CN112689397A - Paster device is used in integrated circuit board processing - Google Patents

Paster device is used in integrated circuit board processing Download PDF

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Publication number
CN112689397A
CN112689397A CN202011579220.6A CN202011579220A CN112689397A CN 112689397 A CN112689397 A CN 112689397A CN 202011579220 A CN202011579220 A CN 202011579220A CN 112689397 A CN112689397 A CN 112689397A
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CN
China
Prior art keywords
paster
glue dispensing
rotating
moving
gear
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Withdrawn
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CN202011579220.6A
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Chinese (zh)
Inventor
陈圆圆
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Hefei Highland Creative Technology Co ltd
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Hefei Highland Creative Technology Co ltd
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Priority to CN202011579220.6A priority Critical patent/CN112689397A/en
Publication of CN112689397A publication Critical patent/CN112689397A/en
Withdrawn legal-status Critical Current

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Abstract

The invention discloses a chip mounting device for integrated circuit board processing, which belongs to the technical field of chip mounting of integrated circuit board processing and comprises a moving device, a dust removal device, a glue dispensing device, a chip mounting device and a chip discharging device, wherein the moving device is horizontally arranged on the ground, the dust removal device is vertically arranged at the top of the moving device, the glue dispensing device is vertically arranged at the top of the moving device, the chip mounting device is vertically arranged at the discharging end of the moving device, and the chip discharging device is arranged at the bottom of the chip mounting device. The integrated circuit board is sequentially fed through the moving device, and the integrated circuit board is subjected to glue dispensing through the glue dispensing device.

Description

Paster device is used in integrated circuit board processing
Technical Field
The invention relates to the technical field of integrated circuit board processing paster, in particular to a paster device for integrated circuit board processing.
Background
The circuit board is important constitutional part among the smart machine, in circuit board production and processing process, often need laminate some electrical component to the circuit board on, but current paster device intelligent degree is low, and the artificial mode control paster distance is adopted to most of all, leads to production efficiency greatly reduced, and simultaneously when the paster, probably because under the unstable condition of voltage, when leading to the paster device paster, can be too big to the circuit board application of force to cause the damage to the circuit board.
As a publication number CN211321669U patent relates to a paster device is used in integrated circuit board processing, the on-line screen storage device comprises a base, fixed mounting has rotating device in the middle of the upper portion of base, rotating device's upper portion fixed mounting has the lift post, the upper portion fixed mounting of lift post has the installation cloud platform, one side fixed mounting of installation cloud platform has the telescopic link, the one end bottom fixed mounting of telescopic link has the support column, the bottom fixed mounting of support column has the connecting plate. This paster device is used in integrated circuit board processing has vacuum fixing device through the middle part fixed mounting who places the platform, and has seted up long banding suction hole on vacuum fixing device to be connected vacuum fixing device through connecting pipe and vacuum device, be convenient for fix the circuit board through vacuum device and vacuum fixing device, avoid the circuit board to take place to rock and the dislocation at the in-process of paster, guarantee the paster quality of circuit board.
However, the above-mentioned device still has the following problems, firstly, the integrated circuit board needs to be manually and sequentially placed on the workbench to be processed, and secondly, the integrated circuit board needs to be manually and sequentially glued.
Disclosure of Invention
The embodiment of the invention provides a chip mounting device for processing an integrated circuit board, which solves the technical problems that the integrated circuit board needs to be manually and sequentially placed on a workbench to be processed and the integrated circuit board needs to be manually and sequentially glued.
The embodiment of the invention adopts the following technical scheme: the utility model provides a paster device is used in integrated circuit board processing, includes mobile device, dust collector, adhesive deposite device, paster device and play piece device, the mobile device level sets up on ground, the vertical top that sets up at the mobile device of dust collector, the vertical top that sets up at the mobile device of adhesive deposite device, the vertical discharge end that sets up at the mobile device of paster device, it sets up the bottom at the paster device to go out the piece device.
Further, the mobile device is including removing the seat, removing the backup pad, moving motor, moving belt pulley, two removal dwangs and two locating plates, it sets up on ground to remove the seat level, it sets up on the lateral wall that removes the seat to remove the backup pad level, the moving motor level sets up the top at the removal backup pad, the main shaft of moving motor link up the lateral wall that removes the seat, two remove the dwang symmetry and set up in the inboard that removes the seat, one of them both ends and the removal seat normal running fit of removing the dwang, another the one end of removing the dwang and the main shaft fixed connection of moving motor, another the other end that removes the dwang with remove seat normal running fit, the belt pulley cover is established on two removal dwangs, two the locating plate symmetry sets up on the inside wall that removes the seat.
