CN1947231B - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
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- CN1947231B CN1947231B CN2005800125504A CN200580012550A CN1947231B CN 1947231 B CN1947231 B CN 1947231B CN 2005800125504 A CN2005800125504 A CN 2005800125504A CN 200580012550 A CN200580012550 A CN 200580012550A CN 1947231 B CN1947231 B CN 1947231B
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- pad
- metal
- wiring
- layer
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 168
- 229910052751 metal Inorganic materials 0.000 claims abstract description 246
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
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- 239000010937 tungsten Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
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- 229910000838 Al alloy Inorganic materials 0.000 description 1
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- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- 229910052799 carbon Inorganic materials 0.000 description 1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP051486/2004 | 2004-02-26 | ||
JP2004051486A JP2005243907A (ja) | 2004-02-26 | 2004-02-26 | 半導体装置 |
PCT/JP2005/002801 WO2005083767A1 (ja) | 2004-02-26 | 2005-02-22 | 半導体装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101815998A Division CN101459172B (zh) | 2004-02-26 | 2005-02-22 | 半导体器件 |
CN2010101680019A Division CN101819956B (zh) | 2004-02-26 | 2005-02-22 | 半导体器件 |
Publications (2)
Publication Number | Publication Date |
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CN1947231A CN1947231A (zh) | 2007-04-11 |
CN1947231B true CN1947231B (zh) | 2010-06-23 |
Family
ID=34908632
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101680019A Active CN101819956B (zh) | 2004-02-26 | 2005-02-22 | 半导体器件 |
CN2008101815998A Active CN101459172B (zh) | 2004-02-26 | 2005-02-22 | 半导体器件 |
CN2005800125504A Active CN1947231B (zh) | 2004-02-26 | 2005-02-22 | 半导体器件 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
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CN2010101680019A Active CN101819956B (zh) | 2004-02-26 | 2005-02-22 | 半导体器件 |
CN2008101815998A Active CN101459172B (zh) | 2004-02-26 | 2005-02-22 | 半导体器件 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7701063B2 (zh) |
JP (2) | JP2005243907A (zh) |
KR (1) | KR101127893B1 (zh) |
CN (3) | CN101819956B (zh) |
TW (1) | TWI397135B (zh) |
WO (1) | WO2005083767A1 (zh) |
Cited By (1)
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US8178981B2 (en) | 2004-02-26 | 2012-05-15 | Renesas Electronics Corporation | Semiconductor device |
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- 2005-02-22 US US10/590,276 patent/US7701063B2/en active Active
- 2005-02-22 WO PCT/JP2005/002801 patent/WO2005083767A1/ja active Application Filing
- 2005-02-22 CN CN2008101815998A patent/CN101459172B/zh active Active
- 2005-02-22 CN CN2005800125504A patent/CN1947231B/zh active Active
- 2005-02-22 JP JP2006510418A patent/JPWO2005083767A1/ja active Pending
- 2005-02-22 KR KR1020067017116A patent/KR101127893B1/ko active IP Right Grant
- 2005-02-24 TW TW094105538A patent/TWI397135B/zh active
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2010
- 2010-03-02 US US12/715,925 patent/US8178981B2/en active Active
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8178981B2 (en) | 2004-02-26 | 2012-05-15 | Renesas Electronics Corporation | Semiconductor device |
CN101819956B (zh) * | 2004-02-26 | 2012-07-04 | 瑞萨电子株式会社 | 半导体器件 |
Also Published As
Publication number | Publication date |
---|---|
WO2005083767A1 (ja) | 2005-09-09 |
CN1947231A (zh) | 2007-04-11 |
KR20060126572A (ko) | 2006-12-07 |
KR101127893B1 (ko) | 2012-03-21 |
TWI397135B (zh) | 2013-05-21 |
US8178981B2 (en) | 2012-05-15 |
CN101819956A (zh) | 2010-09-01 |
CN101819956B (zh) | 2012-07-04 |
JPWO2005083767A1 (ja) | 2007-11-29 |
JP2005243907A (ja) | 2005-09-08 |
CN101459172A (zh) | 2009-06-17 |
US20100155960A1 (en) | 2010-06-24 |
TW200534415A (en) | 2005-10-16 |
US20070182001A1 (en) | 2007-08-09 |
US7701063B2 (en) | 2010-04-20 |
CN101459172B (zh) | 2013-06-12 |
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