CN109904103A - A kind of silicon dice transfer device and silicon test device - Google Patents

Abstract

A kind of silicon dice transfer device and silicon test device, belong to semiconductor test field.Silicon dice transfer device includes: ontology, multiple mechanical arms, adsorption piece.Multiple mechanical arm is independently rotatably connected at ontology.Each of multiple mechanical arm mechanical arm includes the body of rod.Wherein, the both ends of the body of rod are connect with ontology, adsorption piece respectively, and adsorption piece is configured to absorption silicon wafer and allows silicon wafer selectively De contamination.The transfer device has a variety of operating attitudes, and it is possible thereby to so that the silicon wafer of control is carried out the on-demand conversion between many attitude, to reach the operation for cooperating appropriate equipment such as to be sorted, detected to silicon wafer.

Description

A kind of silicon dice transfer device and silicon test device

Technical field

This application involves semiconductor test fields, in particular to a kind of silicon dice transfer device and silicon test device.

Background technique

Semiconductor electronic level silicon wafer is the basic raw material of semiconductor industry.Product standard and type is many in semiconductor industry It is more.Silicon wafer needed for different size type product is also different in quality requirements such as size, crystal orientation, resistance, thickness.The inspection of silicon wafer Through entire technical process, mass property mainly includes that electrical parameter, crystallographic parameters, geometric parameter and appearance surfaces are clean Cleanliness parameter.The content that supplied materials silicon wafer need to detect at present is as follows:

1. silicon wafer electrical parameter: conduction type, resistivity, change in resistance and resistivity striped etc.；

2. silicon wafer crystallographic parameters: surface is orientated, with reference to planar orientation, vortex and oxidation induced defect etc.；

3. silicon wafer geometric parameter: diameter, thickness, thickness change, curvature, angularity, flatness, reference planes or notch Size, edge contour and its shape etc.；

4. silicon chip surface parameter: surface cleanliness, surface integrity and it is all types of stain, damage etc. limits.

Tester table in the related technology generallys use semi- or fully automated integral structure, and each board is only capable of Test a kind of limitation of parameter.In order to carrying out the test of multi-parameter, need for silicon wafer to be transferred to corresponding test equipment, into Row test.But existing equipment is often based upon single test purpose design, therefore its flexibility is poor.For measuring multiple parameters Demand, need silicon wafer can by it is complete, be nondestructively desirably transferred to test equipment.

However, there is no such equipment at present.

Summary of the invention

For improve, even solve the problems, such as it is in the prior art at least one, present applicant proposes a kind of silicon dice transfer devices And silicon test device.

The application is achieved in that

In a first aspect, the example of the application provides a kind of silicon dice transfer device.

Silicon dice transfer device includes:

Ontology；

Multiple mechanical arms, multiple mechanical arms are independently rotatably connected at ontology；

Each of multiple mechanical arms mechanical arm includes the body of rod；

Adsorption piece, the both ends of mechanical arm are connect with ontology, adsorption piece respectively, and adsorption piece is configured to absorption silicon wafer and permission Silicon wafer selectively De contamination.

The above silicon dice transfer device have multiple mechanical arms, and between multiple mechanical arm can self-movement, to make Device has selectable many attitude.Meanwhile mechanical arm by adsorption piece adsorb silicon wafer can reduce to a certain extent turn To the damage of silicon wafer during shifting.

Being transferred to silicon wafer with can be convenient thereby, it is possible to carrying out the device of complicated attitude motion different has different silicon The test device of piece Gesture, to realize that single device completes the multiple performance test of silicon wafer.

With reference to first aspect, in some optional examples of the first possible embodiment of the first aspect of the application In, adsorption piece includes the disc and suction nozzle connected that cooperate, and adsorption piece passes through suction silicon wafer and allows silicon wafer selectivity Ground De contamination, suction nozzle have the attachment surface for being configured to contact with silicon wafer, and the area of attachment surface is less than the silicon with preset area Piece.

The possible embodiment of with reference to first aspect the first, in second of possible reality of the first aspect of the application It applies in some optional examples of mode, the quantity of suction nozzle is multiple, and whole suction nozzles is uniformly distributed in disc in a ring.

Multiple suction nozzles are evenly distributed on disc, can be conducive to being uniformly distributed for active force.Whole suction as a result, In silicon wafer, silicon wafer and disc can uniform stressed, thus the problems such as avoiding the distortion of silicon wafer, deformation, while also making machinery The balance control of arm is more easily performed.

