CN102334238A - 各向异性导电膜和发光装置 - Google Patents

各向异性导电膜和发光装置 Download PDF

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Publication number
CN102334238A
CN102334238A CN2010800095162A CN201080009516A CN102334238A CN 102334238 A CN102334238 A CN 102334238A CN 2010800095162 A CN2010800095162 A CN 2010800095162A CN 201080009516 A CN201080009516 A CN 201080009516A CN 102334238 A CN102334238 A CN 102334238A
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light
anisotropic conductive
conductive film
adhesive linkage
emitting device
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CN102334238B (zh
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蟹泽士行
熊仓博之
波木秀次
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Dexerials Corp
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Sony Chemical and Information Device Corp
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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Abstract

本发明提供各向异性导电膜及使用其而成的发光装置，所述各向异性导电膜在将使用发光二极管元件而成的发光装置进行倒装片安装时，在不对LED元件设置导致制造成本增加的光反射层的情况下，而不使发光效率降低。该各向异性导电膜具有将光反射性绝缘粘接层和各向异性导电粘接层进行层叠、并且该光反射性绝缘粘接层是在绝缘性粘接剂中分散有光反射性粒子而成的结构。发光装置具有在基板上的连接端子与发光二极管元件的连接用凸起之间配置该各向异性导电膜，并将基板和发光二极管元件进行倒装片安装的结构。

Description

各向异性导电膜和发光装置
技术领域
本发明涉及各向异性导电膜和发光装置。
背景技术
使用发光二极管（LED）元件而成的发光装置被广泛应用，作为旧式的发光装置的结构，如图3所示，在基板31上用芯片焊接粘接剂32将LED元件33接合，将其上面的p电极34和n电极35用金丝37与基板31的连接端子36进行引线接合，并用透明成型用树脂38将整个LED元件33封闭。但是，对于图3的发光装置，存在以下问题：在LED元件33发出的光中，向上面侧射出的400～500nm的波长的光被金丝37吸收，另外，向下面侧射出的光的一部分被芯片焊接粘接剂32吸收，LED元件33的发光效率降低。
因此，如图4所示，提出了将LED元件33进行倒装片安装（专利文献1）。在该倒装片安装技术中，在p电极34和n电极35处分别形成凸起39，进一步地，在LED元件33的凸起形成面上以与p电极34和n电极35绝缘的方式设置光反射层40。并且，LED元件33和基板31使用各向异性导电糊料41来连接固定。因此，在图4的发光装置中，向LED元件33的上方射出的光不被金线吸收，向下方射出的光的绝大部分被光反射层40反射而向上方射出，因此发光效率不降低。
专利文献1：日本特开平11-168235号公报。
发明内容
但是，在专利文献1的技术中，必须在LED元件33上通过金属蒸镀法等以与p电极34和n电极35绝缘的方式设置光反射层40，在制造上存在成本不可避免地升高的问题。
本发明的目的在于解决以上现有技术的问题，提出了各向异性导电膜以及使用其而成的发光装置，所述各向异性导电膜在将使用发光二极管（LED）元件而成的发光装置进行倒装片安装时，在不对LED元件设置导致制造成本增加的光反射层的情况下，而不使发光效率降低。
本发明人想到如果使各向异性导电膜具有光反射功能，则可以实现上述目的，作为其具体的构成，将各向异性导电膜制成2层的构成，使一层为光反射性绝缘粘接层，并使另一层为各向异性导电粘接层，从而完成了本发明。
即，本发明提供了各向异性导电膜，其是将光反射性绝缘粘接层和各向异性导电粘接层进行层叠而成的各向异性导电膜，其中，该光反射性绝缘粘接层是在绝缘性粘接剂中分散光反射性粒子而成的。
另外，本发明提供了发光装置，其是使各向异性导电膜介于基板上的连接端子和发光二极管元件的连接用的凸起之间、并将该基板和该发光二极管元件进行倒装片安装的发光装置，其中，
该各向异性导电膜是将光反射性绝缘粘接层和各向异性导电粘接层进行层叠，并且该光反射性绝缘粘接层是在绝缘性粘接剂中分散光反射性粒子而成的各向异性导电膜。
本发明的各向异性导电膜具有将光反射性绝缘粘接层和各向异性导电粘接层进行层叠而成的结构。因此，在使用其将LED元件和基板进行各向异性导电连接而制造的发光装置中，LED元件所发出的光中，向基板侧（即，LED元件的背面侧）发出的光被光反射性绝缘粘接层反射而从表面侧射出。因此，发光装置的发光效率不会降低。
附图说明
[图1]本发明的各向异性导电膜的截面图。
[图2]本发明的发光装置的截面图。
[图3]现有的发光装置的截面图。
[图4]现有的发光装置的截面图。
符号说明
1　光反射性绝缘粘接层
2　各向异性导电粘接层
21　基板
22　连接端子
23　LED元件
24　n电极
25　p电极
26　凸起
100　各向异性导电膜
200　发光装置。
具体实施方式
参考附图详细地对本发明进行说明。
图1是本发明的各向异性导电膜100的截面图。该各向异性导电膜100具有将光反射性绝缘粘接层1和各向异性导电粘接层2进行层叠而成的结构，该光反射性绝缘粘接层1是在绝缘性粘接剂中分散光反射性粒子而成的。因此，对于各向异性导电膜100，从光反射性绝缘粘接层1侧入射的光根据光反射性粒子的性状而向入射侧反射。此外，对于从各向异性导电粘接层2侧入射的光，即使其一部分在各向异性导电粘接层2吸收或散射，但其多数也被光反射性绝缘粘接层1反射，从各向异性导电粘接层2射出。因此，可以不使LED元件的发光效率降低。
在本发明中，作为构成光反射性绝缘粘接层1的绝缘性粘接剂，可以适当采用作为现有的各向异性导电粘接膜的绝缘性粘合剂树脂而使用的物质。例如可以使用在以脂环式环氧树脂或加氢环氧树脂等为主成分的环氧系树脂中，含有酸酐、咪唑化合物、氰等交联剂而成的热固性粘接剂。应予说明，如果考虑到密合性等，构成光反射性绝缘粘接层1的绝缘性粘接剂和构成下述的各向异性导电粘接层2的粘合剂优选使用同种的物质。
光反射性粒子可以使用碳酸钙、二氧化钛、二氧化硅、氧化铝等金属氧化物的粒子、用绝缘被膜被覆的镍、银、铝等的金属粒子等。粒子的形状可以列举无定形、球状、鳞片状、针状等，其中，从光扩散效果的角度考虑，优选为球状的形状，从全反射效果的角度考虑，优选鳞片状的形状。从光的反射率的角度考虑，特别优选鳞片状银粒子。
光反射性粒子的大小根据形状而有所不同，一般，如果过于大，则有可能阻碍由各向异性导电粒子形成的连接，如果过小，则难以反射光，因此优选在为球状时，粒径为0.1～30μm、更优选0.2～10μm，在为鳞片状时，长径优选为0.1～100μm、更优选1～50μm，厚度优选为0.01～10μm、更优选0.1～5μm。其中，当进行绝缘被覆时，光反射性粒子的大小是还含有该绝缘被覆的大小。
只要可得到目标的光反射性，光反射性绝缘粘接层1的层厚从连接可靠性的角度考虑优选是薄的。通常为2～30μm。当以该厚度范围为前提时，光反射性绝缘粘接层1中的绝缘性粘接剂与光反射性粒子的配合比例根据光反射性粒子的形状而异，相对于绝缘性粘接剂100质量份，在光反射性粒子为鳞片状时光反射性粒子优选为1～200质量份、更优选10～100质量份。
作为光反射性粒子用绝缘被膜被覆而成的金属粒子中的该绝缘被覆，可以使用各种绝缘性树脂。从机械强度或透明性等的角度考虑，可以优选使用丙烯酸系树脂的固化物。可以优选列举在过氧化苯甲酰等有机过氧化物等的自由基引发剂的存在下，使甲基丙烯酸甲酯和甲基丙烯酸-2-羟基乙酯进行自由基共聚而成的树脂被膜。该情况下，更优选用2，4-甲苯二异氰酸酯等的异氰酸酯系交联剂进行交联。应予说明，对于金属氧化物的粒子，从分散稳定性的观点考虑，也优选预先用与金属粒子同样的绝缘被膜进行被覆。
此外，作为金属粒子，优选预先用硅烷偶联剂在金属表面引入γ-环氧丙氧基或乙烯基等。
作为构成本发明的各向异性导电膜100的各向异性导电粘接层2，可以使用与现有的各向异性导电膜同样的构成，通常为在热固性粘接剂中分散各向异性导电连接用的导电粒子而成的层。作为这种热固化性粘接剂，可以列举例如在以脂环式环氧树脂或加氢环氧树脂等为主成分的环氧系树脂中含有酸酐、咪唑化合物、氰等交联剂而成的物质。此外，作为各向异性导电连接用的导电粒子，可以使用金、镍等的金属粒子、将苯胍胺树脂等树脂粒子的表面用镍等的金属被覆而成的金属被覆树脂粒子等。
