CN1629536A - 使用近白色发光二极管产生无杂色白光的方法和装置 - Google Patents
使用近白色发光二极管产生无杂色白光的方法和装置 Download PDFInfo
- Publication number
- CN1629536A CN1629536A CNA200410101333XA CN200410101333A CN1629536A CN 1629536 A CN1629536 A CN 1629536A CN A200410101333X A CNA200410101333X A CN A200410101333XA CN 200410101333 A CN200410101333 A CN 200410101333A CN 1629536 A CN1629536 A CN 1629536A
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- Prior art keywords
- light
- emitting diode
- white
- white light
- led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/742,688 | 2003-12-19 | ||
US10/742,688 US7066623B2 (en) | 2003-12-19 | 2003-12-19 | Method and apparatus for producing untainted white light using off-white light emitting diodes |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1629536A true CN1629536A (zh) | 2005-06-22 |
CN100541837C CN100541837C (zh) | 2009-09-16 |
Family
ID=34678512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410101333XA Active CN100541837C (zh) | 2003-12-19 | 2004-12-17 | 使用近白色发光二极管产生无杂色白光的方法和装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7066623B2 (zh) |
JP (1) | JP4947610B2 (zh) |
KR (1) | KR101216878B1 (zh) |
CN (1) | CN100541837C (zh) |
DE (1) | DE102004057499B4 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102007612A (zh) * | 2008-11-21 | 2011-04-06 | Lg伊诺特有限公司 | 发光设备和使用该发光设备的显示设备 |
CN1917731B (zh) * | 2005-08-15 | 2011-10-26 | 安华高科技Ecbuip(新加坡)私人有限公司 | 校准的led光模块 |
CN101657671B (zh) * | 2007-02-22 | 2012-07-11 | 科锐公司 | 照明装置、照明方法、滤光器和滤光方法 |
CN102651364A (zh) * | 2011-02-24 | 2012-08-29 | 新世纪光电股份有限公司 | 发光二极管组件 |
CN102803822A (zh) * | 2009-06-15 | 2012-11-28 | 夏普株式会社 | 照明装置、显示装置以及电视接收装置 |
CN101939859B (zh) * | 2008-03-14 | 2012-12-19 | Lg伊诺特有限公司 | 发光设备和包括该发光设备的显示设备 |
CN102969437A (zh) * | 2012-12-06 | 2013-03-13 | 上海顿格电子贸易有限公司 | Led发光元器件 |
CN103839935A (zh) * | 2014-03-14 | 2014-06-04 | 无锡实益达电子有限公司 | 一种具有高色彩表现能力的集成式白光led光源 |
US9115852B2 (en) | 2008-12-19 | 2015-08-25 | Osram Opto Semiconductors Gmbh | Method for producing a plurality of LED illumination devices and a plurality of LED chipsets for illumination devices, and LED illumination device |
CN105324859A (zh) * | 2013-06-18 | 2016-02-10 | 夏普株式会社 | 光源装置以及发光装置 |
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JP2006525682A (ja) * | 2003-04-30 | 2006-11-09 | クリー インコーポレイテッド | 高出力固体発光素子パッケージ |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
US8308980B2 (en) * | 2004-06-10 | 2012-11-13 | Seoul Semiconductor Co., Ltd. | Light emitting device |
KR100665299B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광물질 |
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Also Published As
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CN100541837C (zh) | 2009-09-16 |
DE102004057499B4 (de) | 2010-07-29 |
US20060198137A1 (en) | 2006-09-07 |
US7206507B2 (en) | 2007-04-17 |
US7066623B2 (en) | 2006-06-27 |
JP2005183986A (ja) | 2005-07-07 |
DE102004057499A1 (de) | 2005-07-14 |
KR20050062433A (ko) | 2005-06-23 |
US20050135094A1 (en) | 2005-06-23 |
KR101216878B1 (ko) | 2012-12-28 |
JP4947610B2 (ja) | 2012-06-06 |
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