CN1873971A - 焊锡箔、半导体器件及电子器件 - Google Patents
焊锡箔、半导体器件及电子器件 Download PDFInfo
- Publication number
- CN1873971A CN1873971A CNA2006100958213A CN200610095821A CN1873971A CN 1873971 A CN1873971 A CN 1873971A CN A2006100958213 A CNA2006100958213 A CN A2006100958213A CN 200610095821 A CN200610095821 A CN 200610095821A CN 1873971 A CN1873971 A CN 1873971A
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- scolding tin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H—ELECTRICITY
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0405—Solder foil, tape or wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (62)
Applications Claiming Priority (2)
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JP393267/2000 | 2000-12-21 | ||
JP2000393267 | 2000-12-21 |
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CNB018212433A Division CN1269612C (zh) | 2000-12-21 | 2001-12-19 | 焊锡箔、半导体器件、电子器件、半导体组件及功率组件 |
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CN100578778C CN100578778C (zh) | 2010-01-06 |
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CN200610095821A Expired - Fee Related CN100578778C (zh) | 2000-12-21 | 2001-12-19 | 电子器件 |
CNB018212433A Expired - Fee Related CN1269612C (zh) | 2000-12-21 | 2001-12-19 | 焊锡箔、半导体器件、电子器件、半导体组件及功率组件 |
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CNB018212433A Expired - Fee Related CN1269612C (zh) | 2000-12-21 | 2001-12-19 | 焊锡箔、半导体器件、电子器件、半导体组件及功率组件 |
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US (1) | US7722962B2 (zh) |
JP (1) | JP2009060101A (zh) |
KR (1) | KR100548114B1 (zh) |
CN (2) | CN100578778C (zh) |
AU (1) | AU2002216373A1 (zh) |
TW (1) | TW592871B (zh) |
WO (1) | WO2002049797A1 (zh) |
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2001
- 2001-12-19 AU AU2002216373A patent/AU2002216373A1/en not_active Abandoned
- 2001-12-19 WO PCT/JP2001/011152 patent/WO2002049797A1/ja active IP Right Grant
- 2001-12-19 TW TW090131538A patent/TW592871B/zh not_active IP Right Cessation
- 2001-12-19 CN CN200610095821A patent/CN100578778C/zh not_active Expired - Fee Related
- 2001-12-19 CN CNB018212433A patent/CN1269612C/zh not_active Expired - Fee Related
- 2001-12-19 KR KR1020037008310A patent/KR100548114B1/ko not_active IP Right Cessation
- 2001-12-19 US US10/451,610 patent/US7722962B2/en not_active Expired - Fee Related
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2008
- 2008-08-25 JP JP2008214799A patent/JP2009060101A/ja active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101641176B (zh) * | 2007-01-22 | 2013-05-22 | 马里兰大学 | 高温焊接材料 |
US8247267B2 (en) | 2008-03-11 | 2012-08-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level IC assembly method |
US8551813B2 (en) | 2008-03-11 | 2013-10-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level IC assembly method |
TWI550781B (zh) * | 2010-07-20 | 2016-09-21 | Senju Metal Industry Co | The manufacturing method and functional parts of functional parts |
CN103153527A (zh) * | 2010-08-05 | 2013-06-12 | 千住金属工业株式会社 | 半导体装置接合材料 |
CN103153527B (zh) * | 2010-08-05 | 2015-12-09 | 千住金属工业株式会社 | 半导体装置接合材料 |
CN103842126A (zh) * | 2011-08-02 | 2014-06-04 | 阿尔法金属公司 | 焊料组合物 |
CN106660178A (zh) * | 2014-08-18 | 2017-05-10 | (株)庆东One | 无铅焊料合金组合物和用于制备无铅焊料合金的方法 |
CN104811889A (zh) * | 2015-03-26 | 2015-07-29 | 华天科技(西安)有限公司 | 一种mems麦克风封装器件及其组装方法 |
CN104811889B (zh) * | 2015-03-26 | 2021-08-10 | 华天科技(西安)有限公司 | 一种mems麦克风封装器件的组装方法 |
CN114423557A (zh) * | 2019-10-23 | 2022-04-29 | 阿尔法装配解决方案公司 | 用于电子组件的工程化材料 |
CN111725085A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技(东莞)有限公司 | 一种半导体器件的封装方法及半导体器件 |
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WO2002049797A1 (en) | 2002-06-27 |
KR20030070075A (ko) | 2003-08-27 |
CN1269612C (zh) | 2006-08-16 |
AU2002216373A1 (en) | 2002-07-01 |
US20060061974A1 (en) | 2006-03-23 |
CN1482956A (zh) | 2004-03-17 |
JP2009060101A (ja) | 2009-03-19 |
CN100578778C (zh) | 2010-01-06 |
KR100548114B1 (ko) | 2006-02-02 |
TW592871B (en) | 2004-06-21 |
US7722962B2 (en) | 2010-05-25 |
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