CN220944493U

CN220944493U - High-speed board edging device of bi-polar operation

Info

Publication number: CN220944493U
Application number: CN202322563980.3U
Authority: CN
Inventors: 赖剑锋; 苏惠武; 张惠琳
Original assignee: Jiangxi Fuchangfa Circuit Technology Co ltd
Current assignee: Jiangxi Fuchangfa Circuit Technology Co ltd
Priority date: 2023-09-21
Filing date: 2023-09-21
Publication date: 2024-05-14
Anticipated expiration: 2033-09-21

Abstract

The utility model relates to the field of circuit board processing equipment, in particular to a double-end operation high-speed board edging device, which solves the technical problems: traditional single-end polishing equipment used for edging of high-speed board substrates is low in polishing efficiency, complicated in operation mode of manually and continuously adjusting positions of the substrates, and the technical scheme is as follows: the utility model discloses a double-end operation high-speed plate edging device, which comprises an operation table, an angle adjusting mechanism, an edging mechanism, a locking mechanism, a positioning mechanism, a dust collection assembly and a blast assembly.

Description

High-speed board edging device of bi-polar operation

Technical Field

The utility model relates to the field of circuit board processing equipment, in particular to a double-end operation high-speed board edging device.

Background

Along with the high-speed development of electronic information products, the transmission speed requirement of digital signals on a circuit board is higher and higher, and the high-speed board is one of PCB circuit boards, and has higher signal transmission speed compared with a common PCB board, so that the processing requirement of a substrate board is higher compared with the common PCB board, and in order to ensure that the high-speed board substrate is free from problems in use and test, the processed board is subjected to fine shearing and edge polishing successively, so that burrs at the edge of the board are eliminated, the substrate is more regular, and the board can be more smoothly plugged and plugged with a main board in use and test.

At present, a single-end operation mode is generally adopted for edging the substrate material of the high-speed plate, namely, the edge of the substrate material of which the position is adjusted by manual operation is continuously polished through a polishing machine tool in a single direction, but because the substrate material of the high-speed plate is generally a regular rectangular plate body, the periphery of the substrate material is required to be polished, the position of the substrate facing the polishing machine tool is required to be manually and continuously adjusted in the traditional single-end polishing operation mode, and the adjustment times are at least four times, so that the processing efficiency is greatly reduced.

Therefore, aiming at the situation that the traditional single-end polishing equipment used for polishing the high-speed plate substrate is low in polishing efficiency and the operation mode for manually and continuously adjusting the position of the substrate is complicated, the high-speed plate edge polishing device with double-end polishing function can be designed, and the operation flow for manually adjusting the substrate material of the high-speed plate is simplified while the polishing efficiency is improved.

Disclosure of utility model

In order to solve the problems that the traditional single-end polishing equipment used in the edging processing of the high-speed plate substrate has low polishing efficiency and the operation mode for manually continuously adjusting the position of the substrate is complicated.

The technical scheme of the utility model is as follows: the high-speed plate edging device for double-end operation comprises an operation table, an angle adjusting mechanism, an edging mechanism, a locking mechanism, a positioning mechanism, a dust collecting assembly and a blast assembly; the angle adjustment mechanism is installed in the middle of the operation panel, the edging mechanism is installed to the bilateral symmetry of operation panel upper end, the operation panel top is provided with locking mechanical system, positioning mechanism and positioning mechanism are installed to angle adjustment mechanism upper end and are in the locking mechanical system below, are provided with dust collection subassembly on angle adjustment mechanism and the edging mechanism, still install the blast assembly on the edging mechanism.

Preferably, angle adjustment mechanism, locking mechanical system and positioning mechanism cooperation work, can be at the in-process automatically regulated polishing position of edging when fixed to high-speed board base plate, compare in traditional manual adjustment operation labour saving and time saving more, the design of polishing of the bi-polar of edging mechanism can polish simultaneously the both sides edge that the base plate is relative, compare in traditional single-ended edging, angle position adjustment frequency to high-speed board base plate is less than traditional mode of polishing greatly, polishing efficiency is higher, dust collection subassembly and blast air subassembly are in the mode of blowing through wind power in-process of polishing with the chip material automatic collection that produces, also can blow down the chip material of adhesion on the base plate edge fast and fall into dust collection subassembly in, avoid the chip material to scatter the pollution operation district.

