CN111341702A - Manufacturing method of integrated circuit board - Google Patents
Manufacturing method of integrated circuit board Download PDFInfo
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- CN111341702A CN111341702A CN202010201695.5A CN202010201695A CN111341702A CN 111341702 A CN111341702 A CN 111341702A CN 202010201695 A CN202010201695 A CN 202010201695A CN 111341702 A CN111341702 A CN 111341702A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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Abstract
The invention belongs to the technical field of integrated circuit boards, and particularly relates to a manufacturing method of an integrated circuit board, which is completed by matching an integrated circuit board manufacturing and processing device aiming at dispensing on the surface of the circuit board, and specifically comprises the following steps: step one, placing an integrated circuit board: stacking the integrated circuit board on the upper surface of the bearing plate; step two, dispensing the integrated circuit board: the positions of the electric sliding block and the mounting block are adjusted to align the glue outlet with the position to be glued on the integrated circuit board; the rubber plug is driven to move upwards by the reciprocating rotating motor, and the silica gel in the dispensing head flows out of the glue outlet and drops onto the integrated circuit board on the uppermost layer; step three, moving out the integrated circuit board: and pushing the integrated circuit board on the uppermost layer out of the accommodating cavity by a material pushing mechanism. When the integrated circuit board manufacturing method provided by the invention is used for dispensing the surface of the integrated circuit board, the dispensing amount and the dispensing position can be accurately controlled.
Description
Technical Field
The invention belongs to the technical field of integrated circuit boards, and particularly relates to a manufacturing method of an integrated circuit board.
Background
The integrated circuit board is made by using semiconductor manufacturing process, and many transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by multilayer wiring or tunnel wiring. The chip component on the integrated circuit board is usually adhered and fixed by silica gel, and when the glue is dispensed on the surface of the integrated circuit board, the glue is dispensed on the surface of the integrated circuit board by holding a glue gun by an operator at present. In the actual production process, this method has the following problems: (1) the glue dispensing amount of each time is difficult to accurately control by manual glue dispensing, so that the glue amount is easy to be too much or too little, and the condition that the silica gel overflows the edge of the patch element or the patch element is not firmly adhered is caused; (2) the position is glued to the difficult accurate control point of artifical point of going on, and the thickness on silica gel layer is inhomogeneous after the paster component pastes on the circuit board, leads to the paster component can't keep parallel with integrated circuit board surface, has reduced paster component's the effect of pasting.
Disclosure of Invention
Technical problem to be solved
The invention provides a manufacturing method of an integrated circuit board, aiming at solving the following problems existing in the prior art when the surface of the integrated circuit board is glued manually: (1) the glue dispensing amount of each time is difficult to accurately control by manual glue dispensing, so that the more or less glue dispensing amount is easy to cause the condition that the silica gel overflows the edge of the patch element or the patch element is not firmly adhered; (2) the position is glued to the difficult accurate control point of artifical point of going on, and the thickness on silica gel layer is inhomogeneous after the paster component pastes on the circuit board, leads to the paster component can't keep parallel with integrated circuit board surface, has reduced paster component's the effect of pasting.
(II) technical scheme
In order to solve the technical problems, the invention adopts the following technical scheme:
a manufacturing method of an integrated circuit board is used for dispensing on the surface of the circuit board and is completed by matching an integrated circuit board manufacturing and processing device, wherein the integrated circuit board manufacturing and processing device comprises a base, the top surface of the base is in a horizontal state, and supporting legs are vertically and fixedly installed on the bottom surface of the base. Two mutually parallel spouts have been seted up to the upper surface of base, and sliding fit has electronic slider in the spout, and the vertical fixed mounting in top of electronic slider has the support column, and horizontal fixed mounting has the guide bar between the support column.
The guide bar is provided with a mounting block in a sliding manner, the upper surface and the lower surface of the mounting block are horizontal, and the lower surface of the mounting block is fixedly provided with a dispensing head. The horizontal position of the dispensing head can be adjusted by adjusting the positions of the electric sliding block and the mounting block, so that the dispensing head can be positioned right above the position to be dispensed of the circuit board, and the horizontal position of the dispensing head can be ensured not to be changed in the dispensing process. The upper surface of the mounting block is vertically and rotatably provided with a screw rod at the position corresponding to the dispensing head. The top end of the screw rod is vertically and fixedly provided with a gear column coaxial with the screw rod. The surface fixed mounting has the motor cabinet on the installation piece, and the vertical fixed mounting in motor cabinet top has reciprocal rotating electrical machines, and the output shaft of reciprocal rotating electrical machines runs through the motor cabinet and fixed mounting has the gear with gear post intermeshing. The bottom end of the screw rod is vertically and rotatably provided with a rigid straight rod coaxial with the screw rod, and the bottom end of the rigid straight rod is fixedly provided with a rubber plug. The inside vacuole formation of dispensing head and bottom are seted up and are glued the mouth with the play of rubber buffer mutually supporting, have seted up on the lateral wall of dispensing head and have advanced gluey mouth, advance gluey mouth tip and install sealed lid through the screw thread. Before the circuit board is glued, silica gel is filled into the glue dispensing head through the glue inlet, and the cavity in the glue dispensing head is sealed through the sealing cover. The gear is driven to rotate in the forward direction through the forward rotation of the reciprocating rotating motor, so that the gear column is driven to rotate in the forward direction; because gear post and screw rod fixed connection, the gear post drives the screw rod forward rotation when forward rotation, and screw rod and gear post rise in step. The screw rod rises and drives the rigid straight rod and the rubber plug to rise simultaneously, and the rubber plug no longer plays the sealed effect to the mouth that goes out, and silica gel drops downwards from going out the mouth outflow of glue. The gear is driven to rotate reversely through the reverse rotation of the reciprocating rotating motor, so that the rubber plug is driven to descend until the rubber outlet is sealed again, and the silica gel does not flow out from the rubber outlet. The glue outlet amount of each time of the glue outlet can be accurately controlled by controlling the speed and time of each rotation of the reciprocating rotary motor, so that the glue dispensing amount is accurately controlled.
