CN1196204C - 具有透镜的led光源 - Google Patents
具有透镜的led光源 Download PDFInfo
- Publication number
- CN1196204C CN1196204C CN00806593.4A CN00806593A CN1196204C CN 1196204 C CN1196204 C CN 1196204C CN 00806593 A CN00806593 A CN 00806593A CN 1196204 C CN1196204 C CN 1196204C
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- lens
- source according
- led source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims abstract description 52
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 238000012856 packing Methods 0.000 claims description 16
- 239000004744 fabric Substances 0.000 claims description 15
- 239000011159 matrix material Substances 0.000 claims description 8
- 239000012780 transparent material Substances 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 230000003044 adaptive effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- 230000002708 enhancing effect Effects 0.000 claims description 2
- 230000003595 spectral effect Effects 0.000 claims description 2
- 238000001228 spectrum Methods 0.000 claims description 2
- 230000009466 transformation Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 4
- 239000004606 Fillers/Extenders Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19918370.8 | 1999-04-22 | ||
DE19918370A DE19918370B4 (de) | 1999-04-22 | 1999-04-22 | LED-Weißlichtquelle mit Linse |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510009164.1A Division CN100555681C (zh) | 1999-04-22 | 2000-04-07 | 具有透镜的发光二极管光源 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1348608A CN1348608A (zh) | 2002-05-08 |
CN1196204C true CN1196204C (zh) | 2005-04-06 |
Family
ID=7905558
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200610101194XA Expired - Lifetime CN100452461C (zh) | 1999-04-22 | 2000-04-07 | 具有透镜的发光二极管光源 |
CN00806593.4A Expired - Lifetime CN1196204C (zh) | 1999-04-22 | 2000-04-07 | 具有透镜的led光源 |
CNB2006101011954A Expired - Lifetime CN100452462C (zh) | 1999-04-22 | 2000-04-07 | 制造发光二极管光源的方法 |
CN200510009164.1A Expired - Lifetime CN100555681C (zh) | 1999-04-22 | 2000-04-07 | 具有透镜的发光二极管光源 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200610101194XA Expired - Lifetime CN100452461C (zh) | 1999-04-22 | 2000-04-07 | 具有透镜的发光二极管光源 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101011954A Expired - Lifetime CN100452462C (zh) | 1999-04-22 | 2000-04-07 | 制造发光二极管光源的方法 |
CN200510009164.1A Expired - Lifetime CN100555681C (zh) | 1999-04-22 | 2000-04-07 | 具有透镜的发光二极管光源 |
Country Status (6)
Country | Link |
---|---|
US (4) | US6759803B2 (zh) |
JP (1) | JP5100926B2 (zh) |
CN (4) | CN100452461C (zh) |
DE (1) | DE19918370B4 (zh) |
TW (1) | TW575966B (zh) |
WO (1) | WO2000065664A1 (zh) |
Families Citing this family (175)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19918370B4 (de) * | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
DE10020465A1 (de) * | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement |
DE10023353A1 (de) * | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
JP3956647B2 (ja) | 2001-05-25 | 2007-08-08 | セイコーエプソン株式会社 | 面発光レ−ザの製造方法 |
DE10129785B4 (de) * | 2001-06-20 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
DE10142009B4 (de) * | 2001-08-28 | 2010-04-22 | Osram Opto Semiconductors Gmbh | LED - Lichtquelle mit einem Konversionsmittel und mit einer UV-absorbierenden Schicht |
