CN109973837A - 具有稳定的引线框架的led模块 - Google Patents
具有稳定的引线框架的led模块 Download PDFInfo
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- CN109973837A CN109973837A CN201811556179.3A CN201811556179A CN109973837A CN 109973837 A CN109973837 A CN 109973837A CN 201811556179 A CN201811556179 A CN 201811556179A CN 109973837 A CN109973837 A CN 109973837A
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Abstract
本发明涉及应用于LED灯具(100)、优选LED改装灯中的LED模块(1),其具有引线框架(10)和与引线框架(10)电气且机械相连的一个或多个LED(12),以及涉及用于制造此种LED模块(1)的方法。LED模块(1)具有由绝缘材料制成的一个或多个稳定区段(14),其局部地、优选点状地和/或线状地嵌入引线框架(10)的中间区域(13)中,从而使引线框架(10)的区段彼此固定并优选彼此间隔。
Description
技术领域
本发明涉及一种用于在LED灯具、例如LED改装灯中使用的LED模块,以及一种用于制造此种LED模块的方法。此LED模块具有引线框架以及与引线框架电气并机械连接的一个或多个LED。
背景技术
已知为了LED的连接和固定而使用冲裁薄板(也称作“金属冲裁栅格”或“引线框架”)的LED灯具。
DE 100 14 804 A1描述了一种发光模块,其具有两个由薄板冲裁成的导体电路,其由塑料的载体材料包封。导体电路和载体材料共同构成用于多个串联的LED的载体。为了制造此载体,由薄板冲裁出导体电路,其中,保留为了后续加工而用于稳定冲裁后的薄板的运输条和连接梁。在较晚的时间点再去除此运输条和连接梁。在冲裁工序之后,使用用作载体材料的塑料包封导体电路,从而建立导体电路之间持久的机械连接。在此,导体电路的用于装载LED的侧面上保持没有塑料。LED的固定通过SMD钎焊技术(SMD表示“Surface-mountdevice”)进行,其中,为导体电路施用焊膏,接着装载LED并继而通过熔炉的红外线加热,由此使焊膏熔化。由此方式将LED与导体电路相连。
为了执行上述方法,需要压铸机,从而为了制造载体而使用塑料包封导体电路。这技术复杂、昂贵并且还需要大量的塑料,塑料在钎焊过程期间还必须符合高热力要求。为此,DE 100 14 804 A1使用了弹性的塑料,从而实现发光模块对不同灯具形状的一定的可匹配性。尽管如此,由于载体材料,发光模块的可弯曲性以及由此的灵活度都受到限制。
发明内容
本发明的目的在于,解决上述技术问题中的一种或多种,尤其提供一种用于在LED灯具、优选LED改装灯中使用的LED模块以及一种用于制造此种LED模块的方法,其以技术简单、但是可靠并稳定的方式实现对LED灯具的高的几何适应性。
此目的通过具有权利要求1的特征的LED模块以及一种具有权利要求10的特征的方法实现。有利的扩展方案由从属权利要求、本发明的下列附图及优选实施例的说明中给出。
根据本发明的LED模块设计用于在LED灯具中使用。在此,LED灯具优选为所谓的LED改装灯,例如具有传统白炽灯泡的外形以及螺旋灯头,此螺旋灯头设计用于传统灯座或销接触灯座,例如用于GU10灯座的改装灯、用于G4或G9灯座的销灯头灯或者用于G13灯座的荧光灯管。为此目的,LED灯具优选具有LED驱动器,其将由灯座提供的电网电压转换为适用于LED的形式。