Further, dust collector includes dust removal support frame, dust removal backup pad, dust removal air pump, dust removal intake pipe and dust removal outlet duct, the vertical setting of dust removal support frame is at the top of removing the seat, dust removal backup pad level sets up on the lateral wall that removes the seat, dust removal air pump level sets up the top at the dust removal backup pad, dust removal intake pipe level sets up on the dust removal air pump and link up the dust removal air pump, dust removal outlet duct level sets up the inboard at the dust removal support frame, the one end of dust removal outlet duct link up the dust removal support frame, the one end and the dust removal intake pipe fixed connection of dust removal outlet duct, the bottom of dust removal outlet duct is equipped with a.
Further, the glue dispensing device comprises a rotating assembly and a glue dispensing assembly, the rotating assembly is vertically arranged at the top of the moving seat, the glue dispensing assembly is horizontally arranged at the bottom of the rotating assembly, the rotating assembly is provided with a glue dispensing support frame, a glue dispensing motor, a glue dispensing support rod, a glue dispensing rotating pipe, a glue dispensing fixing rod and two glue dispensing rotating blocks, the glue dispensing support frame is vertically arranged at the top of the moving seat, the glue dispensing motor is horizontally arranged on the side wall of the glue dispensing support frame, a main shaft of the glue dispensing motor penetrates through the glue dispensing support frame, the two glue dispensing rotating blocks are symmetrically arranged on the inner side wall of the glue dispensing support frame, one glue dispensing rotating block is in rotating fit with the glue dispensing support frame, the other glue dispensing rotating block is fixedly connected with the main shaft of the glue dispensing motor, the support rod is horizontally arranged at the inner, the glue dispensing fixed rod is vertically arranged at the bottom of the glue dispensing rotating tube.
Further, the subassembly is glued to point includes the point and glues the box, advances the rubber tube, a plurality of rubber tube and a plurality of play gluey pearl, the point is glued the bottom that the box level set up the point and is glued the fixed pole, advance the rubber tube setting at the top of point and glue the box, it is a plurality of go out the vertical setting of rubber tube and glue the bottom of box, a plurality of go out the inboard of rubber tube and a plurality of rubber tube sliding fit that the pearl setting is being glued in a plurality of rubber tubes.
Further, the sheet discharging device comprises a sheet discharging support frame, a sheet discharging box, a sheet discharging support plate, a sheet discharging motor, a sheet discharging rotating gear, a sheet discharging matching gear and a sheet discharging threaded rod, the sheet discharging support plate is horizontally arranged on the sheet mounting device, the sheet discharging box is vertically arranged on the sheet discharging support frame, a sheet discharging hole is formed in the sheet discharging box, the sheet discharging support plate is horizontally arranged on the side wall of the sheet discharging box, the sheet discharging motor is horizontally arranged on the sheet discharging support plate, the sheet discharging rotating gear is vertically arranged on a spindle of the sheet discharging motor, the sheet discharging matching gear is vertically arranged on the sheet discharging box, the sheet discharging matching gear is in running fit with the sheet discharging box, the sheet discharging rotating gear is meshed with the sheet discharging matching gear, the sheet discharging threaded rod is horizontally arranged in the sheet discharging box, one end of the sheet discharging threaded rod penetrates through the sheet discharging box, one end of the sheet discharging matching gear penetrates through the sheet discharging matching gear, the piece-discharging threaded rod is meshed with the piece-discharging matching gear.
Further, the paster device comprises a paster support seat, a paster support plate, a paster support frame, a paster cylinder, a paster ring, a paster motor, a paster rotating rod, a paster rotating gear, a circular gear plate, a rotating disc and two paster matching gears, wherein the paster support seat is vertically arranged at the discharge end of the mobile device, the paster support plate is vertically arranged on the side wall of the paster support seat, the paster support frame is horizontally arranged on the side wall of the paster support plate, the paster cylinder is vertically arranged at the bottom of the paster support frame, the paster ring is horizontally arranged on the main shaft of the paster cylinder, the paster motor is vertically arranged at the top of the paster support frame, the main shaft of the paster motor penetrates through the paster support frame, one end of the paster rotating rod is arranged on the main shaft of the paster motor, and the other end of the paster rotating rod is in running fit with the, paster running gear level sets up in the inboard of paster supporting seat and with paster dwang fixed connection, two paster cooperation gear symmetry sets up in the paster supporting seat, two paster cooperation gear and paster supporting seat normal running fit, paster running gear and two paster cooperation gear engagement, circular gear board level sets up in the paster supporting seat, circular gear board and paster supporting seat normal running fit, two paster cooperation gear and circular gear board meshing, the rolling disc level sets up the top at circular gear board, be equipped with a plurality of pan feeding grooves on the rolling disc.
The embodiment of the invention adopts at least one technical scheme which can achieve the following beneficial effects:
firstly, when the integrated circuit board is subjected to chip mounting, the mobile device conveys the circuit board to other devices for processing, the dust removal device removes dust on the surface of the integrated circuit board, the glue dispensing device performs glue dispensing on the integrated circuit board, the chip discharging device performs chip placing on the glued surface of the integrated circuit board, and the chip mounting device performs pressing on the integrated circuit board after chip mounting.
