CN1328780C - 基板处理装置及基板处理方法 - Google Patents
基板处理装置及基板处理方法 Download PDFInfo
- Publication number
- CN1328780C CN1328780C CNB2004100575931A CN200410057593A CN1328780C CN 1328780 C CN1328780 C CN 1328780C CN B2004100575931 A CNB2004100575931 A CN B2004100575931A CN 200410057593 A CN200410057593 A CN 200410057593A CN 1328780 C CN1328780 C CN 1328780C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003314209 | 2003-09-05 | ||
JP2003314209A JP4080401B2 (ja) | 2003-09-05 | 2003-09-05 | 基板処理装置および基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1591816A CN1591816A (zh) | 2005-03-09 |
CN1328780C true CN1328780C (zh) | 2007-07-25 |
Family
ID=34414899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100575931A Active CN1328780C (zh) | 2003-09-05 | 2004-08-23 | 基板处理装置及基板处理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4080401B2 (zh) |
KR (1) | KR100591568B1 (zh) |
CN (1) | CN1328780C (zh) |
TW (1) | TWI244721B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399175B (zh) * | 2007-09-25 | 2010-06-23 | 佳能安内华股份有限公司 | 显示基板制造方法 |
Families Citing this family (42)
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US7292428B2 (en) * | 2005-04-26 | 2007-11-06 | Applied Materials, Inc. | Electrostatic chuck with smart lift-pin mechanism for a plasma reactor |
CN100409424C (zh) * | 2005-04-26 | 2008-08-06 | 大日本网目版制造株式会社 | 基板处理装置 |
KR100943433B1 (ko) * | 2005-12-30 | 2010-02-19 | 주식회사 에이디피엔지니어링 | 기판 리프팅 모듈 및 리프팅 방법 |
KR100682739B1 (ko) * | 2005-08-12 | 2007-02-15 | 주식회사 아이피에스 | 기판 리프팅 장치 및 이를 이용한 기판 디척킹 방법 |
KR101186517B1 (ko) * | 2005-12-07 | 2012-10-08 | 티이씨 주식회사 | 글라스 승강장치 및 이를 이용한 액정표시장치의 제조방법 |
JP4781867B2 (ja) * | 2006-03-23 | 2011-09-28 | 大日本スクリーン製造株式会社 | 熱処理装置 |
JP5117052B2 (ja) * | 2006-04-26 | 2013-01-09 | 株式会社オーク製作所 | 露光装置および露光方法 |
JPWO2007144982A1 (ja) * | 2006-06-13 | 2009-10-29 | 芝浦メカトロニクス株式会社 | 吸着保持装置及び吸着保持方法 |
JP4795899B2 (ja) * | 2006-08-31 | 2011-10-19 | 東京エレクトロン株式会社 | 基板載置機構および基板受け渡し方法 |
JP4799325B2 (ja) * | 2006-09-05 | 2011-10-26 | 東京エレクトロン株式会社 | 基板受け渡し装置,基板処理装置,基板受け渡し方法 |
JP5009101B2 (ja) * | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | 基板研磨装置 |
JP5044332B2 (ja) * | 2007-09-04 | 2012-10-10 | 大日本スクリーン製造株式会社 | 処理装置 |
TWI439351B (zh) * | 2008-09-29 | 2014-06-01 | Nitto Denko Corp | Adsorption tablets |
KR101004434B1 (ko) * | 2008-11-26 | 2010-12-28 | 세메스 주식회사 | 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법 |
US20100184290A1 (en) * | 2009-01-16 | 2010-07-22 | Applied Materials, Inc. | Substrate support with gas introduction openings |
KR101011932B1 (ko) | 2009-06-25 | 2011-02-08 | 에이피시스템 주식회사 | 대형 기판 안착장치 |
WO2012108263A1 (ja) * | 2011-02-08 | 2012-08-16 | シャープ株式会社 | 基板保持装置および露光装置 |
CN102179881A (zh) * | 2011-04-01 | 2011-09-14 | 石金精密科技(深圳)有限公司 | 平面薄板吸附固定*** |
US8593613B2 (en) * | 2011-09-13 | 2013-11-26 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | LCD exposure stage device and exposure system |
CN202257028U (zh) * | 2011-09-13 | 2012-05-30 | 深圳市华星光电技术有限公司 | Lcd曝光平台装置及曝光*** |
KR101389005B1 (ko) * | 2011-12-20 | 2014-04-28 | 삼성디스플레이 주식회사 | 레이저 가공장치 및 그 제어방법 |
JP6057599B2 (ja) * | 2012-08-09 | 2017-01-11 | タツモ株式会社 | 吸着定盤及びその製造方法 |
JP5993710B2 (ja) * | 2012-10-26 | 2016-09-14 | 株式会社ディスコ | 洗浄装置と四角板状ワークの搬送方法 |
CN103172271B (zh) * | 2013-03-15 | 2015-11-25 | 京东方科技集团股份有限公司 | 一种涂布方法 |
JP2015115528A (ja) * | 2013-12-13 | 2015-06-22 | Ntn株式会社 | 基板処理装置および基板処理方法 |
CN103913902A (zh) * | 2014-03-25 | 2014-07-09 | 京东方科技集团股份有限公司 | 一种掩膜板组装装置及组装方法 |
JP6535206B2 (ja) * | 2014-05-08 | 2019-06-26 | 株式会社ブイ・テクノロジー | 露光方法及び露光装置 |
KR101958397B1 (ko) * | 2015-05-15 | 2019-03-15 | 주식회사 다원시스 | 유기막 증착 장치와, 방법 및 유기막 장치 |
JP6615643B2 (ja) * | 2016-03-03 | 2019-12-04 | 株式会社タカトリ | 被加工部材の加工方法及び加工装置 |
US20180326590A1 (en) * | 2015-11-16 | 2018-11-15 | Takatori Corporation | Wire saw device, and processing method and processing device for workpiece |
JP6709457B2 (ja) * | 2016-05-26 | 2020-06-17 | 株式会社タカトリ | 被加工部材の加工方法及び加工装置 |
CN106915023A (zh) * | 2015-12-24 | 2017-07-04 | 中国科学院理化技术研究所 | 一种用于液体注模成型加工过程中除气固定的真空抽板 |
JP6591916B2 (ja) * | 2016-03-07 | 2019-10-16 | 株式会社ブイ・テクノロジー | マスク製造装置 |
KR102401363B1 (ko) * | 2017-10-30 | 2022-05-24 | 세메스 주식회사 | 반도체 패키지들을 진공 흡착하기 위한 진공 테이블 |
JP6986930B2 (ja) | 2017-11-07 | 2021-12-22 | 株式会社荏原製作所 | 基板研磨装置および研磨方法 |
CN109759721A (zh) * | 2018-12-28 | 2019-05-17 | 武汉华星光电技术有限公司 | 切割设备及切割方法 |
DE102019107477B4 (de) * | 2019-03-22 | 2021-03-04 | Homag Gmbh | Konsole, Spannmittel und Unterdruckspanneinrichtung |
TWI822993B (zh) * | 2019-05-08 | 2023-11-21 | 日商尼康股份有限公司 | 基板貼合裝置及基板貼合方法 |
CN111158218A (zh) * | 2020-01-03 | 2020-05-15 | Tcl华星光电技术有限公司 | 曝光平台装置及曝光*** |
JP6788922B1 (ja) * | 2020-01-10 | 2020-11-25 | 上野精機株式会社 | 電子部品の処理装置 |
JP7438018B2 (ja) | 2020-05-11 | 2024-02-26 | 東京エレクトロン株式会社 | 基板載置方法及び基板載置機構 |
CN111817497B (zh) * | 2020-07-10 | 2022-01-21 | 深圳市汇顶科技股份有限公司 | 控制装置和运动机构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06333799A (ja) * | 1993-05-21 | 1994-12-02 | Toshiba Corp | 半導体製造装置 |
JPH1064982A (ja) * | 1996-08-14 | 1998-03-06 | Dainippon Screen Mfg Co Ltd | 基板保持機構及び基板処理装置 |
JPH1086085A (ja) * | 1996-09-19 | 1998-04-07 | Dainippon Screen Mfg Co Ltd | 基板吸着装置および基板吸着方法 |
JPH11265927A (ja) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | チップの突き上げ装置 |
JP2002313902A (ja) * | 2001-04-18 | 2002-10-25 | Canon Inc | 静電チャック、該静電チャックから基板を離脱する方法 |
-
2003
- 2003-09-05 JP JP2003314209A patent/JP4080401B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-21 TW TW093121762A patent/TWI244721B/zh active
- 2004-08-23 CN CNB2004100575931A patent/CN1328780C/zh active Active
- 2004-09-02 KR KR1020040069809A patent/KR100591568B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06333799A (ja) * | 1993-05-21 | 1994-12-02 | Toshiba Corp | 半導体製造装置 |
JPH1064982A (ja) * | 1996-08-14 | 1998-03-06 | Dainippon Screen Mfg Co Ltd | 基板保持機構及び基板処理装置 |
JPH1086085A (ja) * | 1996-09-19 | 1998-04-07 | Dainippon Screen Mfg Co Ltd | 基板吸着装置および基板吸着方法 |
JPH11265927A (ja) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | チップの突き上げ装置 |
JP2002313902A (ja) * | 2001-04-18 | 2002-10-25 | Canon Inc | 静電チャック、該静電チャックから基板を離脱する方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399175B (zh) * | 2007-09-25 | 2010-06-23 | 佳能安内华股份有限公司 | 显示基板制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI244721B (en) | 2005-12-01 |
KR100591568B1 (ko) | 2006-06-19 |
KR20050024250A (ko) | 2005-03-10 |
CN1591816A (zh) | 2005-03-09 |
TW200518256A (en) | 2005-06-01 |
JP4080401B2 (ja) | 2008-04-23 |
JP2005085881A (ja) | 2005-03-31 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |