CN115261879A - 适用于msap制程的有机去膜液 - Google Patents
适用于msap制程的有机去膜液 Download PDFInfo
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Abstract
本发明涉及一种适用于MSAP制程的有机去膜液，由以下重量份的各组分组成：有机胺5‑60份，有机溶剂10‑20份，渗透剂1‑10份，有机缓蚀剂0.5‑1份，水50‑70份。本发明的优点是：有效去除不同型号的水溶性、半水溶性干膜，不咬蚀铜，对基材影响小，溶解干膜能力强，可减少夹膜存在，剥膜快速干净，对镀锡线路间的干膜要有一定的溶解能力，有效控制干膜剥下来的颗粒大小，便于过滤除去，不堵塞喷嘴，适合水平喷淋式剥膜机等。
Description
技术领域
本发明涉及一种适用于MSAP制程的有机去膜液，属于线路板清洁剂领域。
背景技术
随着电子产品的多功能化、小型化、轻量化的发展，细线路的设计成为电路板生产的必然趋势。与传统的减成法相比，MSAP制程具有以下优势：1）线路加工能力更高，可以达到线宽间距25微米；2）制程稳定性高；MSAP制程已逐渐成为主流。
用传统的氢氧化钠和氢氧化钾等无机碱溶液进行去膜处理已经不能满足精细线路的加工要求，业内人士逐渐开发出新型的以有机碱作为主要成分的水溶性去膜液。以有机碱作为主要成分的去膜液具有去膜效率高、对锡镀层和铜面攻击弱、容量大、保养周期长等优点，使水溶性有机碱去膜液被越来越多PCB制造商接受。现有的无机碱去膜液存在对铜微蚀量大，铜面氧化造成的铜面异色较严重，同时不易分解，扩散速度慢，分布不均匀的问题。
发明内容
为克服现有技术的缺陷，本发明提供一种适用于MSAP制程的有机去膜液，本发明的技术方案是：
一种适用于MSAP制程的有机去膜液，由以下重量份的各组分组成：有机胺5-60份，有机溶剂10-20份，渗透剂1-10份，有机缓蚀剂0.5-1份，水50-70份。
所述的有机胺50份，有机溶剂15份，渗透剂5份，有机缓蚀剂1份，水60份。
所述的有机胺为乙醇胺、三乙醇胺、二乙醇胺或三异丙醇胺中的一种或几种按照任意比例混合而成；在该有机胺中还混合有烷基季铵盐，该烷基季铵盐与有机胺的质量比为1:2。
所述的烷基季铵盐为四甲基氢氧化铵、四甲基溴化铵或四丁基氢氧化铵中的一种。
所述的有机溶剂为乙二醇、丙二醇、正丁醇、异丁醇、丙二醇甲醚、丙二醇***、丙二醇丁醚、甲基环几烷或六溴化环己烷中的一种或几种按照任意比例混合而成。
所述的渗透剂为小分子醇醚类，为乙二醇、乙酸乙酯、山梨糖醇或丁酸甲酯中的一种或几种按照任意比例混合而成。
所述的有机缓蚀剂为具有-NH2或-S-基团的有机缓蚀剂，为苯并三氮唑、甲基苯骈三氮唑及其衍生物、蛋氨酸、3-巯基-1，2，4***或3-氨基-5-巯基-1,2,4-三氮唑中的一种。
本发明的优点是：有效去除不同型号的水溶性、半水溶性干膜，不咬蚀铜，对基材影响小，溶解干膜能力强，可减少夹膜存在，剥膜快速干净，对镀锡线路间的干膜要有一定的溶解能力，有效控制干膜剥下来的颗粒大小，便于过滤除去，不堵塞喷嘴，适合水平喷淋式剥膜机等。
具有以下优点：
1.解决了传统无机碱去膜液对铜微蚀量大，铜面氧化造成的铜面异色较严重的问题，从而提高产品良率。
2.有机碱主要成份为烷链醇胺或烷基季铵盐类及其组合物，具有强碱性，但不攻击铜面及抗蚀镀层。与无机碱相比，有机碱不易分解，扩散快，分布均匀。