US20030057421A1 (en) * | 2001-09-27 | 2003-03-27 | Tzer-Perng Chen | High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate |
US7186005B2 (en) * | 2001-10-18 | 2007-03-06 | Ilight Technologies, Inc. | Color-changing illumination device |
EP2009676B8 (en) | 2002-05-08 | 2012-11-21 | Phoseon Technology, Inc. | A semiconductor materials inspection system |
DE10228634A1 (de) * | 2002-06-26 | 2004-01-22 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbare Miniatur-Lumineszenz-und/oder Photo-Diode und Verfahren zu deren Herstellung |
DE10229067B4 (de) | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
JP4074498B2 (ja) * | 2002-09-25 | 2008-04-09 | セイコーエプソン株式会社 | 面発光型発光素子、光モジュールおよび光伝達装置 |
JP4143732B2 (ja) * | 2002-10-16 | 2008-09-03 | スタンレー電気株式会社 | 車載用波長変換素子 |
JP2004158635A (ja) * | 2002-11-06 | 2004-06-03 | Stanley Electric Co Ltd | 表面実装型チップled及びその製造方法 |
US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
US20040183081A1 (en) * | 2003-03-20 | 2004-09-23 | Alexander Shishov | Light emitting diode package with self dosing feature and methods of forming same |
DE10315131A1 (de) * | 2003-04-03 | 2004-10-14 | Hella Kg Hueck & Co. | Scheinwerfer für Fahrzeuge |
US7318659B2 (en) * | 2004-03-03 | 2008-01-15 | S. C. Johnson & Son, Inc. | Combination white light and colored LED light device with active ingredient emission |
DE102004001312B4 (de) * | 2003-07-25 | 2010-09-30 | Seoul Semiconductor Co., Ltd. | Chip-Leuchtdiode und Verfahren zu ihrer Herstellung |
US7488973B2 (en) * | 2003-07-30 | 2009-02-10 | The Kansai Electric Power Co., Inc. | High-heat-resistant semiconductor device |
US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
EP1521031A3 (en) | 2003-09-30 | 2008-02-27 | Toshiba Lighting & Technology Corporation | Light emitting diode lighting appliance and light emitting diode emergency light using the same |
US6942360B2 (en) * | 2003-10-01 | 2005-09-13 | Enertron, Inc. | Methods and apparatus for an LED light engine |
DE10346452A1 (de) * | 2003-10-03 | 2005-04-28 | Schefenacker Vision Systems | Leuchtelement mit Einlegelichtleitkörper |
EP1678442B8 (en) * | 2003-10-31 | 2013-06-26 | Phoseon Technology, Inc. | Led light module and manufacturing method |
WO2005057082A1 (ja) * | 2003-12-10 | 2005-06-23 | Okaya Electric Industries Co., Ltd. | 表示ランプ |
DE10361650A1 (de) * | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul und Verfahren zu dessen Herstellung |
CN100341160C (zh) * | 2004-02-27 | 2007-10-03 | 沈育浓 | 发光二极管晶片封装体及其封装方法 |
WO2005091392A1 (en) | 2004-03-18 | 2005-09-29 | Phoseon Technology, Inc. | Micro-reflectors on a substrate for high-density led array |
TWI257184B (en) * | 2004-03-24 | 2006-06-21 | Toshiba Lighting & Technology | Lighting apparatus |
US7326583B2 (en) * | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
US7279346B2 (en) * | 2004-03-31 | 2007-10-09 | Cree, Inc. | Method for packaging a light emitting device by one dispense then cure step followed by another |
US8294166B2 (en) | 2006-12-11 | 2012-10-23 | The Regents Of The University Of California | Transparent light emitting diodes |
US20080121918A1 (en) * | 2006-11-15 | 2008-05-29 | The Regents Of The University Of California | High light extraction efficiency sphere led |