With reference to first aspect the first or second of possible embodiment, in the third of the first aspect of the application In some optional examples of possible embodiment, suction nozzle has multiple adsorption orifices, and each of multiple adsorption orifices, which all has, to be connect Sub- face is touched, attachment surface is made of the contact shoe face of multiple adsorption orifices.

Suction nozzle is constituted with multiple adsorption orifices, so as to further decrease the attachment surface with silicon wafer, avoids the dirt to silicon wafer Dye.Suction nozzle with multiple adsorption orifices constituted can in part with smaller adsorption force in silicon wafer, avoid silicon chip surface partial zones The excessive problem of domain stress, to also play a protective role to silicon wafer.

The third possible embodiment with reference to first aspect, in the 4th kind of possible reality of the first aspect of the application It applies in some optional examples of mode, adsorption orifice includes core, the wall body around core, between being formed between core and wall body Gap；Disc have for accommodate adsorption orifice and quantity at least with multiple adsorption orifices multiple suckers correspondingly.

By the way that adsorption orifice to be designed as to the micro-structure of optimization, can be further reduced to a certain extent and silicon chip surface Contact, and by the way that adsorption capacity appropriate can also be provided, to adsorb fixed silicon wafer.

The 4th kind of possible embodiment with reference to first aspect, in the 5th kind of possible reality of the first aspect of the application It applies in some optional examples of mode, one or both is made using soft material in core and wall body.

Core, the wall body contacted with silicon wafer is made using soft material, it can be to avoid adsorption capacity when adsorbing fixed silicon wafer Fluctuation leads to the damage to silicon wafer.In addition, with certain flexibility, therefore, being vibrated due to being made of soft material Or buffer function can be played when fluctuation, to also play protection to silicon wafer.

The third possible embodiment with reference to first aspect, in the 6th kind of possible reality of the first aspect of the application It applies in some optional examples of mode, core, wall body are protruding to outside sucker.

Core and wall body reach the outside of sucker, so as to so that the surface that is unlikely to of silicon wafer fully with adsorption piece Disc surface contact injures so as to reduce the striking off of non-adsorbed fixed area to a certain extent, wipe file.

The 6th kind of possible embodiment with reference to first aspect, in the 7th kind of possible reality of the first aspect of the application It applies in some optional examples of mode, silicon dice transfer device, which has, is configured to the carrier that constraint silicon wafer drives for mechanical arm.

It can satisfy certain special test needs using the fixed silicon wafer of carrier.Carrier can be with mechanical arm with convenient, suitable When mode connect, and the connection type between silicon wafer and carrier can according to test be selected.Alternatively, carrier and machine It is detachably connected between tool arm using universal joint, and the connection type of carrier and silicon wafer is constructed in advance as needed.

In second aspect, the example of the application provides a kind of silicon test device.

Silicon test device includes tester, optional silicon wafer storage platform, silicon dice transfer device.

Wherein, tester includes test device, silicon wafer storage platform.

Test device, optional silicon wafer storage platform around silicon dice transfer device arrangement, silicon dice transfer device be configured to by It is stored in the silicon chip extracting of silicon wafer storage platform and is transferred to test device to detect to silicon wafer.

Silicon dice transfer device and tester, silicon wafer storage platform cooperation, the storage of silicon wafer, movement and test are separated, can To be configured, be constructed to each apparatus relatively independently, be conducive to the maintenance and management of equipment.

In conjunction with second aspect, in some optional examples of the first possible embodiment of the second aspect of the application In, silicon wafer store platform have it is multiple and with tester together in a ring around around silicon dice transfer device.

There are tester multiple silicon wafers to store platform, therefore can store multiple silicon wafers.And in conjunction with the silicon with multi-pose Piece transfer device can quickly complete the multi-parameters test of multiple silicon wafers.

During implementation above, silicon dice transfer device provided by the embodiments of the present application passes through the machinery with flexible posture A variety of operating attitudes may be implemented in arm, in order to make silicon wafer that different postures be presented, and then meet test needs.

Detailed description of the invention

Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to needed in the embodiment attached Figure is briefly described, it should be understood that the following drawings illustrates only some embodiments of the application, therefore is not construed as pair The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this A little attached drawings obtain other relevant attached drawings.

Fig. 1 is a kind of structural schematic diagram of silicon dice transfer device provided by the embodiments of the present application；

Fig. 2 is the structural schematic diagram of another silicon dice transfer device provided by the embodiments of the present application；

Fig. 3 shows the structural schematic diagram of one of silicon dice transfer device provided by the embodiments of the present application adsorption piece；

Fig. 4 shows the structural schematic diagram of another adsorption piece in silicon dice transfer device provided by the embodiments of the present application；

Fig. 5 shows the structural schematic diagram of the test mould group in silicon dice transfer device provided by the embodiments of the present application；

Fig. 6 shows the structural schematic diagram at the first visual angle of silicon test device provided by the embodiments of the present application；

Fig. 7 shows the structural schematic diagram at the second visual angle of silicon test device provided by the embodiments of the present application.

