CN113644140A - 光模块 - Google Patents

光模块 Download PDF

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CN113644140A
CN113644140A CN202110432686.1A CN202110432686A CN113644140A CN 113644140 A CN113644140 A CN 113644140A CN 202110432686 A CN202110432686 A CN 202110432686A CN 113644140 A CN113644140 A CN 113644140A
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capacitor
light
resistor
conductor
region
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野口大辅
山本宽
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Cambridge Optoelectronics Co ltd
CIG Photonics Japan Ltd
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Cambridge Optoelectronics Co ltd
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Abstract

本发明提供一种光模块，其目的在于避免大型化、阻抗增加。光模块(100)具有：光源(24)；光调制器(26)，其能够对来自光源(24)的光进行调制；电容器(52)，其具有上电极(54)和下电极(56)；以及电阻器(42)，其与电容器(52)的上电极(54)以面接合的方式串联连接。电阻器(42)及电容器(52)与光调制器(26)并联连接。

Description

光模块
技术领域
本发明涉及光模块。
背景技术
已知有光调制器根据电信号对光进行调制的光模块(专利文献1和2)。在光调制器上并联连接终端电阻，取得阻抗匹配。
现有技术文献
专利文献
专利文献1：日本特开2009-152472号公报
专利文献2：日本特开2009-238965号公报
发明内容
发明所要解决的课题
如果在终端电阻上串联连接电容器而不流过直流成分，则能够实现低功耗化。但是，需要有搭载电容器的区域，封装会大型化。另外，若利用导线将终端电阻与电容器连接，则不仅需要有导线的键合区域，而且阻抗会增加从而有损高频特性。另外，在专利文献1中，没有公开与终端电阻串联连接的电容器。在专利文献2的结构中，由于终端电阻和电容器位于同一平面上，因此无法避免封装的大型化。
本发明的目的在于避免大型化、阻抗增加。
用于解决课题的方案
(1)本发明所涉及的光模块的特征在于，具有：光源；光调制器，其能够对来自所述光源的光进行调制；电容器，其具有上电极及下电极；以及电阻器，其与所述电容器的所述上电极以面接合的方式串联连接，所述电阻器及所述电容器与所述光调制器并联连接。
根据本发明，由于电容器和电阻器面接合，所以能够避免使用导线时产生的阻抗增加，由于在电容器上具有电阻器，所以能够避免大型化。
(2)根据(1)所述的光模块的特征也可以是，所述光源以及所述光调制器是一体化的光半导体元件。
(3)根据(1)或(2)所述的光模块的特征也可以是，所述电阻器包括：第一导体，其与所述电容器的所述上电极面接合；第二导体；以及电阻体，其电串联连接在所述第一导体与所述第二导体之间。
(4)根据(3)所述的光模块的特征也可以是，所述电阻器还包括绝缘体，所述第一导体从所述绝缘体的下表面到达上表面，所述第二导体以及所述电阻***于所述绝缘体的所述上表面。
(5)根据(4)所述的光模块的特征也可以是，所述第一导体通过所述绝缘体的侧面。
(6)根据(4)所述的光模块的特征也可以是，所述第一导体贯通所述绝缘体。
(7)根据(4)至(6)中任一项所述的光模块的特征也可以是，所述绝缘体的端部以及所述第二导体的端部在接近所述光调制器的方向上位于从所述电容器外伸的位置。