Secondly, when the integrated circuit board is subjected to surface mounting, the movable support plate is supported by the movable seat, the movable motor is supported by the movable support plate, the movable motor works to drive the other movable rotating rod to rotate, the other movable rotating rod rotates to drive the movable belt pulley to rotate, the movable belt pulley rotates one movable rotating rod, the two movable rotating rods are matched to drive the movable belt pulley to better move to better convey the integrated circuit board, the positioning plates are symmetrically arranged on the movable seat to form an opening, the integrated circuit boards conveyed by the movable device are sequentially placed on the surface mounting device, and the integrated circuit board is better processed.
Thirdly, when the integrated circuit board is subjected to surface mounting, the dust removal air pump is supported by the dust removal supporting plate, the dust removal air pump works to drive the dust removal air inlet pipe to suck air, the dust removal air inlet pipe conveys air into the dust removal air outlet pipe, the dust removal air outlet pipe blows the air out of the plurality of air outlet holes, and the plurality of air outlet holes blow the air onto the integrated circuit board to blow off dust on the integrated circuit board.
When the integrated circuit board is subjected to surface mounting, the glue dispensing support frame supports the glue dispensing motor, the glue dispensing motor works to drive the other glue dispensing rotating block to rotate, the other glue dispensing rotating block rotates to drive the glue dispensing supporting rod to rotate, the glue dispensing supporting rod rotates to drive the glue dispensing rotating pipe to move, the glue dispensing rotating pipe moves to drive the glue dispensing fixing rod to move, and the glue dispensing fixing rod moves to drive the glue dispensing assembly to move.
Fifthly, when the integrated circuit board is subjected to surface mounting, the glue fixing rod moves to drive the glue dispensing box to move, the glue dispensing box moves to drive the glue inlet pipe, the plurality of glue outlet pipes and the plurality of glue outlet beads to move, glue flows into the glue dispensing box through the glue inlet pipe, the glue is input into the plurality of glue outlet pipes through the glue dispensing box, the plurality of glue outlet beads move upwards when the plurality of glue outlet beads touch the integrated circuit board, and the plurality of glue outlet pipes are dripped onto the integrated circuit board.
Sixth, when the integrated circuit board is subjected to chip mounting, the chip discharging support frame supports the chip discharging box, the chip discharging box supports the chip discharging support plate, the chip is manually placed into the chip discharging hole, the chip discharging support plate supports the chip discharging motor, the chip discharging motor works to drive the chip discharging rotating gear to rotate, the chip discharging rotating gear rotates to drive the chip discharging matching gear to rotate, the chip discharging matching gear rotates to drive the chip discharging threaded rod, one chip is sequentially placed on the integrated circuit by placing one chip on the chip, and the chip mounting device can conveniently press the chip on the integrated circuit board.
Seventhly, when the integrated circuit board is subjected to surface mounting, the surface mounting support frame performs a supporting effect on the surface mounting support frame, the surface mounting motor works and drives, the surface mounting rotating rod rotates to drive the surface mounting rotating gear to rotate, the surface mounting rotating gear rotates to drive the two surface mounting matching gears to rotate, the two surface mounting rotating gears rotate to drive the circular gear plate to rotate, the circular gear plate rotates to drive the rotating disc to rotate, the rotating disc rotates to drive the feeding groove to rotate, the feeding groove rotates to drive the integrated circuit board to be conveyed to the bottom of the surface mounting air cylinder, the surface mounting air cylinder works to drive the surface mounting ring to move to the surface mounting placed on the integrated circuit board by the surface mounting device, and the problem that the surface mounting is easy to drop in.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a side view of the present invention;
FIG. 3 is a schematic perspective view of a mobile device according to the present invention;
FIG. 4 is a schematic perspective view of the dust removing device of the present invention;
FIG. 5 is a schematic perspective view of a dispensing device according to the present invention;
FIG. 6 is a schematic perspective view of a sheet discharging device according to the present invention;
FIG. 7 is a first perspective view of the patch device of the present invention;
fig. 8 is a schematic perspective view of a patch device of the present invention.