Icon: 100- silicon dice transfer device；101- ontology；1011- elevating mechanism；102- mechanical arm；The 1021- body of rod； 1022- rotary shaft；103- adsorption piece；1031- disc；1032- suction nozzle；10321- wall body；10322- core；201- integration testing Mould group；202- test module；203- test panel card slot；204- test equipment cabinet；205- silicon wafer card slot；206- test arm is fixed Axis；207- test arm；208- test template pallet；301- silicon wafer card plug box；302- mechanical arm and platform；305- integration testing Instrument.

Specific embodiment

To keep the purposes, technical schemes and advantages of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application In attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is Some embodiments of the present application, instead of all the embodiments.The application being usually described and illustrated herein in the accompanying drawings is implemented The component of example can be arranged and be designed with a variety of different configurations.Therefore, the reality to the application provided in the accompanying drawings below The detailed description for applying example is not intended to limit claimed scope of the present application, but is merely representative of the selected implementation of the application Example.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts Every other embodiment, shall fall in the protection scope of this application.

Due to the imperfection sensitivity and its relatively high quality requirement of silicon wafer, therefore, it is necessary to detect to silicon wafer And test, ensure the quality of subsequent product such as chip to reject underproof silicon wafer.

In practical operation, silicon wafer usually needs to undergo a variety of tests.

Generally, operation test is carried out using automation or Semi-automatic device in the related technology.However, use some in this way It is arranged in the equipment of test both for specific a kind of or one kind test parameter requirement.Therefore, in order to complete silicon wafer Complete test is frequently necessary between devices move silicon wafer.

But just it has been observed that the single parameter due to silicon wafer is tested often through single equipment, this results in silicon wafer Complete test can be relatively cumbersome, and silicon wafer be easy to occur in moving process it is damaged, to make its efficient multi-parameters test Compare and is difficult to realize.

First aspect.

In view of above content, inventor be directed to status the problem of attempt solve.In example, inventor is mentioned A kind of equipment for enabling silicon wafer to be more convenient movement during the test is gone out.As will be hereinafter explained: this sets It is standby to can be applied in system or the device of multiple test equipments, and equipment can be such that silicon wafer shifts between test equipment, The pose adjustment that each test equipment completes its corresponding test request can also be corresponded to simultaneously.

More preferably, although silicon wafer is by the adjustment of carry out many attitude and motion mode, silicon wafer is undergoing these It is also able to retain its own when adjustment not to be destroyed or will not be affected and unqualified.For example, can be with using the equipment in example Silicon wafer is set to complete a variety of tests, additionally it is possible to keep its surface integrity (warpage, deformation of unevenness etc. if there is not), cleanliness (if not being contaminated) etc..

For becoming apparent from, the equipment in the application example will be referred to below and be said with silicon dice transfer device 100 Bright, detailed content is referring to Figure 1 to Fig. 7.

Silicon dice transfer device 100 includes ontology 101, mechanical arm 102, adsorption piece 103.Wherein, mechanical arm 102 respectively and this Body 101, adsorption piece 103 connect.Wherein adsorption piece 103 is the component for adsorbing silicon wafer, and mechanical arm 102 can carry out appropriate Movement is to drive adsorption piece 103 can also, so that silicon wafer be made to be moved.

First part, ontology 101 (or platform/support platform can be referred to as).

Ontology 101 is normally used as the basis of transfer device and is provided and uses.It is mechanical arm 102 and adsorption piece 103 and other component one directly or indirectly connecting portion and attachment point, tie point are provided.Ontology 101 is also each Component provides stable state (such as original state, posture), so that mechanical arm 102 is moved to desired purpose.This is often meaned , ontology 101 is fixedly to be arranged or be at least fixed when in use.The movement of mechanical arm 102 can this as a result, Body 101 is referring to implementation accurately movement.

However, needing may desire to ontology 101 based on installation, maintenance etc. can also be moved.This can be by ontology The 101 installation equipment such as movement mechanism or idler wheel are realized.Or the mobile demand for ontology 101, be provided independently one it is removable Motivation structure, ontology 101 can be placed in movement mechanism.Movement mechanism lock and be fixed ontology 101, movement mechanism movement with Just change the spatial position of ontology 101.

In a kind of example, ontology 101 can take column structure to be arranged, such as cylindrical body or prism (such as triangular prism, four Prism etc.).The physical structures such as height of ontology 101 size can carry out the setting of selectivity according to actual demand, show It is not limited particularly in example.It, can be to its height based on needs although being not particularly limited to its height Degree carries out certain design.For example, making ontology 101 can be with using 1011/ lifter of elevating mechanism (such as cylinder, hydraulic cylinder) Adjustment height on demand.Alternatively, the structure of ontology 101 can be such as hydraulic cylinder.In such scheme, ontology 101 is generallyd use The mode that more piece is arranged is arranged.In addition, inner space (such as accommodating cavity) also can be set in ontology 101, to accommodate based on needing Various components, such as be routed.It is understood that for the ontology 101 with accommodating cavity, with what can selectively be opened and closed Door.

For convenience of description, the definition of ontology 101 has a first end and second end, and its substantially extended by first end to second end and At.Wherein, first end often with various work tops (such as ground) contact/fixation；Second end with mechanical arm 102 Deng to connect It connects.

Second part, mechanical arm 102.

Mechanical arm 102 is set in such a way that one end is connected to the first end-of 101-ontology of ontology 101, while mechanical The other end of arm 102 is connect with adsorption piece 103.Mechanical arm 102 is the main motion parts of silicon dice transfer device 100, is executed With complete most motor performance, and thus driving adsorption piece 103 moved together with it.

The motion mode of mechanical arm 102 can have elongation, shortening, rotation etc., and each motion mode can be carried out independently Implementation can be combined.The motion-promotion force of mechanical arm 102 can be mainly made up of motor, speed reducer or hydraulic system.But Based on the convenience used, motor driven is a kind of beneficial selection and trial.

In example, the posture of mechanical arm 102 is linear type or may be shaped form, specifically can be according to its construction not With and with different selections, therefore also there is different motion modes.

For example, when there is mechanical arm 102 an independent body of rod 1021 to constitute, such as can surround and ontology 101 First end connecting portion is moved, such as is rotated.Such as ontology 101 is in the scheme of quadrangular, the rotation of mechanical arm 102 is transported Dynamic mode can be using the first surface of the first end perpendicular to ontology 101 (top surface of quadrangular) straight line as rotary shaft 1022；Or using second surface (side surface of the quadrangular) straight line of the first end perpendicular to ontology 101 as rotary shaft 1022；Or Person, mechanical arm 102 have both both aforementioned motion mode.The rotary motion of mechanical arm 102 can be provided dynamic by the rotation of motor Power is embodiment.Therefore, the output shaft of motor can be conllinear with 1022 line of rotary shaft of mechanical arm 102.Or pass through gear knot Structure carries out cooperation transmission.

In another example, mechanical arm 102 has multiple bodies of rod 1021.The quantity of the body of rod 1021 can be two, three It is a, four, it is even more, be not particularly limited.It is connected between each body of rod 1021 by such as hinge, and electricity can be fitted through Machine realizes rotation.It can be rotated between two bodies of rod 1021 interconnected with 1022 line of common axis of rotation, and mechanical arm 102 There is 1022 line of multiple rotary shafts in varying numbers, and each 1022 line of rotary shaft in a kind of example according to the number of the body of rod 1021 It is parallel to each other.For example, illustrating by taking the ontology 101 of above-mentioned quadrangular as an example, the first end of the body of rod 1021 and ontology 101 rotates Top surface of the axis of connecting portion perpendicular to ontology 101.Alternatively, each 1022 line of rotary shaft can also and it is not all parallel, It such as can be partially parallel, partially vertical.In this way, more postures may be implemented in mechanical arm 102.

It further, can be to the of mechanical arm 102 and ontology 101 in order to keep the athletic posture of mechanical arm 102 richer One end connection type is adjusted.For example, mechanical arm 102 integrally can go up and down (separate or close) relative to ontology 101, because This, the flexible and lifting of mechanical arm 102 can be with aggregate motion.As a kind of implementation, can be set in the accommodating cavity of ontology 101 Lifting platform is set, top surface has the through-hole with accommodating cavity perforation connection.Lifting platform can be reached partly or entirely outside through-hole. Mechanical arm 102 is then connected to lifting platform by the body of rod 1021.Lifting platform can be constructed by way of hydraulic boosting.

The quantity of mechanical arm 102 is optional.For example, a mechanical arm 102 or two mechanical arms 102 etc..When depositing In the mechanical arm 102 of two or more, each mechanical arm 102 is independently rotatably connected at ontology 101.

