CN1208898C - 带有构图声学反射镜的稳固安装的多谐振器体声波滤波器 - Google Patents
带有构图声学反射镜的稳固安装的多谐振器体声波滤波器 Download PDFInfo
- Publication number
- CN1208898C CN1208898C CNB011395990A CN01139599A CN1208898C CN 1208898 C CN1208898 C CN 1208898C CN B011395990 A CNB011395990 A CN B011395990A CN 01139599 A CN01139599 A CN 01139599A CN 1208898 C CN1208898 C CN 1208898C
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- Prior art keywords
- resonator
- layer
- acoustic reflector
- metal level
- filter
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 230000008878 coupling Effects 0.000 claims abstract description 7
- 238000010168 coupling process Methods 0.000 claims abstract description 7
- 238000005859 coupling reaction Methods 0.000 claims abstract description 7
- 239000007769 metal material Substances 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 20
- 230000004888 barrier function Effects 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000006187 pill Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 abstract 1
- 238000002955 isolation Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 230000004044 response Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
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- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007634 remodeling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000004476 near response Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02125—Means for compensation or elimination of undesirable effects of parasitic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/564—Monolithic crystal filters implemented with thin-film techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Headphones And Earphones (AREA)
- Aerials With Secondary Devices (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/753,214 US6496085B2 (en) | 2001-01-02 | 2001-01-02 | Solidly mounted multi-resonator bulk acoustic wave filter with a patterned acoustic mirror |
US09/753214 | 2001-01-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1365186A CN1365186A (zh) | 2002-08-21 |
CN1208898C true CN1208898C (zh) | 2005-06-29 |
Family
ID=25029665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011395990A Expired - Lifetime CN1208898C (zh) | 2001-01-02 | 2001-12-31 | 带有构图声学反射镜的稳固安装的多谐振器体声波滤波器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6496085B2 (zh) |
EP (1) | EP1227582B8 (zh) |
JP (2) | JP4248177B2 (zh) |
CN (1) | CN1208898C (zh) |
AT (1) | ATE400084T1 (zh) |
DE (1) | DE60134621D1 (zh) |
Families Citing this family (68)
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JP3903848B2 (ja) * | 2001-07-02 | 2007-04-11 | 株式会社村田製作所 | 圧電共振子、圧電共振子の製造方法、圧電フィルタ、圧電フィルタの製造方法、デュプレクサおよび電子通信機器 |
JP2003229743A (ja) * | 2001-11-29 | 2003-08-15 | Murata Mfg Co Ltd | 圧電フィルタ、通信装置および圧電フィルタの製造方法 |
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US7275292B2 (en) * | 2003-03-07 | 2007-10-02 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Method for fabricating an acoustical resonator on a substrate |
JP3945486B2 (ja) * | 2004-02-18 | 2007-07-18 | ソニー株式会社 | 薄膜バルク音響共振子およびその製造方法 |
KR100622955B1 (ko) * | 2004-04-06 | 2006-09-18 | 삼성전자주식회사 | 박막 벌크 음향 공진기 및 그 제조방법 |
US7388454B2 (en) | 2004-10-01 | 2008-06-17 | Avago Technologies Wireless Ip Pte Ltd | Acoustic resonator performance enhancement using alternating frame structure |
DE102004054895B4 (de) * | 2004-11-12 | 2007-04-19 | Infineon Technologies Ag | Dünnschicht-BAW-Filter sowie Verfahren zur Herstellung eines Dünnschicht-BAW-Filters |
US8981876B2 (en) | 2004-11-15 | 2015-03-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Piezoelectric resonator structures and electrical filters having frame elements |
US7202560B2 (en) | 2004-12-15 | 2007-04-10 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Wafer bonding of micro-electro mechanical systems to active circuitry |
US7791434B2 (en) | 2004-12-22 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric |
US7369013B2 (en) | 2005-04-06 | 2008-05-06 | Avago Technologies Wireless Ip Pte Ltd | Acoustic resonator performance enhancement using filled recessed region |
FR2889374A1 (fr) * | 2005-07-29 | 2007-02-02 | Michelin Soc Tech | Structure resonnante hybride pour verifier des parametres d'un pneumatique |
US7737807B2 (en) | 2005-10-18 | 2010-06-15 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating series-connected decoupled stacked bulk acoustic resonators |
US7675390B2 (en) | 2005-10-18 | 2010-03-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating single decoupled stacked bulk acoustic resonator |
