WO2008102476A1 - 電子回路装置、その製造方法及び表示装置 - Google Patents
電子回路装置、その製造方法及び表示装置 Download PDFInfo
- Publication number
- WO2008102476A1 WO2008102476A1 PCT/JP2007/070471 JP2007070471W WO2008102476A1 WO 2008102476 A1 WO2008102476 A1 WO 2008102476A1 JP 2007070471 W JP2007070471 W JP 2007070471W WO 2008102476 A1 WO2008102476 A1 WO 2008102476A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- circuit device
- manufacturing
- display apparatus
- electronic circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/517,996 US20100321908A1 (en) | 2007-02-22 | 2007-10-19 | Electronic circuit device, production method thereof, and display device |
CN200780044882XA CN101574022B (zh) | 2007-02-22 | 2007-10-19 | 电子电路装置及其制造方法以及显示装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007042701 | 2007-02-22 | ||
JP2007-042701 | 2007-02-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008102476A1 true WO2008102476A1 (ja) | 2008-08-28 |
Family
ID=39709759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/070471 WO2008102476A1 (ja) | 2007-02-22 | 2007-10-19 | 電子回路装置、その製造方法及び表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100321908A1 (ja) |
CN (1) | CN101574022B (ja) |
WO (1) | WO2008102476A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010035551A1 (ja) * | 2008-09-29 | 2010-04-01 | シャープ株式会社 | 基板モジュールおよびその製造方法 |
JP2014101377A (ja) * | 2008-03-05 | 2014-06-05 | Vicus Therapeutics Llc | 癌および粘膜炎の治療のための組成物および方法 |
JP2019061253A (ja) * | 2017-01-24 | 2019-04-18 | 大日本印刷株式会社 | 調光セル、調光体及び移動体 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4814277B2 (ja) * | 2008-04-18 | 2011-11-16 | ソニーケミカル&インフォメーションデバイス株式会社 | 接合体、該接合体の製造方法、及び該接合体に用いられる異方性導電膜 |
JP2011198779A (ja) * | 2008-07-22 | 2011-10-06 | Sharp Corp | 電子回路装置、その製造方法及び表示装置 |
EP2466631A1 (en) * | 2009-09-30 | 2012-06-20 | Sharp Kabushiki Kaisha | Substrate module and manufacturing method thereof |
KR101712043B1 (ko) | 2010-10-14 | 2017-03-03 | 삼성전자주식회사 | 적층 반도체 패키지, 상기 적층 반도체 패키지를 포함하는 반도체 장치 및 상기 적층 반도체 패키지의 제조 방법 |
KR101204570B1 (ko) * | 2010-12-01 | 2012-11-26 | 삼성전기주식회사 | 전자종이 표시장치 및 이의 제조방법 |
US20120267782A1 (en) * | 2011-04-25 | 2012-10-25 | Yung-Hsiang Chen | Package-on-package semiconductor device |
KR20140038164A (ko) * | 2012-09-20 | 2014-03-28 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
JP6392149B2 (ja) * | 2015-03-18 | 2018-09-19 | 株式会社ジャパンディスプレイ | 表示装置、表示装置の製造方法 |
WO2018124023A1 (ja) * | 2016-12-27 | 2018-07-05 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
CN108574158B (zh) * | 2017-03-14 | 2020-10-09 | 群创光电股份有限公司 | 显示装置及其制造方法 |
CN106950763A (zh) * | 2017-03-28 | 2017-07-14 | 武汉华星光电技术有限公司 | 显示模组及终端 |
CN106909006A (zh) * | 2017-04-25 | 2017-06-30 | 昆山龙腾光电有限公司 | 黏贴结构及采用该黏贴结构的导电构造和液晶显示装置 |
CN107422553B (zh) * | 2017-09-05 | 2020-12-25 | Tcl华星光电技术有限公司 | 一种阵列基板及显示面板 |
CN108388054B (zh) * | 2018-02-14 | 2021-11-19 | 武汉天马微电子有限公司 | 显示面板与显示装置 |
US11224131B2 (en) * | 2018-04-04 | 2022-01-11 | Lenovo (Singapore) Pte. Ltd. | Systems and methods for surface mounting cable connections |
JP7444593B2 (ja) * | 2019-12-13 | 2024-03-06 | シャープ株式会社 | 表示装置、表示装置の製造方法およびプリント配線基板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0477134U (ja) * | 1990-11-15 | 1992-07-06 | ||
JPH08114810A (ja) * | 1994-10-14 | 1996-05-07 | Toshiba Corp | 液晶パネル製造装置および圧着装置 |
JP2005166934A (ja) * | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
JP2006235295A (ja) * | 2005-02-25 | 2006-09-07 | Citizen Watch Co Ltd | 液晶表示パネル |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
JPH09148731A (ja) * | 1995-11-17 | 1997-06-06 | Fujitsu Ltd | 配線基板間の接続構造の製造方法 |
JPH1056099A (ja) * | 1996-08-12 | 1998-02-24 | Shinko Electric Ind Co Ltd | 多層回路基板およびその製造方法 |
JP3610787B2 (ja) * | 1998-03-24 | 2005-01-19 | セイコーエプソン株式会社 | 半導体チップの実装構造体、液晶装置及び電子機器 |
JP3660175B2 (ja) * | 1998-11-25 | 2005-06-15 | セイコーエプソン株式会社 | 実装構造体及び液晶装置の製造方法 |
JP2000286293A (ja) * | 1999-03-29 | 2000-10-13 | Nitto Denko Corp | 半導体装置および半導体素子実装用回路基板 |
JP2001223240A (ja) * | 2000-02-10 | 2001-08-17 | Nitto Denko Corp | 半導体装置 |
JP3491595B2 (ja) * | 2000-02-25 | 2004-01-26 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
CN1630680A (zh) * | 2002-01-10 | 2005-06-22 | 东丽株式会社 | 双轴取向热塑性树脂薄膜 |
JP3910527B2 (ja) * | 2002-03-13 | 2007-04-25 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
