CN1311511A - 各向异性导电性粘结膜 - Google Patents
各向异性导电性粘结膜 Download PDFInfo
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- CN1311511A CN1311511A CN01112374A CN01112374A CN1311511A CN 1311511 A CN1311511 A CN 1311511A CN 01112374 A CN01112374 A CN 01112374A CN 01112374 A CN01112374 A CN 01112374A CN 1311511 A CN1311511 A CN 1311511A
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- adhesive layer
- insulating properties
- film
- circuit board
- anisotropic conductive
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y10T29/00—Metal working
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Abstract
在使用各向异性导电性粘结膜,将IC芯片等的电子部件安装在聚酯基的柔性印刷电路板上的情况下,提高粘结性和导通可靠性。各向异性导电性粘结膜1A由第1绝缘性粘结剂层2、第2绝缘性粘结剂层3、以及导电颗粒4组成,其中,第2绝缘性粘结剂层3固化后的弹性率比第1绝缘性粘结剂层2固化后的弹性率低,而导电颗粒4分散到第1绝缘性粘结剂层2或第2绝缘性粘结剂层3的至少其中一个中。
Description
本发明涉及半导体芯片等电子部件和电路板等电气机械连接使用的各向异性导电性粘结膜,特别涉及适合在聚酯基的柔性印刷电路板上倒装安装半导体芯片情况的各向异性导电性粘结膜。
以往,为了电气机械地将半导体芯片等电子部件和电路板之间、或电路板之间进行连接而使用各向异性导电性粘结膜(ACF),但近年来特别在携带电话或IC卡等领域中,为了在柔性印刷电路板(FPC)上倒装安装(COF)IC芯片而广泛使用各向异性导电性粘结膜。
作为各向异性导电性粘结膜,一般使用将导电颗粒分散到环氧树脂系的单层的绝缘性粘结剂层中的单层结构的膜。此外,已知用同一组成的绝缘性粘结剂来分散导电颗粒的层和不分散的层的双层结构,或有分散导电颗粒的绝缘性粘结剂层和改变该绝缘性粘结剂组成的一部分的绝缘性粘结剂组成的层的双层结构的膜。
另一方面,在携带电话和IC卡等领域中,由于价格竞争,所以强烈要求降低成本。因此,作为在这些领域使用的柔性印刷电路板,相对于以前的聚酰亚胺基的柔性印刷电路板,大多使用聚酯基的柔性印刷电路板。
但是,聚酯基的柔性印刷电路板在其表面性的影响下与聚酰亚胺基的情况相比粘结性低,另一方面,使用现有的环氧树脂系的绝缘性粘结剂的各向异性导电性粘结膜弹性率提高,所以如果将安装电子部件的柔性印刷电路板从聚酰亚胺基的柔性印刷电路板变更为聚酯基的柔性印刷电路板,则存在电子部件和电路板之间的粘结性下降的问题。
与此相对,作为各向异性导电性粘结膜的绝缘性粘结剂,尝试使用粘结性高弹性率低的丙烯酸酯系的粘结剂,但在该情况下,即使粘结性提高,但仍存在导通可靠性差的问题。
因此,在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下,如果使用现有的各向异性导电性粘结膜,与粘结性或导通可靠性相关,产生不能满足规定的技术规范这样的问题。
本发明的目的在于,解决这样的现有技术问题的发明,使用各向异性导电性粘结膜,即使在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下,也可以获得良好的粘结性和导通可靠性。
本发明人使用各向异性导电性粘结膜,在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下,将构成各向异性导电性粘结膜的绝缘性粘结剂层形成具有电子部件侧的层和柔性印刷电路板侧的层的多层结构,通过使柔性印刷电路板侧的绝缘性粘结剂层的固化后的弹性率比电子部件侧的绝缘性粘结剂层的固化后的弹性率低,发现粘结性和导通可靠性被同时提高,从而完成本发明。