根据本发明的LED模块具有引线框架,其为金属导体框架,例如由薄板冲裁、剪裁或蚀刻形成。在未折弯或尚未折弯的情况下,此引线框架为平面的构成物,其具有两个相对的、基本平行延伸的、间距为薄板厚度的表面。引线框架可例如由低成本的材料制成,例如钢,或者由具有高导热率的材料制成,例如铜,或者由视觉上看起来高品质的金属制成,例如黄铜。薄板厚度优选在0.1mm至2mm的范围内,更加优选在0.2mm至0.8m的范围内。尤其考虑能够用于印刷电路板(PCB)的材料。此外,引线框架可具有涂层,例如具有Sn层、Zn层、Au层、Ag层、Pt层、Pd层或者Ni层,和/或引线框架的表面可以部分地或者完全地打毛。尤其引线框架的部分区域可设置反光的、例如白色的涂层。为了在LED灯具中固定和电气连接,LED模块具有接头,其例如可以为引线框架的集成的或一件式的区段,或者为钎焊到引线框架上的导体。通过例如将弹簧触点集成在引线框架内可以在必要时节约SMD弹簧接触件或者连接插头。
根据本发明,LED模块还具有一个或多个与引线框架电气并机械相连的LED。LED优选焊接在引线框架相应的连接位置处,例如借助SMD工艺。LED可构造为一件式的半导体元件或者也可为多件式的零件。
根据本发明,LED模块还具有一个或多个由绝缘材料制成的稳定区段,其局部地、优选点状地和/或线状地嵌入引线框架的中间区域中,从而使引线框架的区段彼此固定并优选彼此间隔。
就此而言,“局部”尤其意味着,引线框架不完全地或者大部分地嵌入例如由塑料制成的壳体或外套中。因此,稳定区段的特征在于,其有针对性地设置在引线框架的需要稳定性和必要时需要间隔的位置处,从而保证LED模块机械的及电气的功能性。稳定区段可尤其设置在例如为间隙的中间区域内,从而避免意外的共同弯曲以及对引线框架绝缘区段的电气接触。
稳定区段优选由聚合物和/或玻璃和/或陶瓷和/或粘合剂和/或具有绝缘特性的SMD元件制成。具有绝缘特性的SMD元件包括:具有百万欧级或千兆欧级的极高电阻的电阻,沿着截止方向的二极管,用于直流电的电容或类似元件。环氧树脂粘合剂证实为有利的聚合物,其纵向膨胀系数(CTE)与LED的可能具有的聚合物壳体处于相同的数量级并因此在交替的温差应力下不造成对LED的热力负载。替代地或额外地,也考虑其他聚合物,例如热塑性塑料、如PC、PMMA、PBT,热固性塑料或者弹性体,例如硅树脂。
如此构造的LED模块可以不具有壳体或者不具有完全地或大部分地嵌入引线框架的塑料载体。不需要设置压铸机和为引线框架包封载体材料的工序,由此降低了制造投入,尤其成本和时间。不存在用于制造塑料模具的成本。因为LED模块使用没有载体的引线框架,所以,其还特别易弯曲,可三维变形并因此能够灵活地用于不同的LED灯具。此外,由此,LED模块的光辐射特性可尤其调整为多面的。通过金属的引线框架的导热性以及LED模块的开放式构造方式,还有效地避免了局部集热,由此,在一些实施形式中能够省却用于散热的特殊措施。在视觉审美方面,金属的引线框架电路板也看起来例如比由FR4制成的传统电路板更高品质。在特殊的LED灯具中,电路板可用作视觉吸睛点。此外,没有壳体和载体的开放式构造方式还实现了借助激光刻印或光化学蚀刻工艺刻印或蚀刻标识,例如二维码或灯具标签,由此,LED模块的视觉外观可灵活地调整。
引线框架的两个表面优选绝大部分不与稳定区段的材料接触。“绝大部分”意味着,两个表面中(单独观察)大于一半、优选大于80%不与稳定区段接触。优选引线框架的两个表面(单独观察)绝大部分(在前述含义下)为裸露的,也就是说,也不与LED、SMD元件、焊点等接触。由此,进一步改善了上述灵活性并进一步降低了制造投入。
出于相同的理由,各个稳定区段优选为可区分的,也就是说,其不与引线框架的数量级内的构造物重叠。因此,各个稳定区段的范围优选仅对应于引线框架整个范围的仅一小部分。引线框架尤其具有优选电气绝缘的中间区域,例如间隙或间隙区段,其不被填充,并因此在厚度方向上完全贯穿引线框架。稳定区段的范围优选基本符合待桥接的中间区域的数量级。
