CN1691344A - 光学器件及其制造方法 - Google Patents
光学器件及其制造方法 Download PDFInfo
- Publication number
- CN1691344A CN1691344A CNA2005100673657A CN200510067365A CN1691344A CN 1691344 A CN1691344 A CN 1691344A CN A2005100673657 A CNA2005100673657 A CN A2005100673657A CN 200510067365 A CN200510067365 A CN 200510067365A CN 1691344 A CN1691344 A CN 1691344A
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- optical element
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 29
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- 239000011347 resin Substances 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims description 2
- 241001232809 Chorista Species 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 abstract description 11
- 229910001111 Fine metal Inorganic materials 0.000 abstract 1
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- 229910000679 solder Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
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- 238000009434 installation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C15/00—Tyre beads, e.g. ply turn-up or overlap
- B60C15/06—Flipper strips, fillers, or chafing strips and reinforcing layers for the construction of the bead
- B60C15/0628—Flipper strips, fillers, or chafing strips and reinforcing layers for the construction of the bead comprising a bead reinforcing layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C15/00—Tyre beads, e.g. ply turn-up or overlap
- B60C15/06—Flipper strips, fillers, or chafing strips and reinforcing layers for the construction of the bead
- B60C15/0628—Flipper strips, fillers, or chafing strips and reinforcing layers for the construction of the bead comprising a bead reinforcing layer
- B60C2015/0692—Flipper strips, fillers, or chafing strips and reinforcing layers for the construction of the bead comprising a bead reinforcing layer characterised by particular materials of the cords
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004130301A JP4686134B2 (ja) | 2004-04-26 | 2004-04-26 | 光学デバイスおよびその製造方法 |
JP2004-130301 | 2004-04-26 | ||
JP2004130301 | 2004-04-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1691344A true CN1691344A (zh) | 2005-11-02 |
CN100420027C CN100420027C (zh) | 2008-09-17 |
Family
ID=35135581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100673657A Expired - Fee Related CN100420027C (zh) | 2004-04-26 | 2005-04-21 | 光学器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7511367B2 (zh) |
JP (1) | JP4686134B2 (zh) |
KR (1) | KR100671094B1 (zh) |
CN (1) | CN100420027C (zh) |
TW (1) | TWI248202B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101675498B (zh) * | 2007-03-02 | 2011-09-28 | 明锐有限公司 | 用于微镜器件的倒装芯片封装的方法和*** |
CN103378013A (zh) * | 2012-04-27 | 2013-10-30 | 佳能株式会社 | 电子部件和电子装置 |
CN103400817A (zh) * | 2013-08-09 | 2013-11-20 | 苏州晶方半导体科技股份有限公司 | 半导体芯片封装模组、封装结构及其封装方法 |
US9155212B2 (en) | 2012-04-27 | 2015-10-06 | Canon Kabushiki Kaisha | Electronic component, mounting member, electronic apparatus, and their manufacturing methods |
US9220172B2 (en) | 2012-04-27 | 2015-12-22 | Canon Kabushiki Kaisha | Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus |
US10236312B2 (en) | 2015-02-16 | 2019-03-19 | Sony Corporation | Camera module and electronic apparatus to lower risk of breakage of camera module |
CN112992956A (zh) * | 2021-05-17 | 2021-06-18 | 甬矽电子(宁波)股份有限公司 | 芯片封装结构、芯片封装方法和电子设备 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100789545B1 (ko) | 2005-03-07 | 2007-12-28 | 삼성전기주식회사 | 플립칩 실장 기술을 이용한 광변조기 모듈 패키지 |
KR100815350B1 (ko) | 2005-04-01 | 2008-03-19 | 삼성전기주식회사 | 광변조기 모듈 패키지 구조 |
JP2009503837A (ja) * | 2005-07-28 | 2009-01-29 | エヌエックスピー ビー ヴィ | マイクロエレクトロニクス部品用パッケージ及びその製造方法 |
KR100836658B1 (ko) | 2005-10-11 | 2008-06-10 | 삼성전기주식회사 | 광 변조기 모듈 패키지 및 그 제조 방법 |
KR100721172B1 (ko) * | 2006-06-02 | 2007-05-23 | 삼성전기주식회사 | 이미지 센서 모듈 및 그 제조방법 |
KR100758686B1 (ko) * | 2006-09-25 | 2007-09-13 | 주식회사 테크젠 | 이미지 센서 모듈 및 그 제조방법 |
TWI320545B (en) * | 2006-10-05 | 2010-02-11 | Chipmos Technologies Inc | Film type package for fingerprint sensor |
WO2008109867A2 (en) * | 2007-03-07 | 2008-09-12 | University Of Washington | Active contact lens |
CN101414592B (zh) * | 2007-10-18 | 2010-04-14 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器封装结构 |
JP5292307B2 (ja) * | 2007-11-29 | 2013-09-18 | 京セラ株式会社 | 光学装置、封止用基板および光学装置の製造方法 |
US8138027B2 (en) * | 2008-03-07 | 2012-03-20 | Stats Chippac, Ltd. | Optical semiconductor device having pre-molded leadframe with window and method therefor |
US7931832B2 (en) * | 2008-03-31 | 2011-04-26 | Johnson & Johnson Vision Care, Inc. | Ophthalmic lens media insert |
WO2013027464A1 (ja) * | 2011-08-19 | 2013-02-28 | 富士フイルム株式会社 | 撮像素子モジュール及びその製造方法 |
US8492888B2 (en) * | 2011-09-02 | 2013-07-23 | Stats Chippac Ltd. | Integrated circuit packaging system with stiffener and method of manufacture thereof |
US9455423B2 (en) * | 2014-01-24 | 2016-09-27 | Verily Life Sciences Llc | Battery |
DE102014215856A1 (de) * | 2014-08-11 | 2016-02-11 | Robert Bosch Gmbh | Fahrerbeobachtungssystem in einem Kraftfahrzeug |
US10135076B1 (en) | 2015-05-05 | 2018-11-20 | Verily Life Sciences Llc | Tear-activated micro-battery for use on smart contact lenses |
US20170288780A1 (en) * | 2016-03-31 | 2017-10-05 | Intel Corporation | Optoelectronic transceiver assemblies |
KR20240073033A (ko) * | 2021-09-30 | 2024-05-24 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 촬상 장치, 전자 기기 및 촬상 장치의 제조 방법 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2516712B2 (ja) * | 1990-09-18 | 1996-07-24 | 株式会社三井ハイテック | 半導体装置の製造方法 |
JPH0590549A (ja) * | 1991-09-27 | 1993-04-09 | Sanyo Electric Co Ltd | 固体撮像素子及びその製造方法 |
JPH06203403A (ja) * | 1992-10-22 | 1994-07-22 | Matsushita Electron Corp | 半導体レーザ装置および光ピックアップ装置 |
US5748658A (en) * | 1993-10-22 | 1998-05-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and optical pickup head |
US5952714A (en) * | 1995-08-02 | 1999-09-14 | Matsushita Electronics Corporation | Solid-state image sensing apparatus and manufacturing method thereof |
JP3138191B2 (ja) * | 1995-08-10 | 2001-02-26 | 三洋電機株式会社 | 固体撮像素子 |
JPH09199701A (ja) * | 1996-01-16 | 1997-07-31 | Olympus Optical Co Ltd | 固体撮像装置 |
JP3443406B2 (ja) * | 1997-02-10 | 2003-09-02 | 松下電器産業株式会社 | 樹脂封止型半導体装置 |
JP4372241B2 (ja) * | 1998-08-05 | 2009-11-25 | パナソニック株式会社 | 固体撮像装置の製造方法 |
US6130448A (en) | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
US6147389A (en) | 1999-06-04 | 2000-11-14 | Silicon Film Technologies, Inc. | Image sensor package with image plane reference |
US6384473B1 (en) | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
JP2001358997A (ja) * | 2000-06-12 | 2001-12-26 | Mitsubishi Electric Corp | 半導体装置 |
TW454309B (en) * | 2000-07-17 | 2001-09-11 | Orient Semiconductor Elect Ltd | Package structure of CCD image-capturing chip |
JP3540281B2 (ja) * | 2001-02-02 | 2004-07-07 | シャープ株式会社 | 撮像装置 |
EP1357605A1 (en) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Image sensor semiconductor package with castellation |
JP3980933B2 (ja) | 2002-05-23 | 2007-09-26 | ローム株式会社 | イメージセンサモジュールの製造方法 |
US6713857B1 (en) * | 2002-12-05 | 2004-03-30 | Ultra Tera Corporation | Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package |
US7150569B2 (en) | 2003-02-24 | 2006-12-19 | Nor Spark Plug Co., Ltd. | Optical device mounted substrate assembly |
DE10318501A1 (de) | 2003-04-24 | 2005-01-05 | Robert Bosch Gmbh | Chipaufbau in einem Premold-Gehäuse |
JP4606063B2 (ja) * | 2004-05-14 | 2011-01-05 | パナソニック株式会社 | 光学デバイスおよびその製造方法 |
-
2004
- 2004-04-26 JP JP2004130301A patent/JP4686134B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-21 CN CNB2005100673657A patent/CN100420027C/zh not_active Expired - Fee Related
- 2005-04-21 KR KR1020050033132A patent/KR100671094B1/ko not_active IP Right Cessation
- 2005-04-22 US US11/111,706 patent/US7511367B2/en not_active Expired - Fee Related
- 2005-04-26 TW TW094113349A patent/TWI248202B/zh not_active IP Right Cessation
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101675498B (zh) * | 2007-03-02 | 2011-09-28 | 明锐有限公司 | 用于微镜器件的倒装芯片封装的方法和*** |
CN103378013A (zh) * | 2012-04-27 | 2013-10-30 | 佳能株式会社 | 电子部件和电子装置 |
US9155212B2 (en) | 2012-04-27 | 2015-10-06 | Canon Kabushiki Kaisha | Electronic component, mounting member, electronic apparatus, and their manufacturing methods |
US9220172B2 (en) | 2012-04-27 | 2015-12-22 | Canon Kabushiki Kaisha | Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus |
US9253922B2 (en) | 2012-04-27 | 2016-02-02 | Canon Kabushiki Kaisha | Electronic component and electronic apparatus |
CN103378013B (zh) * | 2012-04-27 | 2016-10-05 | 佳能株式会社 | 电子部件和电子装置 |
CN103400817A (zh) * | 2013-08-09 | 2013-11-20 | 苏州晶方半导体科技股份有限公司 | 半导体芯片封装模组、封装结构及其封装方法 |
US10236312B2 (en) | 2015-02-16 | 2019-03-19 | Sony Corporation | Camera module and electronic apparatus to lower risk of breakage of camera module |
CN112992956A (zh) * | 2021-05-17 | 2021-06-18 | 甬矽电子(宁波)股份有限公司 | 芯片封装结构、芯片封装方法和电子设备 |
CN112992956B (zh) * | 2021-05-17 | 2022-02-01 | 甬矽电子(宁波)股份有限公司 | 芯片封装结构、芯片封装方法和电子设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2005317564A (ja) | 2005-11-10 |
KR100671094B1 (ko) | 2007-01-17 |
US20050236685A1 (en) | 2005-10-27 |
CN100420027C (zh) | 2008-09-17 |
JP4686134B2 (ja) | 2011-05-18 |
TW200536113A (en) | 2005-11-01 |
TWI248202B (en) | 2006-01-21 |
KR20060047342A (ko) | 2006-05-18 |
US7511367B2 (en) | 2009-03-31 |
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C14 | Grant of patent or utility model | ||
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Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141202 |
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Effective date of registration: 20141202 Address after: American California Patentee after: Craib Innovations Ltd Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20080917 Termination date: 20160421 |