Reference numerals:
the device comprises a moving device 1, a moving seat 11, a moving support plate 12, a moving motor 13, a moving rotating rod 14, a moving belt pulley 15, a positioning plate 16, a dust removing device 2, a dust removing support frame 21, a dust removing support plate 22, a dust removing air pump 23, a dust removing air inlet pipe 24, a dust removing air outlet pipe 25, an air outlet hole 26, a glue dispensing device 3, a rotating component 31, a glue dispensing support frame 311, a glue dispensing motor 312, a glue dispensing rotating block 313, a glue dispensing support rod 314, a glue dispensing rotating pipe 315, a glue dispensing fixing rod 316, a glue dispensing component 32, a glue dispensing box 321, a glue inlet pipe 322, a glue outlet pipe 323, a glue outlet bead 324, a sheet outlet device 4, a sheet outlet support frame 41, a sheet outlet box 42, a sheet outlet hole 43, a sheet outlet support plate 44, a sheet outlet motor 45, a sheet outlet rotating gear 46, a sheet outlet matching gear, the automatic feeding device comprises a paster cylinder 54, a paster ring 55, a paster motor 56, a paster rotating rod 57, a paster rotating gear 58, a paster matching gear 59, a circular gear plate 510, a rotating disc 511 and a feeding groove 512.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 8, an embodiment of the present invention provides a chip mounting device for processing an integrated circuit board, including a moving device 1, a dust removing device 2, a dispensing device 3, a chip mounting device 5, and a chip discharging device 4, where the moving device 1 is horizontally disposed on the ground, the dust removing device 2 is vertically disposed on the top of the moving device 1, the dispensing device 3 is vertically disposed on the top of the moving device 1, the chip mounting device 5 is vertically disposed at a discharging end of the moving device 1, and the chip discharging device 4 is disposed at the bottom of the chip mounting device 5; the mobile device 1 is used for conveying the circuit board to other devices for processing, the dust removal device 2 is used for removing dust on the surface of the integrated circuit board, the glue dispensing device 3 is used for dispensing the integrated circuit board, the chip discharging device 4 is used for placing the chip on the surface of the integrated circuit board subjected to glue dispensing, and the chip mounting device 5 is used for pressing the integrated circuit board subjected to chip mounting.
The moving device 1 comprises a moving seat 11, a moving support plate 12, a moving motor 13, a moving belt pulley 15, two moving rotating rods 14 and two positioning plates 16, the movable seat 11 is horizontally arranged on the ground, the movable support plate 12 is horizontally arranged on the side wall of the movable seat 11, the moving motor 13 is horizontally arranged on the top of the moving support plate 12, the main shaft of the moving motor 13 penetrates through the side wall of the moving seat 11, the two moving rotating rods 14 are symmetrically arranged on the inner side of the moving seat 11, wherein, both ends of one movable rotating rod 14 are in running fit with the movable seat 11, one end of the other movable rotating rod 14 is fixedly connected with the main shaft of the movable motor 13, the other end of the other movable rotating rod 14 is in running fit with the movable seat 11, the movable belt pulley 15 is sleeved on the two movable rotating rods 14, and the two positioning plates 16 are symmetrically arranged on the inner side wall of the movable seat 11; remove seat 11 and support removal backup pad 12, removal backup pad 12 supports removal motor 13, removal motor 13 work drives another removal dwang 14 and rotates, another removal dwang 14 rotates and drives removal belt pulley 15 and rotate, removal belt pulley 15 rotates one of them removal dwang 14 and rotates, two cooperation that remove dwang 14 drive removal belt pulley 15 better removal is to the better transport effect of integrated circuit board, 16 symmetries of locating plate set up and form a mouth on removing seat 11, carry to remove device 1 and come integrated circuit board and put to paster device 5 in proper order, the better processes integrated circuit board.
The dust removal device 2 comprises a dust removal support frame 21, a dust removal support plate 22, a dust removal air pump 23, a dust removal air inlet pipe 24 and a dust removal air outlet pipe 25, the dust removal support frame 21 is vertically arranged at the top of the movable seat 11, the dust removal support plate 22 is horizontally arranged on the side wall of the movable seat 11, the dust removal air pump 23 is horizontally arranged at the top of the dust removal support plate 22, the dust removal air inlet pipe 24 is horizontally arranged on the dust removal air pump 23 and penetrates through the dust removal air pump 23, the dust removal air outlet pipe 25 is horizontally arranged on the inner side of the dust removal support frame 21, one end of the dust removal air outlet pipe 25 penetrates through the dust removal support frame 21, one end of the dust removal air outlet pipe 25; the dust removal air pump 23 is supported by the dust removal supporting plate 22, the dust removal air pump 23 works to drive the dust removal air inlet pipe 24 to suck air, the dust removal air inlet pipe 24 conveys air to the dust removal air outlet pipe 25, the dust removal air outlet pipe 25 blows the air out of the air outlets 26, the air outlets 26 blow the air to the integrated circuit board, and dust on the integrated circuit board is blown off.
The glue dispensing device 3 comprises a rotating component 31 and a glue dispensing component 32, wherein the rotating component 31 is vertically arranged at the top of a movable seat 11, the glue dispensing component 32 is horizontally arranged at the bottom of the rotating component 31, the rotating component 31 is provided with a glue dispensing support frame 311, a glue dispensing motor 312, a glue dispensing support rod 314, a glue dispensing rotating pipe 315, a glue dispensing fixing rod 316 and two glue dispensing rotating blocks 313, the glue dispensing support frame 311 is vertically arranged at the top of the movable seat 11, the glue dispensing motor 312 is horizontally arranged on the side wall of the glue dispensing support frame 311, a main shaft of the glue dispensing motor 312 penetrates through the glue dispensing support frame 311, the two glue dispensing rotating blocks 313 are symmetrically arranged on the inner side wall of the glue dispensing support frame 311, one glue dispensing rotating block 313 is in rotating fit with the glue dispensing support frame 311, the other glue dispensing rotating block 313 is fixedly connected with the main shaft of the glue dispensing motor 312, the dispensing rotary tube 315 is sleeved on the dispensing support rod 314, and the dispensing fixing rod 316 is vertically arranged at the bottom of the dispensing rotary tube 315; the dispensing support frame 311 supports the dispensing motor 312, the dispensing motor 312 operates to drive the other dispensing rotating block 313 to rotate, the other dispensing rotating block 313 rotates to drive the dispensing support rod 314 to rotate, the dispensing support rod 314 rotates to drive the dispensing rotating tube 315 to move, the dispensing rotating tube 315 moves to drive the dispensing fixing rod 316 to move, and the dispensing fixing rod 316 moves to drive the dispensing assembly 32 to move.
The dispensing assembly 32 comprises a dispensing box 321, a glue inlet pipe 322, a plurality of glue outlet pipes 323 and a plurality of glue outlet beads 324, wherein the dispensing box 321 is horizontally arranged at the bottom of the dispensing fixing rod 316, the glue inlet pipe 322 is arranged at the top of the dispensing box 321, the plurality of glue outlet pipes 323 are vertically arranged at the bottom of the dispensing box 321, and the plurality of glue outlet beads 324 are arranged at the inner sides of the plurality of glue outlet pipes 323 and are in sliding fit with the plurality of glue outlet pipes 323; the dispensing fixing rod 316 moves to drive the dispensing box 321 to move, the dispensing box 321 moves to drive the glue inlet pipe 322, the glue outlet pipes 323 and the glue outlet beads 324 to move, the glue inlet pipe 322 flows glue into the dispensing box 321, the dispensing box 321 inputs glue into the glue outlet pipes 323, when the glue outlet beads 324 touch the integrated circuit board, the glue outlet beads 324 move upwards, and the glue outlet pipes 323 drip onto the integrated circuit board.
The film discharging device 4 comprises a film discharging support frame 41, a film discharging box 42, a film discharging support plate 44, a film discharging motor 45, a film discharging rotating gear 46, a film discharging matching gear 47 and a film discharging threaded rod 48, wherein the film discharging support plate 44 is horizontally arranged on the surface mounting device 5, the film discharging box 42 is vertically arranged on the film discharging support frame 41, a film discharging hole 43 is arranged in the film discharging box 42, the film discharging support plate 44 is horizontally arranged on the side wall of the film discharging box 42, the film discharging motor 45 is horizontally arranged on the film discharging support plate 44, the film discharging rotating gear 46 is vertically arranged on a main shaft of the film discharging motor 45, the film discharging matching gear 47 is vertically arranged on the film discharging box 42, the film discharging matching gear 47 is in running fit with the film discharging box 42, the film discharging rotating gear 46 is meshed with the film discharging matching gear 47, the film discharging gear 48 is horizontally arranged in the film discharging box 42, one end of the film discharging threaded rod 48 runs through the film discharging box 42, one end of the sheet-out threaded rod 48 penetrates through the sheet-out matching gear 47, and the sheet-out threaded rod 48 is meshed with the sheet-out matching gear 47; go out piece support frame 41 and support play piece box 42, it supports play piece backup pad 44 to go out piece box 42, the manual work is put the paster in business turn over piece hole 43, it supports play piece motor 45 to go out piece backup pad 44, it drives out piece rotating gear 46 and rotates to go out the work of piece motor 45, it rotates to drive out piece cooperation gear 47 to go out piece rotating gear 46, it rotates and drives out piece threaded rod 48 to go out piece cooperation gear 47, carry out a blowing to the paster and carry out the piece effect of putting in proper order to integrated circuit, make things convenient for paster device 5 to press according to reality to the paster on the integrated circuit board.
The paster device 5 comprises a paster support seat 51, a paster support plate 52, a paster support frame 53, a paster cylinder 54, a paster ring 55, a paster motor 56, a paster rotating rod 57, a paster rotating gear 58, a circular gear plate 510, a rotating disc 511 and two paster matching gears 59, wherein the paster support seat 51 is vertically arranged at the discharge end of the mobile device 1, the paster support plate 52 is vertically arranged on the side wall of the paster support seat 51, the paster support frame 53 is horizontally arranged on the side wall of the paster support plate 52, the paster cylinder 54 is vertically arranged at the bottom of the paster support frame 53, the paster ring 55 is horizontally arranged on the main shaft of the paster cylinder 54, the paster motor 56 is vertically arranged at the top of the paster support frame 53, the main shaft of the paster motor 56 penetrates through the paster support frame 53, one end of the paster rotating rod 57 is arranged on the main shaft of the paster motor 56, the other end of the patch rotating rod 57 is in running fit with the patch supporting seat 51, the patch rotating gear 58 is horizontally arranged on the inner side of the patch supporting seat 51 and is fixedly connected with the patch rotating rod 57, the two patch matching gears 59 are symmetrically arranged in the patch supporting seat 51, the two patch matching gears 59 are in running fit with the patch supporting seat 51, the patch rotating gear 58 is meshed with the two patch matching gears 59, the circular gear plate 510 is horizontally arranged in the patch supporting seat 51, the circular gear plate 510 is in running fit with the patch supporting seat 51, the two patch matching gears 59 are meshed with the circular gear plate 510, the rotating disc 511 is horizontally arranged at the top of the circular gear plate 510, and the rotating disc 511 is provided with a plurality of feeding grooves 512; paster support frame 53 carries out a supporting role to going out piece support frame 41, paster motor 56 work drives, paster dwang 57 rotates and drives paster bull gear 58 and rotates, paster bull gear 58 rotates and drives two paster cooperation gears 59 and rotate, two paster bull gear 58 rotate and drive circular gear board 510 and rotate, circular gear board 510 rotates and drives rolling disc 511 and rotate, rolling disc 511 rotates and drives pan feeding groove 512 and rotate, pan feeding groove 512 rotates and drives integrated circuit board and carry to the bottom of paster cylinder 54, paster cylinder 54 work drives paster ring 55 and removes the paster of putting 4 placing on integrated circuit board, carry out the problem of preventing the easy dropping of later stage paster according to reality.
The working principle of the invention is as follows: when the integrated circuit board processing device is used, the mobile device 1 conveys a circuit board to other devices for processing, the dust removal device 2 removes dust on the surface of the integrated circuit board, the glue dispensing device 3 dispenses the integrated circuit board, the chip discharging device 4 discharges the chip on the glued surface of the integrated circuit board, the chip mounting device 5 presses the integrated circuit board after the chip mounting, the mobile seat 11 supports the mobile support plate 12, the mobile support plate 12 supports the mobile motor 13, the mobile motor 13 works to drive the other mobile rotating rod 14 to rotate, the other mobile rotating rod 14 rotates to drive the mobile belt pulley 15 to rotate, the mobile belt pulley 15 rotates one of the mobile rotating rods 14, the two mobile rotating rods 14 are matched to drive the mobile belt pulley 15 to better move to better convey the integrated circuit board, and the positioning plates 16 are symmetrically arranged on the mobile seat 11 to form a port, the integrated circuit board is sequentially placed on the chip mounting device 5 by conveying the moving device 1, the integrated circuit board is better processed, the dedusting air pump 23 is supported by the dedusting support plate 22, the dedusting air pump 23 works to drive the dedusting air inlet pipe 24 to suck air, the dedusting air inlet pipe 24 conveys air into the dedusting air outlet pipe 25, the dedusting air outlet pipe 25 blows air out of a plurality of air outlet holes 26, the air is blown onto the integrated circuit board by the air outlet holes 26 to blow off dust on the integrated circuit board, the adhesive dispensing support frame 311 supports the adhesive dispensing motor 312, the adhesive dispensing motor 312 works to drive the other adhesive dispensing rotating block 313 to rotate, the other adhesive dispensing rotating block 313 rotates to drive the adhesive dispensing support rod 314 to rotate, the adhesive dispensing rotating pipe 315 rotates to drive the adhesive dispensing rotating pipe 315 to move, and the adhesive dispensing rotating pipe 315 moves to drive the fixed rod 316 to move, the glue fixing rod 316 moves to drive the glue dispensing assembly 32 to move, the glue fixing rod moves to drive the glue dispensing box 321 to move, the glue dispensing box 321 moves to drive the glue inlet pipe 322, the glue outlet pipes 323 and the glue outlet balls 324 to move, the glue inlet pipe 322 flows glue into the glue dispensing box 321, the glue dispensing box 321 inputs glue into the glue outlet pipes 323, when the glue outlet balls 324 touch the integrated circuit board, the glue outlet balls 324 move upwards, the glue outlet pipes 323 drip onto the integrated circuit board, the glue outlet box 42 supports the glue outlet support plate 44, the glue is manually put into the glue outlet pipe hole 43, the glue outlet support plate 44 supports the glue outlet motor 45, the work of the glue outlet motor 45 drives the glue outlet rotating gear 46 to rotate, the glue outlet rotating gear 46 rotates