引线框架优选完全地或局部地涂覆白色的反光涂层,其中在此,一个、多个或所有LED可以被覆盖或遮掩。
优选引线框架至少部分地折弯,由此,一方面能够以简单的方式调整LED模块的光辐射特性,另一方面能够将LED模块变为适用于LED灯具的三维几何形状。优选引线框架沿着直线折叠180°,从而能够获得双面的光辐射,而无须对引线框架的两面装载。这简化了制造过程。此外,由此方式能够改善冷却效果,因为由LED产生的热量能够由更大的引线框架面积排出。
当由此方式将引线框架的两个区段彼此折叠时,此两个区段优选通过一个或多个稳定区段间隔或在必要时相连,由此阻止两个区段之间的电气接触。因此,涉及的稳定区段协同地用作彼此折叠的引线框架区段之间的间隔垫片。替代地或额外地,可以将由绝缘材料、例如塑料制成的间隔垫片安装在引线框架上。如果将绝缘磁体用作间隔垫片,则还能够以简单且独特的方式使折叠的引线框架区段固定。
引线框架优选两面都装载LED,也就是说,LED位于引线框架的两个表面上,由此,LED模块能够实施得尤其紧凑且节约材料。此外,还产生了有利的热力特性,由此,相比于传统的可双面装载的电路板材料,例如FR4、金属内核PCB MCPCB,LED模块特别低成本且可靠。
LED优选栅格状地布置。换而言之,LED构成二维的或三维的栅格,由此使LED模块的能够制造的几何形状更加灵活。LED、尤其栅格的所有LED优选通过引线框架串联。但是在特殊的实施形式中,也可使用并联电路或者由并联电路和串联电路构成的混合电路。
根据本发明的、用于制造根据前述说明的LED模块的方法包括:由薄板冲裁或化学蚀刻或剪裁出引线框架,其中,优选暂时保留不成为制成的LED模块的一部分的连接梁和/或运输区段;通过将LED与引线框架电气地且机械地相连、优选钎焊,使用LED装载引线框架;在引线框架的中间区域中局部地引入绝缘材料、优选聚合物和/或玻璃和/或陶瓷和/或绝缘的SMD元件,由此构成稳定区段,从而稳定引线框架。
上述方法步骤的说明不规定顺序。因此,例如使用LED装载引线框架既可以在稳定步骤之前、也可以在其之后进行。同时实施也是可能的,尤其在借助SMD元件执行绝缘的稳定的情况下。
优选取消对引线框架的此种包封,即,构造引线框架完全地或大部分地嵌入其中的壳体或塑料载体。
优选至少部分地打毛和/或覆涂引线框架的一个或两个表面,优选使用Sn层、Zn层、Au层、Ag层、Pd层、Pt层或Ni层覆涂。除了保护引线框架免受可能的外部影响以外,由此还能够提高热量排放值。这促使LED处的温度降低,从而避免对LED的光辐射特性的影响并改善耐久性。
引线框架优选完全地或部分地具有反光的、例如白色的涂层。
引线框架的一个或两个表面优选设置有雕刻,优选激光刻印和/或光化学蚀刻结构。
优选引线框架至少部分弯曲,例如在使用LED装载引线框架之后并且在通过引入稳定区段而进行稳定之后。
针对LED模块说明的技术作用、优选的实施形式和对现有技术的贡献类似地适用于制造方法。
本发明的其他优点和特征由下文中对优选实施例的说明中给出。在此所述的特征能够独立地或者与一个或多个前述特征结合地实施,只要这些特征不矛盾。在此,对优选实施例进行的下列说明参照附图进行。
附图说明
图1a和1b由前方(图1a)和由后方(图1b)示出了装载有多个LED的、稳定的引线框架的LED模块。
图2a和2b示出了根据另一实施例的LED模块,其中,示出了在引线框架的折弯过程以前(图2a)和之后(图2b)的LED模块。
图3示出了根据另一实施例的LED模块。
图4示出了根据另一实施例的LED模块。
图5a至5c示出了根据另一实施例的LED模块,其中,图5b和5c示出了不同的折弯和装载配置。
图6a至6c示出了根据另一实施例的LED模块,其具有两件式的引线框架;在此,图6a和6b示出了在制造过程中的半成品,并且图6c示出了完成的LED模块。
图7a至7c示出了根据不同实施例的LED模块在LED灯具中的可能的应用。
图8a,8b和8c示出了用于制造LED模块的半成品。
图9a至9h示出了不同实施例的引线框架几何形状。
具体实施方式
下面根据附图说明优选的实施例。在此,不同附图中相同的、类似的或作用相同的元件使用相同的附图标记,并部分地省却了对这些元件的重复性说明,从而避免赘述。
图1a示出了根据第一实施例的LED模块1,其由在此称为“前面”的侧面观察。图1b示出了从相对的侧面、即“背面”观察的LED模块1。
LED模块1具有引线框架(Leadframe)10,其为由薄板冲裁或剪裁成的金属导体框。引线框架10可例如由低成本的材料制成,例如钢,或者由导热性能高的材料制成,例如铜。尤其考虑能够用于印刷电路板(PCB)的材料。如果使用了磁性材料,如磁性钢,则能够简化LED模块1的连接和光学校准。此外,引线框架10还可具有涂层,例如具有Sn层或Ni层。在引线框架10上焊接有或作为引线框架的集成的组成部分地连接有接头11,其用于固定在灯具中并进行电气连接(参见附图7a至7c)。
引线框架10构成导体电路,其在图1a和1b的示例中实现了多个LED 12的串联。为此目的,LED 12借助SMD工艺安装到引线框架10的相应连接位置上。LED 12分别桥接引线框架10的绝缘的中间区域13,从而LED 12有利于引线框架10的稳定性。
为了进一步并最终地稳定引线框架10,设置点状或线状的稳定区段14,其由绝缘材料-例如聚合物、玻璃、粘合剂、陶瓷或绝缘SMD元件-制成并桥接了一个或多个在此称作间隙的中间区域13。稳定区段14至少部分地嵌入中间区域13中,从而稳定引线框架10相应的区段并使其彼此间隔。稳定区段14的特征在于,其局部地设置在引线框架的需要间隔和稳定性的位置处,从而保证LED模块1的机械的及电气的功能性。因此,稳定区段14尤其设置在中间区域13中,从而避免意外的共同弯曲和电气接触引线框架10的绝缘区段。
如此构造的LED模块1适用于没有稳定的壳体并且没有塑料载体的情况,其中,引线框架10完全地或大部分地嵌入此壳体或塑料载体中。尤其不需要设置压铸机和使用载体材料包封引线框架10的工序。因为LED模块1使用不具有载体的引线框架10,所以,其还十分柔软、能够三维变形并因此能够灵活地用于不同的LED灯具。相比于具有塑料载体的LED模块,简化了制造过程,降低了制造成本和产品成本。通过引线框架10的高导热性能以及LED模块1的开放式构造方式,还有效地避免了局部集热,由此,在一些实施变体中能够省却用于散热的特殊措施。
引线框架10可单面或双面装载LED 12。
根据在图2a和2b中所示的实施例,也能够由此实现双面光辐射,即,如图2b中所示地弯折经过冲裁或剪裁、装配和稳定的引线框架10(图2a)。在一些情况下,稳定区段14中的一个或多个能够协同地用作待折向彼此的引线框架区段之间的间隔垫片。替代地或额外地,可将由绝缘材料、例如塑料制成的间隔垫片安装在引线框架10上。如果使用绝缘磁体作为间隔垫片,则还能够以简单且独特的方式使弯折的引线框架区段彼此固定。
通过在生产工序中弯曲引线框架10,能够以简单的方式调整光辐射特性。尤其能够根据图2b的实施例获得双面光辐射,而无须双面装载引线框架。这简化了制造过程。此外,由此方式还能够改善冷却作用,因为由LED产生的热量能够由更大的引线框架面积导出。
图3示出了根据另一实施例的LED模块1,其中,引线框架10具有平面的圆形形状。图4中的实施例示出了通过折弯引线框架薄板的区段而获得的引线框架10的三维形状。
图5a示出了根据另一实施例的具有引线框架10的LED模块1,此引线框架具有冲裁或剪裁的引线框架区段10′。引线框架区段10′可单独地弯折,由此能够获得灵活的光辐射特性。尤其能够以不同的方式弯折图5a中的基本形状并为其装载LED 12,如图5b和5c中所示地,由此以简单的方式能够实现可灵活调节的光分布。
