CN1537232A - 可规划测试插座 - Google Patents
可规划测试插座 Download PDFInfo
- Publication number
- CN1537232A CN1537232A CNA028144279A CN02814427A CN1537232A CN 1537232 A CN1537232 A CN 1537232A CN A028144279 A CNA028144279 A CN A028144279A CN 02814427 A CN02814427 A CN 02814427A CN 1537232 A CN1537232 A CN 1537232A
- Authority
- CN
- China
- Prior art keywords
- guide plate
- semiconductor device
- substrate
- shell
- electric terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/906,886 US6677770B2 (en) | 2001-07-17 | 2001-07-17 | Programmable test socket |
US09/906,886 | 2001-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1537232A true CN1537232A (zh) | 2004-10-13 |
CN100350253C CN100350253C (zh) | 2007-11-21 |
Family
ID=25423149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028144279A Expired - Fee Related CN100350253C (zh) | 2001-07-17 | 2002-07-09 | 测试插座及应用该测试插座以固定半导体装置的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6677770B2 (zh) |
JP (1) | JP2004536324A (zh) |
KR (1) | KR20040020953A (zh) |
CN (1) | CN100350253C (zh) |
DE (1) | DE10297044B8 (zh) |
TW (1) | TW583402B (zh) |
WO (1) | WO2003010547A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105849572A (zh) * | 2013-09-30 | 2016-08-10 | Nts有限公司 | 半导体芯片检测装置 |
CN109683593A (zh) * | 2018-12-29 | 2019-04-26 | 上海辛格林纳新时达电机有限公司 | 一种脉冲型伺服驱动器基本功能测试方法及设备 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050049578A1 (en) * | 2000-04-14 | 2005-03-03 | Hosheng Tu | Implantable ocular pump to reduce intraocular pressure |
US6927588B1 (en) * | 2002-04-03 | 2005-08-09 | Jeffrey David Snelgrove | Ball alignment plate testing apparatus and method for testing semiconductor chips |
US6998862B2 (en) * | 2003-04-28 | 2006-02-14 | Micron Technology, Inc. | Test socket for semiconductor components having serviceable nest |
US7256595B2 (en) * | 2004-03-22 | 2007-08-14 | Micron Technology, Inc. | Test sockets, test systems, and methods for testing microfeature devices |
KR100563603B1 (ko) * | 2004-06-04 | 2006-03-23 | 주식회사 대성엔지니어링 | 인서트 장치 |
US7118385B1 (en) | 2005-09-22 | 2006-10-10 | International Business Machines Corporation | Apparatus for implementing a self-centering land grid array socket |
KR100822281B1 (ko) * | 2006-11-29 | 2008-04-16 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러용 캐리어모듈 |
US7955892B2 (en) * | 2007-11-25 | 2011-06-07 | Globalfoundries Inc. | Multiple size package socket |
TWI680019B (zh) * | 2016-05-11 | 2019-12-21 | 萬潤科技股份有限公司 | 晶圓殘膠清潔方法及裝置 |
US20180172760A1 (en) * | 2016-12-20 | 2018-06-21 | Multitest Elektronische Systeme Gmbh | Contact device and a method of testing a singulated electronic component using a contact device |
US10789550B2 (en) * | 2017-04-13 | 2020-09-29 | Battelle Memorial Institute | System and method for generating test vectors |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5228866A (en) * | 1992-07-06 | 1993-07-20 | Wells Electronics, Inc. | Socket for integrated circuit carrier |
US5290192A (en) * | 1992-09-28 | 1994-03-01 | Wells Electronics, Inc. | Chip carrier socket |
US5557212A (en) * | 1994-11-18 | 1996-09-17 | Isaac; George L. | Semiconductor test socket and contacts |
US5926027A (en) * | 1995-09-28 | 1999-07-20 | Bumb, Jr.; Frank E. | Apparatus and method for testing a device |
US5791914A (en) * | 1995-11-21 | 1998-08-11 | Loranger International Corporation | Electrical socket with floating guide plate |
KR0175268B1 (ko) * | 1996-05-10 | 1999-04-01 | 김광호 | 수평 하향식 접속 방식의 베어 칩 테스트 장치 |
US6181149B1 (en) | 1996-09-26 | 2001-01-30 | Delaware Capital Formation, Inc. | Grid array package test contactor |
JPH11329648A (ja) | 1998-05-19 | 1999-11-30 | Molex Inc | Icデバイスソケット |
JP2001249163A (ja) * | 2000-03-06 | 2001-09-14 | Takai Kogyo Kk | Icデバイスの試験用ソケット |
-
2001
- 2001-07-17 US US09/906,886 patent/US6677770B2/en not_active Expired - Lifetime
-
2002
- 2002-07-09 JP JP2003515864A patent/JP2004536324A/ja active Pending
- 2002-07-09 KR KR10-2003-7017259A patent/KR20040020953A/ko not_active Application Discontinuation
- 2002-07-09 CN CNB028144279A patent/CN100350253C/zh not_active Expired - Fee Related
- 2002-07-09 WO PCT/EP2002/007583 patent/WO2003010547A2/en active Application Filing
- 2002-07-09 DE DE10297044T patent/DE10297044B8/de not_active Expired - Fee Related
- 2002-07-10 TW TW091115334A patent/TW583402B/zh not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105849572A (zh) * | 2013-09-30 | 2016-08-10 | Nts有限公司 | 半导体芯片检测装置 |
CN105849572B (zh) * | 2013-09-30 | 2019-01-22 | Nts有限公司 | 半导体芯片检测装置 |
CN109683593A (zh) * | 2018-12-29 | 2019-04-26 | 上海辛格林纳新时达电机有限公司 | 一种脉冲型伺服驱动器基本功能测试方法及设备 |
Also Published As
Publication number | Publication date |
---|---|
WO2003010547A3 (en) | 2003-09-25 |
DE10297044B4 (de) | 2011-06-01 |
CN100350253C (zh) | 2007-11-21 |
US6677770B2 (en) | 2004-01-13 |
US20030016038A1 (en) | 2003-01-23 |
TW583402B (en) | 2004-04-11 |
DE10297044B8 (de) | 2013-01-03 |
KR20040020953A (ko) | 2004-03-09 |
JP2004536324A (ja) | 2004-12-02 |
DE10297044T5 (de) | 2004-08-12 |
WO2003010547A2 (en) | 2003-02-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: INFINEON TECHNOLOGIES AG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121012 Address after: Munich, Germany Patentee after: QIMONDA AG Address before: Munich, Germany Patentee before: Infineon Technologies AG |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151230 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: QIMONDA AG |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071121 Termination date: 20180709 |
|
CF01 | Termination of patent right due to non-payment of annual fee |