US7463499B2 (en) | 2005-10-31 | 2008-12-09 | Avago Technologies General Ip (Singapore) Pte Ltd. | AC-DC power converter |
JP2007129391A (ja) * | 2005-11-02 | 2007-05-24 | Matsushita Electric Ind Co Ltd | 音響共振器及びフィルタ |
US7544612B1 (en) | 2006-01-20 | 2009-06-09 | Skyworks Solutions, Inc. | Method and structure for reducing the effect of vertical steps in patterned layers in semiconductor structures |
US7414350B1 (en) * | 2006-03-03 | 2008-08-19 | Skyworks Solutions, Inc. | Acoustic mirror structure for a bulk acoustic wave structure and method for fabricating same |
US7746677B2 (en) | 2006-03-09 | 2010-06-29 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | AC-DC converter circuit and power supply |
US7479685B2 (en) | 2006-03-10 | 2009-01-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Electronic device on substrate with cavity and mitigated parasitic leakage path |
JP4525623B2 (ja) * | 2006-03-23 | 2010-08-18 | エプソントヨコム株式会社 | 圧電振動片の製造方法 |
DE102006023165B4 (de) * | 2006-05-17 | 2008-02-14 | Infineon Technologies Ag | Verfahren zur Herstellung eines akustischen Spiegels aus alternierend angeordneten Schichten hoher und niedriger akustischer Impedanz |
JP5096695B2 (ja) * | 2006-05-30 | 2012-12-12 | パナソニック株式会社 | 薄膜音響共振器 |
JP4846477B2 (ja) * | 2006-07-26 | 2011-12-28 | パナソニック株式会社 | 薄膜音響共振器の製造方法 |
JP2008172713A (ja) * | 2007-01-15 | 2008-07-24 | Hitachi Media Electoronics Co Ltd | 圧電薄膜共振器および圧電薄膜共振器フィルタおよびその製造方法 |
US8188548B2 (en) * | 2007-02-15 | 2012-05-29 | Infineon Technologies Ag | Device and method for reducing a voltage dependent capacitive coupling |
US8586195B2 (en) * | 2007-07-11 | 2013-11-19 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method for forming an acoustic mirror with reduced metal layer roughness and related structure |
US20090053401A1 (en) * | 2007-08-24 | 2009-02-26 | Maxim Integrated Products, Inc. | Piezoelectric deposition for BAW resonators |
WO2009031358A1 (ja) | 2007-09-06 | 2009-03-12 | Murata Manufacturing Co., Ltd. | 圧電共振子 |
US7791435B2 (en) | 2007-09-28 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Single stack coupled resonators having differential output |
WO2009043370A1 (en) * | 2007-10-01 | 2009-04-09 | Telefonaktiebolaget Lm Ericsson (Publ) | A voltage controlled switching device |
DE112008002726T5 (de) * | 2007-10-18 | 2010-08-26 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | BAW-Struktur mit reduzierten topografischen Stufen und verwandtes Verfahren |
US8512800B2 (en) | 2007-12-04 | 2013-08-20 | Triquint Semiconductor, Inc. | Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters |
US7732977B2 (en) | 2008-04-30 | 2010-06-08 | Avago Technologies Wireless Ip (Singapore) | Transceiver circuit for film bulk acoustic resonator (FBAR) transducers |
US7855618B2 (en) | 2008-04-30 | 2010-12-21 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator electrical impedance transformers |
US7768364B2 (en) * | 2008-06-09 | 2010-08-03 | Maxim Integrated Products, Inc. | Bulk acoustic resonators with multi-layer electrodes |
US8248185B2 (en) | 2009-06-24 | 2012-08-21 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator structure comprising a bridge |
US8902023B2 (en) | 2009-06-24 | 2014-12-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator structure having an electrode with a cantilevered portion |
JP5113870B2 (ja) * | 2009-08-27 | 2013-01-09 | 日本電波工業株式会社 | 表面実装用水晶振動子の製造方法 |
US8193877B2 (en) | 2009-11-30 | 2012-06-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Duplexer with negative phase shifting circuit |
US8796904B2 (en) | 2011-10-31 | 2014-08-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer |
US9243316B2 (en) | 2010-01-22 | 2016-01-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of fabricating piezoelectric material with selected c-axis orientation |
US8962443B2 (en) | 2011-01-31 | 2015-02-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Semiconductor device having an airbridge and method of fabricating the same |
US9048812B2 (en) | 2011-02-28 | 2015-06-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer |
US9154112B2 (en) | 2011-02-28 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge |
US9083302B2 (en) | 2011-02-28 | 2015-07-14 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator |
US9203374B2 (en) | 2011-02-28 | 2015-12-01 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator comprising a bridge |
US9425764B2 (en) | 2012-10-25 | 2016-08-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having composite electrodes with integrated lateral features |
US9148117B2 (en) | 2011-02-28 | 2015-09-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge and frame elements |