Preferably, the angle adjusting mechanism comprises a steering motor, a supporting table and a support column; the steering motor is arranged at the lower end of the middle position of the operating platform, the upper end of a transmission shaft of the steering motor penetrates through the operating platform and is connected with a truncated cone-shaped supporting platform, a support column with a hollow structure is arranged at the upper end of the supporting platform, the steering motor is used for controlling a positioned high-speed board substrate to rotate on a horizontal plane, rotation scheduling is ninety degrees, each rotation can enable one side edge of the rectangular substrate to be right opposite to an edging mechanism, the diameter of the top end of the supporting platform is smaller than the width of the substrate, and scraps produced during edge polishing of the substrate can naturally fall onto the side wall of the supporting platform to slide downwards, so that centralized recovery of the scraps is facilitated.

Preferably, the edging mechanism comprises a horizontal cylinder, a movable table, a roller, a rotary motor and a polishing disc; the horizontal cylinder bilateral symmetry installs in operation panel upper end both sides, the output fixedly connected with movable table of the relative one side of horizontal cylinder, the movable table is in the saddle left and right sides, the gyro wheel along operation panel surface rolling is installed to the movable table lower extreme, the rotating electrical machines is installed to one side that the movable table was dorsad, the transmission shaft of rotating electrical machines passes the movable table and is connected with the dish of polishing, the horizontal cylinder stretches out and draws back through pneumatic power control piston rod, produce horizontal push-pull effect to the movable table, make the dish of polishing that is in the movable table be close to or keep away from the base plate material, simultaneously also provide the radial force of polishing at the in-process of polishing, the movable table rolls on the operation panel through the gyro wheel at the in-process that removes, reduce the frictional force that removes when providing steady support for oneself, it is smoother to remove, the rotating electrical machines drive is polished the dish high-speed rotation, the edge of base plate can fully cover, disposable one side of base plate of polishing.

Preferably, the locking mechanism comprises a back plate, a vertical cylinder and a compression ring; the backplate is L type and fixed connection in operation panel upper end rear side, and vertical cylinder is installed to the horizontal part upper end of backplate, and vertical cylinder's output passes the horizontal part of backplate and is connected with the clamping ring, and the clamping ring is in the movable table top, and the clamping ring adopts silica gel or rubber material, has certain elasticity and pliability, and it vertically goes up and down by vertical cylinder drive, and then makes its extrusion at the surface of high-speed board base plate, avoids the base plate to roll over at polishing in-process.

Preferably, the positioning mechanism comprises an air pump, an air pipe and a sucker; the air pump is installed in the vertical portion rear end of backplate, and the trachea is pegged graft in the pillar is inboard, and the sucking disc is installed to the trachea upper end, and accessible hose connection is used for carrying the air current with the trachea intercommunication between air pump and the pillar, and the air pump is through hose extraction and the transport air, when the extraction air, makes to form negative pressure in trachea and the sucking disc, and then firmly adsorb on with the base plate material, after polishing, refill air, make the inside and outside air pressure balance of sucking disc, release the absorption locking to the base plate, it is very convenient to get and put.

Preferably, the dust collection assembly comprises a dust collection groove and a material guide table; the annular dust collection groove is formed in the upper end of the supporting table, the sucking disc is located above the middle of the dust collection groove, the guide table with the inclined bottom wall is installed to one side of the movable table, the guide table is located below the polishing disc, and scraps generated during polishing of the substrate naturally fall onto the side wall of the supporting table to slide downwards, finally enter the dust collection groove at the outer edge of the bottom end of the supporting table, the dust collection groove has a certain depth, a large amount of scraps can be collected, frequent cleaning of the dust collection groove is not needed in the polishing process, and centralized recovery of the scraps is facilitated.