The upper surface of base has been seted up and has been held the chamber, holds the vertical sliding fit of chamber bottom surface and has the erection column, and the horizontal fixed mounting in erection column top has and holds chamber lateral wall sliding fit's bearing board, and the vertical fixed mounting in both sides edge of bearing board has the baffle. The upper surface of the base is positioned on the guide plates which are fixedly arranged on two sides of the accommodating cavity in a vertical mode and are parallel to the baffle, and the tops of the guide plates are fixedly provided with limiting pieces horizontally through torsion springs. A first return spring is vertically arranged between the lower surface of the bearing plate and the bottom surface of the containing cavity. The upper surface of the base is provided with a material pushing mechanism, an oil cavity communicated with the accommodating cavity and the material pushing mechanism is arranged in the base, the horizontal top end of the bottom end of the oil cavity is vertical, and the mounting column is in sliding fit with the bottom end of the oil cavity. A plurality of integrated circuit boards are stacked together, so that the edge of the circuit board is aligned with the baffle plate and placed on the upper surface of the bearing plate, the first reset spring contracts under the action of the gravity of the circuit board and the bearing plate, and the uppermost layer circuit board is abutted to the lower surface of the limiting piece under the action of the elastic force of the first reset spring, so that the circuit board is ensured to be in a horizontal state. And in the process that the bearing plate moves downwards to compress the first return spring, the mounting column slides downwards in the bottom end of the oil cavity.
The manufacturing method of the integrated circuit board comprises the following steps:
step one, placing an integrated circuit board: and pushing the bearing plate downwards to align and stack the edges of the integrated circuit boards and the baffle plates to the upper surface of the bearing plate, so that the upper surface of the integrated circuit board on the uppermost layer is abutted to the lower surface of the limiting piece.
Step two, dispensing the integrated circuit board: the positions of the electric sliding block and the mounting block are adjusted to enable the glue outlet and the positions of the integrated circuit board to be subjected to glue dispensing to be aligned. The rubber stopper is driven to move upwards through the forward rotation of the reciprocating rotating motor, and the silica gel in the dispensing head flows out from the glue outlet and drips onto the integrated circuit board on the uppermost layer. The reciprocating rotating motor rotates reversely to drive the rubber plug to move downwards to block the rubber outlet to stop dispensing.
Step three, moving out the integrated circuit board: after dispensing of the integrated circuit board on the uppermost layer is completed, the integrated circuit board on the uppermost layer is pushed out of the accommodating cavity through the material pushing mechanism, so that the integrated circuit board on the uppermost layer slides into a position between the two guide plates on the top surface of the base, and then the integrated circuit board is manually taken out.
As a preferred technical scheme of the invention, in the integrated circuit board manufacturing and processing device, the material pushing mechanism comprises a limiting sleeve, a push rod, a rubber plate, a second return spring, a rack, a rotating motor, an incomplete gear, a connecting rod and a sealing block. The stop collar is installed to the base top surface, and horizontal slidable mounting has the push rod that is on a parallel with the deflector in the stop collar, and the horizontal fixed mounting in push rod outer end has the rubber slab of perpendicular to baffle. And a second return spring is arranged between the rubber plate and the limiting sleeve. The inner end of the push rod is horizontally and fixedly provided with a rack parallel to the push rod, the top surface of the base is horizontally and fixedly provided with a rotating motor, and an output shaft of the rotating motor is fixedly provided with an incomplete gear meshed with the rack. The bottom of the push rod is fixedly provided with a sealing block which is in horizontal sliding fit with the oil cavity through a vertical connecting rod. The glue dispensing head carries out the point on integrated circuit board surface and glues the in-process, and rotating electrical machines is in the rotation state, and after the completion was glued to the point glue head point, incomplete gear and rack break away from the meshing state, through second reset spring's spring action promotion rubber slab and push rod to circuit board edge quick travel, the rubber slab is strikeed to the circuit board edge after with the circuit board release hold the chamber, the circuit board gets into the position between two deflectors of base upper surface. In the process that the push rod moves towards the edge of the circuit board quickly, the connecting rod drives the sealing block to move quickly in the oil cavity, oil in the oil cavity flows under the action of air pressure and drives the mounting column to move downwards for a short distance, so that the bearing plate and the circuit board on the bearing plate are driven to move downwards for a short distance; so that the uppermost circuit board does not make contact with the lower circuit board during the horizontal movement. After the rotating motor continues to rotate to drive the incomplete gear and the rack to enter a meshing state, the incomplete gear drives the rack, the push rod and the rubber plate to horizontally move, and the rubber plate compresses the second return spring. Meanwhile, the push rod drives the sealing block to move and restore to the initial position in the oil cavity through the connecting rod, and oil in the oil cavity pushes the mounting column to move upwards after being extruded by the sealing block; the supporting plate pushes the circuit board against the lower surface of the limiting sheet under the elastic force action of the first return spring.
