CN1784787A - 用于沟道隔离的斜角注入 - Google Patents
用于沟道隔离的斜角注入 Download PDFInfo
- Publication number
- CN1784787A CN1784787A CNA2004800123792A CN200480012379A CN1784787A CN 1784787 A CN1784787 A CN 1784787A CN A2004800123792 A CNA2004800123792 A CN A2004800123792A CN 200480012379 A CN200480012379 A CN 200480012379A CN 1784787 A CN1784787 A CN 1784787A
- Authority
- CN
- China
- Prior art keywords
- photodiode
- type
- trench isolation
- sidewall
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (113)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/385,844 US6949445B2 (en) | 2003-03-12 | 2003-03-12 | Method of forming angled implant for trench isolation |
US10/385,844 | 2003-03-12 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910132434A Division CN101521217A (zh) | 2003-03-12 | 2004-03-12 | 用于沟道隔离的斜角注入 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1784787A true CN1784787A (zh) | 2006-06-07 |
CN100487901C CN100487901C (zh) | 2009-05-13 |
Family
ID=32961576
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800123792A Expired - Lifetime CN100487901C (zh) | 2003-03-12 | 2004-03-12 | 用于沟槽隔离的斜角注入 |
CN200910132434A Pending CN101521217A (zh) | 2003-03-12 | 2004-03-12 | 用于沟道隔离的斜角注入 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910132434A Pending CN101521217A (zh) | 2003-03-12 | 2004-03-12 | 用于沟道隔离的斜角注入 |
Country Status (6)
Country | Link |
---|---|
US (3) | US6949445B2 (zh) |
EP (1) | EP1604403A2 (zh) |
JP (1) | JP2006521697A (zh) |
KR (1) | KR100777376B1 (zh) |
CN (2) | CN100487901C (zh) |
WO (1) | WO2004081989A2 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105097665A (zh) * | 2014-05-21 | 2015-11-25 | 英飞凌科技股份有限公司 | 用于制造半导体器件的方法和半导体器件 |
CN107910343A (zh) * | 2017-12-11 | 2018-04-13 | 上海华力微电子有限公司 | Cmos图像传感器及其制造方法 |
CN108615739A (zh) * | 2016-12-13 | 2018-10-02 | 台湾积体电路制造股份有限公司 | 形成图像传感器装置的方法 |
CN109216392A (zh) * | 2018-09-12 | 2019-01-15 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
CN109727906A (zh) * | 2017-10-31 | 2019-05-07 | 无锡华润微电子有限公司 | N型半导体元器件的浅槽隔离结构的处理方法 |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8816443B2 (en) * | 2001-10-12 | 2014-08-26 | Quantum Semiconductor Llc | Method of fabricating heterojunction photodiodes with CMOS |
JP2004165462A (ja) * | 2002-11-14 | 2004-06-10 | Sony Corp | 固体撮像素子及びその製造方法 |
US6949445B2 (en) * | 2003-03-12 | 2005-09-27 | Micron Technology, Inc. | Method of forming angled implant for trench isolation |
KR100477790B1 (ko) * | 2003-03-13 | 2005-03-22 | 매그나칩 반도체 유한회사 | 씨모스 이미지센서의 제조방법 |
US6897082B2 (en) * | 2003-06-16 | 2005-05-24 | Micron Technology, Inc. | Method of forming well for CMOS imager |
KR100554836B1 (ko) * | 2003-06-30 | 2006-03-03 | 주식회사 하이닉스반도체 | 플래시 메모리 소자의 제조방법 |
US7141468B2 (en) * | 2003-10-27 | 2006-11-28 | Texas Instruments Incorporated | Application of different isolation schemes for logic and embedded memory |
KR100619396B1 (ko) * | 2003-12-31 | 2006-09-11 | 동부일렉트로닉스 주식회사 | 시모스 이미지 센서 및 그 제조방법 |
US7148525B2 (en) * | 2004-01-12 | 2006-12-12 | Micron Technology, Inc. | Using high-k dielectrics in isolation structures method, pixel and imager device |
US20050158897A1 (en) * | 2004-01-21 | 2005-07-21 | Jhy-Jyi Sze | Image sensor device and method of fabricating the same |