就是说,本发明提供各向异性导电性粘结膜,由第1绝缘性粘结剂层、第2绝缘性粘结剂层、以及导电颗粒构成,其中,第2绝缘性粘结剂层的固化后的弹性率比第1绝缘性粘结剂层固化后的弹性率低,而导电颗粒分散到第1绝缘性粘结剂层或第2绝缘性粘结剂层的至少其中一个中。
此外,本发明提供连接方法,使用上述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接,其中,将各向异性导电性粘结膜的第1绝缘性粘结剂层配置在半导体芯片侧,将第2绝缘性粘结剂层配置在电路板侧。
而且,本发明提供连接结构体,使用上述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接,其中,将各向异性导电性粘结膜的第1绝缘性粘结剂层的固化物与半导体芯片粘结,将第2绝缘性粘结剂层的固化物与电路板粘结。
图1是本发明的连接方法的说明图。
图2是本发明的连接方法的说明图。
图3是本发明的连接方法的说明图。
以下,参照附图来详细说明本发明。再有,在各图中,同一符号表示同一或同等的结构要素。
图1是使用本发明的各向异性导电性粘结膜1A来连接IC芯片10和电路板20的方法说明图。
各向异性导电性粘结膜1A有第1绝缘性粘结剂层2、第2绝缘性粘结剂层3的双层结构,导电颗粒4分别分散到双方的绝缘性粘结剂层2、3中。
在本发明的各向异性导电性粘结膜1A中,具有第1绝缘性粘结剂层2的固化后的弹性率c1比第2绝缘性粘结剂层3的固化后的弹性率c2大的特征。绝缘性粘结剂层2、3的固化后的弹性率之比c1/c2最好在10以上。由此,在使用各向异性导电性粘结膜1A来连接IC芯片10和电路板20的情况下,即使电路板20在聚酯基的基本材料膜21上设有布线电路22,通过将第1绝缘性粘结剂层2侧配置在IC芯片10侧,将绝缘性粘结剂层3配置连接在电路板20侧,与电路板为聚酰亚胺基的情况同样,也可以同时提高粘结性和导通可靠性。
作为这种使绝缘性粘结剂层2、3的固化后的弹性率不同的方法没有特别限制,但如果使用同种的绝缘性树脂,则即使调整固化剂的种类或添加量,也难以使固化后的弹性率完全不同,所以最好使用不同的绝缘性树脂。例如,由热固化性环氧系粘结剂等来形成第1绝缘性粘结剂层2,由热固化性丙烯酸酯系粘结剂等来形成第2绝缘性粘结剂层3。特别是从保存性和速固化性等特性方面来看,最好由使用咪唑系潜在性热固化剂的热固化性环氧系粘结剂来形成第1绝缘性粘结剂层2,由使用过氧化物系固化剂的热固化性丙烯酸酯系粘结剂来形成第2绝缘性粘结剂层3。这种情况下,热固化性环氧系粘结剂可以由双酚A型环氧树脂、双酚F型环氧树脂、四溴双酚A型环氧树脂等一般的环氧树脂来构成。此外,热固化性丙烯酸酯系粘结剂可以由具有反应性二重结合的氨基丙烯酸酯、聚酯丙烯酸酯、环氧丙烯酸酯等构成。
第1绝缘性粘结剂层2的厚度t1和第2绝缘性粘结剂层3的厚度t2之比t1/t2最好在0.15以上、7以下。如果该比t1/t2低于0.15,则第1绝缘性粘结剂层2的形成效果不能充分体现,导通可靠性下降。相反,如果t1/t2超过7,则第2绝缘性粘结剂层3的形成效果不能充分体现,粘结性下降。
第1绝缘性粘结剂层2的厚度t1和第2绝缘性粘结剂层3的厚度t2的相加厚度可以与现有的单层的各向异性导电性粘结膜相同,一般最好为10~100μm。
另一方面,作为导电颗粒4,例如可以使用由Ni、Ag、Cu或它们的合金等组成的金属粉、在球状树脂颗粒的表面上实施金属电镀的颗粒、在这些良好导体组成的颗粒表面上设有绝缘性树脂覆盖膜的颗粒等,可以使用在以往各向异性导电性粘结剂中使用的各种导电颗粒。导电颗粒的粒径最好为0.2~20μm。此外,分散到第1绝缘性粘结剂层2中的导电颗粒4、和分散到第2绝缘性粘结剂层3中的导电颗粒4可以使用相同的导电颗粒,也可以使用不同的导电颗粒。
作为各向异性导电性粘结膜1A的制造方法,按照一般方法将各自导电颗粒4分散到第1绝缘性粘结剂层形成用组成物和第2绝缘性粘结剂层形成用组成物中,进行成膜,通过将所得的2片薄膜重合压接来制造。此外,也可以在形成分散了导电颗粒4的第1绝缘性粘结剂层2或第2绝缘性粘结剂层3的一个之后,在其上还涂敷分散另一个导电颗粒4的绝缘性粘结剂形成用组成物,通过成膜来形成。从生产率来看,将各个膜重合的方法较好。