As a preferred technical scheme of the invention, in the circuit board manufacturing and processing device, an air channel is formed in a base, one end of the air channel is communicated with an oil cavity on one side of a sealing block close to a rubber plate, and the other end of the air channel is communicated with the upper surface of the base. The air channel can ensure that the air pressure in the oil cavity at one side of the sealing block close to the rubber plate is kept constant with the outside, so that the sealing block can freely slide in the oil cavity without being influenced by the air pressure.
According to the preferred technical scheme, in the integrated circuit board manufacturing and processing device, a hydraulic cylinder is vertically and fixedly mounted at the top of the dispensing head, a hydraulic rod is vertically and slidably mounted in the hydraulic cylinder, and a first sealing plate in sliding fit with the rigid straight rod and the inner side wall of the dispensing head is horizontally fixed at the bottom of the hydraulic rod. The lateral wall of the hydraulic cylinder is provided with a through hole, and the rigid straight rod is horizontally and fixedly provided with a second sealing plate which is in sliding fit with the outer lateral wall of the hydraulic cylinder and the inner lateral wall of the glue dispensing head. And hydraulic oil is filled above the second sealing plate in the dispensing head. The rigid straight rod drives the second sealing plate to move upwards in the upward movement process, the second sealing plate presses hydraulic oil into the hydraulic cylinder through the through hole, the hydraulic oil enters the hydraulic cylinder and pushes the hydraulic rod to move downwards, the hydraulic rod moves downwards to drive the first sealing plate to move downwards, and therefore pressure is applied to silica gel in the dispensing head, and the silica gel is pressed out of the glue outlet; the glue outlet can be ensured to have the same glue outlet amount every time only by ensuring that the distance of the rigid straight rod moving upwards every time is constant. In the downward movement process of the rigid straight rod, the second sealing plate is driven to move downwards, hydraulic oil in the hydraulic cylinder flows out of the hydraulic cylinder under the action of air pressure, and meanwhile, the hydraulic rod and the first sealing plate move upwards under the action of air pressure. In the process that the first sealing plate moves upwards, the external air pressure is greater than the air pressure in the dispensing head, so that the air pressure can press the silica gel sagging near the glue outlet back into the dispensing head, and the silica gel sagging near the glue outlet in the process that the rubber plug moves downwards to seal the glue outlet is prevented from dripping, so that the precision of the glue injection amount is improved.
As a preferred technical scheme of the invention, in the integrated circuit board manufacturing and processing device, a plurality of groups of conveying rollers vertical to the guide plates are horizontally and rotatably arranged between the guide plates, so that the friction force of the integrated circuit board in the moving process after being sent out of the accommodating cavity by the material pushing mechanism is reduced, and the silica gel on the surface of the circuit board is prevented from generating free flow due to friction vibration.
As a preferred technical solution of the present invention, in the integrated circuit board manufacturing processing apparatus, a plurality of mounting blocks are slidably mounted on the guide bar, and the upper surface of the base is correspondingly provided with accommodating cavities having the same number as the mounting blocks. Through fixed bolster fixed connection between the installation piece to the realization is glued a plurality of circuit boards simultaneously, has improved the efficiency of processing.
As a preferred technical scheme of the invention, in the integrated circuit board manufacturing and processing device, a threaded sleeve parallel to the guide rod is horizontally and fixedly installed on the inner side of the support column, a threaded rod is rotatably installed in the threaded sleeve, and the end part of the threaded rod is in rotating fit with the side surface of the outermost side installation block. After the horizontal position of the installation block is adjusted, the position of the installation block is fixed by adjusting the extension length of the threaded rod in the threaded sleeve, so that the horizontal position of the installation block is prevented from deviating, and the accuracy of the glue injection position is improved.
(III) advantageous effects
The invention has at least the following beneficial effects:
(1) when the integrated circuit board manufacturing method provided by the invention is used for dispensing glue on the surface of the integrated circuit board, the integrated circuit board manufacturing and processing device is adopted to complete the dispensing. The rubber plug is driven to open and close the rubber outlet through the reciprocating rotating motor, and the time for opening the rubber outlet can be accurately controlled by controlling the rotating speed and time of the reciprocating rotating motor, so that the dispensing amount is accurately controlled.
(2) The flow velocity can receive self viscosity and the influence of point gum mouth department frictional force when silica gel free flow, can appear the condition that the volume of appearing gluing is different in the same time. In order to solve the above problems, in the dispensing process of the circuit board, the first sealing plate presses the silica gel out of the dispensing opening when the dispensing opening is opened, the pressure applied to the silica gel in each dispensing process is the same, and the flow rates of the silica gel tend to be consistent under the same pressure, so that the dispensing amount in each dispensing process is consistent, and the dispensing amount is controlled more accurately.
(3) According to the invention, the position of the electric sliding block and the mounting block is adjusted, the position of the dispensing head in the horizontal direction is accurately adjusted before dispensing, and the horizontal position of the dispensing head is not changed any more in the dispensing process, so that the precision of the dispensing position is ensured. After the dispensing of the circuit board on the uppermost layer is completed, the mounting columns drive the bearing plate to descend by a small distance in the process of pushing the circuit board out of the accommodating cavity through the pushing mechanism, so that a certain gap is formed between the circuit board on the uppermost layer and the circuit board on the lower layer, the situation that the circuit board on the lower layer is driven to generate horizontal displacement in the moving process of the circuit board on the uppermost layer is avoided, the horizontal position of the circuit board on the lower layer is ensured not to change, and the precision of the dispensing position.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a diagram illustrating steps in a method for fabricating an integrated circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of an apparatus for manufacturing and processing an integrated circuit board according to an embodiment of the present invention;
FIG. 3 is an enlarged view of an apparatus A for manufacturing and processing an IC board according to an embodiment of the present invention;
FIG. 4 is an enlarged view of an apparatus B for manufacturing and processing an IC board according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an internal structure of a dispensing head of the device for manufacturing and processing an integrated circuit board according to the embodiment of the present invention;
FIG. 6 is a schematic diagram of the internal structure of the base of the device for manufacturing and processing the integrated circuit board according to the embodiment of the present invention;
fig. 7 is an enlarged schematic view of the integrated circuit board manufacturing apparatus C according to the embodiment of the present invention.
In the figure: 1-base, 2-supporting leg, 3-chute, 4-electric slide block, 5-supporting column, 6-guide rod, 7-mounting block, 8-dispensing head, 9-screw, 10-gear column, 11-motor base, 12-reciprocating rotary motor, 13-gear, 14-rigid straight rod, 15-rubber plug, 16-glue outlet, 17-glue inlet, 18-sealing cover, 19-containing cavity, 20-mounting column, 21-bearing plate, 22-baffle, 23-guide plate, 24-spacing plate, 25-first return spring, 26-pushing mechanism, 261-spacing sleeve, 262-push rod, 263-rubber plate, 264-second return spring, 265-rack, 266-rotary motor, 267-incomplete gear, 268-connecting rod, 269-sealing block, 27-oil chamber, 28-air channel, 29-hydraulic cylinder, 30-hydraulic rod, 31-first sealing plate, 32-through hole, 33-second sealing plate, 34-conveying roller, 35-fixing bracket, 36-thread sleeve and 37-threaded rod.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As shown in fig. 2 to 7, the present embodiment provides an integrated circuit board manufacturing and processing device, which includes a base 1, wherein the top surface of the base 1 is horizontal, and the bottom surface is vertically and fixedly provided with supporting legs 2. Two mutually parallel spouts 3 have been seted up to base 1's upper surface, and 3 sliding fit in the spout has electronic slider 4, and the vertical fixed mounting in top of electronic slider 4 has support column 5, and horizontal fixed mounting has guide bar 6 between the support column 5.
The guide rod 6 is provided with a mounting block 7 in a sliding way, the upper surface and the lower surface of the mounting block 7 are horizontal, and the lower surface of the mounting block 7 is fixedly provided with a dispensing head 8. The horizontal position of the dispensing head 8 can be adjusted by adjusting the positions of the electric sliding block 4 and the mounting block 7, so that the dispensing head 8 can be positioned right above the position to be dispensed of the circuit board, and the horizontal position of the dispensing head 8 can be ensured not to be changed in the dispensing process. The upper surface of the mounting block 7 is vertically and rotatably provided with a screw 9 at a position corresponding to the dispensing head 8. The top end of the screw rod 9 is vertically and fixedly provided with a gear column 10 which is coaxial with the screw rod. The upper surface of the mounting block 7 is fixedly provided with a motor base 11, a reciprocating rotating motor 12 is vertically and fixedly mounted above the motor base 11, and an output shaft of the reciprocating rotating motor 12 penetrates through the motor base 11 and is fixedly provided with a gear 13 which is meshed with the gear column 10. The bottom end of the screw rod 9 is vertically and rotatably provided with a rigid straight rod 14 coaxial with the screw rod, and the bottom end of the rigid straight rod 14 is fixedly provided with a rubber plug 15. The inside cavity that forms of dispensing head 8 and bottom offer with rubber buffer 15 outlet 16 of mutually supporting, offer on dispensing head 8's the lateral wall and advance gluey mouth 17, advance gluey mouth 17 tip and install sealed lid 18 through the screw thread. Before the circuit board is glued, silica gel is filled into the glue dispensing head 8 through the glue inlet 17, and the cavity in the glue dispensing head 8 is sealed through the sealing cover 18. The reciprocating rotating motor 12 rotates forwards to drive the gear 13 to rotate forwards, so that the gear column 10 is driven to rotate forwards; because the gear post 10 and the screw 9 are fixedly connected, the screw 9 is driven to rotate forwardly while the gear post 10 rotates forwardly, and the screw 9 and the gear post 10 ascend synchronously. The screw 9 rises and simultaneously drives the rigid straight rod 14 and the rubber plug 15 to rise, the rubber plug 15 does not seal the rubber outlet 16 any more, and the silica gel flows out from the rubber outlet 16 and drops downwards. The reciprocating rotating motor 12 rotates reversely to drive the gear 13 to rotate reversely, so as to drive the rubber plug 15 to descend until the rubber outlet 16 is sealed again, and the silica gel does not flow out from the rubber outlet 16 any more. The glue discharging amount of the glue outlet 16 at each time can be accurately controlled by controlling the speed and time of each rotation of the reciprocating rotary motor 12, so that the glue dispensing amount is accurately controlled.
The upper surface of base 1 has been seted up and has been held chamber 19, holds the vertical sliding fit in 19 bottom surfaces in chamber and has a erection column 20, and the horizontal fixed mounting in erection column 20 top has and holds 19 lateral wall sliding fit's in chamber bearing board 21, and the vertical fixed mounting in both sides edge of bearing board 21 has baffle 22. The upper surface of the base 1 is vertically and fixedly provided with guide plates 23 parallel to the baffle 22 at two sides of the accommodating cavity 19, and the tops of the guide plates 23 are horizontally and fixedly provided with limiting pieces 24 through torsion springs. A first return spring 25 is vertically installed between the lower surface of the supporting plate 21 and the bottom surface of the accommodating cavity 19. The upper surface of the base 1 is provided with a pushing mechanism 26, an oil cavity 27 communicating the accommodating cavity 19 and the pushing mechanism 26 is arranged in the base 1, the horizontal top end of the bottom end of the oil cavity 27 is vertical, and the mounting column 20 is in sliding fit with the bottom end of the oil cavity 27. A plurality of integrated circuit boards are stacked together, the edge of the circuit board is aligned with the baffle plate 22 and placed on the upper surface of the supporting plate 21, the first return spring 25 contracts under the action of the gravity of the circuit board and the supporting plate 21, and the uppermost circuit board is abutted to the lower surface of the limiting plate 24 under the action of self elasticity, so that the circuit board is ensured to be in a horizontal state. During the downward movement of the support plate 21 compressing the first return spring 25, the mounting post 20 slides downward within the bottom end of the oil chamber 27.
In this embodiment, the pushing mechanism 26 includes a stop collar 261, a push rod 262, a rubber plate 263, a second return spring 264, a rack 265, a rotating motor 266, an incomplete gear 267, a connecting rod 268, and a sealing block 269. The top surface of the base 1 is provided with a limit sleeve 261, a push rod 262 parallel to the guide plate 23 is horizontally and movably arranged in the limit sleeve 261, and a rubber plate 263 perpendicular to the baffle 22 is horizontally and fixedly arranged at the outer end of the push rod 262. A second return spring 264 is installed between the rubber plate 263 and the stop collar 261. The inner end of the push rod 262 is horizontally and fixedly provided with a rack 265 parallel to the push rod, the top surface of the base 1 is horizontally and fixedly provided with a rotating motor 266, and an output shaft of the rotating motor 266 is fixedly provided with an incomplete gear 267 engaged with the rack 265. The bottom of the push rod 262 is fixedly provided with a sealing block 269 which is in horizontal sliding fit with the oil chamber 27 through a vertical connecting rod 268. The in-process is glued to the point to integrated circuit board surface that the head 8 glues, and rotating electrical machines 266 is in the rotation state, and after 8 point glues the completion of gluing of head, incomplete gear 267 and rack 265 break away from the meshing state, and the spring action through second reset spring 264 promotes rubber slab 263 and push rod 262 to circuit board edge fast movement, and rubber slab 263 pushes out the circuit board after striking the circuit board edge and holds chamber 19, and the circuit board gets into the position between two deflectors 23 of base 1 upper surface. In the process that the push rod 262 moves towards the edge of the circuit board quickly, the connecting rod 268 drives the sealing block 269 to move quickly in the oil chamber 27, oil in the oil chamber 27 is subjected to air pressure to flow, and the mounting post 20 is driven to move downwards for a short distance, so that the supporting plate 21 and the circuit board on the supporting plate 21 are driven to move downwards for a short distance; so that the uppermost circuit board does not make contact with the lower circuit board during the horizontal movement. After the rotating motor 266 continues to rotate to drive the incomplete gear 267 and the rack 265 to enter the engaged state, the incomplete gear 267 drives the rack 265, the push rod 262 and the rubber plate 263 to move horizontally, and the rubber plate 263 compresses the second return spring 264. Meanwhile, the push rod 262 drives the sealing block 269 to move back to the initial position in the oil chamber 27 through the connecting rod 268, and the oil in the oil chamber 27 is squeezed by the sealing block 269 to push the mounting post 20 to move upwards; the support plate 21 supports the circuit board against the lower surface of the position-limiting plate 24 under the elastic force of the first return spring 25.
In this embodiment, the base 1 has an air channel 28 formed therein, one end of the air channel 28 communicates with the oil chamber 27 on the side of the sealing block 269 close to the rubber plate 263, and the other end of the air channel 28 communicates with the upper surface of the base 1. The air passage 28 ensures that the air pressure and the outside of the oil chamber 27 on the side of the sealing block 269 adjacent to the rubber plate 263 are kept constant, thereby ensuring that the sealing block 269 can slide freely in the oil chamber 27 without being affected by the air pressure.