这种导电粒子为球状形状，如果其粒径过大，则连接可靠性降低，因此优选为1～20μm、更优选3～10μm。
为了得到目标的连接可靠性，各向异性导电粘接层2的层厚通常为5～40μm。当以该厚度范围为前提时，各向异性导电粘接层2中的绝缘性粘接剂与导电粒子的配合比例为，相对于绝缘性粘接剂100质量份，导电粒子优选为1～50质量份、更优选10～25质量份。
本发明的各向异性导电膜可以如以下说明那样来制造。首先，将光反射性粒子和绝缘性粘接剂与甲苯等的溶剂一起进行分散混合，并涂布在进行了剥离处理的PET膜上，以形成期望的厚度，在约80℃左右的温度下进行干燥，制成光反射性绝缘粘接层膜。另外，将各向异性导电连接用的导电粒子和绝缘性粘接剂与甲苯等的溶剂一起进行分散混合，并涂布在进行了剥离处理的PET膜上，以形成期望的厚度，在约80℃左右的温度下进行干燥，制成各向异性导电粘接层膜。接着，将二个膜叠合，通过两侧的剥离膜在约40℃下进行加压，由此将膜一体化，从而可以得到本发明的各向异性导电膜。
接着，对于本发明的发光装置，参考图2进行说明。发光装置200是如下的发光装置：使上述本发明的各向异性导电膜100介于基板21上的连接端子22、与LED元件23的在n电极24和p电极25处各自形成的连接用凸起26之间，将该基板21和该LED元件23进行倒装片安装而成。即，各向异性导电膜100是光反射性绝缘粘接层1和各向异性导电粘接层2的叠层结构物，光反射性绝缘粘接层1是在绝缘性粘接剂中分散光反射性粒子而成的。该情况下，期望各向异性导电膜100的光反射性绝缘粘接层1配置在LED元件23侧，但也可以配置在相反侧。应予说明，根据需要也可以用透明成型用树脂进行封闭，以覆盖整个LED元件23。
在这样构成的发光装置200中，LED元件23所发出的光中，向基板21侧发出的光被各向异性导电膜100的光反射性绝缘粘接层1反射，从LED元件23的上面射出。因此，可以防止发光效率的降低。
本发明的发光装置200中的除各向异性导电膜100以外的构成（LED元件23、凸起26、基板21、连接端子22等）可以与现有的发光装置的构成相同。此外，本发明的发光装置200除了使用各向异性导电膜100以外，还可以利用现有的各向异性导电连接技术进行制造。
[实施例]
实施例1
（1a）光反射性粒子的制作
在带有搅拌机的烧瓶中加入鳞片状银粒子（长10μm、宽10μm、厚0.5μm）5g和甲苯50ml，一边搅拌一边在烧瓶中加入硅烷偶联剂（3-甲基丙烯酰氧基丙基三乙氧基硅烷）0.25g，在25℃下搅拌60分钟。接着，在该混合物中加入甲基丙烯酸甲酯2g、甲基丙烯酸-2-羟基乙酯2g、过氧化苯甲酰0.04g和2,4-甲苯二异氰酸酯1g，在80℃下搅拌12小时，由此得到作为光反射性粒子的绝缘被覆鳞片状银粒子。包括绝缘被覆的光反射性粒子的平均大小为长10μm、宽10μm、厚0.5μm。
（1b）光反射性绝缘性粘接层膜的制作
通过在氢化环氧树脂（YX8000、JER（株））中添加酸酐（MH-700、新日本理化（株））、咪唑（2MZA、四国化成（株）），制备绝缘性粘合剂树脂。将所得绝缘性粘合剂树脂100质量份和绝缘被覆鳞片状银粒子50质量份在甲苯100ml中分散混合，将得到的混合物涂布在剥离聚对苯二甲酸乙二醇酯（PET）膜上，以使干燥厚度为10μm，在80℃下干燥5分钟，由此得到光反射性绝缘性粘接层膜。
（1c）各向异性导电粘接层膜的制作
将与上述（1b）同样的绝缘性粘合剂树脂100质量份和镀银被覆树脂粒子（粒径5μm）20质量份在甲苯100ml中分散混合，将得到的混合物涂布在剥离聚对苯二甲酸乙二醇酯（PET）膜上，以使干燥厚度为10μm，在80℃下干燥5分钟，由此得到各向异性导电粘接层膜。
（1d）各向异性导电膜的制作
将所得光反射性绝缘性粘接层膜和各向异性导电粘接层膜叠合，通过两侧的PET膜，在40℃下进行10秒钟的加压，由此通过将两膜层叠而得到各向异性导电膜。
＜特性评价＞
使用200℃的加热头，将发光二极管元件（If＝20mA时的特性为Vf＝3.3V、发光强度＝150mcd、主波长＝470nm）经由各向异性导电膜在环氧玻璃钢基板上以1Kg/芯片的条件进行20秒的加热加压，由此进行粘接。此时，由于对发光二极管元件的凸起部分施加压力，因此将光反射性绝缘粘接层膜的粘接剂排除，可通过各向异性导电粘接层的导电粒子使得发光二极管元件和环氧玻璃钢基板之间导通。应予说明，凸起以外的光反射性绝缘粘接层不被排除，可维持光反射功能。
另外，使所得发光装置发光，使用亮度计（BM-9，トプコンテクノハウス（株））测定从上面射出的光的初始亮度（kcd/m2）。此外，对LED亮灯可靠性进行评价，对于LED在100℃下流过20mA的恒定电流，将Vf值的变化为±0.3V以内的情况记作“○”，将Vf值的变化超过±0.3V的情况记作“×”。得到的结果示于表1。
实施例2
作为光反射性粒子，使用平均粒径为0.2μm的二氧化钛粒子（JR405、テイカ（株））50质量份来代替绝缘被覆鳞片状银粒子，除此以外，与实施例1同样地制成光反射性绝缘性粘接层膜、各向异性导电粘接层膜，进而制成各向异性导电膜。使用该各向异性导电膜，与实施例1同样地将发光二极管元件连接在环氧玻璃钢基板上，进行特性评价。得到的结果示于表1。
比较例1
使用银糊料来代替各向异性导电膜，将发光二极管与环氧玻璃钢基板连接，与实施例1同样地进行特性评价。得到的结果示于表1。
比较例2
不使用光反射性绝缘性粘接层膜，而使用实施例1的各向异性导电粘接层膜本身作为各向异性导电膜，与实施例1同样地将发光二极管元件与环氧玻璃钢基板连接，进行特性评价。得到的结果示于表1。
[表1]
Figure 2010800095162100002DEST_PATH_IMAGE001
由表1可知，对于实施例1的情况，由于使用了绝缘被覆的鳞片状Ag粒子，因此初始亮度与银糊料（比较例1）相比表现出高亮度，且LED亮灯可靠性也良好。此外，对于实施例2的情况，由于使用了TiO2粒子，因此表现出与银糊料（比较例1）相匹敌的初始亮度，且LED亮灯可靠性也良好。对于比较例2的情况，由于不具有光反射层，因此初始亮度存在问题。
产业实用性
本发明的各向异性导电膜具有将光反射性绝缘粘接层和各向异性导电粘接层进行层叠而成的结构。因此，在使用其将LED元件和基板进行各向异性导电连接而制造的发光装置中，可使LED元件所发出的光中、向基板侧（即，LED元件的背面侧）发出的光被光反射性绝缘粘接层反射而从表面侧射出。因此，可以不使发光装置的发光效率降低。由此，本发明的各向异性导电膜在将LED元件进行倒装片安装时是有用的。