3.本发明中添加的碎膜成份，具有很好的渗透作用，提高剥离速度，对线宽小于25微米的精细线路去膜板也能很快剥离。主要成份为小分子醇醚类溶剂，它们具有很好的渗透性，可以溶解干膜中的增稠剂，降低干膜与铜的结合力，加快干膜的剥离，同时使膜屑更小。
具体实施方式
下面结合具体实施例来进一步描述本发明，本发明的优点和特点将会随着描述而更为清楚。但这些实施例仅是范例性的，并不对本发明的范围构成任何限制。本领域技术人员应该理解的是，在不偏离本发明的精神和范围下可以对本发明技术方案的细节和形式进行修改或替换，但这些修改和替换均落入本发明的保护范围内。
实施例1：一种适用于MSAP制程的有机去膜液，由以下重量份的各组分组成：有机胺30份，有机溶剂10份，渗透剂1份，有机缓蚀剂0.5份，水50份。
所述的有机胺为乙醇胺、三乙醇胺、二乙醇胺或三异丙醇胺中的一种或几种按照任意比例混合而成；在该有机胺中还混合有烷基季铵盐，该烷基季铵盐与有机胺的质量比为1:2，该烷基季铵盐的重量份为15份；所述的烷基季铵盐为四甲基氢氧化铵、四甲基溴化铵或四丁基氢氧化铵中的一种。
所述的有机溶剂为乙二醇、丙二醇、正丁醇、异丁醇、丙二醇甲醚、丙二醇***、丙二醇丁醚、甲基环几烷或六溴化环己烷中的一种或几种按照任意比例混合而成。
所述的渗透剂为小分子醇醚类，为乙二醇、乙酸乙酯、山梨糖醇或丁酸甲酯中的一种或几种按照任意比例混合而成。
所述的有机缓蚀剂为具有-NH2或-S-基团的有机缓蚀剂，为苯并三氮唑、甲基苯骈三氮唑及其衍生物、蛋氨酸、3-巯基-1，2，4***或3-氨基-5-巯基-1,2,4-三氮唑中的一种。
实施例2：一种适用于MSAP制程的有机去膜液，由以下重量份的各组分组成：所述的有机胺5份，季铵盐10份，有机溶剂15份，渗透剂5份，有机缓蚀剂1份，水60份。
所述的有机胺为乙醇胺、三乙醇胺、二乙醇胺或三异丙醇胺中的一种或几种按照任意比例混合而成；在该有机胺中还混合有烷基季铵盐，该烷基季铵盐与有机胺的质量比为1:2，该烷基季铵盐的重量份为25份；所述的烷基季铵盐为四甲基氢氧化铵、四甲基溴化铵或四丁基氢氧化铵中的一种。
所述的有机溶剂为乙二醇、丙二醇、正丁醇、异丁醇、丙二醇甲醚、丙二醇***、丙二醇丁醚、甲基环几烷或六溴化环己烷中的一种或几种按照任意比例混合而成。
所述的渗透剂为小分子醇醚类，为乙二醇、乙酸乙酯、山梨糖醇或丁酸甲酯中的一种或几种按照任意比例混合而成。
所述的有机缓蚀剂为具有-NH2或-S-基团的有机缓蚀剂，为甲基苯骈三氮唑及其衍生物、蛋氨酸、3-巯基-1，2，4***或3-氨基-5-巯基-1,2,4-三氮唑中的一种。
实施例3：一种适用于MSAP制程的有机去膜液，由以下重量份的各组分组成：有机胺60份，有机溶剂20份，渗透剂10份，有机缓蚀剂1份，水70份。
所述的有机胺为乙醇胺、三乙醇胺、二乙醇胺或三异丙醇胺中的一种或几种按照任意比例混合而成；在该有机胺中还混合有烷基季铵盐，该烷基季铵盐与有机胺的质量比为1:2；该烷基季铵盐的重量份为30份；所述的烷基季铵盐为四甲基氢氧化铵、四甲基溴化铵或四丁基氢氧化铵中的一种。
所述的有机溶剂为乙二醇、丙二醇、正丁醇、异丁醇、丙二醇甲醚、丙二醇***、丙二醇丁醚、甲基环几烷或六溴化环己烷中的一种或几种按照任意比例混合而成。