In this embodiment, a hydraulic cylinder 29 is vertically and fixedly mounted at the top of the dispensing head 8, a hydraulic rod 30 is vertically and slidably mounted in the hydraulic cylinder 29, and a first sealing plate 31 which is in sliding fit with the rigid straight rod 14 and the inner side wall of the dispensing head 8 is horizontally and fixedly arranged at the bottom of the hydraulic rod 30. The side wall of the hydraulic cylinder 29 is provided with a through hole 32, and the rigid straight rod 14 is horizontally and fixedly provided with a second sealing plate 33 which is in sliding fit with the outer side wall of the hydraulic cylinder 29 and the inner side wall of the dispensing head 8. The dispensing head 8 is filled with hydraulic oil above the second sealing plate 33. In the upward movement process of the rigid straight rod 14, the second sealing plate 33 is driven to move upward, the second sealing plate 33 presses hydraulic oil into the hydraulic cylinder 29 through the through hole 32, the hydraulic oil enters the hydraulic cylinder 29 and pushes the hydraulic rod 30 to move downward, and the hydraulic rod 30 moves downward to drive the first sealing plate 31 to move downward, so that pressure is applied to silica gel in the dispensing head 8, and the silica gel is pressed out of the glue outlet 16; the glue outlet 16 can ensure the same glue outlet amount each time only by ensuring that the distance of the rigid straight rod 14 moving upwards each time is constant. When the rigid straight rod 14 moves downwards, the second sealing plate 33 is driven to move downwards, hydraulic oil in the hydraulic cylinder 29 flows out of the hydraulic cylinder 29 under the action of air pressure, and meanwhile, the hydraulic rod 30 and the first sealing plate 31 move upwards under the action of air pressure. In the process that the first sealing plate 31 moves upwards, the external air pressure is greater than the air pressure in the dispensing head 8, so that the air pressure can press the silica gel hanging near the glue outlet 16 back into the dispensing head 8, and the silica gel hanging near the glue outlet 16 is prevented from dropping in the process that the rubber plug 15 moves downwards to seal the glue outlet 16, so that the precision of the glue injection amount is improved. A plurality of groups of conveying rollers 34 vertical to the guide plates 23 are horizontally and rotatably arranged between the guide plates 23 to reduce the friction force of the integrated circuit board in the moving process after the integrated circuit board is sent out of the accommodating cavity 19 by the material pushing mechanism 26, and avoid the silica gel on the surface of the circuit board from generating free flow due to friction vibration.
In this embodiment, three mounting blocks 7 are slidably mounted on the guide bar 6, and three accommodating cavities 19 are correspondingly formed on the upper surface of the base 1. The mounting blocks 7 are fixedly connected through the fixing support 35, so that the three circuit boards can be glued at the same time. A threaded sleeve 36 parallel to the guide rod 6 is horizontally and fixedly arranged on the inner side of the support column 5, a threaded rod 37 is rotatably arranged in the threaded sleeve 36, and the end part of the threaded rod 37 is in rotating fit with the side surface of the outermost mounting block 7. After the horizontal position of the mounting block 7 is adjusted, the position of the mounting block 7 is fixed by adjusting the extension length of the threaded rod 37 in the threaded sleeve 36, so that the horizontal position of the mounting block 7 is ensured not to deviate, and the accuracy of the glue injection position is improved.
As shown in fig. 1, the embodiment further provides a method for manufacturing an integrated circuit board, which is completed by using the integrated circuit board manufacturing and processing device, and specifically includes the following steps:
step one, placing an integrated circuit board: the supporting plate 21 is pushed downward to align the edge of the ic board with the baffle 22 and stack the ic board on the upper surface of the supporting plate 21, so that the upper surface of the uppermost ic board abuts against the lower surface of the position-limiting plate 24.
Step two, dispensing the integrated circuit board: the positions of the electric sliding block 4 and the mounting block 7 are adjusted to align the glue outlet 16 with the position of the integrated circuit board to be glued. The rubber stopper 15 is driven to move upwards by the forward rotation of the reciprocating rotary motor 12, and the silica gel in the dispensing head 8 flows out from the gel outlet 16 and drops on the integrated circuit board on the uppermost layer. The reciprocating rotary motor 12 rotates reversely to drive the rubber plug 15 to move downwards to block the rubber outlet 16 to stop dispensing.
