CN1945434B - 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板 - Google Patents
光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板 Download PDFInfo
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- CN1945434B CN1945434B CN2006101404506A CN200610140450A CN1945434B CN 1945434 B CN1945434 B CN 1945434B CN 2006101404506 A CN2006101404506 A CN 2006101404506A CN 200610140450 A CN200610140450 A CN 200610140450A CN 1945434 B CN1945434 B CN 1945434B
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- solidifying
- resin
- resin composition
- carboxylic acid
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-290765 | 2005-10-04 | ||
JP2005290765 | 2005-10-04 | ||
JP2005290765A JP4849860B2 (ja) | 2005-10-04 | 2005-10-04 | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1945434A CN1945434A (zh) | 2007-04-11 |
CN1945434B true CN1945434B (zh) | 2010-05-12 |
Family
ID=38028841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006101404506A Active CN1945434B (zh) | 2005-10-04 | 2006-10-08 | 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4849860B2 (zh) |
KR (1) | KR100787325B1 (zh) |
CN (1) | CN1945434B (zh) |
TW (1) | TW200727078A (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4975579B2 (ja) * | 2007-10-01 | 2012-07-11 | 太陽ホールディングス株式会社 | 組成物、ドライフィルム、硬化物及びプリント配線板 |
JP5513711B2 (ja) * | 2007-10-01 | 2014-06-04 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物 |
JP5376793B2 (ja) * | 2007-11-07 | 2013-12-25 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
JP5449688B2 (ja) * | 2008-03-26 | 2014-03-19 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
KR101612569B1 (ko) * | 2008-03-28 | 2016-04-14 | 다이요 홀딩스 가부시키가이샤 | 경화성 수지 조성물과 그의 경화물, 및 인쇄 배선판 |
JP2009239181A (ja) * | 2008-03-28 | 2009-10-15 | Taiyo Ink Mfg Ltd | プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板 |
CN102199273B (zh) * | 2010-03-25 | 2014-07-09 | 株式会社艾迪科 | 光固化树脂和使用该树脂的分散剂 |
JP6084353B2 (ja) * | 2010-12-28 | 2017-02-22 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法 |
JP5660690B2 (ja) * | 2013-08-02 | 2015-01-28 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物 |
WO2016117237A1 (ja) * | 2015-01-21 | 2016-07-28 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
JP6892668B2 (ja) * | 2016-10-14 | 2021-06-23 | 互応化学工業株式会社 | 感光性樹脂組成物 |
JP7109186B2 (ja) * | 2017-12-27 | 2022-07-29 | 株式会社Dnpファインケミカル | ウレタン(メタ)アクリレート系組成物、活性エネルギー線重合性組成物、及び積層体 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1155890A (zh) * | 1995-06-06 | 1997-07-30 | 日本油脂株式会社 | 热固性组合物,涂覆方法和涂覆制品 |
US20020098440A1 (en) * | 1999-01-27 | 2002-07-25 | Kenichiro Sato | Positive photoresist composition for far ultraviolet ray exposure |
CN1364247A (zh) * | 1999-05-06 | 2002-08-14 | 太阳油墨制造株式会社 | 焊锡抗蚀剂油墨组合物 |
CN1396937A (zh) * | 2000-01-18 | 2003-02-12 | 太阳油墨制造株式会社 | 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物 |
CN1420998A (zh) * | 2000-03-29 | 2003-05-28 | 学校法人神奈川大学 | 光固化性·热固化性树脂组合物、其感光性干薄膜及使用其的图型形成方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61272A (ja) * | 1984-06-12 | 1986-01-06 | Taiyo Ink Seizo Kk | インキ組成物 |
JPH0717737B2 (ja) * | 1987-11-30 | 1995-03-01 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
JP2684948B2 (ja) * | 1993-02-03 | 1997-12-03 | 株式会社日本触媒 | 液状感光性樹脂組成物 |
JP2003076015A (ja) * | 2001-09-07 | 2003-03-14 | Nichigo Morton Co Ltd | 感光性樹脂組成物及びそれを用いたドライフィルム |
JP4328593B2 (ja) * | 2003-09-18 | 2009-09-09 | 太陽インキ製造株式会社 | カルボキシル基含有感光性樹脂を含有する組成物 |
JP4309225B2 (ja) * | 2003-10-14 | 2009-08-05 | 太陽インキ製造株式会社 | 硬化性組成物、その硬化物及びそれを用いたプリント配線板 |
JP3912405B2 (ja) * | 2003-11-11 | 2007-05-09 | 三菱化学株式会社 | 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置 |
JP4489566B2 (ja) * | 2003-11-27 | 2010-06-23 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、その硬化物、およびプリント配線板 |
TW200519535A (en) * | 2003-11-27 | 2005-06-16 | Taiyo Ink Mfg Co Ltd | Hardenable resin composition, hardened body thereof, and printed circuit board |
JP4815952B2 (ja) * | 2005-08-26 | 2011-11-16 | Jsr株式会社 | 重合体、カラーフィルタ用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル |
-
2005
- 2005-10-04 JP JP2005290765A patent/JP4849860B2/ja active Active
-
2006
- 2006-09-25 TW TW095135391A patent/TW200727078A/zh unknown
- 2006-09-29 KR KR1020060095264A patent/KR100787325B1/ko active IP Right Grant
- 2006-10-08 CN CN2006101404506A patent/CN1945434B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1155890A (zh) * | 1995-06-06 | 1997-07-30 | 日本油脂株式会社 | 热固性组合物,涂覆方法和涂覆制品 |
US20020098440A1 (en) * | 1999-01-27 | 2002-07-25 | Kenichiro Sato | Positive photoresist composition for far ultraviolet ray exposure |
CN1364247A (zh) * | 1999-05-06 | 2002-08-14 | 太阳油墨制造株式会社 | 焊锡抗蚀剂油墨组合物 |
CN1396937A (zh) * | 2000-01-18 | 2003-02-12 | 太阳油墨制造株式会社 | 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物 |
CN1420998A (zh) * | 2000-03-29 | 2003-05-28 | 学校法人神奈川大学 | 光固化性·热固化性树脂组合物、其感光性干薄膜及使用其的图型形成方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI336026B (zh) | 2011-01-11 |
CN1945434A (zh) | 2007-04-11 |
JP2007101830A (ja) | 2007-04-19 |
JP4849860B2 (ja) | 2012-01-11 |
KR20070037998A (ko) | 2007-04-09 |
TW200727078A (en) | 2007-07-16 |
KR100787325B1 (ko) | 2007-12-21 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: TAIYO HOLDINGS CO., LTD. Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: Taiyo Holding Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Taiyo Ink Manufacturing Co., Ltd. |
|
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070411 Assignee: Taiyo Ink Mfg.Co., Ltd. Assignor: Taiyo Holding Co., Ltd. Contract record no.: 2011990000116 Denomination of invention: Photohardenable and thermosetting resin compositions, their hardened product, and printing circuit boards using the same Granted publication date: 20100512 License type: Common License Record date: 20110302 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model |