CN1035409A - Make the equipment and the method for printed circuit prototypes - Google Patents
Make the equipment and the method for printed circuit prototypes Download PDFInfo
- Publication number
- CN1035409A CN1035409A CN88109246A CN88109246A CN1035409A CN 1035409 A CN1035409 A CN 1035409A CN 88109246 A CN88109246 A CN 88109246A CN 88109246 A CN88109246 A CN 88109246A CN 1035409 A CN1035409 A CN 1035409A
- Authority
- CN
- China
- Prior art keywords
- raw sheet
- clamping
- chalker
- equipment
- make
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Abstract
Make the equipment and the method for printed circuit prototypes, utilize computer aided design system designing printed circuit board wiring figure on screen 14, then designed figure is drawn on the film or on the raw sheet of printed circuit board (PCB), on the pairing position of the pad of circuitous pattern, raw sheet is holed, the figure of plate is appeared.
Description
The present invention relates to a kind of method and apparatus, be specially adapted to make printed circuit prototypes.
Make printed circuit prototypes and be one when not only useless but also dull process.Up to now, the designer is designing circuit pattern on paper or film normally, then it is depicted on the raw sheet of printed circuit board (PCB), perhaps is made into mask and covers on the raw sheet of printed circuit board (PCB), for example utilizing then, corrosion technology makes plate manifest circuitous pattern.When all there is circuitous pattern on the two sides of printed circuit board (PCB), very accurate at plate two sides transfer printing circuitous pattern, fully aim at the welded disc place at least guaranteeing, make electric component to be connected and realize certain circuit function with circuit board.Produce printed circuit board (PCB) and a large amount of waste products of producing mainly cause owing to the misalignment of circuit board two sides with prior art, and this defective before circuit board is finished be do not allow detectable.
The invention provides a kind of equipment of making printed circuit prototypes, this equipment comprises, the X-Y workbench, raw sheet is fixed on device on the X-Y workbench exactly, be arranged on one or more clamping framves of X-Y workbench top, but be positioned at clamping device on one or more clamping framves and clamping at clamping device and comprise chalker and at least two interchangeable devices of boring bar tool, make one or more clamping framves with respect to raw sheet and/or raw sheet with respect to one or more clamping framves along orthogonal X, the Y direction moves and makes boring bar tool according to the drive unit that moves up and down with the corresponding signal of predetermined pattern when boring bar tool is contained in the clamping device at least, and store said drive signal and transfer signals to the storage device of drive unit.
Because raw sheet is fixed on the X-Y workbench exactly, and chalker and/or raw sheet be driven according to the signal that is transferred on the drive unit reliably, so the circuitous pattern on circuit board two sides can easily accurately be aimed at.
Drive unit can be the device that the clamping frame is moved in X and Y direction with respect to static raw sheet, also can be the device that raw sheet is moved in X and Y direction with respect to static clamping frame, can make the device that the direction of clamping frame in X, Y direction move and make the device that the another one direction of raw sheet in X, Y direction moves but preferably include.
Chalker can be for example writing brush or similarly thing; when it contacts with raw sheet; just on raw sheet, stay ink marks or similar lines; or a kind of like this device; to be it with raw sheet do not need to contact just can stay ink marks or similar lines on raw sheet; ink-jet printing apparatus for example, perhaps chalker can also be the light irradiation device that causes polymerization, particularly UV curing apparatus.Chalker is preferably worked in the palisade mode, and in other words, chalker scans on raw sheet, in the place that needs produce lines, marks lines with the form of overlapping circulation.
Raw sheet can be the insulation board that is coated with conductor, at this moment, uses etching resisting ink to rule so that after line and boring with insulation board above the partial corrosion that does not have printing ink to cover of one deck fall.The first string is, can cover the polymerisable resist layer of one deck on raw sheet, and the polymerisable resist layer of this layer can make its polymerization by the rayed of sending in the chalker, removes tectal unpolymerized part then and resulting raw sheet is corroded.Another scheme is, can with chalker directly on the raw sheet of insulation with the conductive inks line, can avoid like this printed circuit board (PCB) is carried out chemical corrosion or other appears the process of printed circuit pattern.Another scheme is, rules on drawing film with chalker, then, drawing film covered on the raw sheet, exposes and develops.Hole of boring by making on the raw sheet and the pad alignment on the drawing film align drawing film and raw sheet.