Step three, moving out the integrated circuit board: after dispensing the top layer of the integrated circuit board, the top layer of the integrated circuit board is pushed out of the accommodating cavity 19 by the pushing mechanism 26, so that the top layer of the integrated circuit board slides into a position between the two guide plates 23 on the top surface of the base 1, and then the integrated circuit board is manually taken out.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A manufacturing method of an integrated circuit board is provided, which is used for dispensing on the surface of the circuit board and is characterized in that: the manufacturing method of the integrated circuit board is completed by matching an integrated circuit board manufacturing and processing device, wherein the integrated circuit board manufacturing and processing device comprises a base (1), the top surface of the base (1) is in a horizontal state, and supporting legs (2) are vertically and fixedly installed on the bottom surface of the base; the upper surface of the base (1) is provided with two parallel sliding chutes (3), the sliding chutes (3) are in sliding fit with an electric sliding block (4), the top of the electric sliding block (4) is vertically and fixedly provided with supporting columns (5), and guide rods (6) are horizontally and fixedly arranged between the supporting columns (5);
the guide rod (6) is provided with an installation block (7) in a sliding way, the upper surface and the lower surface of the installation block (7) are horizontal, and the lower surface of the installation block (7) is fixedly provided with a dispensing head (8); the upper surface of the mounting block (7) is vertically and rotatably provided with a screw (9) at a position corresponding to the dispensing head (8); a gear column (10) coaxial with the screw rod (9) is vertically and fixedly arranged at the top end of the screw rod; a motor base (11) is fixedly installed on the upper surface of the installation block (7), a reciprocating rotating motor (12) is vertically and fixedly installed above the motor base (11), and an output shaft of the reciprocating rotating motor (12) penetrates through the motor base (11) and is fixedly provided with a gear (13) which is meshed with the gear column (10); a rigid straight rod (14) coaxial with the screw rod (9) is vertically and rotatably arranged at the bottom end of the screw rod (9), and a rubber plug (15) is fixedly arranged at the bottom end of the rigid straight rod (14); a cavity is formed in the dispensing head (8), the bottom of the cavity is provided with a glue outlet (16) matched with the rubber plug (15), the side wall of the dispensing head (8) is provided with a glue inlet (17), and the end part of the glue inlet (17) is provided with a sealing cover (18) through threads;
an accommodating cavity (19) is formed in the upper surface of the base (1), a mounting column (20) is vertically and slidably matched with the bottom surface of the accommodating cavity (19), a bearing plate (21) which is slidably matched with the side wall of the accommodating cavity (19) is horizontally and fixedly mounted at the top of the mounting column (20), and baffles (22) are vertically and fixedly mounted at the edges of two sides of the bearing plate (21); guide plates (23) parallel to the baffle plate (22) are vertically and fixedly installed on the two sides of the accommodating cavity (19) on the upper surface of the base (1), and limiting pieces (24) are horizontally and fixedly installed at the tops of the guide plates (23) through torsion springs; a first return spring (25) is vertically arranged between the lower surface of the bearing plate (21) and the bottom surface of the accommodating cavity (19); the upper surface of the base (1) is provided with a material pushing mechanism (26), an oil cavity (27) communicated with the accommodating cavity (19) and the material pushing mechanism (26) is arranged in the base (1), the bottom end of the oil cavity (27) is horizontal, the top end of the oil cavity is vertical, and the mounting column (20) is in sliding fit with the bottom end of the oil cavity (27);
the manufacturing method of the integrated circuit board comprises the following steps:
step one, placing an integrated circuit board: pushing the supporting plate (21) downwards, aligning and stacking the edge of the integrated circuit board and the baffle plate (22) to the upper surface of the supporting plate (21), and enabling the upper surface of the integrated circuit board on the uppermost layer to abut against the lower surface of the limiting sheet (24);
step two, dispensing the integrated circuit board: the positions of the electric sliding block (4) and the mounting block (7) are adjusted to align the glue outlet (16) with the position of the integrated circuit board to be glued; the rubber plug (15) is driven to move upwards by the forward rotation of the reciprocating rotating motor (12), and the silica gel in the dispensing head (8) flows out of the gel outlet (16) and drops on the integrated circuit board on the uppermost layer; the reciprocating rotary motor (12) rotates reversely to drive the rubber plug (15) to move downwards to block the rubber outlet (16) to stop dispensing;
step three, moving out the integrated circuit board: after dispensing of the integrated circuit board on the uppermost layer is completed, the integrated circuit board on the uppermost layer is pushed out of the accommodating cavity (19) through the pushing mechanism (26) so that the integrated circuit board on the uppermost layer slides into a position between the two guide plates (23) on the top surface of the base (1), and then the integrated circuit board is manually taken out.
2. The method of claim 1, wherein: in the integrated circuit board manufacturing and processing device, the pushing mechanism (26) comprises a limiting sleeve (261), a push rod (262), a rubber plate (263), a second return spring (264), a rack (265), a rotating motor (266), an incomplete gear (267), a connecting rod (268) and a sealing block (269); a limit sleeve (261) is installed on the top surface of the base (1), a push rod (262) parallel to the guide plate (23) is installed in the limit sleeve (261) in a horizontal sliding mode, and a rubber plate (263) perpendicular to the baffle (22) is horizontally and fixedly installed at the outer end of the push rod (262); a second return spring (264) is arranged between the rubber plate (263) and the limit sleeve (261); a rack (265) parallel to the push rod (262) is horizontally and fixedly installed at the inner end of the push rod (262), a rotating motor (266) is horizontally and fixedly installed on the top surface of the base (1), and an incomplete gear (267) meshed with the rack (265) is fixedly installed on an output shaft of the rotating motor (266); the bottom of the push rod (262) is fixedly provided with a sealing block (269) which is in horizontal sliding fit with the oil cavity (27) through a vertical connecting rod (268).
3. The method of claim 2, wherein: among the processing apparatus is made to the circuit board, seted up air duct (28) in base (1), oil pocket (27) that air duct (28) one end intercommunication sealing block (269) is close to rubber slab (263) one side, air duct (28) other end intercommunication base (1) upper surface.
