TW200518256A - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing methodInfo
- Publication number
- TW200518256A TW200518256A TW093121762A TW93121762A TW200518256A TW 200518256 A TW200518256 A TW 200518256A TW 093121762 A TW093121762 A TW 093121762A TW 93121762 A TW93121762 A TW 93121762A TW 200518256 A TW200518256 A TW 200518256A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- substrate processing
- attract
- angular
- holding surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides a substrate processing apparatus which can satisfactorily attract a substrate to its substrate-placing part even when the size of the substrate is increased and, at the same time, from which the substrate attracted to the substrate-placing section can be removed satisfactorily. A plurality of adsorption grooves 75 formed on the holding surface of the substrate treating device in a grid-like state are connected to each other at grid points 76. A part of the grid points 76 communicates with the suction holes 72. The suction holes 72 are connected to a vacuum pump in communicating states through piping. End-section lifter pins 71a and central-part lifter pins 71b are independently provided in vertically movable states. Consequently, (1) the substrate treating device can attract the whole bottom surface of an angular substrate W even when the device does not have many attraction holes in the holding surface, and, (2) it can attract the angular substrate W onto the holding surface from the vicinity of the central part of the substrate W to the end section of the angular substrate W.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003314209A JP4080401B2 (en) | 2003-09-05 | 2003-09-05 | Substrate processing apparatus and substrate processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200518256A true TW200518256A (en) | 2005-06-01 |
TWI244721B TWI244721B (en) | 2005-12-01 |
Family
ID=34414899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093121762A TWI244721B (en) | 2003-09-05 | 2004-07-21 | Substrate processing apparatus and substrate processing method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4080401B2 (en) |
KR (1) | KR100591568B1 (en) |
CN (1) | CN1328780C (en) |
TW (1) | TWI244721B (en) |
Cited By (1)
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---|---|---|---|---|
EP3479958A1 (en) * | 2017-11-07 | 2019-05-08 | Ebara Corporation | Substrate polishing device and polishing method |
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US20100184290A1 (en) * | 2009-01-16 | 2010-07-22 | Applied Materials, Inc. | Substrate support with gas introduction openings |
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Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06333799A (en) * | 1993-05-21 | 1994-12-02 | Toshiba Corp | Semiconductor manufacturing device |
JP3881062B2 (en) * | 1996-08-14 | 2007-02-14 | 大日本スクリーン製造株式会社 | Substrate holding mechanism and substrate processing apparatus |
JPH1086085A (en) * | 1996-09-19 | 1998-04-07 | Dainippon Screen Mfg Co Ltd | Substrate adsorption device and method |
JP3509538B2 (en) * | 1998-03-17 | 2004-03-22 | 松下電器産業株式会社 | Chip pushing device |
JP2002313902A (en) * | 2001-04-18 | 2002-10-25 | Canon Inc | Electrostatic chuck and method of dismounting substrate therefrom |
-
2003
- 2003-09-05 JP JP2003314209A patent/JP4080401B2/en not_active Expired - Lifetime
-
2004
- 2004-07-21 TW TW093121762A patent/TWI244721B/en active
- 2004-08-23 CN CNB2004100575931A patent/CN1328780C/en active Active
- 2004-09-02 KR KR1020040069809A patent/KR100591568B1/en active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3479958A1 (en) * | 2017-11-07 | 2019-05-08 | Ebara Corporation | Substrate polishing device and polishing method |
US11331766B2 (en) | 2017-11-07 | 2022-05-17 | Ebara Corporation | Substrate polishing device and polishing method |
Also Published As
Publication number | Publication date |
---|---|
TWI244721B (en) | 2005-12-01 |
CN1591816A (en) | 2005-03-09 |
JP2005085881A (en) | 2005-03-31 |
KR20050024250A (en) | 2005-03-10 |
JP4080401B2 (en) | 2008-04-23 |
CN1328780C (en) | 2007-07-25 |
KR100591568B1 (en) | 2006-06-19 |
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