For generally, mechanical arm 102 (mechanical arm) may include computer control device, telescopic moving rotating arm, absorption Device (one and more than one), sensor device and power device.Wherein, computer control device controls entire manipulator The operation of arm；Wherein, telescopic moving rotating arm is connect with computer control device, is moved at the control along preset direction, Quan Fang Sucker is moved to designated position by position, multi-angle.Wherein, adsorbent equipment and sensor device and power device, which are all fixed on, stretches It contracts on mobile rotating arm, the moving arm is used for separate or close object to be adsorbed, and operating is driven using servo motor；Sensing Device device is made of multiple sensors, for incuding the orientation of telescopic moving rotating arm, while to whether there is in binding domain Absorbent bodies such as vacuum pressure of silicon wafer, absorption etc. can control in detail.Adsorbent equipment is distributed in the flat of telescopic moving rotating arm It on platform, individually directly positions, multiple arms are then uniformly distributed, and are designed in scissors hand or X-type shape, and multi-arm is parallel, increase platform Service efficiency and fluctuating plate and test speed.

Part III, adsorption piece 103.

Adsorption piece 103 is connected to mechanical arm 102, and is located at the both ends of mechanical arm 102 together with ontology 101.In machine Tool arm 102 includes in the scheme of a body of rod 1021, and connection type can be described as ontology 101 and adsorption piece 103 connects respectively It is connected to the both ends of the body of rod 1021.

Adsorption piece 103 is connect with the body of rod 1021 for constituting mechanical arm 102 by rotary shaft 1022.Rotary shaft 1022 can be by The output shaft for being embedded in the motor in the body of rod 1021 provides.Rotary shaft 1022 can be consistent with the length direction of the body of rod 1021. For example, when the body of rod 1021 is cylindrical body, the centre of gyration line of the output shaft of motor and the axis collinear of the body of rod 1021.In this way, logical Being appropriately arranged with for adsorption piece 103 is crossed, can make fixed silicon wafer that the movement such as overturning occur by adsorption piece 103.

Adsorption piece 103 is the component contacted with silicon wafer, and is that silicon wafer is fixed by way of absorption.Adsorb Part 103 is configured to absorption silicon wafer and allows silicon wafer selectively De contamination.In this way, passing through adsorption piece when needing transferring silicon chip 103 are fixed, and then can discharge silicon wafer by adsorption piece 103 when silicon wafer is transferred to desired locations.Suction type therein It is to be realized by negative-pressure adsorption.Therefore, in the alternative scheme in part, there is silicon dice transfer device 100 needle vacuum to fill Set-such as vacuum pump, air pump-and by pipeline transmit air to form negative pressure.

Since silicon wafer is usually to be provided with thin slice (such as circular piece), adsorption piece 103 may include the company of mutual cooperation The disc 1031 and suction nozzle 1032 connect.Suction nozzle 1032 is incorporated in disc 1031, and is cooperated by pipeline and vacuum generating device.Its In, suction nozzle 1032 is the component directly contacted with silicon wafer.Adsorption piece 103 adsorbs silicon wafer by suction nozzle 1032 and silicon wafer is allowed to select Property ground De contamination.It is considered based on what is protected to silicon wafer, the definition of suction nozzle 1032 has the attachment surface for being configured to contact with silicon wafer, and attached Face area be less than with preset area silicon wafer.In other words, the attachment surface of suction nozzle 1032 does not spread in silicon wafer fully Surface.In this way, the pollution to silicon wafer can reduced to a certain degree, destroy by reducing contact of the adsorption piece 103 with silicon wafer.

In order to adsorb fixed silicon wafer securely, can attempt to arrange more suction nozzles 1032, i.e., in silicon dice transfer device 100 Suction nozzle 1032 quantity can be it is multiple.It is inhaled in this way, increasing while reducing the contact surface of single suction nozzle 1032 and silicon wafer 1032 quantity of mouth, to also suitably ensure that silicon wafer is steady in the case where the contact area of totality and silicon wafer is relatively small Admittedly it is fixed.Further, for the scheme for being provided with multiple suction nozzles 1032, whole suction nozzles 1032 be can choose in a ring The mode of (such as concentric loop) is even to be distributed in disc 1031.Based on this, the size of disc 1031 can be with appropriate adjustment, to meet suction nozzle 1032 arrangement needs.For example, disc 1031 can have less than silicon wafer size or disc 1031 have be greater than or equal to The size of silicon wafer.For example, disc 1031 is round pie, circular piece piece, circle sheet etc., with silicon wafer same shape and size.Example Such as, shape can be in eggplant type or Pear-Shaped, rectangular, ellipse etc.；Size and shape can be different.

Can also adjust the make of suction nozzle 1032 except selective adjustment in the quantity to suction nozzle 1032 It is whole.In brief, suction nozzle 1032 can not be limited in a specific way there are many selection of make.

For example, suction nozzle 1032 can be made of solid memder, if suction nozzle 1032 is a sucker.Sucker has substantially round The shape of shape, and etat lacunaire is presented in middle section.By to the pressing of depressed section and its own or external recovery Rebound can form negative-pressure adsorption when with an intimate surface contact and fix.Such adsorption structure, the generation of negative pressure can be with Independent of equipment such as such as vacuum pumps.

In another example, suction nozzle 1032 can be comprised of multiple members, if suction nozzle 1032 includes multiple suckers.Inhale Mouth 1032 can be the array body structure being made of multiple suckers.

In other optional ways, suction nozzle 1032 can be to be made of adsorption orifice.The quantity of adsorption orifice can be one, It is also possible to multiple.There are multiple adsorption orifices in suction nozzle 1032, therefore, suction nozzle 1032 can be one and be made of multiple adsorption orifices Array body structure.Each of multiple adsorption orifices all has contact shoe face, to make the attachment surface of suction nozzle 1032 by all inhaling Whole contact shoe faces of attached mouth are constituted.Wherein adsorption orifice is also entity component, and it is solid individually can to form negative-pressure adsorption with silicon wafer It is fixed.For example, adsorption orifice be the sucker smaller compared to the sucker in 1032 implementation of suction nozzle of aforementioned single element (or Claim small sucker/attachment flaps).

Alternatively, each of multiple adsorption orifices of suction nozzle 1032 adsorption orifice is constituted to be accommodated in hole.For example, disk Piece 1031 have for accommodate adsorption orifice and quantity at least with multiple adsorption orifices multiple suckers correspondingly.That is, whole suctions Attached mouth is all contained in each sucker (adsorption orifice is corresponding with a sucker), and the two quantity is identical.Alternatively, the number of sucker Amount is more than adsorption orifice.

It, can be using such as rubber or silicon rubber suction cup for adsorption orifice.Alternatively, in another example, adsorption orifice can To be composite unit structure.Such as adsorption orifice may include core 10322, the wall body 10321 around core 10322.10322 He of core Wall body 10321 is generally annular configuration.Gap is formed between core 10322 and wall body 10321.Wherein, core 10322 can be with It is a hollow column structure, and main negative pressure is also generated by it and adsorbs silicon wafer.Wall body 10321 can play auxiliary, Cooperate the fixed silicon wafer of core 10322.

Toroidal cavity among core and wall body is the pipeline for connecting negative pressure, and core and wall body contribute to support, not have In the case where core, and can be used, core is added, is to avoid for supporting silicon chip because of the intracavitary negative pressure of vacuum of wall body It is excessive, cause fragment.

Due to relatively brittle by the quality of fixed silicon wafer, it is undesirable to it is damaged in moving process, therefore, core 10322 and wall body 10321 can using various appropriate materials material make.Generally, in core 10322 and wall body 10321 One of or both be made using soft material (such as silica gel, resin, rubber)；Or it is also possible to using soft modeling Material, silica gel, rubber etc. have can slight elastic deformation without the material that is damaged to silicon wafer itself, or to core, wall The materials such as one or more layers silica gel, rubber, fiber, plastics are adhered in body surface face.In addition, core 10322, wall body 10321 can be convex Out to arrangement outside sucker.In this way, can be reduced when that silicon wafer can be made to be fixed to avoid mostly being contacted with silicon chip surface The damage or pollution of silicon wafer.

In short, the sucker for being set to sucker takes symmetrical structure to arrange in optional some examples.Its quantity can be with It is sucker at 1-10, every place's sucker can be made of 1-10 small suckers, each small hole sucting diameter 1mm-50mm size.Sucker is taken Annular, sucker are prepared using soft materials such as rubber, silica gel, fibers, and Ring like suction disc can effectively adsorb silicon wafer, and have to silicon wafer Protective effect, crack caused by avoiding because of vacuum should split equivalent damage and interfacial contact bring scratch etc..Symmetry arrangement make by Power is uniform；Every cluster sucker has a pipeline and can be with pressure sensing, monitoring vacuum simultaneously.Sucker integrally protrude sucker or It is equal with sucker.

Since silicon wafer needs to carry out a variety of tests, some special testing requirements may be needed to use certain tool Auxiliary.Therefore, silicon dice transfer device 100 can also configure on demand is configured to the load that constraint silicon wafer drives for mechanical arm 102 Body.

This can be using test template pallet (abbreviation pallet) as example for the carrier of silicon wafer during the test.Carry out When partial test (when such as appearance is tested), the directly hanging silicon wafer of vacuum chuck is used.However, hanging test can make silicon wafer, there are quilts Sucker shield portions, so as to cause being difficult to measure.At this point, problem above can be evaded by taking the pallet of test template, to complete The test of silicon wafer needs.In a kind of example, pallet periphery is fixed, and tunable arrangement is then taken in middle section.It is matched with pallet, silicon wafer The also settable test template bracket of transfer device 100.The structure of test template bracket is set using three card slots and multidigit card slot It sets, the silicon wafer of 4 cun to 18 cun sizes can be used, while being also not necessarily limited to this size.Template pallet is hollow, convenient for test mould group pair The test on silicon wafer two sides.

Silicon dice transfer device 100 in example can mainly be used to that silicon wafer is made to be transferred to each position appropriate.And The test of silicon wafer can then be completed by various testing tools, as following contents that will be mentioned are shown.

Second aspect.

A kind of system that can be completed to silicon test can also be provided in the application example comprising testing tool and upper The silicon dice transfer device 100 stated.Silicon dice transfer device 100 to by silicon wafer from initial position transfer to testing tool, with It will pass through the test of testing tool.

Normally, silicon dice transfer device 100 can only execute the transfer operation of silicon wafer.When by transfer device by silicon wafer After being placed in testing tool, test operation can be completed only by testing tool.But in other examples, the test of silicon wafer It can be transfer device and testing tool and cooperate and carry out.Therefore, in examples some in this way, silicon wafer can be needed in test The adjustment of posture is carried out, and the adjustment of the posture may need the participation of transfer device.

Based on foregoing teachings, a kind of silicon test device is proposed in example comprising tester, silicon dice transfer device 100.Silicon dice transfer device 100 is configured to silicon wafer being transferred to tester to detect silicon wafer.Further, test dress It sets and may also include silicon wafer storage platform.As its name suggests, silicon wafer storage platform is for storing silicon wafer.Silicon dice transfer device 100 is by structure The silicon chip extracting of silicon wafer storage platform will be stored in and is transferred to test device to detect to silicon wafer by making.By the storage of silicon wafer It puts, test equipment and silicon wafer transfer equipment cooperation arrangement, so as to the system that is made of three with relatively higher efficiency, right Silicon wafer more safely carries out a variety of tests.

It is apparent from, transfer, convenient test based on silicon wafer consider, tester, silicon wafer storage platform can be around silicon wafer What the mode of transfer device 100 was laid out.In this way, the integrated level of test device is relatively higher, use is also more convenient, while being safeguarded Property, can also obtain certain promotion in terms of reliability.

Therefore, it for having both the test device of transfer and test silicon wafer above, can be used to realize the test of silicon wafer And sorting.For example, the silicon wafer of different quality is distinguished according to test result.It is expected to solve the test of silicon wafer using the device Efficient the problem of, reduces false detection rate, detection parameters diversification and protects the detection of silicon wafer complete.

In order to test simultaneously multiple silicon wafers, silicon wafer storage platform can be arranged multiple (such as 2,3,4 numbers Amount) and with test device together in a ring around around silicon dice transfer device 100.

Each test mould group of test equipment, including electrical testing mould group (conduction type, resistivity, change in resistance And resistivity striped etc.), crystallography test mould group (surface orientation, with reference to planar orientation, vortex and oxidation induced defect etc.), Geometrical test mould group (diameter, thickness, thickness change, curvature, angularity, flatness, reference planes or notch size, edge Profile and its shape etc.), surface test mould group (surface cleanliness, surface integrity and it is all types of stain, damage etc. limits) Single positioning or multiple it is evenly distributed on platform surrounding.

Silicon wafer is transferred on test pallet by the sucker suction on mechanical arm, and test mould group is tested.It tests To microcomputer, system is classified data summarization automatically according to specification after finishing, and is then sorted to different stage by arm In silicon wafer basket basket.

During the test, silicon wafer is different with the orientation of tester table, and partial parameters can be directly in the sucker of mechanical arm Upper test can also be fixed and is placed on the template of test, followed template to be moved to different platform and tested, while can also place Fixed bit postpones in template, 202 exercise test of test module.That is: it is moved between a. silicon wafer difference erect-position, test equipment mouth is solid It is fixed.B. silicon wafer is fixed, the mobile adaptation in test equipment port.C. silicon wafer is placed on the template, template movement to test equipment port.Or Person；A. it is moved between silicon wafer difference erect-position, test equipment mouth is fixed.Silicon wafer is fixed on test pallet, integrated test mould group Instrument mouth fixes (reasonable distribution is in test platform surrounding).B. silicon wafer is fixed, the mobile adaptation in test equipment port.Silicon wafer is fixed, The mobile adaptation (rotatable) in test equipment port.

For generally, refering to Fig. 5 of attached drawing.Test equipment can be a kind of integration testing mould group 201.It includes independent Test module 202, test panel card slot 203 (can fix, can also move up and down), for test equipment cabinet 204, silicon wafer card slot 205, 207 test arm fixing axle 206 of test arm, the adjustable test arm 207 of tool scale, test template pallet 208.Wherein, test template The outer diameter of pallet 208 is adjustable, in order to be supported to various sizes of equipment.

The overall structure of test device such as Fig. 6 and Fig. 7, including silicon wafer card plug box 301, mechanical arm and platform 302, Integration testing mould group 201, single test module 202, integration testing instrument 305.

For the above structure, the following advantage is included at least:

Silicon wafer uses novel sucker during movement, is effectively adsorbed in disk, while avoiding excessive contact, avoids Pollution and fragment risk.

The fluctuating plate of silicon wafer uses single machine arm, scissor mechanical arm or X-type or star-like mechanical arm, increases up and down Piece efficiency, to increase detectability.

Novel tray shape tests template, is the carrier of silicon test, effectively avoid with the contact in silicon test face, protection is easy Broken product, while silicon wafer is tested on test pallet with the movement of test module 202, local test tray number is according to test-strips Part is 1-9 test pallet, greatly increases testing efficiency.

The star-like design and matching test pallet of test module 202 increase space utilization rate.

Local test pallet can carry out size adjusting according to testing requirement, cover 4 cun -18 cun of test scope, simultaneously The shape (such as round, rectangular, irregular shape) of adjustable test silicon wafer, greatly increases testing efficiency.Test module 202 with Integrated mode reasonable layout is in test platform surrounding, and matching test pallet and the module demand tested, increase space are sharp With rate and test speed.

The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.

Claims (10)

1. a kind of silicon dice transfer device characterized by comprising

Ontology；

Multiple mechanical arms, the multiple mechanical arm are independently rotatably connected at the ontology；

Each of the multiple mechanical arm mechanical arm includes the body of rod；

Adsorption piece, the both ends of the mechanical arm are connect with the ontology, the adsorption piece respectively, and the adsorption piece is configured to inhale The attached silicon wafer and allow the silicon wafer selectively De contamination.

2. silicon dice transfer device according to claim 1, which is characterized in that the adsorption piece includes the connection that cooperates Disc and suction nozzle, the adsorption piece pass through silicon wafer described in the suction and allow the silicon wafer selectively De contamination, institute Stating suction nozzle has the attachment surface for being configured to contact with silicon wafer, and the area of the attachment surface is less than the silicon wafer with preset area.

3. silicon dice transfer device according to claim 2, which is characterized in that the quantity of the suction nozzle is multiple, and all Suction nozzle be uniformly distributed in the disc in a ring.

4. silicon dice transfer device according to claim 2 or 3, which is characterized in that the suction nozzle has multiple adsorption orifices, institute Each for stating multiple adsorption orifices all has contact shoe face, and the attachment surface is made of the contact shoe face of the multiple adsorption orifice.

5. silicon dice transfer device according to claim 4, which is characterized in that the adsorption orifice includes core, around described The wall body of core is formed with gap between the core and the wall body；

The disc have for accommodate the adsorption orifice and quantity at least with the multiple suctions correspondingly of the multiple adsorption orifice Hole.

6. silicon dice transfer device according to claim 5, which is characterized in that one or two in the core and the wall body Person is made using soft material.

7. silicon dice transfer device according to claim 5, which is characterized in that the core, the wall body are protruding to described Outside sucker.

8. silicon dice transfer device according to claim 1, which is characterized in that the silicon dice transfer device, which has, to be configured to The carrier that constraint silicon wafer drives for the mechanical arm.

9. a kind of silicon test device, which is characterized in that store platform, tester, such as claim 1~8 including optional silicon wafer Any one of described in silicon dice transfer device；The tester, the optional silicon wafer storage platform are shifted around the silicon wafer Device arrangement, the silicon dice transfer device are configured to that the silicon chip extracting of the silicon wafer storage platform will be stored in and are transferred to described Tester is to detect silicon wafer.

10. silicon test device according to claim 9, which is characterized in that silicon wafer storage platform have it is multiple and with The tester is together in a ring around around the silicon dice transfer device.