Single clamping frame can have the clamping device of clamping chalker and boring bar tool releasedly, two or more clamping framves perhaps can be arranged, one of them has the clamping device of clamping chalker, and another has the clamping device of clamping boring bar tool.Under latter event, each clamping frame must can move to resting position, can not influence other clamping frame action in resting position.
The present invention also provides a kind of method of making printed circuit prototypes, this method comprises: with computer-aided design (CAD) system is PCB design wiring figure, the wiring figure for example is stored in the MCU microcomputer unit or on the employed recording medium of MCU microcomputer unit, raw sheet is fixed on the X-Y workbench of equipment of the present invention, so that on raw sheet, make circuitous pattern, the signal of storage is transferred on the drive unit to order about the chalker of clamping on clamping device moves with respect to the first surface of raw sheet, thereby transfer printing wiring figure on said first surface, replace chalker with boring bar tool, the signal of storage is transferred on the drive unit to order about boring bar tool moves with respect to raw sheet and on raw sheet, drill through the hole corresponding to the pad locations place in the circuitous pattern, then, if necessary, this plate development is obtained printed circuit board (PCB).
After the one side transfer printing of circuitous pattern at raw sheet, raw sheet is turned over, on another surface of raw sheet, repeat scratching process and make the wiring and the pad substantial alignment on raw sheet two sides.
The imagination certainly, after raw sheet turned over, wiring was with mirror image form or the transfer printing of anti-mirror image form, and this depends on that raw sheet is a turn-over how.
Describe the present invention in more detail by embodiment in conjunction with the accompanying drawings now, in the accompanying drawing, Fig. 1 is the schematic diagram that can be used for a kind of X-Y workbench of the present invention, and Fig. 2 is the block diagram of processing step of the present invention.
At first, with reference to Fig. 1, the X-Y workbench comprises table top 1, and has raw sheet is fixed on device (not shown) on the table top 1 exactly, and raw sheet can be fixed on the framework, has location hole on the framework, and the alignment pin on these holes and the table top aligns.Table top 1 is supported by slide bar 2, and is enabled to move at directions X through rotating band 4 drivings by CD-ROM drive motor 3.
Clamping frame 5 is arranged above table top 1, and it is supported by slide bar 6, and is enabled to move in the Y of X-Y workbench direction through rotating band 7 drivings by CD-ROM drive motor 8.
Clamping frame 5 has the alternatively clamping device 9 of clamping chalker (not shown) and boring bar tool (not shown), thereby device 9 is positioned at and makes on the clamping frame that the instrument of clamping can be moved to the service position on the clamping frame, also can be moved to off-position, in the service position, above-mentioned instrument carries out needed operation to raw sheet, at off-position, above-mentioned instrument leaves raw sheet.Though this device is not shown in the drawings, the structure of this device is conspicuous to those skilled in the art.
Come accessory drive by the signal that produces in the mnemonic, make table top 1 move, make clamping frame 5 move, make that the instrument on the clamping frame 5 rises and the decline (see figure 2) in the Y direction at directions X.Initial signal controlling chalker of exporting from memory and X, Y CD-ROM drive motor 3,8 directly mark the wiring figure with China ink against corrosion on the raw sheet surface.
When boring bar tool during in the service position, the signal of output is used to control motor 3 and 8 then, and signal is also controlled drill bit when needed and risen and descend.
Can the designing printed circuit wiring figure on display terminal 14, in order to quicken design, all deposit software all in the design packet in memory system, this just needs a bigger memory.
1.2 million bits (M Byte) are proved to be feasible, the information in the program library for example can be stored on the disk.