本发明的各向异性导电性粘结膜只要设有固化后的弹性率不同的2层绝缘性粘结剂层,就可以获得各种状态。例如,在上述的图1的各向异性导电性粘结膜1A中,将导电颗粒4分散到第1绝缘性粘结剂层2和第2绝缘性粘结剂层3双方,但如图2的各向异性导电性粘结膜1B所示,也可以不将导电颗粒4分散到第1绝缘性粘结剂层2中,而仅分散到第2绝缘性粘结剂层3中。由此,在凸缘面积小的微细图形的情况下,图形可以捕捉更多的导电颗粒。
此外,如图3所示,也可以不将导电颗粒4分散到第2绝缘性粘结剂层3中,而仅分散到第1绝缘性粘结剂层2中。
此外,在本发明的各向异性导电性粘结膜中,除了固化后的弹性率不同的2层的绝缘性粘结剂层以外,根据需要,也可以将其它的绝缘性粘结剂层设置在第1绝缘性粘结剂层2和第2绝缘性粘结剂层3之间而形成三层以上的多层结构。
本发明的各向异性导电性粘结膜可以用于各种电子部件和电路板之间的连接、或电路板之间的连接等。这种情况下,作为连接对象的电路板,可以列举出聚酯基的电路板、聚酰亚胺基的电路板等。
特别在将IC芯片等半导体芯片倒装安装在聚酯基的电路板上的情况下,通过将本发明的各向异性导电性粘结膜的第1绝缘性粘结剂层配置在半导体芯片侧,将第2绝缘性粘结剂层配置在电路板侧,与使用现有的各向异性导电性粘结膜的情况相比,可以显著地提高粘结性和导通可靠性。因此,本发明还包括这样的连接方法和通过这样的连接方法连接的连接结构体。
【实施例】
以下,根据实施例来具体说明本发明。
实施例1~10、比较例1~3
按表2或表3所示的厚度制作表1的配合组成的膜1~膜5,通过将所得的膜按表2或表3所示的组合重合、压接来制作双层结构的各向异性导电性粘结膜。此外,通过热压固化成为50μm厚的膜状的各膜1~5,通过动态粘弹性测定装置(オリエンテック社)求固化后的弹性率(0℃)。结果示于表1。
评价
夹入各实施例和比较例的各向异性导电性粘结膜并经加热加压(200℃、1N/冲击、10秒)来连接在PET基的基板膜上夹入粘结剂层形成的铝的布线图形的柔性印刷电路板、IC芯片(4×4mm、IC芯片的厚度t=0.15mm)。
如下评价所得的连接结构体的(1)连接强度、(2)导通可靠性、(3)耐冲击性。结果示于表2和表3。
(1)粘结强度
将IC芯片固定在玻璃上,将柔性印刷电路板在90°方向上以50mm/min的拉伸速度来剥离,测定此时的剥离速度。再有,如果剥离强度在4N/cm以上,则可得到充分的连接可靠性,如果在2N/cm以上,则可靠性有一些下降,但实用性充分,而如果低于2N/cm,则为NG。
(2)导通可靠性
60℃、95%RH、500小时的老化后的电阻值不足老化前的初期电阻值2倍的情况评价为○,2倍以上、5倍以下的情况评价为△,而5倍以上的情况评价为×。
(3)耐冲击性
用塑料制的棒对连接结构体的IC芯片周边施加1N左右的轻冲击后电阻值不足施加轻冲击前的初期电阻值2倍的情况评价为○,2倍以上、5倍以下的情况评价为△,而5倍以上的情况评价为×。
【表1】(单位:重量份)
注:(*1)油化シェルエポキシ社,EP1009(*2)旭チバ社,HX3941HP(*3)帝国化学社,WS-023(*4)荒川化学工业社,ビ一ムセット 504H(*5)东亜合成社,アロニックス M315(*6)日本油脂社,パ一キュア WO(*7)Ni粒子,粒径5μm以下
成分 膜1 膜2 膜3 膜4 膜5 |
固态环氧树脂(*1) 35 |
热潜在性固化剂(*2)65 |
丙烯酸橡胶(*3) 55 ← ← ← |
聚氨丙烯酸酯(*4) 30 40 15 |
多宫能丙烯酸酯(*5) 10 25 40 |
过氧化物化合物(*6) 5 ← ← ← |
导电粒子(*7) 15 ← ← ← ← |
固化后的弹性率(30℃)22×10-25×10-21×10-13×10-1[GPa] |
【表2】
实施例1 实施例2 实施例3 实施例4 实施例5 实施例6 实施例7 |
膜1 芯片侧 芯片侧 芯片侧 芯片侧 芯片侧 芯片侧 芯片侧 |
25μm 20μm 15μm 10μm 5μm 15μm 15μm |
膜2 基板侧 基板侧 基板侧 基板侧 基板侧 基板侧 基板侧 |
5μm 10μm 15μm 20μm 25μm |
膜3 基板侧15μm |
膜4 基板侧15μm |
膜5 |
膜厚之比(芯片侧/基板侧) |
5 2 1 0.5 0.2 1 1 |
膜固化物弹性率比(芯片侧/基板侧) |
100 100 100 100 100 40 20 |