图6a至6c示出了一组其他的实施例,其特征为具有唯一的LED12的、例如用于单点光源灯具的LED模块1。引线框架10分为两部分,在两个引线框架区段10a和10b之间具有间隙13。在此,图6a示出了半成品200,其中,两个引线框架区段10a和10b通过稳定区段14彼此相连。同时,稳定区段14以可靠的方式使两个引线框架区段10a和10b彼此间隔。此外,在图6a中示出了两个接触区段15,其设置用于与SMD元件、如简单的连接器或弹簧触点相连。在图6b中示出了半成品200,其中,两个引线框架区段10a和10b还借助连接梁201相连。图6c示出了在使用LED 12装载半成品200的引线框架10之后的LED模块1。
图7a至7c示出了上述LED模块1在LED灯具100中的示例性用途,此LED灯具具有带有螺旋灯头的传统白炽灯泡的外形。普遍来讲,LED灯具100可以为所谓的LED改装灯,其设计用于在传统的灯座中使用。为此目的,LED灯具100优选具有LED驱动器(未示出),其将由灯座提供的电网电压转换为适用于LED 12的形式。
需要指出,LED模块1能够多样地使用,例如用于设计用于荧光灯管灯头的管状灯具、LED改装灯具、LED条形灯、LED灯丝、平面灯具嵌板、聚光灯、对准光辐射体、线性灯具、工矿灯、手电筒、壁灯和/或顶灯等。尤其在具有大的LED电路板的LED灯具中可以有利地使用前述引线框架原理。
为了制造LED模块1,根据一种实施例,首先由导电的薄板冲裁或剪裁出多个引线框架10,如图8a中所示,在必要时,保留连接梁201和/或运输区段202,此二者暂时机械地稳定半成品200从而用于运输和后续加工,并在之后的时间点被去除。引线框架10还可以由预制的穿孔薄板和/或穿槽薄板加工,从而节约订制分离时的切割时间。此外,还可以打毛和/或覆涂引线框架10的表面。因此,在引线框架10的热量排放值升高时,这促使LED 12处的温度降低。此外,还可以通过涂层提高光效率。在另一制造工序中,通过至少部分地在引线框架10的中间区域13中嵌入、例如注入绝缘材料(例如聚合物和/或玻璃和/或陶瓷),嵌入或安装了一个或多个稳定区段14。在一个可以在之前、同时或紧接着执行的制造工序中,将LED 12固定在引线框架10上,由此制造由多个装载的并彼此相连的引线框架10组成的半成品200,其在图8b中示意性地示出。使用LED 12装载引线框架10可借助SMD工艺完成。因此,引线框架10可以在相应位置处设置焊膏,接着装载LED 12并加热,从而熔化焊膏并使其与引线框架10和LED 12的接头相连。LED 12的连接和固定也能够以其他的技术手段完成。此外,焊点可用于引线框架区段的机械稳定和/或电气连接。此外,在另一制造工序中,如果接头11并非已经集成地或一件式地构造为引线框架10的组成部分,则将接头焊接在引线框架10上。如果存在上述连接梁201和/或运输区段202则将其去除。在另一制造工序中,在必要时通过折弯将LED模块1转变为期望的三维形状。
为了在SMD装载过程中保证引线框架半成品的高的机械稳定性,可设置U形、V形、W形和/或L形结构的运输区段202或其部分。这例如在图8c中可见。在此,优选由辊折弯的薄板的横向受到弯曲。在此,如果运输区段202仅向下构型或弯曲,则不影响可能的刮平过程(SMD焊膏覆涂)。此稳定措施显著地提高了薄板在生产过程中的刚性,并促使例如厚度<0.6mm的较薄的薄板可以使用。优选运输区段202至少在纵向边缘上、例如在约10mm的宽度中为平的,从而简化运输过程。优选在从薄板卷中分割出引线框架半成品时就已经加工形成了运输区段202的用于稳定性的U形、V形、W形和/或L形的轮廓。
在上述实施例中,LED 12通过引线框架10串联。但是,也可实施不同的几何结构,也就是说LED 12的电路和空间布置。例如,可以参见图9a至9h中的引线框架几何结构。
图9a示出了在引线框架10上的串联的LED 12的平面栅格型布置。稳定区段14以可靠的方式保证LED模块1的机械稳定性和电气功能性。图9b示出了一种几何结构,其中,LED12同样串联并栅格型地布置,但设置了更少的稳定点14。由此,图9b中的LED模块1能够特别灵活地弯曲,由此适用于特殊的灯具形状,例如全向发光的灯具。根据此实施例,引线框架10的区段之间的电气接触部分地通过连接区段16实现,其可例如通过钎焊制造。在弯曲后,引线框架10的三维形状可例如通过其他稳定区段14固定。图9c的实施例中示出了部分并联的LED 12的电路,从而显示,所述的强化的引线框架10的原理不限于串联的LED 12。图9d至9f示出了具有不同类型地安装的稳定区段14的受到稳定的条形的引线框架10的实施例。在此,LED 12串联。具有并联的LED 12的受到稳定的条形的引线框架10由图9g中示出。图9h中示出了由并联和串联的LED 12组成的混合体。
只要可用,实施例中所示的全部单独的特征都可以彼此结合和/或替换,而不脱离本发明的范围。
附图标记说明
1 LED模块
10 引线框架
10′ 引线框架区段
10a 引线框架区段
10b 引线框架区段
11 接头
12 LED
13 中间区域/间隙
14 稳定区段
15 接触区段
16 连接区段
100 LED灯具
200 半成品
201 连接梁
202 运输区段
Claims (14)
1.用于LED灯具(100)中的LED模块(1),所述LED模块具有引线框架(10)和与所述引线框架(10)电气且机械相连的一个或多个LED(12),其中,
所述LED模块(1)还具有由绝缘材料制成的一个或多个稳定区段(14),所述稳定区段局部地嵌入所述引线框架(10)的中间区域(13)中,从而使所述引线框架(10)的区段彼此固定。
2.根据权利要求1所述的LED模块(1),其特征在于,所述稳定区段(14)由聚合物和/或玻璃和/或陶瓷和/或具有绝缘特性的SMD元件制成。
3.根据权利要求1或2所述的LED模块(1),其特征在于,所述引线框架(10)的两个侧面的表面都绝大部分地不与所述稳定区段(14)的材料接触。
4.根据权利要求1所述的LED模块(1),其特征在于,所述引线框架(10)具有电气绝缘的中间区域(13),所述中间区域不受到填充并且因此在厚度方向上完全地贯穿所述引线框架(10)。
5.根据权利要求1所述的LED模块(1),其特征在于,所述引线框架至少部分地折弯。
6.根据权利要求5所述的LED模块(1),其特征在于,所述引线框架(10)的彼此折叠的两个区段通过一个或多个所述稳定区段(14)间隔。
7.根据权利要求1所述的LED模块(1),其特征在于,所述引线框架(10)两面都装载有LED(12)。
8.根据权利要求1所述的LED模块(1),其特征在于,所述LED(12)栅格状地和/或线状地和/或环形地布置。
9.根据权利要求1所述的LED模块(1),其特征在于,所述LED(12)通过所述引线框架(10)串联,或者由串联电路和并联电路的组合形式连接。
10.用于制造根据前述权利要求中任一项所述的LED模块(1)的方法,所述方法包括:
由薄板冲裁、剪裁或蚀刻引线框架(10);
将LED(12)电气地且机械地与所述引线框架(10)相连,从而使用LED(12)装载所述引线框架(10);
在所述引线框架(10)的中间区域(13)中局部地引入绝缘材料,由此构成稳定区段(14),从而稳定所述引线框架(10)。
11.根据权利要求10所述的方法,其特征在于,省却对所述引线框架(10)完全的或部分的包封。
12.根据权利要求10或11所述的方法,其特征在于,至少部分地打毛和/或覆涂所述引线框架(10)的一个或两个表面。
13.根据权利要求10所述的方法,其特征在于,所述引线框架(10)的一个或两个表面设有反光的涂层和/或雕刻。
14.根据权利要求10所述的方法,其特征在于,所述引线框架(10)至少部分地弯折。
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