Claims (7)

1. 各向异性导电膜，其是将光反射性绝缘粘接层和各向异性导电粘接层进行层叠而成的各向异性导电膜，其中，该光反射性绝缘粘接层是在绝缘性粘接剂中分散光反射性粒子而成的。
2. 权利要求1所述的各向异性导电膜，其中，光反射性粒子是用绝缘被膜被覆的金属粒子。
3. 权利要求2所述的各向异性导电膜，其中，金属粒子为鳞片状银粒子。
4. 权利要求2或3所述的各向异性导电膜，其中，被覆鳞片状金属粒子的绝缘被膜是甲基丙烯酸甲酯与甲基丙烯酸-2-羟基乙酯的自由基共聚物被膜。
5. 权利要求4所述的各向异性导电膜，其中，该绝缘被膜用异氰酸酯系交联剂进行交联。
6. 发光装置，其是使各向异性导电膜介于基板上的连接端子和发光二极管元件的连接用的凸起之间、并将该基板和该发光二极管元件进行倒装片安装的发光装置，其中，
该各向异性导电膜是将光反射性绝缘粘接层和各向异性导电粘接层进行层叠、并且该光反射性绝缘粘接层是在绝缘性粘接剂中分散光反射性粒子而成的各向异性导电膜。
7. 权利要求6所述的发光装置，其中，该各向异性导电膜的光反射性绝缘粘接层配置在发光二极管元件侧。
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