CN1587147A - 一种低熔点、低膨胀系数焊料玻璃封接粉及其制备方法 - Google Patents
一种低熔点、低膨胀系数焊料玻璃封接粉及其制备方法 Download PDFInfo
- Publication number
- CN1587147A CN1587147A CNA2004100702034A CN200410070203A CN1587147A CN 1587147 A CN1587147 A CN 1587147A CN A2004100702034 A CNA2004100702034 A CN A2004100702034A CN 200410070203 A CN200410070203 A CN 200410070203A CN 1587147 A CN1587147 A CN 1587147A
- Authority
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- low
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- low melting
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Links
- 239000011521 glass Substances 0.000 title claims abstract description 66
- 239000000843 powder Substances 0.000 title claims abstract description 47
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 31
- 238000002844 melting Methods 0.000 title claims description 25
- 230000008018 melting Effects 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 13
- 238000002360 preparation method Methods 0.000 claims abstract description 35
- 238000007789 sealing Methods 0.000 claims abstract description 25
- 229910000174 eucryptite Inorganic materials 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims description 29
- 239000006132 parent glass Substances 0.000 claims description 28
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 22
- 239000011575 calcium Substances 0.000 claims description 19
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 18
- 229910052791 calcium Inorganic materials 0.000 claims description 18
- 238000001816 cooling Methods 0.000 claims description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 10
- 238000000498 ball milling Methods 0.000 claims description 9
- 238000010298 pulverizing process Methods 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004110 Zinc silicate Substances 0.000 claims description 5
- 239000004567 concrete Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 claims description 5
- 235000019352 zinc silicate Nutrition 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052845 zircon Inorganic materials 0.000 claims description 4
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- -1 trichroite Chemical compound 0.000 claims description 3
- 238000007873 sieving Methods 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- 239000006121 base glass Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229910002065 alloy metal Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
- C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