Preferably, the air blast assembly comprises a fan and an air outlet; the fan is installed to movable table dorsad one side, and the air outlet that communicates with the air supply passage of fan has been seted up to movable table subtended one side, and the air outlet is in around polishing the dish, and the fan is blown air to base plate one side through the air outlet, can blow down the powder bits of adhesion on the base plate edge, and the wind-force size of fan carries out design adjustment in advance, ensures that wind-force is suitable, can not too big lead to the chip material to be blown outwards and kicked up.

The utility model has the beneficial effects that:

1. Through the cooperation of the angle adjusting mechanism, the locking mechanism and the positioning mechanism, the polishing position can be automatically adjusted in the polishing process when the high-speed board substrate is fixed, compared with the traditional manual adjustment operation, the polishing machine is more time-saving and labor-saving, the double-end edge polishing mechanism is higher in polishing efficiency compared with the traditional single-end edge polishing design, the angle position adjusting frequency of the high-speed board substrate is greatly lower than that of the traditional polishing mode, the dust collecting assembly and the air blast assembly on the positioning mechanism and the edge polishing mechanism can automatically collect generated scraps in the polishing process, and the scraps adhered on the edge of the substrate can be quickly blown down into the dust collecting assembly in a wind blowing mode, so that the scraps are prevented from scattering and polluting an operation area;

2. The positioning mechanism adopts an adsorption structure formed by an air pump and a sucker, can quickly form effective locking on the surface of the substrate material of the high-speed plate, is matched with a compression ring made of flexible materials, clamps the surface of the substrate and prevents the coating material on the surface of the substrate from being damaged;

3. The substrate scraps generated in the polishing process naturally slide into the dust collection groove through the material guide table, and after a certain amount of scraps are recovered, the scraps can be taken out and can be recycled through hot melting treatment to be reused as raw materials for manufacturing the high-speed board substrate, so that the waste of materials is reduced.

Drawings

FIG. 1 shows a first perspective view of a double-ended high-speed board edging device according to the present utility model;

FIG. 2 shows a second perspective view of the dual end operation high speed board edging device of the present utility model;

FIG. 3 shows a schematic perspective view of the console of the double-ended high-speed plate edging device according to the present utility model;

FIG. 4 shows a schematic perspective view of the edging mechanism of the double-ended high-speed plate edging device according to the present utility model;

Fig. 5 shows a schematic perspective view of an angle adjusting mechanism of the double-end type high-speed plate edging device.

Reference numerals illustrate: 1. an operation table; 2. an angle adjusting mechanism; 3. an edging mechanism; 4. a locking mechanism; 5. a positioning mechanism; 6. a dust collection assembly; 7. a blower assembly; 201. a steering motor; 202. a support; 203. a support post; 301. a horizontal cylinder; 302. a movable table; 303. a roller; 304. a rotating electric machine; 305. polishing the grinding disc; 401. a back plate; 402. a vertical cylinder; 403. a compression ring; 501. an air pump; 502. an air pipe; 503. a suction cup; 601. a dust collection tank; 602. a material guiding table; 701. a blower; 702. and an air outlet.

Detailed Description

The utility model is further described below with reference to the drawings and examples.

Referring to fig. 1-2, the present utility model provides an embodiment: the high-speed plate edging device for double-end operation comprises an operating table 1, an angle adjusting mechanism 2, an edging mechanism 3, a locking mechanism 4, a positioning mechanism 5, a dust collecting assembly 6 and a blowing assembly 7; the angle adjustment mechanism 2 is installed in the middle of the operation panel 1, edging mechanism 3 is installed to the bilateral symmetry of operation panel 1 upper end, operation panel 1 top is provided with locking mechanical system 4, positioning mechanism 5 and positioning mechanism 5 are in locking mechanical system 4 below are installed to angle adjustment mechanism 2 upper end, be provided with dust collection subassembly 6 on angle adjustment mechanism 2 and the edging mechanism 3, still install blast assembly 7 on edging mechanism 3, angle adjustment mechanism 2, locking mechanical system 4 and positioning mechanism 5 cooperation work, can be in the in-process automatic adjustment polishing position of edging when fixed to high-speed board base plate, compared with traditional manual adjustment operation labour saving and time saving, the bi-polar design of edging mechanism 3 can polish simultaneously to the both sides edge that the base plate is relative, compared with traditional single-end edging, angle position adjustment frequency is greatly less than traditional mode of polishing to high-speed board base plate, the dust collection subassembly 6 and blast assembly 7 are in the mode of polishing through wind-force will produce the automatic collection of chip material on the edge, also can fall into dust collection subassembly 6 fast with the chip material on the edge of adhesion and pollute the work district.

Referring to fig. 3 and 5, in the present embodiment, the angle adjustment mechanism 2 includes a steering motor 201, a bracket 202, and a strut 203; the steering motor 201 is arranged at the lower end of the middle position of the operation table 1, the upper end of a transmission shaft of the steering motor 201 passes through the operation table 1 and is connected with a truncated cone-shaped supporting table 202, a supporting column 203 with a hollow structure is arranged at the upper end of the supporting table 202, and the positioning mechanism 5 comprises an air pump 501, an air pipe 502 and a sucking disc 503; the air pump 501 is arranged at the rear end of the vertical part of the backboard 401, the air pipe 502 is inserted into the inner side of the supporting column 203, the sucker 503 is arranged at the upper end of the air pipe 502, the air pump 501 and the supporting column 203 can be connected through a hose and are communicated with the air pipe 502 for conveying air flow, the steering motor 201 is used for controlling the positioned high-speed board substrate to rotate on the horizontal plane, the rotation is carried out at ninety degrees, one side edge of the rectangular substrate is right opposite to the edging mechanism 3, the diameter of the top end of the supporting table 202 is smaller than the width of the substrate, scraps produced during the edge polishing of the substrate can naturally fall onto the side wall of the supporting table 202 so as to slide downwards, the centralized recovery of the scraps is facilitated, the air pump 501 pumps and conveys air through the hose, negative pressure is formed in the air pipe 502 and the sucker 503 when the air is pumped, the substrate material is firmly adsorbed on the air pump, and after polishing is finished, the sucker 503 is refilled with air pressure balance, the inside and outside the air pump 503 is released, the adsorption locking of the substrate is very convenient to take and place.

Referring to fig. 3 to 4, in the present embodiment, the edging mechanism 3 includes a horizontal cylinder 301, a movable table 302, a roller 303, a rotary motor 304, and a polishing plate 305; the horizontal cylinder 301 is symmetrically arranged on two sides of the upper end of the operation table 1, the output end of the opposite side of the horizontal cylinder 301 is fixedly connected with the movable table 302, the movable table 302 is positioned on the left side and the right side of the supporting table 202, the lower end of the movable table 302 is provided with the idler wheels 303 rolling along the surface of the operation table 1, one side of the movable table 302, which is opposite to the movable table 302, is provided with the rotating motor 304, the transmission shaft of the rotating motor 304 passes through the movable table 302 and is connected with the polishing disc 305, and the locking mechanism 4 comprises a backboard 401, a vertical cylinder 402 and a compression ring 403; the backboard 401 is L-shaped and fixedly connected to the rear side of the upper end of the operation platform 1, a vertical cylinder 402 is arranged at the upper end of the horizontal part of the backboard 401, the output end of the vertical cylinder 402 passes through the horizontal part of the backboard 401 and is connected with a compression ring 403, the compression ring 403 is positioned above the movable platform 302, and the dust collection assembly 6 comprises a dust collection groove 601 and a material guide platform 602; an annular dust collection groove 601 is formed in the upper end of the supporting table 202, the suction disc 503 is located above the middle of the dust collection groove 601, a material guide table 602 with an inclined bottom wall is mounted on one opposite side of the movable table 302, the material guide table 602 is located below the polishing disc 305, and the air blast assembly 7 comprises a fan 701 and an air outlet 702; the fan 701 is arranged on the back side of the movable table 302, the air outlet 702 communicated with the air supply channel of the fan 701 is arranged on the opposite side of the movable table 302, the air outlet 702 is arranged around the polishing disc 305, the horizontal cylinder 301 controls the piston rod to stretch and retract through pneumatic power, the movable table 302 generates a horizontal push-pull effect, the polishing disc 305 on the movable table 302 is close to or far away from the substrate material, meanwhile, the polishing radial force is also provided in the polishing process, the movable table 302 rolls on the operation table 1 through the roller 303 in the moving process, the stable support is provided for the movable table, the moving friction force is reduced, the movement is smoother, the rotary motor 304 drives the polishing disc 305 to rotate at a high speed, the polishing disc 305 can fully cover the edge of the substrate, one side edge of the substrate is polished at one time, the pressing ring 403 adopts silica gel or rubber material, the vertical cylinder 402 drives the vertical cylinder to longitudinally lift and further extrudes the vertical cylinder to the surface of the high-speed plate substrate, so that the substrate is prevented from tipping in the polishing process, the generated scraps naturally fall onto the side wall of the supporting table 202 to slide downwards during polishing of the substrate, finally enter the dust collection groove 601 at the outer edge of the bottom end of the supporting table 202, the dust collection groove 601 has a certain depth, a large amount of scraps can be collected, frequent cleaning of the dust collection groove 601 is not needed during polishing, centralized recovery of the scraps is facilitated, the fan 701 blows air to one side of the substrate through the air outlet 702, the scraps adhered to the edge of the substrate can be blown down, the wind power of the fan 701 is designed and adjusted in advance, the proper wind power is ensured, and the scraps are not blown outwards and lifted due to overlarge wind power.

When the device works, a user horizontally places a substrate material of a high-speed plate on the sucker 503, adjusts the position of the substrate material, enables the side edge of the narrower side of the substrate to face the polishing disc 305, then starts the air pump 501, pumps air through a hose connected with the support 203, forms negative pressure in the sucker 503, firmly adsorbs the substrate, then starts the vertical cylinder 402 to control the pressing ring 403 to longitudinally press the substrate material, and gradually increases the pressing force until the substrate is clamped by the sucker 503 and the pressing ring 403;

Then, the edging mechanisms 3 on the two sides are started, the horizontal cylinder 301 pushes the movable table 302 to move oppositely and close to the substrate, meanwhile, the rotary motor 304 drives the polishing disc 305 to operate at a high speed, edging work is started at the moment that the polishing disc 305 is contacted with the side edge of the substrate, and the horizontal cylinder 301 continuously applies horizontal acting force to flatten burrs on the edge of the substrate;

During edging, scraps generated by the edge of the substrate naturally fall into the dust collection groove 601 along the side wall of the saddle 202, after the side edge is polished, the horizontal cylinder 301 drives the movable table 302 to return to the initial position, in the moving process, the fan 701 synchronously operates, and the air outlet 702 is used for blowing the edge of the substrate, so that a small amount of adhered scraps are blown down and fall into the material guide table 602, and finally slide into the dust collection groove 601 along the material guide table 602;

After the movable table 302 returns to the initial position, the vertical cylinder 402 also pulls the pressing ring 403 upwards to be separated from the substrate, then the steering motor 201 is started, the supporting table 202 is controlled to rotate ninety degrees horizontally, the substrate is provided with the side edge which is not polished on the other side to the polishing disc 305, then the vertical cylinder 402 drives the pressing ring 403 to squeeze and lock the substrate again, and the polishing disc 305 polishes the opposite sides on the other side of the substrate again according to the steps.

Through the above-mentioned step, through the cooperation work of angle adjustment mechanism 2, locking mechanical system 4 and positioning mechanism 5, can be in the in-process automatically regulated polishing position of edging when fixed with high-speed board base plate, compare in traditional manual adjustment operation labour saving and time saving more, the edging mechanism 3 that the bi-polar set up in addition compares in traditional single-ended edging design can carry out synchronous polishing to the both sides edge that the base plate is relative simultaneously, angle position adjustment frequency to high-speed board base plate is less than traditional mode of polishing greatly, polishing efficiency is higher, in order to solve the single-ended equipment of polishing of tradition that high-speed board base plate edging was used, polishing efficiency is low, the manual continuous operation mode of adjusting the base plate position of manual work is loaded down with trivial details problem.

The embodiments of the present utility model have been described in detail with reference to the drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present utility model.

Claims

1. The high-speed board edging device for double-end operation comprises an operation table (1); the method is characterized in that: the device also comprises an angle adjusting mechanism (2), an edging mechanism (3), a locking mechanism (4), a positioning mechanism (5), a dust collecting component (6) and a blowing component (7); the angle adjustment mechanism (2) is installed in the middle of the operation panel (1), edging mechanism (3) is installed to bilateral symmetry on operation panel (1), and operation panel (1) top is provided with locking mechanical system (4), and positioning mechanism (5) are in locking mechanical system (4) below are installed to angle adjustment mechanism (2), are provided with dust collection subassembly (6) on angle adjustment mechanism (2) and edging mechanism (3), still install blast assembly (7) on edging mechanism (3).

2. The double-ended high-speed board edging device of claim 1, wherein: the angle adjusting mechanism (2) comprises a steering motor (201), a supporting table (202) and a supporting column (203); the steering motor (201) is arranged at the lower end of the middle position of the operating platform (1), the upper end of a transmission shaft of the steering motor (201) penetrates through the operating platform (1) and is connected with a truncated cone-shaped supporting platform (202), and a supporting column (203) with a hollow structure is arranged at the upper end of the supporting platform (202).

3. The double-ended high-speed board edging device of claim 2, wherein: the edging mechanism (3) comprises a horizontal cylinder (301), a movable table (302), a roller (303), a rotary motor (304) and a polishing disc (305); the horizontal cylinder (301) is symmetrically arranged on two sides of the upper end of the operating platform (1), the output end of one side opposite to the horizontal cylinder (301) is fixedly connected with the movable table (302), the movable table (302) is positioned on the left side and the right side of the supporting table (202), the lower end of the movable table (302) is provided with the roller (303) rolling along the surface of the operating platform (1), one side opposite to the movable table (302) is provided with the rotating motor (304), and the transmission shaft of the rotating motor (304) penetrates through the movable table (302) and is connected with the polishing disc (305).

4. A double-ended high speed board edging device according to claim 3, characterized in that: the locking mechanism (4) comprises a back plate (401), a vertical cylinder (402) and a compression ring (403); the backplate (401) is L type and fixed connection in operation panel (1) upper end rear side, and perpendicular cylinder (402) are installed to horizontal portion upper end of backplate (401), and the output of perpendicular cylinder (402) passes the horizontal portion of backplate (401) and is connected with clamping ring (403), and clamping ring (403) are in movable table (302) top.

5. The double-ended high-speed board edging device, as claimed in claim 4, wherein: the positioning mechanism (5) comprises an air pump (501), an air pipe (502) and a sucker (503); the air pump (501) is arranged at the rear end of the vertical part of the backboard (401), the air pipe (502) is inserted into the inner side of the supporting column (203), the sucker (503) is arranged at the upper end of the air pipe (502), and the air pump (501) and the supporting column (203) can be connected through a hose and communicated with the air pipe (502) for conveying air flow.

6. A double-ended high speed board edging device according to claim 3, characterized in that: the dust collection assembly (6) comprises a dust collection groove (601) and a material guide table (602); an annular dust collection groove (601) is formed in the upper end of the supporting table (202), the sucker (503) is located above the middle of the dust collection groove (601), a material guide table (602) with an inclined bottom wall is mounted on one opposite side of the movable table (302), and the material guide table (602) is located below the polishing disc (305).

7. A double-ended high speed board edging device according to claim 3, characterized in that: the air blast assembly (7) comprises a fan (701) and an air outlet (702); a fan (701) is arranged on one back side of the movable table (302), an air outlet (702) communicated with an air supply channel of the fan (701) is formed on the opposite side of the movable table (302), and the air outlet (702) is arranged around the polishing disc (305).