(8)根据(4)至(7)中任一项所述的光模块的特征也可以是，还具有导线，该导线的一端与所述电阻器的所述第二导体的所述端部键合，另一端与所述光调制器键合。
(9)根据(4)至(7)中任一项所述的光模块的特征也可以是，还具有：键合焊盘，其在与所述电容器相反的一侧位于所述光调制器的旁边；第一导线，其一端与所述光调制器键合，另一端与所述键合焊盘键合；以及第二导线，其一端与所述电阻器的所述第二导体的所述端部键合，且超过所述光调制器的上方，另一端与所述键合焊盘键合。
(10)根据(1)至(9)中任一项所述的光模块的特征也可以是，还具有：导电性块，其具有第一面及第二面，且具有在所述第一面和所述第二面之间贯通的多个贯通孔，并在所述第一面具有基座部；以及多个引线，其与所述导电性块绝缘并分别固定在所述多个贯通孔的内侧，所述电容器搭载于所述基座部。
(11)根据(10)所述的光模块的特征也可以是，还具有搭载基板，该搭载基板搭载有所述光源及所述光调制器，所述搭载基板搭载于所述基座部。
(12)根据(1)至(11)中任一项所述的光模块的特征也可以是，所述光源包括多个光源，所述光调制器包括与所述多个光源分别对应的多个光调制器，所述电容器包括多个电容器，所述电阻器包括与所述多个电容器分别对应的多个电阻器，所述多个光调制器和所述多个电容器交替配置。
(13)根据(11)所述的光模块的特征也可以是，所述基座部在上表面包括第一区域和比所述第一区域低的第二区域，所述搭载基板搭载于所述第一区域，所述电容器搭载于所述第二区域。
(14)根据(11)所述的光模块的特征也可以是，所述基座部在上表面包括第一区域和比所述第一区域低的第二区域，所述搭载基板搭载于所述第一区域，所述光源包括多个光源，所述光调制器包括与所述多个光源分别对应的多个光调制器，所述电容器包括多个电容器，该多个电容器由搭载于所述第一区域的至少一个第一电容器以及搭载于所述第二区域的至少一个第二电容器构成，所述电阻器包括与所述多个电容器分别对应的多个电阻器。
附图说明
图1是第一实施方式所涉及的光模块的侧视图。
图2是导电性块以及搭载于该导电性块的电子部件的主视图。
图3是图2所示的导电性块以及搭载于该导电性块的电子部件的俯视图。
图4是表示通过使用了三维电场解析工具的模拟而得到的、现有例和第一实施方式的频率特性的图。
图5是在第二实施方式中导电性块以及搭载于该导电性块的电子部件的主视图。
图6是图5所示的导电性块以及搭载于该导电性块的电子部件的俯视图。
图7是在第三实施方式中导电性块以及搭载于该导电性块的电子部件的主视图。
图8是图7所示的导电性块以及搭载于该导电性块的电子部件的俯视图。
图9是在第四实施方式中导电性块以及搭载于该导电性块的电子部件的主视图。
图10是图9所示的导电性块以及搭载于该导电性块的电子部件的俯视图。
图11是在第五实施方式中搭载于导电性块的电子部件的俯视图。
图12是在第六实施方式中基座部以及搭载于该基座部的电子部件的俯视图。
图13是图12所示的基座部以及搭载于该基座部的电子部件的局部侧视图。
图中：
10—导电性块；12—第一面；14—第二面；16—贯通孔；18—基座部；20—绝缘材料；22—光半导体元件；24—光源；26—光调制器；28—搭载基板；28a—通孔；30—电极焊盘；32—键合焊盘；34—键合电极；36—旁路电容器；38—中继基板；40—布线图案；42—电阻器；44—绝缘体；46—第一导体；48—第二导体；50—电阻体；52—电容器；54—上电极；56—下电极；100—光模块；102—柔性基板；244—绝缘体；246—第一导体；258—通孔；326—光调制器；332—键合焊盘；342—电阻器；348—第二导体；352—电容器；418—基座部；426—光调制器；428—搭载基板；442—电阻器；452—电容器；458—第一区域；460—第二区域；524—光源；526—光调制器；542—电阻器；552—电容器；618—基座部；624—光源；626—光调制器；628—搭载基板；642—电阻器；652A—第一电容器；652B—第二电容器；658—第一区域；660—第二区域；L1—引线；L2—引线；W—导线；W1—导线；W11—第一导线；W2—导线；W22—第二导线；W3—导线；W4—导线；W5—导线。
具体实施方式
以下，参照附图，对本发明的实施方式进行具体且详细的说明。在全部附图中，标注相同标记的部件具有相同或等同的功能，省略其重复说明。另外，图形的大小并不一定与倍率一致。
[第一实施方式]
图1是第一实施方式所涉及的光模块的侧视图。光模块100是TO-CAN(TransistorOutline-Can)型光模块，可以是具备发光元件的光发送子组件(TOSA：TransmitterOptical Sub-Assembly)以及具备发光元件和受光元件这两者的双向模块(BOSA：Bidirectional Optical Sub-Assembly)中的任一种。光模块100具有柔性基板(FPC)102，与印刷基板(PCB104)连接。光模块100具有导电性块10(例如孔眼)。
图2是导电性块10以及搭载于该导电性块10的电子部件的主视图。图3是图2所示的导电性块10以及搭载于该导电性块10的电子部件的俯视图。
导电性块10由金属等导电材料构成，具有第一面12及第二面14。导电性块10具有在第一面12与第二面14之间分别贯通的多个贯通孔16。导电性块10在第一面12具有一体的基座部18。基座部18在第一面12***，具有朝向与第一面12平行的方向的上表面。基座部18也由导电体构成。导电性块10与基准电位(例如接地)连接。
光模块100具有多个引线L1、L2。多个引线L1、L2在多个贯通孔16的内侧与导电性块10绝缘并分别固定。例如，在贯通孔16中填充有玻璃等绝缘材料20。多个引线L1、L2从第一面12突出。多个引线L1、L2还从第二面14突出，与柔性基板102(图1)连接。
光模块100具有光半导体元件22。光半导体元件22是将光源24(例如激光器)以及光调制器26集成在单片上的调制器集成型半导体光元件(例如调制器集成激光器)。光源24和光调制器26被一体化。光源24通过注入驱动电流而射出连续光。光调制器26对来自光源24的光进行调制。由此，输出信号光。光调制器26被单端驱动。
光半导体元件22(光源24以及光调制器26)搭载于由绝缘材料构成的搭载基板28。搭载基板28固定于基座部18(其上表面)。在搭载基板28上，在与基座部18相反的一侧形成有电极焊盘30。电极焊盘30经由通孔28a、未图示的城堡形结构与基准电位(例如接地)的基座部18电连接。
光半导体元件22与光源24以及光调制器26共同地在下表面与电极焊盘30接合，由此，使接地电位稳定。光半导体元件22在上表面具有光源24以及光调制器26各自的键合电极34。
在搭载基板28上，与电极焊盘30并排地形成有键合焊盘32。键合焊盘32不与基座部18电连接。导线W1在其一端键合于键合焊盘32，在另一端键合于光调制器26的键合电极34。
在基座部18上搭载有旁路电容器36。旁路电容器36在背面与基座部18导通，并与基准电位(例如接地)连接。导线W2在一端键合于直流电源用引线L1，在另一端键合于旁路电容器36的上表面。其他导线W3在一端键合于旁路电容器36的上表面，在另一端键合于光源24的键合电极34。旁路电容器36与和直流电源连接的光源24并联连接，将叠加在直流偏置上的高频噪声向基准电位(例如接地)释放。
在基座部18上搭载有由绝缘材料构成的中继基板38。在中继基板38上，在与基座部18相反的一侧形成有布线图案40。布线图案40通过金锡焊料等与用于传递调制电信号的引线L2接合。中继基板38的布线图案40与引线、导线相比电感较低，因此能够进行到高频率的阻抗匹配。导线W4在一端键合于布线图案40，在另一端键合于搭载基板28的键合焊盘32。为了尽可能缩短导线W4，优选布线图案40与键合焊盘32接近。
光模块100具有电阻器42。电阻器42具有图2所示的绝缘体44(例如绝缘基板)。电阻器42具有第一导体46。第一导体46从绝缘体44的下表面到达上表面。具体而言，第一导体46通过绝缘体44的侧面。电阻器42具有第二导体48。第二导体48位于绝缘体44的上表面。由于第二导体48位于与第一导体46重叠的位置，因此能够使电阻器42在平面上小型化。电阻器42具有电阻体50。电阻体50在第一导体46与第二导体48之间电串联连接。电阻体50位于绝缘体44的上表面。
光模块100具有电容器52。电容器52搭载于导电性块10的基座部18。电容器52具有上电极54和下电极56。下电极56与基座部18导通。
电阻器42与电容器52面接合。详细而言，第一导体46与电容器52的上电极54面接合。在面接合中也可以使用导电性粘接剂。通过面接合，能够避免由于使用导线而产生的阻抗增加。另外，由于在电容器52上具有电阻器42，因此能够避免光模块100的平面大型化。
电阻器42与作为高电阻体的光调制器26并联连接，能够实现与线路的特性阻抗(例如50Ω)相等的电阻上的终端。电容器52与电阻器42串联连接，电阻器42和电容器52与光调制器26并联连接。电容器52使高频电流通过，因此在高频区域中电阻器42成为终端。另一方面，由于电容器52不通过直流电流，因此电阻器42中的发热减少，能够实现未图示的温度调节器(例如帕尔帖元件)的低功耗化。
绝缘体44的端部在接近光调制器26的方向上位于从电容器52外伸的位置。第二导体48的端部在接近光调制器26的方向上位于从电容器52外伸的位置。导线W5的一端与电阻器42的第二导体48的端部键合。导线W5的另一端与光调制器26(键合电极34)键合。
若在电容器52与搭载基板28之间存在充分的间隙，则能够避免电阻器42与搭载基板28的干涉。另外，如果使第二导体48的面积最小，则也没有与基座部18的接地间共振的问题，能够使接地电位稳定。
电容器52的寄生电感随着电容值而降低，在高频带中作为理想的电容器52而动作，因此优选为0.1μF左右的电容器。在使用0.5mm见方的平板电容器52作为0.1μF的电容器52的情况下，电阻器42的绝缘体44可以为0.35mm见方左右的小尺寸。
这样，将电阻器42配置在电容器52之上是空间上浪费最少的布局。相反，若将电容器52接合于电阻器42之上，则用于接合的导电性粘接剂的润湿扩展有可能覆盖在电阻体50上。因此，需要对润湿扩展进行限制等对策，绝缘体44也需要设为0.5mm见方以上的尺寸，在成本上具有很大的缺点。
图4是表示通过使用了三维电场解析工具的模拟而得到的、现有例和第一实施方式的频率特性的图。现有例是通过不重叠地排列电阻器以及电容器而使接地图案变大的例子，通过接地共振而将频带限制至30GHz左右。与此相对，在第一实施方式中，得到了直至超过40GHz的频率的充分的透射特性(S21)。
[第二实施方式]
图5是在第二实施方式中导电性块以及搭载于该导电性块的电子部件的主视图。图6是图5所示的导电性块以及搭载于该导电性块的电子部件的俯视图。
第一导体246贯通绝缘体244。第一导体246包括在绝缘体244的下表面和上表面分别分离的部分，例如，两者通过通孔258导通。关于其他结构，相当于在第一实施方式中说明的内容。
[第三实施方式]
图7是在第三实施方式中导电性块以及搭载于该导电性块的电子部件的主视图。图8是图7所示的导电性块以及搭载于该导电性块的电子部件的俯视图。
光模块具有键合焊盘332。焊盘332在与电容器352相反的一侧位于光调制器326的旁边。第一导线W11在一端键合于光调制器326，在另一端键合于键合焊盘332。第二导线W22在一端键合于电阻器342的第二导体348的端部，在另一端键合于键合焊盘332。第二导线W22以超过光调制器326的上方的方式配置。
在本实施方式中，没有直接连接光调制器326和电阻器342的导线，通过第一导线W11和第二导线W22将两者电连接。通过使用多个第一导线W11及多个第二导线W22，能够进一步降低电感。关于其他结构，相当于在第一实施方式中说明的内容。
[第四实施方式]
图9是在第四实施方式中导电性块以及搭载于该导电性块的电子部件的主视图。图10是图9所示的导电性块以及搭载于该导电性块的电子部件的俯视图。
基座部418在上表面包括第一区域458。基座部418在上表面包括比第一区域458低的第二区域460。搭载基板428搭载于第一区域458。电容器452搭载于第二区域460。由于第二区域460变低，因此搭载于电容器452之上的电阻器442被配置得较低。由此，导线W的一端(向电阻器442的键合部分)与另一端(向光调制器426的键合部分)的高度之差变小，因此能够缩短导线W而降低电感。由此，能够进一步降低高频区域中的阻抗，因此能够进行直至高频区域的阻抗匹配。关于其他结构，相当于在第一实施方式中说明的内容。
[第五实施方式]
图11是在第五实施方式中搭载于导电性块的电子部件的俯视图。
多个光调制器526分别对应于多个光源524。多个电阻器542分别对应于多个电容器552。多个光调制器526和多个电容器552交替配置。关于其他结构，相当于在第一实施方式中说明的内容。
[第六实施方式]
图12是在第六实施方式中基座部以及搭载于该基座部的电子部件的俯视图。图13是图12所示的基座部以及搭载于该基座部的电子部件的局部侧视图。
基座部618在上表面包括第一区域658。基座部618在上表面包括比第一区域658低的第二区域660。搭载基板628搭载于第一区域658。多个光调制器626分别对应于多个光源624。
在第一区域658搭载有至少一个第一电容器652A，在第二区域660搭载有至少一个第二电容器652B。多个电阻器642分别对应于多个电容器(第一电容器652A及第二电容器652B)。关于其他结构，相当于在第一实施方式中说明的内容。
本发明并不限定于上述的实施方式，能够进行各种变形。例如，在实施方式中说明的结构能够置换为实质上相同的结构、起到相同作用效果的结构或者能够实现相同目的的结构。

Claims (14)

1.一种光模块，其特征在于，具有：
光源；
光调制器，其能够对来自所述光源的光进行调制；
电容器，其具有上电极及下电极；以及
电阻器，其与所述电容器的所述上电极以面接合的方式串联连接，
所述电阻器及所述电容器与所述光调制器并联连接。
2.根据权利要求1所述的光模块，其特征在于，
所述光源以及所述光调制器是一体化的光半导体元件。
3.根据权利要求1所述的光模块，其特征在于，
所述电阻器包括：第一导体，其与所述电容器的所述上电极面接合；第二导体；以及电阻体，其电串联连接在所述第一导体与所述第二导体之间。
4.根据权利要求3所述的光模块，其特征在于，
所述电阻器还包括绝缘体，
所述第一导体从所述绝缘体的下表面到达上表面，
所述第二导体以及所述电阻***于所述绝缘体的所述上表面。
5.根据权利要求4所述的光模块，其特征在于，
所述第一导体通过所述绝缘体的侧面。
6.根据权利要求4所述的光模块，其特征在于，
所述第一导体贯通所述绝缘体。
7.根据权利要求4至6中任一项所述的光模块，其特征在于，
所述绝缘体的端部以及所述第二导体的端部在接近所述光调制器的方向上位于从所述电容器外伸的位置。
8.根据权利要求4至6中任一项所述的光模块，其特征在于，
还具有导线，该导线的一端与所述电阻器的所述第二导体的所述端部键合，另一端与所述光调制器键合。
9.根据权利要求4至6中任一项所述的光模块，其特征在于，还具有：
键合焊盘，其在与所述电容器相反的一侧位于所述光调制器的旁边；
第一导线，其一端与所述光调制器键合，另一端与所述键合焊盘键合；以及
第二导线，其一端与所述电阻器的所述第二导体的所述端部键合，且超过所述光调制器的上方，另一端与所述键合焊盘键合。
10.根据权利要求1至6中任一项所述的光模块，其特征在于，还具有：
导电性块，其具有第一面及第二面，且具有在所述第一面和所述第二面之间贯通的多个贯通孔，并在所述第一面具有基座部；以及
多个引线，其与所述导电性块绝缘并分别固定在所述多个贯通孔的内侧，
所述电容器搭载于所述基座部。
11.根据权利要求10所述的光模块，其特征在于，
还具有搭载基板，该搭载基板搭载有所述光源及所述光调制器，
所述搭载基板搭载于所述基座部。
12.根据权利要求1至6中任一项所述的光模块，其特征在于，
所述光源包括多个光源，
所述光调制器包括与所述多个光源分别对应的多个光调制器，
所述电容器包括多个电容器，
所述电阻器包括与所述多个电容器分别对应的多个电阻器，
所述多个光调制器和所述多个电容器交替配置。
13.根据权利要求11所述的光模块，其特征在于，
所述基座部在上表面包括第一区域和比所述第一区域低的第二区域，
所述搭载基板搭载于所述第一区域，
所述电容器搭载于所述第二区域。
14.根据权利要求11所述的光模块，其特征在于，
所述基座部在上表面包括第一区域和比所述第一区域低的第二区域，
所述搭载基板搭载于所述第一区域，
所述光源包括多个光源，
所述光调制器包括与所述多个光源分别对应的多个光调制器，
所述电容器包括多个电容器，该多个电容器由搭载于所述第一区域的至少一个第一电容器以及搭载于所述第二区域的至少一个第二电容器构成，
所述电阻器包括与所述多个电容器分别对应的多个电阻器。
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