Come the wiring figure of designing printed circuit board in conjunction with the user's who is stored in element in the system library and point element requirement.Use Genius mouse just to need not to use QWERTY keyboard.The center mouse button is listed the menu of user's point element, and the pin solder joint at first is determined, and is doing the pad mark on each bond pad locations then, adds the profile diagram of element at last.
The position of element is by Genius mouse control on the screen, and Genius mouse can rotate, move or copy the picture element.Cabling between the pad can be removed and be replaced by interim logic connecting line, and enlarged area helps to connect between pad widely.
Use cursor to draw circuit trace on screen, moving of cursor controlled by Genius mouse, positions a cursor over original position earlier, marks lines then, so just can mark circuit trace.Can add the pad of being with through hole so that realize being connected with circuit trace on another conductor layer.Also can at first use the logic connecting line.On connected pad, the mark at pad place is shown cursor lock.Make in this way and can accurately and promptly connect very much, just drawn connecting line editor can be organized into circuit trace then.
Cabling can be wiped or heavily be drawn, and the zone of design can be moved or reappear.In case selected the circuit that will connect, system automatically in accordance with regulations circuit on screen, rule, drawn fully up to wiring figure.
Utilize the automatic routing system of multipath that wiring is provided, these wirings can have 45, and through hole (Vias) only just is set in needs.For the circuit of complexity, may need repeatedly to move and determine whole connecting paths.The process of back is carried out according to aforesaid, finishes up to whole paths are connected.
Just can make printed circuit prototypes according to the method described above.
Claims (9)
1, a kind of equipment that is used to make printed circuit prototypes, it comprises: the X-Y workbench, raw sheet is fixed on device on the X-Y workbench exactly, be arranged on one or more clamping framves of X-Y workbench top, but be positioned at clamping device on one or more clamping framves and clamping at clamping device and comprise chalker and at least two interchangeable devices of boring bar tool, make one or more clamping framves with respect to raw sheet and/or raw sheet with respect to one or more clamping framves along orthogonal X, the Y direction moves and makes boring bar tool according to the drive unit that moves up and down with the corresponding signal of predetermined pattern when boring bar tool is contained in the clamping device at least, and store said drive signal and transfer signals to the storage device of drive unit.
2, according to the said equipment of claim 1, wherein, drive unit comprises to make device that clamping device moves along a direction in X, the Y direction and makes the device that raw sheet moves along another direction in X, the Y direction.
3, according to claim 1 or 2 said equipment, wherein chalker is the writing brush or a similar device that can stay ink marks or similar lines when contacting with raw sheet on raw sheet.
4, according to claim 1 or 2 said equipment, wherein chalker is an ink-jet printing apparatus.
5, according to claim 1 or 2 said equipment, wherein chalker is worked in the palisade mode.
6, a kind of method of making printed circuit prototypes, this method comprises: with computer-aided design (CAD) system is PCB design wiring figure, the wiring figure for example is stored in the MCU microcomputer unit or on the employed recording medium of MCU microcomputer unit, raw sheet is fixed on the X-Y workbench of equipment of the present invention, so that on raw sheet, make circuitous pattern, the signal of storage is transferred on the drive unit to order about the chalker of clamping on clamping device moves with respect to the first surface of raw sheet, thereby transfer printing wiring figure on said first surface, replace chalker with boring bar tool, the signal of storage is transferred on the drive unit to order about boring bar tool moves with respect to raw sheet and on raw sheet, drill through the hole corresponding to the pad locations place in the circuitous pattern, then, if necessary, this plate development is obtained printed circuit board (PCB).
7, according to the said method of claim 6, wherein raw sheet is the insulation board that is coated with conductor, and uses China ink line against corrosion.
8, according to the said method of claim 6, wherein on raw sheet, cover a kind of polymerisable resist layer, utilize the rayed of sending in the chalker to make its polymerization.