粘结强度 4.2 5.8 8.0 8.2 8.5 8.9 8.4(N/cm) |
导通可靠性○ ○ ○ ○ ○ ○ ○ |
耐冲击性 ○ ○ ○ ○ ○ ○ ○ |
【表3】
实施例8实施例9实施例10比较例1比较例2比较例3膜1 芯片侧 芯片侧 芯片侧 基板侧27μm 3μm 15μm 15μm 30μm |
膜2 基板侧 基板侧 芯片侧3μm 27μm 15μm 30μm |
膜3 |
膜4 |
膜5 基板侧15μm |
膜厚之比(芯片侧/基板侧)9 0.11 1 1 - - |
膜固化物弹性率比(芯片侧/基板侧)100 100 6.7 0.01 - - |
粘结强度 3.2 8.7 2.9 2.5 1.2 7.8(N/cm) |
导通可靠性 ○ △ ○ × ○ × |
耐冲击性 ○ △ ○ × ○ × |
从表2、表3的结果可知,在使用单层环氧系的膜1(弹性率:2GPa)的比较例2中,粘结性低,在使用单层丙烯酸酯系的膜2(弹性率:2×10-2GPa)的比较例3中,导通可靠性和耐冲击性差。此外,即使在膜1和膜2的双层结构的情况下,在将膜1配置在基板侧,将膜2配置在芯片侧并进行连接的比较例1中,可知粘结强度比较低、导通可靠性和耐冲击性也差。
与此相对,可知在将环氧系的膜1(弹性率:2GPa)配置在芯片侧,将丙烯酸酯系的膜2~5(弹性率:2×10-2~3×10-1GPa)配置在基板侧进行连接的实施例1~10中,粘结强度、导通可靠性、耐冲击性都良好,特别是膜1和膜2~5的弹性率之比在10以上、厚度比在0.15以上、7以下的实施例1~7中,粘结强度、导通可靠性、耐冲击性更好。
根据本发明的各向异性导电性粘结膜,即使在聚酯基的柔性印刷电路板上安装IC芯片等电子部件的情况下,也可以获得良好的粘结性和导通可靠性。
Claims (9)
1.一种各向异性导电性粘结膜,由第1绝缘性粘结剂层、第2绝缘性粘结剂层、以及导电颗粒构成,其中,第2绝缘性粘结剂层的固化后的弹性率比第1绝缘性粘结剂层固化后的弹性率低,而导电颗粒分散到第1绝缘性粘结剂层或第2绝缘性粘结剂层的至少一个中。
2.如权利要求1所述的各向异性导电性粘结膜,其中,第1绝缘性粘结剂层固化后的弹性率c1与第2绝缘性粘结剂层固化后的弹性率c2之比c1/c2在10以上。
3.如权利要求2所述的各向异性导电性粘结膜,其中,第1绝缘性粘结剂层的厚度t1与第2绝缘性粘结剂层的厚度t2之比t1/t2在0.15以上、7以下。
4.如权利要求1~3中任何一项所述的各向异性导电性粘结膜,其中,第1绝缘性粘结剂层由使用咪唑系潜在性固化剂的热固化性环氧系粘结剂组成,第2绝缘性粘结剂层由使用过氧化物系固化剂的热固化性丙烯酸酯系粘结剂组成。
5.如权利要求1~4中任何一项所述的各向异性导电性粘结膜,其中,导电颗粒分散到第2绝缘性粘结剂层中。
6.一种连接方法,使用权利要求1~5中任何一项所述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接,其中,将各向异性导电性粘结膜的第1绝缘性粘结剂层配置在半导体芯片侧,将第2绝缘性粘结剂层配置在电路板侧。
7.如权利要求6的连接方法,其中,电路板是聚酯基的电路板。
8.一种连接结构体,使用权利要求1~5中任何一项所述的各向异性导电性粘结膜将半导体芯片和电路板进行电气机械连接,其中,各向异性导电性粘结膜的第1绝缘性粘结剂层的固化物与半导体芯片粘结,第2绝缘性粘结剂层的固化物与电路板粘结。
9.如权利要求8所述的连接结构体,其中,电路板是聚酯基的电路板。
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TWI244497B (en) | 2005-12-01 |
JP3491595B2 (ja) | 2004-01-26 |
US6592783B2 (en) | 2003-07-15 |
US20030102466A1 (en) | 2003-06-05 |
CN1190801C (zh) | 2005-02-23 |
JP2001240816A (ja) | 2001-09-04 |
KR100639083B1 (ko) | 2006-10-27 |
KR20010085434A (ko) | 2001-09-07 |
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