US9136818B2 (en) | 2011-02-28 | 2015-09-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked acoustic resonator comprising a bridge |
US9444426B2 (en) | 2012-10-25 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having integrated lateral feature and temperature compensation feature |
US8575820B2 (en) | 2011-03-29 | 2013-11-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked bulk acoustic resonator |
US8350445B1 (en) | 2011-06-16 | 2013-01-08 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising non-piezoelectric layer and bridge |
US8922302B2 (en) | 2011-08-24 | 2014-12-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator formed on a pedestal |
CN107408936B (zh) * | 2015-03-16 | 2020-12-11 | 株式会社村田制作所 | 弹性波装置及其制造方法 |
US9602076B1 (en) * | 2015-05-19 | 2017-03-21 | Qorvo Us, Inc. | Resonators with balancing capacitor |
US10581403B2 (en) | 2016-07-11 | 2020-03-03 | Qorvo Us, Inc. | Device having a titanium-alloyed surface |
US10361676B2 (en) * | 2017-09-29 | 2019-07-23 | Qorvo Us, Inc. | Baw filter structure with internal electrostatic shielding |
KR20190067706A (ko) * | 2017-12-07 | 2019-06-17 | 인피니언 테크놀로지스 아게 | 무선 주파수 필터를 위한 시스템 및 방법 |
US11757430B2 (en) | 2020-01-07 | 2023-09-12 | Qorvo Us, Inc. | Acoustic filter circuit for noise suppression outside resonance frequency |
US11632097B2 (en) | 2020-11-04 | 2023-04-18 | Qorvo Us, Inc. | Coupled resonator filter device |
US11575363B2 (en) | 2021-01-19 | 2023-02-07 | Qorvo Us, Inc. | Hybrid bulk acoustic wave filter |
CN112953449A (zh) * | 2021-03-04 | 2021-06-11 | 偲百创(深圳)科技有限公司 | 横向激励剪切模式的声学谐振器的制造方法 |
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JPH07114340B2 (ja) * | 1987-01-19 | 1995-12-06 | 株式会社東芝 | 圧電薄膜共振子 |
JPS63187713A (ja) * | 1987-01-29 | 1988-08-03 | Toshiba Corp | 集積型圧電薄膜機能素子 |
US5864261A (en) * | 1994-05-23 | 1999-01-26 | Iowa State University Research Foundation | Multiple layer acoustical structures for thin-film resonator based circuits and systems |
JPH08186467A (ja) * | 1994-12-29 | 1996-07-16 | Murata Mfg Co Ltd | 拡がり振動型圧電振動子およびその製造方法 |
US5821833A (en) * | 1995-12-26 | 1998-10-13 | Tfr Technologies, Inc. | Stacked crystal filter device and method of making |
US5714917A (en) | 1996-10-02 | 1998-02-03 | Nokia Mobile Phones Limited | Device incorporating a tunable thin film bulk acoustic resonator for performing amplitude and phase modulation |
US5873154A (en) | 1996-10-17 | 1999-02-23 | Nokia Mobile Phones Limited | Method for fabricating a resonator having an acoustic mirror |
US5872493A (en) * | 1997-03-13 | 1999-02-16 | Nokia Mobile Phones, Ltd. | Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror |
WO1998052280A1 (fr) * | 1997-05-13 | 1998-11-19 | Mitsubishi Denki Kabushiki Kaisha | Dispositif a couche mince piezo-electrique |
US5910756A (en) * | 1997-05-21 | 1999-06-08 | Nokia Mobile Phones Limited | Filters and duplexers utilizing thin film stacked crystal filter structures and thin film bulk acoustic wave resonators |
US6060818A (en) | 1998-06-02 | 2000-05-09 | Hewlett-Packard Company | SBAR structures and method of fabrication of SBAR.FBAR film processing techniques for the manufacturing of SBAR/BAR filters |
FI108583B (fi) * | 1998-06-02 | 2002-02-15 | Nokia Corp | Resonaattorirakenteita |
EP0986172B1 (en) * | 1998-09-11 | 2004-12-01 | Texas Instruments Incorporated | An integrated acoustic thin film resonator |
FI113211B (fi) * | 1998-12-30 | 2004-03-15 | Nokia Corp | Balansoitu suodatinrakenne ja matkaviestinlaite |
-
2001
- 2001-01-02 US US09/753,214 patent/US6496085B2/en not_active Expired - Lifetime
- 2001-12-20 JP JP2001388031A patent/JP4248177B2/ja not_active Expired - Lifetime
- 2001-12-28 EP EP01310923A patent/EP1227582B8/en not_active Expired - Lifetime
- 2001-12-28 DE DE60134621T patent/DE60134621D1/de not_active Expired - Lifetime
- 2001-12-28 AT AT01310923T patent/ATE400084T1/de not_active IP Right Cessation
- 2001-12-31 CN CNB011395990A patent/CN1208898C/zh not_active Expired - Lifetime
-
2008
- 2008-10-17 JP JP2008268710A patent/JP4838292B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009022052A (ja) | 2009-01-29 |
US6496085B2 (en) | 2002-12-17 |
US20020084873A1 (en) | 2002-07-04 |
JP2002251190A (ja) | 2002-09-06 |
ATE400084T1 (de) | 2008-07-15 |
EP1227582A2 (en) | 2002-07-31 |
DE60134621D1 (de) | 2008-08-14 |
CN1365186A (zh) | 2002-08-21 |
EP1227582B8 (en) | 2008-08-13 |
JP4838292B2 (ja) | 2011-12-14 |
EP1227582B1 (en) | 2008-07-02 |
EP1227582A3 (en) | 2004-09-22 |
JP4248177B2 (ja) | 2009-04-02 |
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