US7154136B2 (en) * | 2004-02-20 | 2006-12-26 | Micron Technology, Inc. | Isolation structures for preventing photons and carriers from reaching active areas and methods of formation |
US7492027B2 (en) * | 2004-02-20 | 2009-02-17 | Micron Technology, Inc. | Reduced crosstalk sensor and method of formation |
JP2005327858A (ja) * | 2004-05-13 | 2005-11-24 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
JP4974474B2 (ja) | 2004-06-22 | 2012-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US7332737B2 (en) * | 2004-06-22 | 2008-02-19 | Micron Technology, Inc. | Isolation trench geometry for image sensors |
KR100659382B1 (ko) * | 2004-08-06 | 2006-12-19 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
US7153719B2 (en) * | 2004-08-24 | 2006-12-26 | Micron Technology, Inc. | Method of fabricating a storage gate pixel design |
US7348651B2 (en) * | 2004-12-09 | 2008-03-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pinned photodiode fabricated with shallow trench isolation |
US7098067B2 (en) * | 2004-12-13 | 2006-08-29 | International Business Machines Corporation | Masked sidewall implant for image sensor |
KR100672663B1 (ko) * | 2004-12-28 | 2007-01-24 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서의 제조방법 |
US7241671B2 (en) * | 2004-12-29 | 2007-07-10 | Dongbu Electronics Co., Ltd. | CMOS image sensor and method for fabricating the same |
KR100606914B1 (ko) * | 2004-12-29 | 2006-08-01 | 동부일렉트로닉스 주식회사 | 반도체 소자의 격리영역 형성방법 |
KR100672666B1 (ko) * | 2004-12-29 | 2007-01-24 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서의 제조방법 |
KR100672708B1 (ko) * | 2004-12-30 | 2007-01-22 | 동부일렉트로닉스 주식회사 | 시모스 이미지 센서의 격리막 형성방법 |
KR100652343B1 (ko) * | 2004-12-31 | 2006-11-30 | 동부일렉트로닉스 주식회사 | 반도체 소자 제조 방법 |
CN100565892C (zh) * | 2005-04-29 | 2009-12-02 | 皇家飞利浦电子股份有限公司 | 具有图像传感器的半导体器件和这种器件的制造方法 |
JP4354931B2 (ja) * | 2005-05-19 | 2009-10-28 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
US7141836B1 (en) | 2005-05-31 | 2006-11-28 | International Business Machines Corporation | Pixel sensor having doped isolation structure sidewall |
KR100720503B1 (ko) * | 2005-06-07 | 2007-05-22 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
US7271025B2 (en) * | 2005-07-12 | 2007-09-18 | Micron Technology, Inc. | Image sensor with SOI substrate |
US20070023796A1 (en) * | 2005-07-27 | 2007-02-01 | International Business Machines Corporation | Pinning layer for pixel sensor cell and method thereof |
KR100748342B1 (ko) * | 2005-09-14 | 2007-08-09 | 매그나칩 반도체 유한회사 | 씨모스 이미지 센서의 제조방법 |
US7652313B2 (en) * | 2005-11-10 | 2010-01-26 | International Business Machines Corporation | Deep trench contact and isolation of buried photodetectors |
KR100776162B1 (ko) * | 2005-12-21 | 2007-11-12 | 동부일렉트로닉스 주식회사 | 이미지 소자의 제조방법 |
KR100724199B1 (ko) * | 2005-12-28 | 2007-05-31 | 동부일렉트로닉스 주식회사 | 에스오아이 소자의 섀로우 트렌치 분리막 형성 방법 |
KR100731102B1 (ko) * | 2005-12-29 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 이의 제조방법 |
KR100719719B1 (ko) * | 2006-06-28 | 2007-05-18 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
US7531374B2 (en) * | 2006-09-07 | 2009-05-12 | United Microelectronics Corp. | CMOS image sensor process and structure |
US7521278B2 (en) * | 2006-10-17 | 2009-04-21 | Eastman Kodak Company | Isolation method for low dark current imager |
