CN1862795A - 接线板 - Google Patents
接线板 Download PDFInfo
- Publication number
- CN1862795A CN1862795A CNA2006100515605A CN200610051560A CN1862795A CN 1862795 A CN1862795 A CN 1862795A CN A2006100515605 A CNA2006100515605 A CN A2006100515605A CN 200610051560 A CN200610051560 A CN 200610051560A CN 1862795 A CN1862795 A CN 1862795A
- Authority
- CN
- China
- Prior art keywords
- circuit pattern
- terminal block
- thickness
- lamination
- cold spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005140498A JP4595665B2 (ja) | 2005-05-13 | 2005-05-13 | 配線基板の製造方法 |
JP2005140498 | 2005-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1862795A true CN1862795A (zh) | 2006-11-15 |
CN100570866C CN100570866C (zh) | 2009-12-16 |
Family
ID=37311270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100515605A Active CN100570866C (zh) | 2005-05-13 | 2006-02-28 | 接线板 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7626124B2 (zh) |
JP (1) | JP4595665B2 (zh) |
CN (1) | CN100570866C (zh) |
DE (1) | DE102006019602B4 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102593074A (zh) * | 2009-07-23 | 2012-07-18 | 三菱综合材料株式会社 | 电源模块用基板、电源模块和电源模块用基板的制造方法 |
CN103841784A (zh) * | 2014-03-18 | 2014-06-04 | 亚超特工业有限公司 | 电子装置的内部中框板的成型方法及其该内部中框板 |
CN104363697A (zh) * | 2014-10-16 | 2015-02-18 | 金壬海 | 陶瓷填充介质铝衬底覆铜板及其制造方法 |
CN106158764A (zh) * | 2016-08-30 | 2016-11-23 | 无锡新洁能股份有限公司 | 功率模块用底板及功率模块 |
CN111867259A (zh) * | 2020-07-30 | 2020-10-30 | 南京凯泰化学科技有限公司 | 一种陶瓷覆铜板的制备方法 |
Families Citing this family (50)
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JP4662361B2 (ja) * | 2006-01-23 | 2011-03-30 | 株式会社小糸製作所 | 光源モジュール |
JP2008053548A (ja) * | 2006-08-25 | 2008-03-06 | Sharp Corp | 回路基板および電気回路の検査方法 |
JP5150076B2 (ja) * | 2006-09-15 | 2013-02-20 | 株式会社豊田自動織機 | 表面実装用電子部品の表面実装構造 |
US7957158B2 (en) * | 2006-10-31 | 2011-06-07 | Sanyo Electric Co., Ltd. | Circuit device |
DE102006061435A1 (de) * | 2006-12-23 | 2008-06-26 | Leoni Ag | Verfahren und Vorrichtung zum Aufspritzen insbesondere einer Leiterbahn, elektrisches Bauteil mit einer Leiterbahn sowie Dosiervorrichtung |
KR100834515B1 (ko) * | 2007-03-07 | 2008-06-02 | 삼성전기주식회사 | 금속 나노입자 에어로졸을 이용한 포토레지스트 적층기판의형성방법, 절연기판의 도금방법, 회로기판의 금속층의표면처리방법 및 적층 세라믹 콘덴서의 제조방법 |
JP4986657B2 (ja) * | 2007-03-09 | 2012-07-25 | パナソニック株式会社 | ブラシレスモータ |
JP5144657B2 (ja) * | 2007-05-30 | 2013-02-13 | 京セラ株式会社 | 積層型放熱基体およびこれを用いた放熱ユニット並びに電子装置 |
DE102007050405B4 (de) * | 2007-10-22 | 2010-09-09 | Continental Automotive Gmbh | Elektrische Leistungskomponente, insbesondere Leistungshalbleiter-Modul, mit einer Kühlvorrichtung und Verfahren zum flächigen und wärmeleitenden Anbinden einer Kühlvorrichtung an eine elektrische Leistungskomponente |
US20090141456A1 (en) * | 2007-11-30 | 2009-06-04 | Itt Manufacturing Enterprises, Inc. | Multilayer, thermally-stabilized substrate structures |
JP5321942B2 (ja) * | 2008-02-29 | 2013-10-23 | 新東工業株式会社 | 電子回路基板の製造方法およびその電子回路基板 |
KR101013078B1 (ko) * | 2008-05-09 | 2011-02-08 | (주)세렉트론 | 저온분사법을 이용한 전극의 제조방법 및 이에 의한 전극 |
DE102009033029A1 (de) | 2009-07-02 | 2011-01-05 | Electrovac Ag | Elektronische Vorrichtung |
EP2315242A1 (en) * | 2009-10-23 | 2011-04-27 | ABB Technology AG | Circuit arrangement and manufacturing method thereof |
JP5186528B2 (ja) * | 2010-04-23 | 2013-04-17 | 日本発條株式会社 | 導電部材及びその製造方法 |
JP5316637B2 (ja) | 2010-05-12 | 2013-10-16 | トヨタ自動車株式会社 | 半導体装置 |
KR101343289B1 (ko) | 2010-05-18 | 2013-12-18 | 도요타지도샤가부시키가이샤 | 반도체 장치 및 그 제조 방법 |
US8436461B2 (en) | 2010-05-21 | 2013-05-07 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
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US20120193126A1 (en) * | 2011-01-31 | 2012-08-02 | General Electric Company | Method of forming sensors and circuits on components |
JP2013012531A (ja) * | 2011-06-28 | 2013-01-17 | Kyocera Corp | 電子部品搭載用部材および電子装置 |
US9335296B2 (en) | 2012-10-10 | 2016-05-10 | Westinghouse Electric Company Llc | Systems and methods for steam generator tube analysis for detection of tube degradation |
WO2014073038A1 (ja) * | 2012-11-06 | 2014-05-15 | 日本碍子株式会社 | 発光ダイオード用基板 |
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JP6037885B2 (ja) * | 2013-02-19 | 2016-12-07 | 三菱重工業株式会社 | 成膜方法 |
US9147631B2 (en) | 2013-04-17 | 2015-09-29 | Infineon Technologies Austria Ag | Semiconductor power device having a heat sink |
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DE102015201927A1 (de) * | 2015-02-04 | 2016-08-04 | Siemens Aktiengesellschaft | Verfahren zum Kaltgasspritzen mit Maske |
JP6400501B2 (ja) * | 2015-02-18 | 2018-10-03 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板の製造方法 |
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DE102020202607A1 (de) * | 2020-02-28 | 2021-09-02 | Siemens Aktiengesellschaft | Elektronikmodul, Verfahren zur Herstellung eines Elektronikmoduls und Industrieanlage |
KR20210117587A (ko) | 2020-03-19 | 2021-09-29 | 삼성전자주식회사 | 반도체 모듈 |
DE102020109557B3 (de) * | 2020-04-06 | 2021-07-29 | Infineon Technologies Ag | Verfahren zur herstellung eines halbleitergehäuses, halbleitergehäuse und eingebettetes pcb-modul |
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JP2022094661A (ja) * | 2020-12-15 | 2022-06-27 | 三菱マテリアル株式会社 | 絶縁回路基板、および、絶縁回路基板の製造方法 |
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- 2006-02-28 CN CNB2006100515605A patent/CN100570866C/zh active Active
- 2006-04-27 DE DE102006019602.3A patent/DE102006019602B4/de active Active
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2009
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CN102593074A (zh) * | 2009-07-23 | 2012-07-18 | 三菱综合材料株式会社 | 电源模块用基板、电源模块和电源模块用基板的制造方法 |
CN102593074B (zh) * | 2009-07-23 | 2016-08-10 | 三菱综合材料株式会社 | 电源模块用基板、电源模块和电源模块用基板的制造方法 |
CN103841784A (zh) * | 2014-03-18 | 2014-06-04 | 亚超特工业有限公司 | 电子装置的内部中框板的成型方法及其该内部中框板 |
CN104363697A (zh) * | 2014-10-16 | 2015-02-18 | 金壬海 | 陶瓷填充介质铝衬底覆铜板及其制造方法 |
CN104363697B (zh) * | 2014-10-16 | 2017-12-29 | 金壬海 | 陶瓷填充介质铝衬底覆铜板及其制造方法 |
CN106158764A (zh) * | 2016-08-30 | 2016-11-23 | 无锡新洁能股份有限公司 | 功率模块用底板及功率模块 |
CN111867259A (zh) * | 2020-07-30 | 2020-10-30 | 南京凯泰化学科技有限公司 | 一种陶瓷覆铜板的制备方法 |
Also Published As
Publication number | Publication date |
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JP2006319146A (ja) | 2006-11-24 |
DE102006019602A1 (de) | 2006-11-23 |
US7626124B2 (en) | 2009-12-01 |
US20100041228A1 (en) | 2010-02-18 |
JP4595665B2 (ja) | 2010-12-08 |
US20060258055A1 (en) | 2006-11-16 |
CN100570866C (zh) | 2009-12-16 |
DE102006019602B4 (de) | 2021-01-28 |
US8336202B2 (en) | 2012-12-25 |
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