所述的渗透剂为小分子醇醚类（能渗透到干膜中，使之膨胀和断裂，最后干膜和基质之间的附着力消失，干膜就很容易除去），为乙二醇、乙酸乙酯、山梨糖醇或丁酸甲酯中的一种或几种按照任意比例混合而成。
所述的有机缓蚀剂为具有-NH2或-S-基团的有机缓蚀剂，为苯并三氮唑、甲基苯骈三氮唑及其衍生物、蛋氨酸、3-巯基-1，2，4***或3-氨基-5-巯基-1,2,4-三氮唑中的一种。
本发明提供了一种对膜进行剥离的去膜液，包括有机胺，有机溶剂，渗透剂，缓蚀剂和水。通过上述组分的配合，能够对膜起到很好的剥离作用，具有非常强的渗透力，能提高剥离速度，对夹膜板有较好的去膜效果，且不腐蚀锡面、金面，不攻击绿油等阻焊膜，可以根据不同需求进行去膜浓度调节。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，根据本发明的技术方案及其发明构思加以等同替换或改变，都应涵盖在本发明的保护范围之内。
| 对比例 | 去膜速度/s | 膜屑大小 | 微蚀量/ɥm | 铜面异色情况 |
| 乙醇胺 | 20 | 2 mm | 0.2 | 铜面异色 |
| 四甲基氢氧化铵 | 600 | 300-500ɥm | 0.1 | 铜面异色 |
| 实施例2 | 20 | 300-500ɥm | 对铜几乎无微蚀 | 铜面无异色 |
目前PCB厂使用的有机去膜产品大多为乙醇胺搭配季铵盐，或者再加入护铜剂，其主要缺点是难以平衡PCB产品去膜时对微蚀量，膜屑大小和板面异色的多重要求。本发明产品通过调节渗透剂及有机胺成份的比例，可以实现膜屑大小的控制调节，去膜速度快，且通过添加独特的护铜成份使铜面无异色，且微蚀量几乎为零。
Claims (7)
1.一种适用于MSAP制程的有机去膜液，其特征在于，由以下重量份的各组分组成：有机胺5-60份，有机溶剂10-20份，渗透剂1-10份，有机缓蚀剂0.5-1份，水50-70份。
2.根据权利要求1所述的一种适用于MSAP制程的有机去膜液，其特征在于，所述的有机胺50份，有机溶剂15份，渗透剂5份，有机缓蚀剂1份，水60份。
3.根据权利要求1或2所述的一种适用于MSAP制程的有机去膜液，其特征在于，所述的有机胺为乙醇胺、三乙醇胺、二乙醇胺或三异丙醇胺中的一种或几种按照任意比例混合而成；在该有机胺中还混合有烷基季铵盐，该烷基季铵盐与有机胺的质量比为1:2。
4.根据权利要求3所述的一种适用于MSAP制程的有机去膜液，其特征在于，所述的烷基季铵盐为四甲基氢氧化铵、四甲基溴化铵或四丁基氢氧化铵中的一种。
5.根据权利要求4所述的一种适用于MSAP制程的有机去膜液，其特征在于，所述的有机溶剂为乙二醇、丙二醇、正丁醇、异丁醇、丙二醇甲醚、丙二醇***、丙二醇丁醚、甲基环几烷或六溴化环己烷中的一种或几种按照任意比例混合而成。
6.根据权利要求4所述的一种适用于MSAP制程的有机去膜液，其特征在于，所述的渗透剂为小分子醇醚类，为乙二醇、乙酸乙酯、山梨糖醇或丁酸甲酯中的一种或几种按照任意比例混合而成。
7.根据权利要求4所述的一种适用于MSAP制程的有机去膜液，其特征在于，所述的有机缓蚀剂为具有-NH2或-S-基团的有机缓蚀剂，为苯并三氮唑、甲基苯骈三氮唑及其衍生物、蛋氨酸、3-巯基-1，2，4***或3-氨基-5-巯基-1,2,4-三氮唑中的一种。
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