- C03C8/12—Frit compositions, i.e. in a powdered or comminuted form containing lead containing titanium or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100702034A CN100345786C (zh) | 2004-07-30 | 2004-07-30 | 一种低熔点、低膨胀系数焊料玻璃封接粉及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100702034A CN100345786C (zh) | 2004-07-30 | 2004-07-30 | 一种低熔点、低膨胀系数焊料玻璃封接粉及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1587147A true CN1587147A (zh) | 2005-03-02 |
CN100345786C CN100345786C (zh) | 2007-10-31 |
Family
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Family Applications (1)
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CNB2004100702034A Expired - Fee Related CN100345786C (zh) | 2004-07-30 | 2004-07-30 | 一种低熔点、低膨胀系数焊料玻璃封接粉及其制备方法 |
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CN (1) | CN100345786C (zh) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009062557A1 (de) * | 2007-11-12 | 2009-05-22 | Futech Gmbh | Wärmedämmendes verglasungselement und verfahren zu dessen herstellung |
CN101585660B (zh) * | 2009-06-23 | 2012-03-07 | 珠海彩珠实业有限公司 | 一种半导体钝化封装用铅硅铝系玻璃粉的制备方法 |
WO2011094076A3 (en) * | 2010-01-28 | 2012-03-22 | Corning Incorporated | Glass frit coatings for impact resistance |
CN102515535A (zh) * | 2011-12-21 | 2012-06-27 | 中国计量学院 | 一种tft-lcd封接用无铅低膨胀系数玻璃粉及其制备方法 |
CN104276836A (zh) * | 2013-07-12 | 2015-01-14 | 中国科学院上海硅酸盐研究所 | 基于负热膨胀密封介质的封接方法 |
CN104326678A (zh) * | 2014-10-16 | 2015-02-04 | 中国建筑材料科学研究总院 | 一种耐火填料颗粒及其制备方法 |
CN104682909A (zh) * | 2015-02-11 | 2015-06-03 | 福建省南平市三金电子有限公司 | 一种新型晶振低温玻璃封装结构及其封装工艺 |
WO2015149510A1 (zh) * | 2014-03-31 | 2015-10-08 | 京东方科技集团股份有限公司 | 玻璃粉混合物、玻璃粉浆料和光电封装件 |
CN105481253A (zh) * | 2015-12-09 | 2016-04-13 | 哈尔滨工业大学 | 一种复合型低温封接玻璃钎料焊膏的制备方法 |
CN106271188A (zh) * | 2016-09-30 | 2017-01-04 | 浙江哈尔斯真空器皿股份有限公司 | 一种钛杯专用真空钎料及其加工方法和钎焊工艺 |
CN106277775A (zh) * | 2016-08-23 | 2017-01-04 | 太仓市双凤镇薄彩工艺品厂 | 一种含有三氧化二铋的低熔点琉璃及其制造方法 |
CN107056064A (zh) * | 2017-06-01 | 2017-08-18 | 合肥邦诺科技有限公司 | 一种基于流延技术的成型低温玻璃焊料的制备方法 |
CN110776259A (zh) * | 2019-11-01 | 2020-02-11 | 湖南嘉盛电陶新材料股份有限公司 | 低膨胀系数的中低温环保型玻璃粉及其制备方法和应用 |
CN111499207A (zh) * | 2020-04-20 | 2020-08-07 | 北京北旭电子材料有限公司 | 玻璃粉、阀片结构及制备方法 |
CN112299720A (zh) * | 2020-11-16 | 2021-02-02 | 成都光明光电有限责任公司 | 低温封接玻璃 |
CN113336546A (zh) * | 2021-05-26 | 2021-09-03 | 济南大学 | 一种一体化压电陶瓷球壳及其加工方法 |
CN113402285A (zh) * | 2021-05-26 | 2021-09-17 | 济南大学 | 一种压电陶瓷低温共烧烧结剂及其制备方法 |
CN113493309A (zh) * | 2021-07-13 | 2021-10-12 | 北京天力创玻璃科技开发有限公司 | 钛或钛合金-可伐合金封接用焊料、其制备方法及其应用 |
CN114249529A (zh) * | 2021-12-06 | 2022-03-29 | 北京北旭电子材料有限公司 | 锂铝硅系填料组合物、锂铝硅系填料及其制备方法、玻璃封接材料及其应用 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86101451A (zh) * | 1986-03-13 | 1987-10-28 | 电子工业部第十二研究所 | 耐高温耐钠腐蚀的玻璃焊料及其制造方法 |
JPS62256741A (ja) * | 1986-04-16 | 1987-11-09 | Nippon Electric Glass Co Ltd | 封着材料 |
US6248679B1 (en) * | 1996-11-18 | 2001-06-19 | Techneglas, Inc. | Low temperature sealing glass |
CN1398806A (zh) * | 2001-07-24 | 2003-02-26 | 成都旭光电子股份有限公司 | 一种电子器件绝缘用微晶玻璃 |
CN1210219C (zh) * | 2002-05-21 | 2005-07-13 | 北京博迩工贸公司 | 铅硼酸盐基质玻璃和含有该基质玻璃的封接玻璃粉 |
-
2004
- 2004-07-30 CN CNB2004100702034A patent/CN100345786C/zh not_active Expired - Fee Related
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009062557A1 (de) * | 2007-11-12 | 2009-05-22 | Futech Gmbh | Wärmedämmendes verglasungselement und verfahren zu dessen herstellung |
CN101585660B (zh) * | 2009-06-23 | 2012-03-07 | 珠海彩珠实业有限公司 | 一种半导体钝化封装用铅硅铝系玻璃粉的制备方法 |
WO2011094076A3 (en) * | 2010-01-28 | 2012-03-22 | Corning Incorporated | Glass frit coatings for impact resistance |
CN102515535A (zh) * | 2011-12-21 | 2012-06-27 | 中国计量学院 | 一种tft-lcd封接用无铅低膨胀系数玻璃粉及其制备方法 |
CN104276836B (zh) * | 2013-07-12 | 2016-08-10 | 中国科学院上海硅酸盐研究所 | 基于负热膨胀密封介质的封接方法 |
CN104276836A (zh) * | 2013-07-12 | 2015-01-14 | 中国科学院上海硅酸盐研究所 | 基于负热膨胀密封介质的封接方法 |
WO2015149510A1 (zh) * | 2014-03-31 | 2015-10-08 | 京东方科技集团股份有限公司 | 玻璃粉混合物、玻璃粉浆料和光电封装件 |
US10177338B2 (en) | 2014-03-31 | 2019-01-08 | Boe Technology Group Co., Ltd. | Glass powder blend, glass powder paste and photoelectric package |
CN104326678A (zh) * | 2014-10-16 | 2015-02-04 | 中国建筑材料科学研究总院 | 一种耐火填料颗粒及其制备方法 |
CN104682909A (zh) * | 2015-02-11 | 2015-06-03 | 福建省南平市三金电子有限公司 | 一种新型晶振低温玻璃封装结构及其封装工艺 |
CN105481253A (zh) * | 2015-12-09 | 2016-04-13 | 哈尔滨工业大学 | 一种复合型低温封接玻璃钎料焊膏的制备方法 |
CN105481253B (zh) * | 2015-12-09 | 2019-01-08 | 哈尔滨工业大学 | 一种复合型低温封接玻璃钎料焊膏的制备方法 |
CN106277775A (zh) * | 2016-08-23 | 2017-01-04 | 太仓市双凤镇薄彩工艺品厂 | 一种含有三氧化二铋的低熔点琉璃及其制造方法 |
CN106271188A (zh) * | 2016-09-30 | 2017-01-04 | 浙江哈尔斯真空器皿股份有限公司 | 一种钛杯专用真空钎料及其加工方法和钎焊工艺 |
CN107056064A (zh) * | 2017-06-01 | 2017-08-18 | 合肥邦诺科技有限公司 | 一种基于流延技术的成型低温玻璃焊料的制备方法 |
CN110776259A (zh) * | 2019-11-01 | 2020-02-11 | 湖南嘉盛电陶新材料股份有限公司 | 低膨胀系数的中低温环保型玻璃粉及其制备方法和应用 |
CN111499207A (zh) * | 2020-04-20 | 2020-08-07 | 北京北旭电子材料有限公司 | 玻璃粉、阀片结构及制备方法 |
CN112299720A (zh) * | 2020-11-16 | 2021-02-02 | 成都光明光电有限责任公司 | 低温封接玻璃 |
CN112299720B (zh) * | 2020-11-16 | 2022-04-12 | 成都光明光电有限责任公司 | 低温封接玻璃 |
CN113336546A (zh) * | 2021-05-26 | 2021-09-03 | 济南大学 | 一种一体化压电陶瓷球壳及其加工方法 |
CN113402285A (zh) * | 2021-05-26 | 2021-09-17 | 济南大学 | 一种压电陶瓷低温共烧烧结剂及其制备方法 |
CN113493309A (zh) * | 2021-07-13 | 2021-10-12 | 北京天力创玻璃科技开发有限公司 | 钛或钛合金-可伐合金封接用焊料、其制备方法及其应用 |
CN114249529A (zh) * | 2021-12-06 | 2022-03-29 | 北京北旭电子材料有限公司 | 锂铝硅系填料组合物、锂铝硅系填料及其制备方法、玻璃封接材料及其应用 |
CN114249529B (zh) * | 2021-12-06 | 2024-03-01 | 北京北旭电子材料有限公司 | 锂铝硅系填料组合物、锂铝硅系填料及其制备方法、玻璃封接材料及其应用 |
Also Published As
Publication number | Publication date |
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CN100345786C (zh) | 2007-10-31 |
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