US8227820B2 (en) | 2005-02-09 | 2012-07-24 | The Regents Of The University Of California | Semiconductor light-emitting device |
US7768023B2 (en) * | 2005-10-14 | 2010-08-03 | The Regents Of The University Of California | Photonic structures for efficient light extraction and conversion in multi-color light emitting devices |
US7956371B2 (en) * | 2005-12-08 | 2011-06-07 | The Regents Of The University Of California | High efficiency light emitting diode (LED) |
US7280288B2 (en) * | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
US7456499B2 (en) * | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
US7878232B2 (en) * | 2004-07-09 | 2011-02-01 | GE Lighting Solutions, LLC | Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management |
US7233106B2 (en) * | 2004-07-14 | 2007-06-19 | Taiwan Oasis Technology Co., Ltd. | LED chip capping construction |
EP1622237A1 (de) * | 2004-07-28 | 2006-02-01 | Infineon Technologies Fiber Optics GmbH | Optisches oder elektronisches Modul und Verfahren zu dessen Herstellung |
JP4659414B2 (ja) * | 2004-09-01 | 2011-03-30 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びそれを用いる発光制御システム |
DE102004045950A1 (de) | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102004050371A1 (de) * | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung |
CN100449801C (zh) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | 半导体发光元件组成 |
TWI277222B (en) * | 2004-10-29 | 2007-03-21 | Lighthouse Technology Co Ltd | LED module and method of packing the same |
KR100628001B1 (ko) | 2004-11-12 | 2006-09-26 | 주식회사 메디아나전자 | 2개의 형광체를 이용하는 파스텔 칼라 발광 다이오드 소자및 그 제조방법 |
KR100580753B1 (ko) | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
CN100388514C (zh) * | 2005-01-20 | 2008-05-14 | 财团法人工业技术研究院 | 一种镜体及应用镜体的均匀发光的发光二极管 |
US7939842B2 (en) * | 2005-01-27 | 2011-05-10 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
US7710016B2 (en) | 2005-02-18 | 2010-05-04 | Nichia Corporation | Light emitting device provided with lens for controlling light distribution characteristic |
KR101136344B1 (ko) * | 2005-04-06 | 2012-04-18 | 삼성전자주식회사 | 광학 렌즈, 이를 갖는 광학 모듈, 이를 갖는 백라이트어셈블리 및 이를 갖는 표시 장치 |
DE102005036520A1 (de) * | 2005-04-26 | 2006-11-09 | Osram Opto Semiconductors Gmbh | Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung |
US7980743B2 (en) | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
WO2006138626A2 (en) * | 2005-06-17 | 2006-12-28 | The Regents Of The University Of California | (AI,Ga,In)N AND ZnO DIRECT WAFER BONDED STRUCTURE FOR OPTOELECTRONIC APPLICATION AND ITS FABRICATION METHOD |
DE102005034793B3 (de) * | 2005-07-21 | 2007-04-19 | G.L.I. Global Light Industries Gmbh | Lichtemittierende Halbleiterdiode hoher Lichtleistung |
WO2007018927A2 (en) * | 2005-07-22 | 2007-02-15 | Illumination Management Solutions, Inc. | A light-conducting pedestal configuration for an led |
KR20080059419A (ko) * | 2005-09-30 | 2008-06-27 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 세륨계 고상 조명용 형광물질들 |
JP2009515344A (ja) * | 2005-11-04 | 2009-04-09 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高い光抽出効率の発光ダイオード(led) |
US20070102718A1 (en) * | 2005-11-07 | 2007-05-10 | Akira Takekuma | Lens in light emitting device |
JP2009530798A (ja) | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
US7182627B1 (en) * | 2006-01-06 | 2007-02-27 | Advanced Thermal Devices, Inc. | High illumosity lighting assembly |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
EP1816688B1 (en) * | 2006-02-02 | 2016-11-02 | LG Electronics Inc. | Light emitting diode package |
US7737634B2 (en) * | 2006-03-06 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED devices having improved containment for liquid encapsulant |
US7808004B2 (en) * | 2006-03-17 | 2010-10-05 | Edison Opto Corporation | Light emitting diode package structure and method of manufacturing the same |
WO2007111355A1 (ja) * | 2006-03-28 | 2007-10-04 | Kyocera Corporation | 発光装置 |
US8969908B2 (en) | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
JP2007311707A (ja) * | 2006-05-22 | 2007-11-29 | Ushio Inc | 紫外線発光素子パッケージ |
US8075140B2 (en) * | 2006-07-31 | 2011-12-13 | 3M Innovative Properties Company | LED illumination system with polarization recycling |
US7804147B2 (en) * | 2006-07-31 | 2010-09-28 | Cree, Inc. | Light emitting diode package element with internal meniscus for bubble free lens placement |
WO2008016908A2 (en) * | 2006-07-31 | 2008-02-07 | 3M Innovative Properties Company | Led source with hollow collection lens |
EP2047678A2 (en) * | 2006-07-31 | 2009-04-15 | 3M Innovative Properties Company | Combination camera/projector system |
US7901083B2 (en) * | 2006-07-31 | 2011-03-08 | 3M Innovative Properties Company | Optical projection subsystem |
US7943952B2 (en) * | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US20080029774A1 (en) * | 2006-08-04 | 2008-02-07 | Acol Technologies S.A. | Semiconductor light source packages with broadband and angular uniformity support |
TWI418054B (zh) * | 2006-08-08 | 2013-12-01 | Lg Electronics Inc | 發光裝置封裝與製造此封裝之方法 |
US20080064131A1 (en) * | 2006-09-12 | 2008-03-13 | Mutual-Tek Industries Co., Ltd. | Light emitting apparatus and method for the same |
DE102006046301A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optisches Element, strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines optischen Elements |
US8087960B2 (en) | 2006-10-02 | 2012-01-03 | Illumitex, Inc. | LED system and method |
US20090275157A1 (en) * | 2006-10-02 | 2009-11-05 | Illumitex, Inc. | Optical device shaping |
US7808013B2 (en) * | 2006-10-31 | 2010-10-05 | Cree, Inc. | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US20090121250A1 (en) * | 2006-11-15 | 2009-05-14 | Denbaars Steven P | High light extraction efficiency light emitting diode (led) using glass packaging |
TWI518941B (zh) | 2006-11-15 | 2016-01-21 | 美國加利福尼亞大學董事會 | 豎立式透明無鏡發光二極體 |
WO2008060601A2 (en) * | 2006-11-15 | 2008-05-22 | The Regents Of The University Of California | High efficiency, white, single or multi-color light emitting diodes (leds) by index matching structures |
WO2008060586A2 (en) | 2006-11-15 | 2008-05-22 | The Regents Of The University Of California | Textured phosphor conversion layer light emitting diode |
US7769066B2 (en) | 2006-11-15 | 2010-08-03 | Cree, Inc. | Laser diode and method for fabricating same |
TW200830593A (en) * | 2006-11-15 | 2008-07-16 | Univ California | Transparent mirrorless light emitting diode |
US7889421B2 (en) | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
DE102006056272A1 (de) | 2006-11-27 | 2008-05-29 | Bernd Kussmaul Gmbh | Beleuchtbarer Körper und Verfahren zu seiner Herstellung |
