TW200519535A - Hardenable resin composition, hardened body thereof, and printed circuit board - Google Patents
Hardenable resin composition, hardened body thereof, and printed circuit boardInfo
- Publication number
- TW200519535A TW200519535A TW093135867A TW93135867A TW200519535A TW 200519535 A TW200519535 A TW 200519535A TW 093135867 A TW093135867 A TW 093135867A TW 93135867 A TW93135867 A TW 93135867A TW 200519535 A TW200519535 A TW 200519535A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- hardenable resin
- circuit board
- printed circuit
- hardened body
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
Abstract
The purpose of the present invention is to provide a hardenable resin composition which can have superior surface hardenable property by irradiation with an active energy beam of 350 to 420 nm in wavelength. The hardenable resin composition contains: a compound (A) having at least one unsaturated double bond; a compound (B) having an oxime ester group; and a benzophenone compound (C ) containing sulfur atoms and hardened with an active energy beam of 350 to 420 nm in wavelength.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003398088 | 2003-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200519535A true TW200519535A (en) | 2005-06-16 |
Family
ID=36769928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093135867A TW200519535A (en) | 2003-11-27 | 2004-11-22 | Hardenable resin composition, hardened body thereof, and printed circuit board |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4865044B2 (en) |
KR (1) | KR101048940B1 (en) |
CN (1) | CN1779568B (en) |
TW (1) | TW200519535A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI402619B (en) * | 2007-03-29 | 2013-07-21 | Tokyo Ohka Kogyo Co Ltd | A coloring photosensitive resin composition, a black matrix, a color filter, and a liquid crystal display |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4849860B2 (en) * | 2005-10-04 | 2012-01-11 | 太陽ホールディングス株式会社 | Photocurable / thermosetting resin composition, cured product thereof, and printed wiring board obtained using the same |
KR100781873B1 (en) * | 2006-01-02 | 2007-12-05 | 주식회사 엘지화학 | Photoactive oxime ester based compounds and photosensitive composition comprising the same |
JP4864545B2 (en) * | 2006-05-26 | 2012-02-01 | 太陽ホールディングス株式会社 | Thermosetting solder resist composition for flexible substrate, flexible substrate and method for producing flexible substrate |
KR100904348B1 (en) * | 2006-10-24 | 2009-06-23 | 다이요 잉키 세이조 가부시키가이샤 | Photocurable thermosetting resin composition and printed wiring board using same |
JP5079310B2 (en) * | 2006-11-15 | 2012-11-21 | 太陽ホールディングス株式会社 | PHOTO TOOL FOR SOLDER RESIST EXPOSURE AND METHOD FOR FORMING SOLDER RESIST PATTERN EXPOSED BY USING THE SAME |
TW200844660A (en) * | 2006-11-15 | 2008-11-16 | Taiyo Ink Mfg Co Ltd | Alkali development type paste composition, method for conductive pattern and black matrix pattern formation using the same, and the conductive pattern and the black matrix pattern |
KR101277020B1 (en) * | 2010-09-30 | 2013-06-24 | 다이요 홀딩스 가부시키가이샤 | Photosensitive conductive paste |
JP5744528B2 (en) * | 2011-01-11 | 2015-07-08 | 東京応化工業株式会社 | Colored photosensitive resin composition for touch panel, touch panel, and display device |
JP2012163735A (en) * | 2011-02-07 | 2012-08-30 | Toyo Ink Sc Holdings Co Ltd | Photosensitive resin composition, and protective film and insulating film for touch panel using the composition |
KR101692003B1 (en) * | 2013-12-24 | 2017-01-03 | 코오롱인더스트리 주식회사 | Photosensitive Resin Composition for Dry Film Photoresist |
TW201940615A (en) * | 2014-12-26 | 2019-10-16 | 日商太陽油墨製造股份有限公司 | Curable resin composition, dry film, cured product and printed circuit board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY121423A (en) * | 1998-06-26 | 2006-01-28 | Ciba Sc Holding Ag | Photopolymerizable thermosetting resin compositions |
SG77689A1 (en) * | 1998-06-26 | 2001-01-16 | Ciba Sc Holding Ag | New o-acyloxime photoinitiators |
JP4033428B2 (en) * | 1999-03-31 | 2008-01-16 | 日本化薬株式会社 | Novel unsaturated group-containing polycarboxylic acid resin, resin composition and cured product thereof |
SG97168A1 (en) * | 1999-12-15 | 2003-07-18 | Ciba Sc Holding Ag | Photosensitive resin composition |
NL1016815C2 (en) * | 1999-12-15 | 2002-05-14 | Ciba Sc Holding Ag | Oximester photo initiators. |
JP2001302871A (en) * | 2000-04-25 | 2001-10-31 | Taiyo Ink Mfg Ltd | Photocurable/thermosetting resin composition and printed wiring board having solder resist coating film and resin insulating layer formed by using the same |
JP3860170B2 (en) * | 2001-06-11 | 2006-12-20 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | Photoinitiators of oxime esters with combined structures |
-
2004
- 2004-11-22 TW TW093135867A patent/TW200519535A/en unknown
- 2004-11-26 CN CN2004100954406A patent/CN1779568B/en active Active
- 2004-11-26 KR KR1020040098063A patent/KR101048940B1/en active IP Right Grant
-
2010
- 2010-02-15 JP JP2010029943A patent/JP4865044B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI402619B (en) * | 2007-03-29 | 2013-07-21 | Tokyo Ohka Kogyo Co Ltd | A coloring photosensitive resin composition, a black matrix, a color filter, and a liquid crystal display |
Also Published As
Publication number | Publication date |
---|---|
CN1779568B (en) | 2010-10-06 |
JP2010160495A (en) | 2010-07-22 |
CN1779568A (en) | 2006-05-31 |
KR20050051574A (en) | 2005-06-01 |
JP4865044B2 (en) | 2012-02-01 |
KR101048940B1 (en) | 2011-07-12 |
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