US7059874B2 (en) * | 2002-03-19 | 2006-06-13 | Paricon Technologies, Inc. | Anisotropic conductive elastomer based electrical interconnect with enhanced dynamic range |
WO2005089094A2 (en) * | 2003-11-21 | 2005-09-29 | The Board Of Regents Of The University And Community College System Of Nevada | Materials and methods for the preparation of anisotropically-ordered solids |
US7139060B2 (en) * | 2004-01-27 | 2006-11-21 | Au Optronics Corporation | Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film |
CN100539305C (zh) * | 2005-02-16 | 2009-09-09 | Jsr株式会社 | 复合导电性薄板及其制造方法 |
-
2007
- 2007-10-19 WO PCT/JP2007/070471 patent/WO2008102476A1/ja active Application Filing
- 2007-10-19 US US12/517,996 patent/US20100321908A1/en not_active Abandoned
- 2007-10-19 CN CN200780044882XA patent/CN101574022B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0477134U (ja) * | 1990-11-15 | 1992-07-06 | ||
JPH08114810A (ja) * | 1994-10-14 | 1996-05-07 | Toshiba Corp | 液晶パネル製造装置および圧着装置 |
JP2005166934A (ja) * | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
JP2006235295A (ja) * | 2005-02-25 | 2006-09-07 | Citizen Watch Co Ltd | 液晶表示パネル |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014101377A (ja) * | 2008-03-05 | 2014-06-05 | Vicus Therapeutics Llc | 癌および粘膜炎の治療のための組成物および方法 |
WO2010035551A1 (ja) * | 2008-09-29 | 2010-04-01 | シャープ株式会社 | 基板モジュールおよびその製造方法 |
JP5008767B2 (ja) * | 2008-09-29 | 2012-08-22 | シャープ株式会社 | 基板モジュールおよびその製造方法 |
US8450753B2 (en) | 2008-09-29 | 2013-05-28 | Sharp Kabushiki Kaisha | Board module and method of manufacturing same |
JP2019061253A (ja) * | 2017-01-24 | 2019-04-18 | 大日本印刷株式会社 | 調光セル、調光体及び移動体 |
JP7047724B2 (ja) | 2017-01-24 | 2022-04-05 | 大日本印刷株式会社 | 調光セル、調光体及び移動体 |
Also Published As
Publication number | Publication date |
---|---|
CN101574022B (zh) | 2011-04-20 |
US20100321908A1 (en) | 2010-12-23 |
CN101574022A (zh) | 2009-11-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008102476A1 (ja) | 電子回路装置、その製造方法及び表示装置 | |
EP2284849A4 (en) | Electronic device and method for connecting electronic circuit board | |
WO2009066183A3 (en) | Tightly-coupled pcb gnss circuit and manufacturing method | |
WO2012150817A3 (en) | Printed circuit board and method for manufacturing the same | |
EP2503861A3 (en) | Printed circuit board assembly for a mobile terminal and method for fabricating the same | |
WO2007005617A3 (en) | Electrically conducting polymer glue, devices made therewith and methods of manufacture | |
WO2008030208A3 (en) | Multilayer electronic component systems and methods of manufacture | |
TW200629490A (en) | Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same | |
GB2488265A (en) | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | |
WO2006093938A3 (en) | Junction-isolated vias | |
EP2256540A3 (en) | Display apparatus and method of fabricating the same | |
WO2010068515A3 (en) | Electronic devices including flexible electrical circuits and related methods | |
TW200740317A (en) | Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method | |
WO2008146243A3 (en) | An electronic device comprising a convertible structure, and a method of manufacturing an electronic device | |
EP2007180A4 (en) | PCB, ELECTRONIC CIRCUIT ARRANGEMENT AND DISPLAY | |
EP2423948A3 (en) | Lateral connection for a via-less thin film resistor and method of forming the same | |
EP2046107A4 (en) | PRINTED CIRCUIT BOARD DEVICE, ELECTRONIC DEVICE WITH PRINTED CIRCUIT BOARD DEVICE, AND MASS CONNECTION METHOD | |
WO2008143358A1 (ja) | 電気装置、接続方法及び接着フィルム | |
EP2490233A4 (en) | Multilayer capacitor, manufacturing method thereof, circuit board, and electronic device | |
WO2012012108A3 (en) | Galvanic isolation transformer | |
EP1976060A4 (en) | ANTENNA CELL MODULE, CARD TYPE INFORMATION DEVICE AND METHOD OF MANUFACTURING THEREOF | |
TW200733843A (en) | Filter and its coils connecting frame | |
EP2053462A4 (en) | ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF | |
TW200629998A (en) | Printed circuit board and forming method thereof | |
WO2013029037A3 (en) | Space-efficient containment devices and method of making same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780044882.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07830205 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12517996 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 07830205 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |