CN113490761B - 蒸镀掩模 - Google Patents

蒸镀掩模 Download PDF

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Publication number
CN113490761B
CN113490761B CN202080014896.2A CN202080014896A CN113490761B CN 113490761 B CN113490761 B CN 113490761B CN 202080014896 A CN202080014896 A CN 202080014896A CN 113490761 B CN113490761 B CN 113490761B
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CN
China
Prior art keywords
view
upper plate
lower plate
support frame
sectional
Prior art date
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Active
Application number
CN202080014896.2A
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English (en)
Chinese (zh)
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CN113490761A (zh
Inventor
岩井洋平
高城淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
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Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Publication of CN113490761A publication Critical patent/CN113490761A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN202080014896.2A 2019-02-19 2020-01-31 蒸镀掩模 Active CN113490761B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019027241A JP7233954B2 (ja) 2019-02-19 2019-02-19 蒸着マスク
JP2019-027241 2019-02-19
PCT/JP2020/003651 WO2020170762A1 (ja) 2019-02-19 2020-01-31 蒸着マスク

Publications (2)

Publication Number Publication Date
CN113490761A CN113490761A (zh) 2021-10-08
CN113490761B true CN113490761B (zh) 2024-06-25

Family

ID=72144464

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080014896.2A Active CN113490761B (zh) 2019-02-19 2020-01-31 蒸镀掩模

Country Status (4)

Country Link
JP (1) JP7233954B2 (ja)
KR (1) KR102641271B1 (ja)
CN (1) CN113490761B (ja)
WO (1) WO2020170762A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023012889A1 (ja) * 2021-08-03 2023-02-09 三菱電機株式会社 接合方法、接合装置、および接合システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150123525A (ko) * 2014-04-25 2015-11-04 (주)브이앤아이솔루션 증착 마스크
CN107419217A (zh) * 2016-05-23 2017-12-01 日立麦克赛尔株式会社 蒸镀掩膜及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57116769U (ja) * 1981-01-07 1982-07-20
JP4528569B2 (ja) * 2004-07-14 2010-08-18 モレックス インコーポレイテド メタルマスク、その取付け調整治具およびその取付け調整方法
JP2007277605A (ja) 2006-04-04 2007-10-25 Epson Toyocom Corp 圧電基板の成膜治具、圧電基板、圧電基板の成膜方法
JP2008255449A (ja) * 2007-04-09 2008-10-23 Kyushu Hitachi Maxell Ltd 蒸着マスクとその製造方法
KR101202346B1 (ko) 2009-04-16 2012-11-16 삼성디스플레이 주식회사 박막 증착용 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
JP5674767B2 (ja) 2010-04-21 2015-02-25 株式会社アルバック マスク
JP5641462B1 (ja) * 2014-05-13 2014-12-17 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
WO2018110253A1 (ja) 2016-12-14 2018-06-21 大日本印刷株式会社 蒸着マスク装置及び蒸着マスク装置の製造方法
JP6376483B2 (ja) * 2017-01-10 2018-08-22 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク装置の製造方法および蒸着マスクの良否判定方法
KR20190013534A (ko) * 2017-07-31 2019-02-11 맥셀 홀딩스 가부시키가이샤 증착 마스크

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150123525A (ko) * 2014-04-25 2015-11-04 (주)브이앤아이솔루션 증착 마스크
CN107419217A (zh) * 2016-05-23 2017-12-01 日立麦克赛尔株式会社 蒸镀掩膜及其制造方法

Also Published As

Publication number Publication date
JP2020132939A (ja) 2020-08-31
CN113490761A (zh) 2021-10-08
JP7233954B2 (ja) 2023-03-07
KR102641271B1 (ko) 2024-02-27
WO2020170762A1 (ja) 2020-08-27
KR20210114040A (ko) 2021-09-17

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