KR100801053B1 (ko) * | 2006-10-27 | 2008-02-04 | 삼성전자주식회사 | 소자 분리 방법 및 이를 이용한 이미지 소자의 형성 방법 |
KR100853193B1 (ko) * | 2007-01-08 | 2008-08-21 | 삼성전자주식회사 | 반도체 소자 및 그 형성방법 |
US8440495B2 (en) * | 2007-03-06 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for reducing crosstalk in image sensors using implant technology |
JP2009065118A (ja) * | 2007-08-09 | 2009-03-26 | Panasonic Corp | 固体撮像装置 |
KR100891227B1 (ko) * | 2007-10-25 | 2009-04-01 | 주식회사 동부하이텍 | 반도체 소자의 제조 방법 |
KR100935269B1 (ko) * | 2007-12-27 | 2010-01-06 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
ITTO20080045A1 (it) * | 2008-01-18 | 2009-07-19 | St Microelectronics Srl | Schiera di fotodiodi operanti in modalita' geiger reciprocamente isolati e relativo procedimento di fabbricazione |
EP2109143B1 (en) | 2008-04-09 | 2013-05-29 | Sony Corporation | Solid-state imaging device, production method thereof, and electronic device |
JP2009272596A (ja) * | 2008-04-09 | 2009-11-19 | Sony Corp | 固体撮像装置とその製造方法、及び電子機器 |
JP4759590B2 (ja) | 2008-05-09 | 2011-08-31 | キヤノン株式会社 | 光電変換装置及びそれを用いた撮像システム |
JP2009277722A (ja) * | 2008-05-12 | 2009-11-26 | Panasonic Corp | 固体撮像装置及びその製造方法 |
US8815634B2 (en) * | 2008-10-31 | 2014-08-26 | Varian Semiconductor Equipment Associates, Inc. | Dark currents and reducing defects in image sensors and photovoltaic junctions |
US20100133638A1 (en) * | 2008-12-01 | 2010-06-03 | Samsung Electronics Co., Ltd. | Image sensors and methods of manufacturing the same |
US20100148230A1 (en) * | 2008-12-11 | 2010-06-17 | Stevens Eric G | Trench isolation regions in image sensors |
IT1392366B1 (it) * | 2008-12-17 | 2012-02-28 | St Microelectronics Rousset | Fotodiodo operante in modalita' geiger con resistore di soppressione integrato e controllabile, schiera di fotodiodi e relativo procedimento di fabbricazione |
IT1393781B1 (it) * | 2009-04-23 | 2012-05-08 | St Microelectronics Rousset | Fotodiodo operante in modalita' geiger con resistore di soppressione integrato e controllabile ad effetto jfet, schiera di fotodiodi e relativo procedimento di fabbricazione |
JP2011049524A (ja) | 2009-07-27 | 2011-03-10 | Sony Corp | 固体撮像素子および固体撮像素子の製造方法 |
DE102009035409B4 (de) * | 2009-07-31 | 2013-06-06 | Globalfoundries Dresden Module One Llc & Co. Kg | Leckstromsteuerung in Feldeffekttransistoren auf der Grundlage einer Implantationssorte, die lokal an der STI-Kante eingeführt wird |
JP5564874B2 (ja) * | 2009-09-25 | 2014-08-06 | ソニー株式会社 | 固体撮像装置、及び電子機器 |
JP5629450B2 (ja) * | 2009-10-16 | 2014-11-19 | キヤノン株式会社 | 半導体素子及び半導体素子の形成方法 |
WO2011107832A1 (en) * | 2010-03-04 | 2011-09-09 | X-Fab Semiconductor Foundries Ag | Manufacturing of a semiconductor device and corresponding semiconductor device |
CN102792677B (zh) * | 2010-03-08 | 2015-08-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
JP5651976B2 (ja) | 2010-03-26 | 2015-01-14 | ソニー株式会社 | 固体撮像素子およびその製造方法、並びに電子機器 |
IT1399690B1 (it) | 2010-03-30 | 2013-04-26 | St Microelectronics Srl | Fotodiodo a valanga operante in modalita' geiger ad elevato rapporto segnale rumore e relativo procedimento di fabbricazione |
CN102651372B (zh) * | 2011-02-23 | 2014-11-05 | 中芯国际集成电路制造(上海)有限公司 | Cmos图像传感器及其制作方法 |
US9318370B2 (en) | 2011-08-04 | 2016-04-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | High-k dielectric liners in shallow trench isolations |
US8518764B2 (en) | 2011-10-24 | 2013-08-27 | Freescale Semiconductor, Inc. | Semiconductor structure having a through substrate via (TSV) and method for forming |
TWI447859B (zh) * | 2012-03-12 | 2014-08-01 | Inotera Memories Inc | 動態隨機存取記憶體的淺溝槽隔絕結構及其製造方法 |
US8969997B2 (en) * | 2012-11-14 | 2015-03-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Isolation structures and methods of forming the same |
US9516248B2 (en) * | 2013-03-15 | 2016-12-06 | Microsoft Technology Licensing, Llc | Photosensor having enhanced sensitivity |
US20150021668A1 (en) * | 2013-07-19 | 2015-01-22 | Stmicroelectronics Sa | Photosensitive cell of an image sensor |
CN104143558B (zh) * | 2014-08-15 | 2018-03-27 | 北京思比科微电子技术股份有限公司 | 一种提高阱容量的图像传感器像素及其制作方法 |
JP2018110140A (ja) * | 2016-12-28 | 2018-07-12 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US11387232B2 (en) * | 2017-03-23 | 2022-07-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP2019114797A (ja) * | 2019-02-20 | 2019-07-11 | 株式会社東芝 | 固体撮像装置および固体撮像装置の製造方法 |
Family Cites Families (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3380276D1 (en) * | 1982-09-07 | 1989-08-31 | Minnesota Mining & Mfg | Method for coating ophthalmic devices |
JPH05152516A (ja) * | 1991-11-29 | 1993-06-18 | Toshiba Corp | 半導体装置とその製造方法 |
US5448090A (en) * | 1994-08-03 | 1995-09-05 | International Business Machines Corporation | Structure for reducing parasitic leakage in a memory array with merged isolation and node trench construction |
US5728621A (en) * | 1997-04-28 | 1998-03-17 | Chartered Semiconductor Manufacturing Pte Ltd | Method for shallow trench isolation |
US5801082A (en) * | 1997-08-18 | 1998-09-01 | Vanguard International Semiconductor Corporation | Method for making improved shallow trench isolation with dielectric studs for semiconductor integrated circuits |
WO1999025018A1 (en) | 1997-11-07 | 1999-05-20 | Advanced Micro Devices, Inc. | Semiconductor device having an improved isolation region and process of fabrication thereof |
US5909041A (en) * | 1997-11-21 | 1999-06-01 | Xerox Corporation | Photogate sensor with improved responsivity |
JPH11274462A (ja) * | 1998-03-23 | 1999-10-08 | Sony Corp | 固体撮像装置 |
US6218691B1 (en) * | 1998-06-30 | 2001-04-17 | Hyundai Electronics Industries Co., Ltd. | Image sensor with improved dynamic range by applying negative voltage to unit pixel |
US5960276A (en) * | 1998-09-28 | 1999-09-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Using an extra boron implant to improve the NMOS reverse narrow width effect in shallow trench isolation process |
US6177333B1 (en) * | 1999-01-14 | 2001-01-23 | Micron Technology, Inc. | Method for making a trench isolation for semiconductor devices |
US20030089929A1 (en) * | 2001-02-14 | 2003-05-15 | Rhodes Howard E. | Trench photosensor for a CMOS imager |
US6232626B1 (en) * | 1999-02-01 | 2001-05-15 | Micron Technology, Inc. | Trench photosensor for a CMOS imager |
DE19905032A1 (de) * | 1999-02-08 | 2000-08-10 | Emitec Emissionstechnologie | Abgassystem mit wenigstens einer Leitfläche |
JP4604296B2 (ja) | 1999-02-09 | 2011-01-05 | ソニー株式会社 | 固体撮像装置及びその製造方法 |
US6310366B1 (en) * | 1999-06-16 | 2001-10-30 | Micron Technology, Inc. | Retrograde well structure for a CMOS imager |
