CN110028917A - 粘接薄膜及带有切割带的粘接薄膜 - Google Patents
粘接薄膜及带有切割带的粘接薄膜 Download PDFInfo
- Publication number
- CN110028917A CN110028917A CN201811536691.1A CN201811536691A CN110028917A CN 110028917 A CN110028917 A CN 110028917A CN 201811536691 A CN201811536691 A CN 201811536691A CN 110028917 A CN110028917 A CN 110028917A
- Authority
- CN
- China
- Prior art keywords
- adhering film
- cutting belt
- film
- adhering
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017239269A JP7046585B2 (ja) | 2017-12-14 | 2017-12-14 | 接着フィルムおよびダイシングテープ付き接着フィルム |
JP2017-239269 | 2017-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110028917A true CN110028917A (zh) | 2019-07-19 |
Family
ID=67055958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811536691.1A Pending CN110028917A (zh) | 2017-12-14 | 2018-12-14 | 粘接薄膜及带有切割带的粘接薄膜 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7046585B2 (ko) |
KR (1) | KR20190071599A (ko) |
CN (1) | CN110028917A (ko) |
TW (2) | TW201932558A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112521878A (zh) * | 2019-09-19 | 2021-03-19 | 日东电工株式会社 | 粘合带 |
CN114005769A (zh) * | 2021-11-01 | 2022-02-01 | 河北博威集成电路有限公司 | 一种微波、射频芯片专用晶圆划片膜相对粘度的检测方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7430039B2 (ja) * | 2019-06-28 | 2024-02-09 | 日東電工株式会社 | ダイシングテープ、及び、ダイシングダイボンドフィルム |
JP2021048205A (ja) | 2019-09-17 | 2021-03-25 | キオクシア株式会社 | 半導体装置の製造方法 |
JP7427480B2 (ja) * | 2020-03-09 | 2024-02-05 | キオクシア株式会社 | 半導体装置 |
JP7446887B2 (ja) * | 2020-03-30 | 2024-03-11 | リンテック株式会社 | フィルム状接着剤 |
CN117321744A (zh) * | 2021-06-16 | 2023-12-29 | 日东电工株式会社 | 导电性片材和切割芯片接合薄膜 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102190977A (zh) * | 2010-03-05 | 2011-09-21 | 日东电工株式会社 | 切割/芯片接合薄膜 |
CN102222633A (zh) * | 2010-04-16 | 2011-10-19 | 日东电工株式会社 | 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法 |
CN102376614A (zh) * | 2010-07-20 | 2012-03-14 | 日东电工株式会社 | 倒装芯片型半导体背面用膜和半导体背面用切割带集成膜 |
CN102898967A (zh) * | 2011-07-25 | 2013-01-30 | 日东电工株式会社 | 胶粘片及其用途 |
CN103081069A (zh) * | 2010-09-06 | 2013-05-01 | 日东电工株式会社 | 半导体装置用薄膜以及半导体装置 |
CN103131355A (zh) * | 2011-11-28 | 2013-06-05 | 日东电工株式会社 | 底填剂材料及半导体装置的制造方法 |
CN103923573A (zh) * | 2013-01-10 | 2014-07-16 | 日东电工株式会社 | 胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法及半导体装置 |
CN104119812A (zh) * | 2013-04-25 | 2014-10-29 | 日东电工株式会社 | 胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置 |
CN104726032A (zh) * | 2013-12-24 | 2015-06-24 | 日东电工株式会社 | 粘接薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置 |
CN106206375A (zh) * | 2015-06-01 | 2016-12-07 | 日东电工株式会社 | 半导体背面用薄膜及其用途 |
CN108178990A (zh) * | 2016-12-08 | 2018-06-19 | 日东电工株式会社 | 粘接薄膜、切割/芯片接合薄膜、半导体装置的制造方法和半导体装置 |
CN109148350A (zh) * | 2017-06-27 | 2019-01-04 | 日东电工株式会社 | 切割带一体型粘接性片 |
CN109135594A (zh) * | 2017-06-27 | 2019-01-04 | 日东电工株式会社 | 切割带一体型背面保护薄膜 |
CN109309039A (zh) * | 2017-07-28 | 2019-02-05 | 日东电工株式会社 | 芯片接合薄膜、切割芯片接合薄膜以及半导体装置制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4876451B2 (ja) | 2005-06-27 | 2012-02-15 | 日立化成工業株式会社 | 接着シート |
JP5255465B2 (ja) | 2009-01-29 | 2013-08-07 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP5219302B2 (ja) | 2010-02-04 | 2013-06-26 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置 |
JP2012023161A (ja) | 2010-07-14 | 2012-02-02 | Furukawa Electric Co Ltd:The | 半導体装置を製造する際に用いるウエハ加工用シート及びその製造方法並びに半導体装置の製造方法 |
JP5877087B2 (ja) | 2012-02-24 | 2016-03-02 | 古河電気工業株式会社 | 接着フィルムおよびウェハ加工用テープ |
JP6068386B2 (ja) | 2014-03-31 | 2017-01-25 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
CN106661412B (zh) | 2015-04-29 | 2020-11-06 | 株式会社Lg化学 | 用于半导体的粘合膜 |
-
2017
- 2017-12-14 JP JP2017239269A patent/JP7046585B2/ja active Active
-
2018
- 2018-12-11 KR KR1020180159193A patent/KR20190071599A/ko active Search and Examination
- 2018-12-14 CN CN201811536691.1A patent/CN110028917A/zh active Pending
- 2018-12-14 TW TW107145235A patent/TW201932558A/zh unknown
- 2018-12-14 TW TW112105913A patent/TW202323475A/zh unknown
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102190977A (zh) * | 2010-03-05 | 2011-09-21 | 日东电工株式会社 | 切割/芯片接合薄膜 |
CN102222633A (zh) * | 2010-04-16 | 2011-10-19 | 日东电工株式会社 | 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法 |
CN102376614A (zh) * | 2010-07-20 | 2012-03-14 | 日东电工株式会社 | 倒装芯片型半导体背面用膜和半导体背面用切割带集成膜 |
CN103081069A (zh) * | 2010-09-06 | 2013-05-01 | 日东电工株式会社 | 半导体装置用薄膜以及半导体装置 |
CN102898967A (zh) * | 2011-07-25 | 2013-01-30 | 日东电工株式会社 | 胶粘片及其用途 |
CN103131355A (zh) * | 2011-11-28 | 2013-06-05 | 日东电工株式会社 | 底填剂材料及半导体装置的制造方法 |
CN103923573A (zh) * | 2013-01-10 | 2014-07-16 | 日东电工株式会社 | 胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法及半导体装置 |
CN104119812A (zh) * | 2013-04-25 | 2014-10-29 | 日东电工株式会社 | 胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置 |
CN104726032A (zh) * | 2013-12-24 | 2015-06-24 | 日东电工株式会社 | 粘接薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置 |
CN106206375A (zh) * | 2015-06-01 | 2016-12-07 | 日东电工株式会社 | 半导体背面用薄膜及其用途 |
CN108178990A (zh) * | 2016-12-08 | 2018-06-19 | 日东电工株式会社 | 粘接薄膜、切割/芯片接合薄膜、半导体装置的制造方法和半导体装置 |
CN109148350A (zh) * | 2017-06-27 | 2019-01-04 | 日东电工株式会社 | 切割带一体型粘接性片 |
CN109135594A (zh) * | 2017-06-27 | 2019-01-04 | 日东电工株式会社 | 切割带一体型背面保护薄膜 |
CN109309039A (zh) * | 2017-07-28 | 2019-02-05 | 日东电工株式会社 | 芯片接合薄膜、切割芯片接合薄膜以及半导体装置制造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112521878A (zh) * | 2019-09-19 | 2021-03-19 | 日东电工株式会社 | 粘合带 |
CN114005769A (zh) * | 2021-11-01 | 2022-02-01 | 河北博威集成电路有限公司 | 一种微波、射频芯片专用晶圆划片膜相对粘度的检测方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2019104862A (ja) | 2019-06-27 |
JP7046585B2 (ja) | 2022-04-04 |
KR20190071599A (ko) | 2019-06-24 |
TW202323475A (zh) | 2023-06-16 |
TW201932558A (zh) | 2019-08-16 |
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