to drive the glue outlet matching gear 47 to rotate, the glue outlet matching gear 47 drives the glue outlet threaded rod 48, one-by-one-time placing of the glue is carried out to the integrated circuit in sequence, make things convenient for paster device 5 to press the reality to the paster on the integrated circuit board, paster support frame 53 carries out a supporting role to going out piece support frame 41, paster motor 56 work drives, paster dwang 57 rotates and drives paster slewing gear 58 and rotates, paster slewing gear 58 rotates and drives two paster cooperation gears 59 and rotate, two paster slewing gear 58 rotate and drive circular gear board 510 and rotate, circular gear board 510 rotates and drives rolling disc 511 and rotate, rolling disc 511 rotates and drives pan feeding groove 512 and rotate, pan feeding groove 512 rotates and drives the integrated circuit board and carry to the bottom of paster cylinder 54, paster cylinder 54 work drives paster ring 55 and removes the paster of putting 4 on the integrated circuit board, carry out the problem that prevents the later stage paster from dropping easily according to reality.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (7)

1. The utility model provides a paster device is used in integrated circuit board processing, its characterized in that, includes mobile device (1), dust collector (2), adhesive deposite device (3), paster device (5) and goes out piece device (4), mobile device (1) level sets up on ground, the vertical top that sets up at mobile device (1) of dust collector (2), the vertical top that sets up at mobile device (1) of adhesive deposite device (3), the vertical discharge end that sets up at mobile device (1) of paster device (5), it sets up the bottom at paster device (5) to go out piece device (4).
2. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the moving device (1) comprises a moving seat (11), a moving support plate (12), a moving motor (13), a moving belt pulley (15), two moving rotating rods (14) and two positioning plates (16), wherein the moving seat (11) is horizontally arranged on the ground, the moving support plate (12) is horizontally arranged on the side wall of the moving seat (11), the moving motor (13) is horizontally arranged at the top of the moving support plate (12), a main shaft of the moving motor (13) penetrates through the side wall of the moving seat (11), the two moving rotating rods (14) are symmetrically arranged on the inner side of the moving seat (11), one of the two ends of the moving rotating rod (14) is in running fit with the moving seat (11), the other end of the moving rotating rod (14) is fixedly connected with the main shaft of the moving motor (13), the other end of the moving rotating rod (14) is in running fit with the moving seat (11), the movable belt pulley (15) is sleeved on the two movable rotating rods (14), and the two positioning plates (16) are symmetrically arranged on the inner side wall of the movable seat (11).
3. A chip mounting apparatus for integrated circuit board fabrication according to claim 2, wherein: the dust removing device (2) comprises a dust removing support frame (21), a dust removing support plate (22), a dust removing air pump (23), a dust removing air inlet pipe (24) and a dust removing air outlet pipe (25), the dust removal support frame (21) is vertically arranged at the top of the movable seat (11), the dust removal support plate (22) is horizontally arranged on the side wall of the movable seat (11), the dust removal air pump (23) is horizontally arranged at the top of the dust removal supporting plate (22), the dust-removing air inlet pipe (24) is horizontally arranged on the dust-removing air pump (23) and penetrates through the dust-removing air pump (23), the dust-removing air outlet pipe (25) is horizontally arranged at the inner side of the dust-removing support frame (21), one end of the dust-removing air outlet pipe (25) penetrates through the dust-removing supporting frame (21), one end of the dust-removing air outlet pipe (25) is fixedly connected with the dust-removing air inlet pipe (24), the bottom of the dust removal air outlet pipe (25) is provided with a plurality of air outlet holes (26).
4. A chip mounting apparatus for integrated circuit board fabrication according to claim 2, wherein: the glue dispensing device (3) comprises a rotating component (31) and a glue dispensing component (32), wherein the rotating component (31) is vertically arranged at the top of the movable seat (11), the glue dispensing component (32) is horizontally arranged at the bottom of the rotating component (31), the rotating component (31) is provided with a glue dispensing support frame (311), a glue dispensing motor (312), a glue dispensing support rod (314), a glue dispensing rotating pipe (315), a glue dispensing fixed rod (316) and two glue dispensing rotating blocks (313), the glue dispensing support frame (311) is vertically arranged at the top of the movable seat (11), the glue dispensing motor (312) is horizontally arranged on the side wall of the glue dispensing support frame (311), a main shaft of the glue dispensing motor (312) penetrates through the glue dispensing support frame (311), the two glue dispensing rotating blocks (313) are symmetrically arranged on the inner side wall of the glue dispensing support frame (311), one of the glue dispensing rotating blocks (313) is in rotating fit with the glue dispensing, the other glue dispensing rotating block (313) is fixedly connected with a main shaft of the glue dispensing motor (312), the glue dispensing supporting rod (314) is horizontally arranged on the inner sides of the two glue dispensing rotating blocks (313), the glue dispensing rotating pipe (315) is sleeved on the glue dispensing supporting rod (314), and the glue dispensing fixing rod (316) is vertically arranged at the bottom of the glue dispensing rotating pipe (315).