4. The method of claim 1, wherein: in the integrated circuit board manufacturing and processing device, a hydraulic cylinder (29) is vertically and fixedly mounted at the top of a dispensing head (8), a hydraulic rod (30) is vertically and slidably mounted in the hydraulic cylinder (29), and a first sealing plate (31) in sliding fit with the inner side wall of a rigid straight rod (14) and the dispensing head (8) is horizontally fixed at the bottom of the hydraulic rod (30); a through hole (32) is formed in the side wall of the hydraulic cylinder (29), and a second sealing plate (33) which is in sliding fit with the outer side wall of the hydraulic cylinder (29) and the inner side wall of the dispensing head (8) is horizontally and fixedly installed on the rigid straight rod (14); hydraulic oil is filled above the second sealing plate (33) in the dispensing head (8).
5. The method of claim 1, wherein: in the integrated circuit board manufacturing device, a plurality of groups of conveying rollers (34) vertical to the guide plates (23) are horizontally and rotatably arranged between the guide plates (23).
6. The method of claim 1, wherein: in the integrated circuit board manufacturing and processing device, a plurality of mounting blocks (7) are slidably mounted on a guide rod (6), and accommodating cavities (19) with the same number as the mounting blocks (7) are correspondingly formed in the upper surface of a base (1); the mounting blocks (7) are fixedly connected through a fixing bracket (35).
7. The method of claim 6, wherein: in the integrated circuit board manufacturing and processing device, a threaded sleeve (36) parallel to a guide rod (6) is horizontally and fixedly mounted on the inner side of a support column (5), a threaded rod (37) is rotatably mounted in the threaded sleeve (36), and the end part of the threaded rod (37) is in running fit with the side surface of an outermost side mounting block (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010201695.5A CN111341702A (en) | 2020-03-20 | 2020-03-20 | Manufacturing method of integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010201695.5A CN111341702A (en) | 2020-03-20 | 2020-03-20 | Manufacturing method of integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111341702A true CN111341702A (en) | 2020-06-26 |
Family
ID=71186659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010201695.5A Withdrawn CN111341702A (en) | 2020-03-20 | 2020-03-20 | Manufacturing method of integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111341702A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112191457A (en) * | 2020-10-10 | 2021-01-08 | 合肥高地创意科技有限公司 | Integrated circuit packaging adhesive dispensing device |
| CN112689397A (en) * | 2020-12-28 | 2021-04-20 | 合肥高地创意科技有限公司 | Paster device is used in integrated circuit board processing |
| CN113304957A (en) * | 2021-07-01 | 2021-08-27 | 东莞市益友光学科技有限公司 | LED lamp pearl casting glue equipment |
| CN113880236A (en) * | 2021-10-16 | 2022-01-04 | 浙江问源环保科技股份有限公司 | Biological sewage treatment tank |
| CN114178139A (en) * | 2021-12-15 | 2022-03-15 | 浙江明都创芯电器有限公司 | Glue dispensing mechanism for packaging LED lamp and use method thereof |
| CN114523256A (en) * | 2022-04-25 | 2022-05-24 | 广州市星康科技有限公司 | Multi-angle rotating mechanism for welding integrated circuit assembly |
| CN114944355A (en) * | 2022-07-27 | 2022-08-26 | 成都汉芯国科集成技术有限公司 | High-efficient packaging hardware is used in integrated circuit chip design |
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2020
- 2020-03-20 CN CN202010201695.5A patent/CN111341702A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112191457A (en) * | 2020-10-10 | 2021-01-08 | 合肥高地创意科技有限公司 | Integrated circuit packaging adhesive dispensing device |
| CN112689397A (en) * | 2020-12-28 | 2021-04-20 | 合肥高地创意科技有限公司 | Paster device is used in integrated circuit board processing |
| CN113304957A (en) * | 2021-07-01 | 2021-08-27 | 东莞市益友光学科技有限公司 | LED lamp pearl casting glue equipment |
| CN113880236A (en) * | 2021-10-16 | 2022-01-04 | 浙江问源环保科技股份有限公司 | Biological sewage treatment tank |
| CN113880236B (en) * | 2021-10-16 | 2023-01-31 | 浙江问源环保科技股份有限公司 | Biological sewage treatment tank |
| CN114178139A (en) * | 2021-12-15 | 2022-03-15 | 浙江明都创芯电器有限公司 | Glue dispensing mechanism for packaging LED lamp and use method thereof |
| CN114178139B (en) * | 2021-12-15 | 2022-12-13 | 浙江明都创芯电器有限公司 | Glue dispensing mechanism for packaging LED lamp and use method thereof |
| CN114523256A (en) * | 2022-04-25 | 2022-05-24 | 广州市星康科技有限公司 | Multi-angle rotating mechanism for welding integrated circuit assembly |
| CN114523256B (en) * | 2022-04-25 | 2022-06-21 | 广州市星康科技有限公司 | Multi-angle rotating mechanism for welding integrated circuit assembly |
| CN114944355A (en) * | 2022-07-27 | 2022-08-26 | 成都汉芯国科集成技术有限公司 | High-efficient packaging hardware is used in integrated circuit chip design |
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Application publication date: 20200626 |
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