US6534335B1 (en) * | 1999-07-22 | 2003-03-18 | Micron Technology, Inc. | Optimized low leakage diodes, including photodiodes |
TW432600B (en) * | 1999-12-16 | 2001-05-01 | United Microelectronics Corp | Process for shallow trench isolation structure |
TW466780B (en) * | 2000-03-17 | 2001-12-01 | Taiwan Semiconductor Mfg | Method to accurately control the manufacturing of high performance photodiode |
JP3688980B2 (ja) * | 2000-06-28 | 2005-08-31 | 株式会社東芝 | Mos型固体撮像装置及びその製造方法 |
US6611037B1 (en) * | 2000-08-28 | 2003-08-26 | Micron Technology, Inc. | Multi-trench region for accumulation of photo-generated charge in a CMOS imager |
US6946635B1 (en) * | 2000-10-05 | 2005-09-20 | Ess Technology, Inc. | System for improving the dynamic range of solid-state imaging devices |
JP4270742B2 (ja) * | 2000-11-30 | 2009-06-03 | Necエレクトロニクス株式会社 | 固体撮像装置 |
KR100346842B1 (ko) * | 2000-12-01 | 2002-08-03 | 삼성전자 주식회사 | 얕은 트렌치 아이솔레이션 구조를 갖는 반도체 디바이스및 그 제조방법 |
US6759409B2 (en) * | 2000-12-18 | 2004-07-06 | Boehringer Ingelheim (Canada) Ltd. | Inhibitors of papilloma virus |
KR100378190B1 (ko) * | 2000-12-28 | 2003-03-29 | 삼성전자주식회사 | 서로 다른 두께의 측벽 산화막을 갖는 트랜치아이솔레이션 형성방법 |
JP3908911B2 (ja) * | 2001-02-16 | 2007-04-25 | シャープ株式会社 | イメージセンサの製造方法 |
US6624016B2 (en) * | 2001-02-22 | 2003-09-23 | Silicon-Based Technology Corporation | Method of fabricating trench isolation structures with extended buffer spacers |
JP3832620B2 (ja) * | 2001-03-05 | 2006-10-11 | 富士写真フイルム株式会社 | カラー撮像装置 |
US6392263B1 (en) * | 2001-05-15 | 2002-05-21 | Texas Instruments Incorporated | Integrated structure for reduced leakage and improved fill-factor in CMOS pixel |
US6512280B2 (en) * | 2001-05-16 | 2003-01-28 | Texas Instruments Incorporated | Integrated CMOS structure for gate-controlled buried photodiode |
DE10221808B4 (de) * | 2001-05-18 | 2010-01-07 | Fuji Electric Co., Ltd., Kawasaki | Verfahren zur Herstellung eines lateralen MOSFETs |
US6720595B2 (en) * | 2001-08-06 | 2004-04-13 | International Business Machines Corporation | Three-dimensional island pixel photo-sensor |
KR100436067B1 (ko) * | 2001-11-16 | 2004-06-12 | 주식회사 하이닉스반도체 | 이미지센서 및 그 제조 방법 |
US6744084B2 (en) * | 2002-08-29 | 2004-06-01 | Micro Technology, Inc. | Two-transistor pixel with buried reset channel and method of formation |
US6888214B2 (en) * | 2002-11-12 | 2005-05-03 | Micron Technology, Inc. | Isolation techniques for reducing dark current in CMOS image sensors |
US7091536B2 (en) * | 2002-11-14 | 2006-08-15 | Micron Technology, Inc. | Isolation process and structure for CMOS imagers |
US7087944B2 (en) * | 2003-01-16 | 2006-08-08 | Micron Technology, Inc. | Image sensor having a charge storage region provided within an implant region |
US6949445B2 (en) * | 2003-03-12 | 2005-09-27 | Micron Technology, Inc. | Method of forming angled implant for trench isolation |
US7102184B2 (en) * | 2003-06-16 | 2006-09-05 | Micron Technology, Inc. | Image device and photodiode structure |
US7148528B2 (en) * | 2003-07-02 | 2006-12-12 | Micron Technology, Inc. | Pinned photodiode structure and method of formation |
US7064406B2 (en) * | 2003-09-03 | 2006-06-20 | Micron Technology, Inc. | Supression of dark current in a photosensor for imaging |
KR100535924B1 (ko) * | 2003-09-22 | 2005-12-09 | 동부아남반도체 주식회사 | 시모스 이미지 센서 및 그 제조방법 |
US7214575B2 (en) * | 2004-01-06 | 2007-05-08 | Micron Technology, Inc. | Method and apparatus providing CMOS imager device pixel with transistor having lower threshold voltage than other imager device transistors |
US20050158897A1 (en) * | 2004-01-21 | 2005-07-21 | Jhy-Jyi Sze | Image sensor device and method of fabricating the same |
US7154136B2 (en) * | 2004-02-20 | 2006-12-26 | Micron Technology, Inc. | Isolation structures for preventing photons and carriers from reaching active areas and methods of formation |
JP4539176B2 (ja) * | 2004-05-31 | 2010-09-08 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
US7535042B2 (en) * | 2004-07-01 | 2009-05-19 | Aptina Imaging Corporation | Pixel cell with a controlled output signal knee characteristic response |
US7262110B2 (en) * | 2004-08-23 | 2007-08-28 | Micron Technology, Inc. | Trench isolation structure and method of formation |
US7297995B2 (en) * | 2004-08-24 | 2007-11-20 | Micron Technology, Inc. | Transparent metal shielded isolation for image sensors |
US7348651B2 (en) * | 2004-12-09 | 2008-03-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pinned photodiode fabricated with shallow trench isolation |
KR100606914B1 (ko) * | 2004-12-29 | 2006-08-01 | 동부일렉트로닉스 주식회사 | 반도체 소자의 격리영역 형성방법 |
US7432148B2 (en) * | 2005-08-31 | 2008-10-07 | Micron Technology, Inc. | Shallow trench isolation by atomic-level silicon reconstruction |
KR100731102B1 (ko) * | 2005-12-29 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 이의 제조방법 |
US7888215B2 (en) * | 2008-06-04 | 2011-02-15 | Omnivision Technologies, Inc. | CMOS image sensor with high full-well-capacity |
-
2003
- 2003-03-12 US US10/385,844 patent/US6949445B2/en not_active Expired - Lifetime
-
2004
- 2004-03-12 CN CNB2004800123792A patent/CN100487901C/zh not_active Expired - Lifetime
- 2004-03-12 CN CN200910132434A patent/CN101521217A/zh active Pending
- 2004-03-12 KR KR1020057017037A patent/KR100777376B1/ko active IP Right Grant
- 2004-03-12 WO PCT/US2004/007510 patent/WO2004081989A2/en active Application Filing
- 2004-03-12 JP JP2006507102A patent/JP2006521697A/ja active Pending
- 2004-03-12 EP EP04720384A patent/EP1604403A2/en not_active Ceased
- 2004-08-24 US US10/923,943 patent/US7514715B2/en not_active Expired - Lifetime
-
2009
- 2009-03-09 US US12/400,597 patent/US7919797B2/en not_active Expired - Lifetime
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US9984917B2 (en) | 2014-05-21 | 2018-05-29 | Infineon Technologies Ag | Semiconductor device with an interconnect and a method for manufacturing thereof |
CN105097665B (zh) * | 2014-05-21 | 2019-08-13 | 英飞凌科技股份有限公司 | 用于制造半导体器件的方法和半导体器件 |
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US20050179071A1 (en) | 2005-08-18 |
US7919797B2 (en) | 2011-04-05 |
CN100487901C (zh) | 2009-05-13 |
JP2006521697A (ja) | 2006-09-21 |
EP1604403A2 (en) | 2005-12-14 |
KR20050117556A (ko) | 2005-12-14 |
US7514715B2 (en) | 2009-04-07 |
CN101521217A (zh) | 2009-09-02 |
US20090206429A1 (en) | 2009-08-20 |
KR100777376B1 (ko) | 2007-11-19 |
US6949445B2 (en) | 2005-09-27 |
WO2004081989A2 (en) | 2004-09-23 |
WO2004081989A3 (en) | 2004-12-23 |
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