DE102006059994A1 (de) * | 2006-12-19 | 2008-06-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
KR100851183B1 (ko) * | 2006-12-27 | 2008-08-08 | 엘지이노텍 주식회사 | 반도체 발광소자 패키지 |
US7834367B2 (en) | 2007-01-19 | 2010-11-16 | Cree, Inc. | Low voltage diode with reduced parasitic resistance and method for fabricating |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US8232564B2 (en) | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
DE102007006349A1 (de) * | 2007-01-25 | 2008-07-31 | Osram Opto Semiconductors Gmbh | Anordnung zur Erzeugung von Mischlicht und Verfahren zur Herstellung einer solchen Anordnung |
DE102007004807A1 (de) * | 2007-01-31 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Licht emittierende Einrichtung mit optischem Körper |
DE102007025092A1 (de) | 2007-05-30 | 2008-12-04 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip |
WO2008151009A1 (en) * | 2007-05-31 | 2008-12-11 | Lumination Llc | Environmentally robust lighting devices and methods of manufacturing same |
CN101315484B (zh) * | 2007-06-01 | 2011-09-28 | 富士迈半导体精密工业(上海)有限公司 | 光源组件及包括光源组件的背光模组 |
KR100801621B1 (ko) * | 2007-06-05 | 2008-02-11 | 서울반도체 주식회사 | Led 패키지 |
US7911059B2 (en) * | 2007-06-08 | 2011-03-22 | SeniLEDS Optoelectronics Co., Ltd | High thermal conductivity substrate for a semiconductor device |
JP2010532104A (ja) | 2007-06-27 | 2010-09-30 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高効率白色発光ダイオードのための光学設計 |
KR100880638B1 (ko) | 2007-07-06 | 2009-01-30 | 엘지전자 주식회사 | 발광 소자 패키지 |
US9401461B2 (en) * | 2007-07-11 | 2016-07-26 | Cree, Inc. | LED chip design for white conversion |
US10505083B2 (en) * | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
TWI347687B (en) * | 2007-07-13 | 2011-08-21 | Lite On Technology Corp | Light-emitting device with open-loop control |
JP4888280B2 (ja) * | 2007-08-28 | 2012-02-29 | パナソニック電工株式会社 | 発光装置 |
US20090065792A1 (en) * | 2007-09-07 | 2009-03-12 | 3M Innovative Properties Company | Method of making an led device having a dome lens |
US8519437B2 (en) | 2007-09-14 | 2013-08-27 | Cree, Inc. | Polarization doping in nitride based diodes |
US8444299B2 (en) | 2007-09-25 | 2013-05-21 | Enertron, Inc. | Dimmable LED bulb with heatsink having perforated ridges |
US9012937B2 (en) | 2007-10-10 | 2015-04-21 | Cree, Inc. | Multiple conversion material light emitting diode package and method of fabricating same |
TWI360238B (en) * | 2007-10-29 | 2012-03-11 | Epistar Corp | Photoelectric device |
JP5212777B2 (ja) * | 2007-11-28 | 2013-06-19 | スタンレー電気株式会社 | 半導体発光装置及び照明装置 |
US8167674B2 (en) | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
JP2011512037A (ja) | 2008-02-08 | 2011-04-14 | イルミテックス, インコーポレイテッド | エミッタ層成形のためのシステムおよび方法 |
US8637883B2 (en) | 2008-03-19 | 2014-01-28 | Cree, Inc. | Low index spacer layer in LED devices |
JP5216384B2 (ja) * | 2008-03-19 | 2013-06-19 | 株式会社東芝 | 発光装置 |
US8877524B2 (en) | 2008-03-31 | 2014-11-04 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
CN101626054B (zh) * | 2008-07-10 | 2011-05-18 | 一品光学工业股份有限公司 | 非球面宽照角光学镜片及其所构成的发光二极管组件 |
TWI363907B (en) * | 2008-08-05 | 2012-05-11 | Au Optronics Corp | Backlight module and light emitting diode thereof |
JP5284006B2 (ja) * | 2008-08-25 | 2013-09-11 | シチズン電子株式会社 | 発光装置 |
US7932529B2 (en) * | 2008-08-28 | 2011-04-26 | Visera Technologies Company Limited | Light-emitting diode device and method for fabricating the same |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
TWI463708B (zh) * | 2009-02-24 | 2014-12-01 | Advanced Optoelectronic Tech | 側面出光型發光元件封裝結構及其製造方法 |
KR101041381B1 (ko) * | 2009-03-20 | 2011-06-15 | (주)레인보우옵틱코리아 | 띠무늬 제거기능을 가지는 led 조명장치 |
US8184440B2 (en) * | 2009-05-01 | 2012-05-22 | Abl Ip Holding Llc | Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board |
US8106569B2 (en) * | 2009-05-12 | 2012-01-31 | Remphos Technologies Llc | LED retrofit for miniature bulbs |
KR101058718B1 (ko) * | 2009-06-19 | 2011-08-22 | 삼성전기주식회사 | 노광 장치 |
CN101936500A (zh) * | 2009-06-30 | 2011-01-05 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
CN102003676B (zh) * | 2009-08-28 | 2012-10-10 | 鸿富锦精密工业(深圳)有限公司 | 透镜 |
CN101672437A (zh) * | 2009-09-18 | 2010-03-17 | 深圳市华海诚信电子显示技术有限公司 | 一种led模块和一种led屏 |
KR100986468B1 (ko) * | 2009-11-19 | 2010-10-08 | 엘지이노텍 주식회사 | 렌즈 및 렌즈를 갖는 발광 장치 |
DE102009046872B4 (de) | 2009-11-19 | 2018-06-21 | Ifm Electronic Gmbh | Berührungslos arbeitendes elektronisches Schaltgerät mit einer optischen Schaltzustandsanzeige |
JP2011142268A (ja) * | 2010-01-08 | 2011-07-21 | Sumitomo Electric Ind Ltd | 光モジュールおよびその製造方法 |
US8646949B2 (en) * | 2010-03-03 | 2014-02-11 | LumenFlow Corp. | Constrained folded path resonant white light scintillator |
EP2567150B1 (en) * | 2010-05-03 | 2018-05-02 | Osram Sylvania Inc. | Thermosyphon light engine and luminaire including same |
JP2012019062A (ja) * | 2010-07-08 | 2012-01-26 | Shin Etsu Chem Co Ltd | 発光半導体装置、実装基板及びそれらの製造方法 |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
DE102010045316A1 (de) * | 2010-09-14 | 2012-03-15 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
DE102010045403A1 (de) | 2010-09-15 | 2012-03-15 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
FI122809B (fi) * | 2011-02-15 | 2012-07-13 | Marimils Oy | Valolähde ja valolähdenauha |
KR20120093679A (ko) * | 2011-02-15 | 2012-08-23 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
US9004724B2 (en) | 2011-03-21 | 2015-04-14 | GE Lighting Solutions, LLC | Reflector (optics) used in LED deco lamp |
DE102011105010A1 (de) * | 2011-06-20 | 2012-12-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
US8558252B2 (en) | 2011-08-26 | 2013-10-15 | Cree, Inc. | White LEDs with emission wavelength correction |
KR101817807B1 (ko) | 2011-09-20 | 2018-01-11 | 엘지이노텍 주식회사 | 발광소자 패키지 및 이를 포함하는 조명시스템 |
US8500300B2 (en) * | 2011-10-03 | 2013-08-06 | National Applied Research Laboratories | Optical lens, light-emitting diode optical component and light-emitting diode road lamp |
US9046241B2 (en) | 2011-11-12 | 2015-06-02 | Jingqun Xi | High efficiency directional light source using lens optics |
US8564004B2 (en) * | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
US9450152B2 (en) | 2012-05-29 | 2016-09-20 | Micron Technology, Inc. | Solid state transducer dies having reflective features over contacts and associated systems and methods |
CN103515511B (zh) * | 2012-06-29 | 2016-08-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其封装方法 |
WO2014007240A1 (ja) * | 2012-07-06 | 2014-01-09 | シャープ株式会社 | 発光装置および発光装置の製造方法 |
KR20140044103A (ko) * | 2012-10-04 | 2014-04-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
JP5904671B2 (ja) * | 2013-03-19 | 2016-04-20 | 京セラコネクタプロダクツ株式会社 | 半導体発光素子を備える照明器具 |
WO2014194044A1 (en) * | 2013-05-29 | 2014-12-04 | Venntis Technologies LLC | Volumetric light emitting device |
DE102013213073A1 (de) * | 2013-07-04 | 2015-01-08 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelementes |
FR3016023A1 (fr) * | 2013-12-26 | 2015-07-03 | Commissariat Energie Atomique | Dispositif d'eclairage de forme spherique |
WO2015187388A1 (en) | 2014-06-02 | 2015-12-10 | 3M Innovative Properties Company | Led with remote phosphor and shell reflector |
US10622522B2 (en) * | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
DE102016104659A1 (de) * | 2016-03-14 | 2017-09-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil |
DE102017121889B3 (de) * | 2017-09-21 | 2018-11-22 | Heraeus Noblelight Gmbh | Breitbandige halbleiterbasierte UV-Lichtquelle für eine Spektralanalysevorrichtung |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
WO2023229405A1 (ko) * | 2022-05-25 | 2023-11-30 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3593055A (en) * | 1969-04-16 | 1971-07-13 | Bell Telephone Labor Inc | Electro-luminescent device |
JPS48102585A (zh) * | 1972-04-04 | 1973-12-22 | ||
JPS5680181A (en) * | 1979-12-05 | 1981-07-01 | Toshiba Corp | Semiconductor luminous device |
DE3128187A1 (de) * | 1981-07-16 | 1983-02-03 | Joachim 8068 Pfaffenhofen Sieg | Opto-elektronisches bauelement |
FR2593930B1 (fr) * | 1986-01-24 | 1989-11-24 | Radiotechnique Compelec | Dispositif opto-electronique pour montage en surface |
JPS62196878A (ja) | 1986-02-25 | 1987-08-31 | Koito Mfg Co Ltd | 照明装置 |
US5043716A (en) * | 1988-07-14 | 1991-08-27 | Adaptive Micro Systems, Inc. | Electronic display with lens matrix |
JPH0927642A (ja) * | 1995-07-13 | 1997-01-28 | Clarion Co Ltd | 照明装置 |
JPH0983018A (ja) * | 1995-09-11 | 1997-03-28 | Nippon Denyo Kk | 発光ダイオードユニット |
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
JP3065258B2 (ja) * | 1996-09-30 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いた表示装置 |
JP4024892B2 (ja) | 1996-12-24 | 2007-12-19 | 化成オプトニクス株式会社 | 蓄光性発光素子 |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
JP2998696B2 (ja) | 1997-05-17 | 2000-01-11 | 日亜化学工業株式会社 | 発光ダイオード |
JPH1117229A (ja) * | 1997-06-27 | 1999-01-22 | Iwasaki Electric Co Ltd | 反射型発光ダイオード及びその実装方法 |
US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
DE19755734A1 (de) | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
US6155699A (en) * | 1999-03-15 | 2000-12-05 | Agilent Technologies, Inc. | Efficient phosphor-conversion led structure |
DE19918370B4 (de) * | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
JP3948650B2 (ja) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
-
1999
- 1999-04-22 DE DE19918370A patent/DE19918370B4/de not_active Expired - Lifetime
-
2000
- 2000-04-07 CN CNB200610101194XA patent/CN100452461C/zh not_active Expired - Lifetime
- 2000-04-07 CN CN00806593.4A patent/CN1196204C/zh not_active Expired - Lifetime
- 2000-04-07 JP JP2000614512A patent/JP5100926B2/ja not_active Expired - Fee Related
- 2000-04-07 CN CNB2006101011954A patent/CN100452462C/zh not_active Expired - Lifetime
- 2000-04-07 CN CN200510009164.1A patent/CN100555681C/zh not_active Expired - Lifetime
