CN1235233C - 可安装的电导体 - Google Patents
可安装的电导体 Download PDFInfo
- Publication number
- CN1235233C CN1235233C CN01820371.XA CN01820371A CN1235233C CN 1235233 C CN1235233 C CN 1235233C CN 01820371 A CN01820371 A CN 01820371A CN 1235233 C CN1235233 C CN 1235233C
- Authority
- CN
- China
- Prior art keywords
- cable
- substrate
- fastener
- hook
- plastic drum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
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- 238000005476 soldering Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/222—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
- B60R16/0215—Protecting, fastening and routing means therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/40—Insulated conductors or cables characterised by their form with arrangements for facilitating mounting or securing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
- B29C2043/461—Rollers the rollers having specific surface features
- B29C2043/465—Rollers the rollers having specific surface features having one or more cavities, e.g. for forming distinct products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/727—Fastening elements
- B29L2031/729—Hook and loop-type fasteners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Insulated Conductors (AREA)
- Installation Of Indoor Wiring (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Manufacturing Of Electric Cables (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24335300P | 2000-10-25 | 2000-10-25 | |
US60/243,353 | 2000-10-25 | ||
US29374301P | 2001-05-25 | 2001-05-25 | |
US60/293,743 | 2001-05-25 | ||
US32324401P | 2001-09-19 | 2001-09-19 | |
US60/323,244 | 2001-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1479926A CN1479926A (zh) | 2004-03-03 |
CN1235233C true CN1235233C (zh) | 2006-01-04 |
Family
ID=27399653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN01820371.XA Expired - Fee Related CN1235233C (zh) | 2000-10-25 | 2001-10-25 | 可安装的电导体 |
Country Status (10)
Country | Link |
---|---|
US (3) | US6977055B2 (zh) |
EP (1) | EP1354385B1 (zh) |
JP (2) | JP4837234B2 (zh) |
CN (1) | CN1235233C (zh) |
AU (1) | AU2002225863A1 (zh) |
CA (1) | CA2426866A1 (zh) |
DE (3) | DE60129862T2 (zh) |
ES (2) | ES2276850T3 (zh) |
MX (1) | MXPA03003695A (zh) |
WO (1) | WO2002035672A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102791529A (zh) * | 2010-03-15 | 2012-11-21 | 矢崎总业株式会社 | 用于制造电路本体的方法和线束 |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060210762A1 (en) * | 2005-03-17 | 2006-09-21 | Tachauer Ernesto S | Rigid subtrates having molded projections, and methods of making the same |
MXPA03003695A (es) * | 2000-10-25 | 2005-01-25 | Velcro Ind | Aseguramiento de conductores electricos. |
FR2826620B1 (fr) * | 2001-06-27 | 2003-09-26 | Aplix Sa | Pavillon a tissu a boucles |
DE20211568U1 (de) | 2002-07-15 | 2002-11-07 | LEONI Bordnetz-Systeme GmbH & Co KG, 90402 Nürnberg | Haltevorrichtung zum Befestigen eines strangförmigen Körpers auf einem flächigen Bauteil |
DE10245596B3 (de) * | 2002-09-30 | 2004-06-17 | Johnson Controls Gmbh | Vorverkabeltes Ausstattungsteil, Leitungsstrang und Verfahren zu seiner Herstellung |
DE10301424B3 (de) * | 2003-01-13 | 2004-02-26 | Gottlieb Binder Gmbh & Co. Kg | Haftverschlußteil mit Schaltkreis |
DE102004003127A1 (de) * | 2004-01-15 | 2005-08-04 | Gottlieb Binder Gmbh & Co. Kg | Haftverschlussteil mit Heizmittel und Verfahren zum Herstellen eines solchen Haftverschlussteils |
DE102004016627A1 (de) * | 2004-03-29 | 2005-11-24 | Gottlieb Binder Gmbh & Co. Kg | Anzeigevorrichtung |
US7690053B2 (en) * | 2005-06-23 | 2010-04-06 | Mag Aerospace Industries, Inc. | Vacuum toilet assembly |
US20070022602A1 (en) * | 2005-07-28 | 2007-02-01 | Kingsford Howard A | Forming conductive traces |
US7556405B2 (en) | 2005-07-28 | 2009-07-07 | Velcro Industries B.V. | Mounting light emitting diodes |
US20070101557A1 (en) * | 2005-11-07 | 2007-05-10 | Gallant Christopher M | Bendable fastener strips |
US7412139B2 (en) * | 2005-12-13 | 2008-08-12 | Velcro Industries B.V. | Light transmission |
WO2007149995A2 (en) * | 2006-06-21 | 2007-12-27 | Velcro Industries B.V. | Making and securing identification tags |
FI20060673A0 (fi) * | 2006-07-11 | 2006-07-11 | Keskuslaboratorio | Painomenetelmä ja -laitteet ja painettu tuote |
US7678998B2 (en) * | 2007-05-21 | 2010-03-16 | Cicoil, Llc | Cable assembly |
US8061886B1 (en) | 2008-04-30 | 2011-11-22 | Velcro Industries B.V. | Securing electrical devices |
US20100080520A1 (en) * | 2008-05-12 | 2010-04-01 | Howard Lind | Flexible silicone cable system integrated with hollow tubing for fluid delivery |
US8595922B2 (en) * | 2008-05-12 | 2013-12-03 | Howard Lind | Flexible silicone cable system integrated with snap washer |
US8375572B2 (en) * | 2008-05-12 | 2013-02-19 | Howard Lind | Method for creating a silicone encased flexible cable |
US8598461B2 (en) * | 2008-05-12 | 2013-12-03 | Howard Lind | Flexible self supporting encased silicone cable system and method |
US20100077528A1 (en) * | 2008-05-12 | 2010-04-01 | Howard Lind | Clothing and apparel integrated with flexible silicone encased cable systems |
JP5183436B2 (ja) * | 2008-11-21 | 2013-04-17 | 株式会社日立製作所 | 機能性パネルおよびその接合方法 |
WO2011063213A1 (en) * | 2009-11-20 | 2011-05-26 | Genz Ryan T | Fabric constructions with sensory transducers |
US8292502B2 (en) * | 2010-04-07 | 2012-10-23 | Arizant Healthcare Inc. | Constructions for zero-heat-flux, deep tissue temperature measurement devices |
KR101388705B1 (ko) * | 2011-06-30 | 2014-04-25 | 삼성전기주식회사 | 선형 진동모터 |
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- 2001-10-25 CN CN01820371.XA patent/CN1235233C/zh not_active Expired - Fee Related
- 2001-10-25 JP JP2002538543A patent/JP4837234B2/ja not_active Expired - Fee Related
- 2001-10-25 DE DE60129862T patent/DE60129862T2/de not_active Expired - Lifetime
- 2001-10-25 CA CA002426866A patent/CA2426866A1/en not_active Abandoned
- 2001-10-25 ES ES01988962T patent/ES2276850T3/es not_active Expired - Lifetime
- 2001-10-25 DE DE60139516T patent/DE60139516D1/de not_active Expired - Lifetime
- 2001-10-25 WO PCT/US2001/046045 patent/WO2002035672A2/en active IP Right Grant
- 2001-10-25 EP EP01988962A patent/EP1354385B1/en not_active Expired - Lifetime
- 2001-10-25 DE DE60125834T patent/DE60125834T2/de not_active Expired - Lifetime
- 2001-10-25 ES ES05011947T patent/ES2292004T3/es not_active Expired - Lifetime
-
2003
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-
2005
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- 2005-11-22 US US11/286,532 patent/US7670639B2/en not_active Expired - Fee Related
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2008
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102791529A (zh) * | 2010-03-15 | 2012-11-21 | 矢崎总业株式会社 | 用于制造电路本体的方法和线束 |
CN102791529B (zh) * | 2010-03-15 | 2015-08-05 | 矢崎总业株式会社 | 用于制造电路本体的方法和线束 |
US9379510B2 (en) | 2010-03-15 | 2016-06-28 | Yazaki Corporation | Method for manufacturing circuit body and wire harness |
Also Published As
Publication number | Publication date |
---|---|
DE60125834D1 (de) | 2007-02-15 |
JP4837234B2 (ja) | 2011-12-14 |
EP1354385B1 (en) | 2007-01-03 |
JP2008235887A (ja) | 2008-10-02 |
JP2004512660A (ja) | 2004-04-22 |
AU2002225863A1 (en) | 2002-05-06 |
US7670639B2 (en) | 2010-03-02 |
WO2002035672A2 (en) | 2002-05-02 |
ES2292004T3 (es) | 2008-03-01 |
US20060049545A1 (en) | 2006-03-09 |
ES2276850T3 (es) | 2007-07-01 |
WO2002035672A3 (en) | 2003-08-28 |
US20040016565A1 (en) | 2004-01-29 |
DE60125834T2 (de) | 2007-08-16 |
US6977055B2 (en) | 2005-12-20 |
DE60129862D1 (de) | 2007-09-20 |
DE60139516D1 (de) | 2009-09-17 |
US20060078732A1 (en) | 2006-04-13 |
EP1354385A2 (en) | 2003-10-22 |
CN1479926A (zh) | 2004-03-03 |
MXPA03003695A (es) | 2005-01-25 |
CA2426866A1 (en) | 2003-05-02 |
DE60129862T2 (de) | 2008-04-17 |
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