CN103972364A - 一种led光源的制造方法 - Google Patents
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
一种LED光源的制造方法，其特征是依次包括如下工艺步骤：（a）用透明材料制造表面带有凹槽的底板；（b）在凹槽的底部涂荧光胶；（c）将LED芯片固定在凹槽底部的荧光胶上；（d）用金属线将LED芯片的电极串接；（e）在LED芯片和金属线上涂荧光胶。本发明简化了传统LED光源的制造流程，减少了材料使用。
Description
技术领域
本发明涉及LED光源领域，特别涉及一种LED光源的制造方法。
背景技术
LED是一种半导体光源，具有节能、体积小、寿命长等等优点，近年来逐步替代传统白炽灯，将成为今后主要的照明光源。
目前制造LED光源的方法有以下2种：方法1，将LED芯片封装成插件或者是贴片的灯珠，再将灯珠、电路板、散热器、电源、外壳等材料组装成LED灯；方法2，直接将LED芯片固定在带有印刷电路层的金属或陶瓷基板上，再焊线、点胶、固化成LED发光模块，再将LED发光模块与电路板、散热器、电源、外壳等材料组装成LED灯；方法1制造LED灯需要采用灯珠封装和LED灯组装两个封装流程，工艺流程多、成本高、散热设计复杂；方法2制造LED灯虽然省去了LED灯珠封装环节，但多了带电路板印刷层的铝基板（或陶瓷基板）制造流程，工艺流程也有点多、仍然需要散热器、成本也偏高。
发明内容
本发明为克服现有技术的不足，提供了一种LED光源的制造方法，该方法适用于大批量制造LED灯。
本发明的技术方案是依次包括如下工艺步骤：
（a）用透明材料制造表面带有凹槽的底板；
（b）在凹槽的底部涂荧光胶；
（c）将一列或多列LED芯片固定在凹槽底部的荧光胶上；
（d）用金线将LED芯片的电极串连联接；
（e）在LED芯片和金线上涂荧光胶。
本发明的有益效果是：采用一块透明材料（例如玻璃）既用于LED芯片固晶、焊线的基板、同时又是LED芯片的散热片，同时还是LED灯的外壳，不仅降低了材料成本，还简化了生产工艺流程。
附图说明
图1 为本发明LED光源模块的结构示意图；
图2为图1中LED光源模块的剖视图；
图3为根据本发明方案制造的一种LED球泡灯示意图；
图4为图3中根据本发明方案制造的一种LED球泡灯示意图的局部剖视图；
图5为图3中根据本发明方案制造的一种LED球泡灯示意图的侧视图。
具体实施方式
图1、图2分别是本发明LED光源模块的结构示意图和剖视图，图1所示为制造完成后的示意图，可看见表面的的玻璃板1和与玻璃板1凹槽表面的荧光胶5；图2所示A-A方向剖视图可见本发明LED光源模块的内部结构，根据图2所示将本发明所述的的制造方法描述如下：
（a）用玻璃铸造带有凹槽的玻璃板1；
（b）在玻璃板1的凹槽底部涂荧光胶4；
（c）将一列LED芯片2（一般使用蓝光芯片）等间隔固定在荧光胶4上；
（d）用金线3将LED芯片2的电极串连联接；
（e）在LED芯片2和金线3上再涂一层荧光胶5。
图3～图5所示是采用本发明的制造方法生产的一种LED灯的示意图，其中图3是正视图、图5是侧视图、图4是图3的局部剖视图；图3中LED灯由灯头8、塑胶连接件7、玻璃板1、LED灯丝6等几个部分组成；从图4所示的图3中LED灯丝6的局部剖视图可以看出，这种球泡灯的主要组成部分玻璃板1和LED灯丝6是采用本发明所述的方法制造的，具体制造方法描述如下：
S1，铸造带有凹槽的梨形玻璃板1；
S2，在玻璃板1的凹槽底部涂一层荧光胶4；
S3，可选步骤：采用加温或者光固等方法快速固化荧光胶4；
S4，在荧光胶4上等间隔地固上蓝光LED芯片2；
S4，用金线3将蓝光LED芯片2电极串连焊接；
S5，在蓝光LED芯片2和金线3上再涂一层荧光胶5；
S6，可选步骤：采用加温或者光固等方法快速固化荧光胶5；
S7，将灯头8、塑胶连接件7、玻璃板1、及上述S2～S6步骤制造的LED灯丝6等部件组装成如图3所示的LED灯；
S8，可选步骤：根据需要，图3所示LED灯可加入电源模块。
Claims (3)
1.一种LED光源的制造方法，其特征是依次包括如下工艺步骤：
（a）用透明材料制造表面带有凹槽的基板；
（b）在基板的凹槽底部涂荧光胶；
（c）将LED芯片固定在凹槽底部的荧光胶上；
（d）用金属线将LED芯片的电极联接；
（e）在LED芯片和金属线上涂荧光胶。
2.根据权利要求1所述的一种LED光源的制造方法，其特征是：步骤（a）中所述透明材料可以是玻璃或者树脂，表面的凹槽可以铸造成型。
3.根据权利要求1所述的一种LED光源的制造方法，其特征是：步骤（b）、步骤（c）、步骤（e）中所述荧光胶可以用荧光粉和环氧树脂混合而成。
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Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105849919A (zh) * | 2014-06-20 | 2016-08-10 | 福建永德吉灯业股份有限公司 | 可直视led发光元件 |
| GB2547085A (en) * | 2015-12-19 | 2017-08-09 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED filament |
| GB2543139B (en) * | 2015-08-17 | 2018-05-23 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED light bulb and LED filament thereof |
| US9995474B2 (en) | 2015-06-10 | 2018-06-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament, LED filament assembly and LED bulb |
| US10240724B2 (en) | 2015-08-17 | 2019-03-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
| US10473271B2 (en) | 2015-08-17 | 2019-11-12 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament module and LED light bulb |
| US10487987B2 (en) | 2015-08-17 | 2019-11-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| US10544905B2 (en) | 2014-09-28 | 2020-01-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10677396B2 (en) | 2006-07-22 | 2020-06-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with symmetrical filament |
| US10784428B2 (en) | 2014-09-28 | 2020-09-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US10790420B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Light bulb with a symmetrical LED filament |
| US10790419B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US10794545B2 (en) | 2014-09-28 | 2020-10-06 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with segmented LED filament |
| US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US10982817B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with a flexible LED filament |
| US10982816B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having uniform light emmision |
| US11015764B2 (en) | 2014-09-28 | 2021-05-25 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with flexible LED filament having perpendicular connecting wires |
| US11073248B2 (en) | 2014-09-28 | 2021-07-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US11085591B2 (en) | 2014-09-28 | 2021-08-10 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11168844B2 (en) | 2015-08-17 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with segmented light conversion layer |
| US11259372B2 (en) | 2015-06-10 | 2022-02-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd | High-efficiency LED light bulb with LED filament therein |
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
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| US20120261692A1 (en) * | 2011-04-12 | 2012-10-18 | Hon Hai Precision Industry Co., Ltd. | Led package structure |
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| CN105849919A (zh) * | 2014-06-20 | 2016-08-10 | 福建永德吉灯业股份有限公司 | 可直视led发光元件 |
| US11168845B2 (en) | 2014-09-28 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having muti-section bending filament |
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