- 2000-04-07 WO PCT/DE2000/001079 patent/WO2000065664A1/de active Application Filing
- 2000-04-19 TW TW89107343A patent/TW575966B/zh not_active IP Right Cessation
-
2001
- 2001-10-22 US US10/007,398 patent/US6759803B2/en not_active Expired - Lifetime
-
2003
- 2003-06-05 US US10/454,919 patent/US6746295B2/en not_active Expired - Lifetime
-
2004
- 2004-05-25 US US10/854,098 patent/US7126273B2/en not_active Expired - Lifetime
-
2006
- 2006-09-13 US US11/520,104 patent/US7594840B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2002543594A (ja) | 2002-12-17 |
WO2000065664A1 (de) | 2000-11-02 |
CN1881635A (zh) | 2006-12-20 |
CN1348608A (zh) | 2002-05-08 |
US7594840B2 (en) | 2009-09-29 |
JP5100926B2 (ja) | 2012-12-19 |
CN1645638A (zh) | 2005-07-27 |
CN100452462C (zh) | 2009-01-14 |
US7126273B2 (en) | 2006-10-24 |
US20070010157A1 (en) | 2007-01-11 |
TW575966B (en) | 2004-02-11 |
US20030211804A1 (en) | 2003-11-13 |
DE19918370B4 (de) | 2006-06-08 |
CN100555681C (zh) | 2009-10-28 |
US20040232825A1 (en) | 2004-11-25 |
US6759803B2 (en) | 2004-07-06 |
US6746295B2 (en) | 2004-06-08 |
CN1881636A (zh) | 2006-12-20 |
DE19918370A1 (de) | 2000-11-02 |
CN100452461C (zh) | 2009-01-14 |
US20020057057A1 (en) | 2002-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1196204C (zh) | 具有透镜的led光源 | |
CN100502064C (zh) | 用于发光器件的封装 | |
CN1237629C (zh) | 光电子元件和制造方法、有多个光电子元件的组件和装置 | |
EP2312657B1 (en) | Method of manufacturing light emitting diode device | |
CN101438424B (zh) | 均匀发射的led封装 | |
US10833054B2 (en) | Smart pixel surface mount device package | |
CN1629536A (zh) | 使用近白色发光二极管产生无杂色白光的方法和装置 | |
CN1809934A (zh) | 具有小型光学元件的高功率发光器封装 | |
CN103765585B (zh) | 具有倒装芯片式安装的固态辐射传感器的固态辐射传感器装置及其相关联***及方法 | |
CN102593336A (zh) | 发光器件封装件及其制造方法 | |
CN101636851A (zh) | 具有透镜中的磷光体片和过模压磷光体的led | |
CN1685530A (zh) | 光电子元件和元件模块 | |
KR20170033947A (ko) | 광원 모듈 및 이를 포함하는 조명 장치 | |
CN102386307A (zh) | 具有对比面的led封装 | |
CN101222012A (zh) | Led封装件 | |
KR20160014197A (ko) | 발광다이오드 패키지 및 이를 이용한 조명장치 | |
KR20100063130A (ko) | 유리 커버를 포함한 복사 방출 소자 및 그 제조 방법 | |
EP2315283A2 (en) | Light emitting device package, lighting module and lighting system | |
CN203826384U (zh) | 固态发射器面板 | |
CN102714264B (zh) | 发光二极管封装件及其制造方法 | |
KR20170020577A (ko) | 광원 모듈 및 이를 포함하는 조명 장치 | |
US8796724B2 (en) | Light emitting systems and methods | |
CN203931383U (zh) | 固态发射器面板 | |
CN203826385U (zh) | 固态发射器面板 | |
CN202111155U (zh) | Led封装 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: OSRAM OPTO SEMICONDUCTORS GMBH + CO. OHG Free format text: FORMER NAME: SIEMENS AG |
|
CP01 | Change in the name or title of a patent holder |
Address after: Regensburg, Germany Patentee after: Osram Opto Semiconductors GmbH & Co. OHG Address before: Regensburg, Germany Patentee before: Siemens AG |
|
ASS | Succession or assignment of patent right |
Owner name: OSRAM AG Free format text: FORMER OWNER: OSRAM OPTO SEMICONDUCTORS GMBH + CO. OHG Effective date: 20111229 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111229 Address after: Munich, Germany Patentee after: Patra Patent Treuhand Address before: Regensburg, Germany Patentee before: Osram Opto Semiconductors GmbH & Co. OHG |
|
CX01 | Expiry of patent term |
Granted publication date: 20050406 |
|
CX01 | Expiry of patent term |