左端伸入到中空功能区11的中部，且正极引线5的左端与LED支架体`的右端呈间隔相对放置并留有间隙13，在正极引线5的左端上面设有正极引线焊点12，最右端的LED芯片2的阳极通过金线3与正极引线7的正极引线焊点12连接。
在LED支架体1的外表面和若干片LED芯片2的上面涂覆有透明硅胶4，使得LED支架体1变成为长条形的LED光源。
在正极引线5伸入到中空功能区11的部分设有半圆弧10。

Claims (3)

1.一种具有热沉结构的LED钨丝灯支架，包括用铜材基板制成的LED支架体，其特征在于：在LED支架体的左端从右向左固定有左焊盘和负极引线，在LED支架体的右端从左向右固定有右焊盘和正极引线，在LED支架体的外表面通过固晶底胶粘接有若干颗LED芯片，相邻两块LED芯片之间通过金线串联在一起，最左端的LED芯片的阴极通过金线与负极引线连接，最右端的LED芯片的阳极通过金线与正极引线连接，在右焊盘的外表面中间设有一个由塑胶形成的中空功能区，LED支架体的右端伸入到中空功能区的左端，正极引线的左端伸入到中空功能区的中部，且正极引线的左端与LED支架体的右端呈间隔相对放置，留有间隙，在正极引线的左端上面设有正极引线焊点，最右端的LED芯片的阳极通过金线与正极引线的正极引线焊点连接。
2.根据权利要求1所述的LED钨丝灯支架，其特征在于：在LED支架体的外表面和若干颗LED芯片的上面涂覆有透明硅胶，使得LED支架体变成为长条形的LED光源。
3.根据权利要求1所述的LED钨丝灯支架，其特征在于：在正极引线伸入到中空功能区的部分设有半圆弧。
CN201420358935.2U 2014-07-01 2014-07-01 具有热沉结构的led钨丝灯支架 Expired - Fee Related CN204011414U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106287339A (zh) * 2015-06-10 2017-01-04 嘉兴山蒲照明电器有限公司 Led球泡灯

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106287339A (zh) * 2015-06-10 2017-01-04 嘉兴山蒲照明电器有限公司 Led球泡灯

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