5. A chip mounting device for processing an integrated circuit board according to claim 4, wherein: glue dispensing assembly (32) including some glue box (321), advance rubber tube (322), a plurality of play rubber tube (323) and a plurality of play rubber pearl (324), some glue box (321) level setting is in the bottom of some gluing fixed rod (316), it sets up the top of some glue box (321) to advance rubber tube (322), and is a plurality of the vertical setting of rubber tube (323) is in the bottom of some glue box (321), and is a plurality of go out rubber pearl (324) set up in the inboard of a plurality of rubber tube (323) and if rubber tube (323) sliding fit.
6. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the film discharging device (4) comprises a film discharging support frame (41), a film discharging box (42), a film discharging support plate (44), a film discharging motor (45), a film discharging rotating gear (46), a film discharging matching gear (47) and a film discharging threaded rod (48), wherein the film discharging support plate (44) is horizontally arranged on the surface mounting device (5), the film discharging box (42) is vertically arranged on the film discharging support frame (41), a film discharging hole (43) is arranged in the film discharging box (42), the film discharging support plate (44) is horizontally arranged on the side wall of the film discharging box (42), the film discharging motor (45) is horizontally arranged on the film discharging support plate (44), the film discharging rotating gear (46) is vertically arranged on a main shaft of the film discharging motor (45), the film discharging matching gear (47) is vertically arranged on the film discharging box (42), and the film discharging matching gear (47) is in running fit with the film discharging box (42), go out piece running gear (46) and play piece cooperation gear (47) meshing, play piece threaded rod (48) level sets up in a piece case (42), the one end of going out piece threaded rod (48) runs through a piece case (42), the one end of going out piece threaded rod (48) link up a piece cooperation gear (47), go out piece threaded rod (48) and a piece cooperation gear (47) meshing.
7. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the paster device (5) comprises a paster support seat (51), a paster support plate (52), a paster support frame (53), a paster cylinder (54), a paster ring (55), a paster motor (56), a paster rotating rod (57), a paster rotating gear (58), a circular gear plate (510), a rotating disc (511) and two paster matching gears (59), wherein the paster support seat (51) is vertically arranged at the discharge end of the mobile device (1), the paster support plate (52) is vertically arranged on the side wall of the paster support seat (51), the paster support frame (53) is horizontally arranged on the side wall of the paster support plate (52), the paster cylinder (54) is vertically arranged at the bottom of the paster support frame (53), the paster ring (55) is horizontally arranged on the main shaft of the paster cylinder (54), the paster motor (56) is vertically arranged at the top of the paster support frame (53), the main shaft of paster motor (56) link up paster support frame (53), the one end setting of paster dwang (57) is on the main shaft of paster motor (56), the other end and the paster supporting seat (51) normal running fit of paster dwang (57), paster slewing gear (58) level set up in the inboard of paster supporting seat (51) and with paster dwang (57) fixed connection, two paster cooperation gear (59) symmetry sets up in paster supporting seat (51), two paster cooperation gear (59) and paster supporting seat (51) normal running fit, paster slewing gear (58) and two paster cooperation gears (59) meshing, circular gear board (510) level sets up in paster supporting seat (51), circular gear board (510) and paster (51) normal running fit, two paster cooperation gear (59) and circular gear board (510) meshing, the rotary disc (511) is horizontally arranged at the top of the circular gear plate (510), and a plurality of feeding grooves (512) are formed in the rotary disc (511).
CN202011579220.6A 2020-12-28 2020-12-28 Paster device is used in integrated circuit board processing Withdrawn CN112689397A (en)

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Publication number Priority date Publication date Assignee Title
CN113976543A (en) * 2021-10-27 2022-01-28 炬为微电子(上海)有限公司 Automatic paster device based on integrated circuit design usefulness

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CN209017395U (en) * 2018-08-31 2019-06-21 河源市瑞达自动化设备有限公司 A kind of automatic placement machine feeding device
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CN111341702A (en) * 2020-03-20 2020-06-26 郭东东 Manufacturing method of integrated circuit board
CN112040667A (en) * 2020-09-06 2020-12-04 刘德远 Paster device for integrated circuit processing

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US20120145013A1 (en) * 2010-12-08 2012-06-14 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
CN108770231A (en) * 2018-08-06 2018-11-06 张家港市欧微自动化研发有限公司 A kind of PCB patches spot gluing equipment
CN209017395U (en) * 2018-08-31 2019-06-21 河源市瑞达自动化设备有限公司 A kind of automatic placement machine feeding device
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Application publication date: 20210420