9,, wherein on the raw sheet surface of insulation, directly rule with conductive inks according to the said method of claim 6.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB878728865A GB8728865D0 (en) | 1987-12-10 | 1987-12-10 | Apparatus & method for manufacture of printed circuit board & prototypes |
| GB8728865 | 1987-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1035409A true CN1035409A (en) | 1989-09-06 |
Family
ID=10628294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN88109246A Pending CN1035409A (en) | 1987-12-10 | 1988-12-10 | Make the equipment and the method for printed circuit prototypes |
Country Status (6)
| Country | Link |
|---|---|
| CN (1) | CN1035409A (en) |
| AU (1) | AU2935789A (en) |
| GB (1) | GB8728865D0 (en) |
| IL (1) | IL88634A0 (en) |
| WO (1) | WO1989005566A1 (en) |
| ZA (1) | ZA889270B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055194C (en) * | 1997-11-21 | 2000-08-02 | 厦门市科学技术委员会 | Covered copper plate fast printing method |
| CN100544549C (en) * | 2005-09-30 | 2009-09-23 | 鸿富锦精密工业（深圳）有限公司 | Circuit board aided design system and method |
| CN102975501A (en) * | 2012-12-18 | 2013-03-20 | 武汉大学 | Circuit board printing system and printing method |
| WO2014008742A1 (en) * | 2012-07-12 | 2014-01-16 | 深圳市常兴技术股份有限公司 | Method for hole grinding with a small-size drill bit |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101778538B (en) * | 2006-06-02 | 2013-04-17 | 刘扬名 | Device system for producing nano spraying circuit boards |
| CN113301789B (en) * | 2021-05-21 | 2023-04-11 | 长春思为科技有限公司 | Circuit board production equipment for multi-station surface mounting |
| CN114599149B (en) * | 2022-05-10 | 2022-07-15 | 四川英创力电子科技股份有限公司 | Double-sided precise targeting device and method for HDI board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1140976A (en) * | 1966-09-23 | 1969-01-22 | Marconi Co Ltd | Improvements in or relating to photographic picture or pattern apparatus |
| GB1367601A (en) * | 1971-11-23 | 1974-09-18 | Harris G P | Circuit systems |
| US4485387A (en) * | 1982-10-26 | 1984-11-27 | Microscience Systems Corp. | Inking system for producing circuit patterns |
| US4654956A (en) * | 1985-04-16 | 1987-04-07 | Protocad, Inc. | Drill apparatus for use with computer controlled plotter |
-
1987
- 1987-12-10 GB GB878728865A patent/GB8728865D0/en active Pending
-
1988
- 1988-12-08 IL IL88634A patent/IL88634A0/en unknown
- 1988-12-10 CN CN88109246A patent/CN1035409A/en active Pending
- 1988-12-12 ZA ZA889270A patent/ZA889270B/en unknown
- 1988-12-12 WO PCT/GB1988/001124 patent/WO1989005566A1/en unknown
- 1988-12-12 AU AU29357/89A patent/AU2935789A/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055194C (en) * | 1997-11-21 | 2000-08-02 | 厦门市科学技术委员会 | Covered copper plate fast printing method |
| CN100544549C (en) * | 2005-09-30 | 2009-09-23 | 鸿富锦精密工业（深圳）有限公司 | Circuit board aided design system and method |
| WO2014008742A1 (en) * | 2012-07-12 | 2014-01-16 | 深圳市常兴技术股份有限公司 | Method for hole grinding with a small-size drill bit |
| CN102975501A (en) * | 2012-12-18 | 2013-03-20 | 武汉大学 | Circuit board printing system and printing method |
| CN102975501B (en) * | 2012-12-18 | 2015-07-15 | 武汉大学 | Circuit board printing system and printing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1989005566A1 (en) | 1989-06-15 |
| ZA889270B (en) | 1989-08-30 |
| AU2935789A (en) | 1989-07-05 |
| GB8728865D0 (en) | 1988-01-27 |
| IL88634A0 (en) | 1989-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |