CN1152534A - Vacuum tweezers - Google Patents
Vacuum tweezers Download PDFInfo
- Publication number
- CN1152534A CN1152534A CN96105164A CN96105164A CN1152534A CN 1152534 A CN1152534 A CN 1152534A CN 96105164 A CN96105164 A CN 96105164A CN 96105164 A CN96105164 A CN 96105164A CN 1152534 A CN1152534 A CN 1152534A
- Authority
- CN
- China
- Prior art keywords
- vacuum
- tweezer
- mentioned
- adsorption
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Disclosed is a vacuum tweezer used in carrying a semiconductor wafer in the process of fabricating a semiconductor, the vacuum tweezer comprises a Y-shaped vacuum tip having a flat body connected to a pumping line through a vacuum pump and two flat extensions projected from the body so as to vacuum-suction the wafer, and at least three suction portions formed on the flat front surface. Because at least three suction portions are formed on the flat front surface of the vacuum tweezer, the suction force on a wafer can be improved. Furthermore, because the vacuum tip is a Y-shaped structure, even though the state of vacuum is broken due to the flexibility of the vacuum tip, a semiconductor wafer can be vacuum-suctioned sufficiently.
Description
Used vacuum tweezer when the present invention relates in semiconductor fabrication process to transmit semiconductor wafer, relate to concretely improve the absorption wafer vacuum cups (Vac-uum tip) part so that the stable vacuum tweezer of semi-conductive transmission.
Generally, in the manufacturing work of semiconductor devices, in the manufacturing process of large-scale integration circuit, require the very high environment of cleanliness level especially, well-known, the yield of semiconductor device or reliability, quality etc. all depend on the cleanliness level of environment.
Thereby, must fully take into account dust at semiconductor applications for carrying out fine process, in order to make various stable process conditions, must adjust temperature and humidity, in fact also moreover, its operating environment also has influence on the Performance And Reliability of device, and it is very important creating suitable operating environment therefore for each manufacturing process of semiconductor devices.
Otherwise, the people that says so accurately who in semiconductor fabrication process, plays the effect of greatest contamination source.People let off steam and particle in the operating environment of semiconductor devices continuously, therefore, will put on the ultra-clean working clothes in this technological operation environment.
What further, semiconductor wafer is had contamination hazard is operator's hand and even finger.The salinity and the grease that often exist on operator's skin make element be subjected to extremely bad influence.Thereby, finish the transmission of semiconductor wafer in order not make people's direct contact, always be the tweezers (limited grasp tweezer---limited clamping tweezers) that adopt stainless and the limited position of clamping.
But with preceding a kind of tweezers holding chip the time, existence may destroy the problem of formed light-sensitive surface on the wafer (photoresist layer) etc., still exists to wafer perimeter as for a kind of tweezers in back and brings damage to become the former therefore problem of decision defective.
The vacuum tweezer that is used to solve aforementioned tweezers problem is shown in Fig. 1.This vacuum tweezer does not lean on clamping but can transmit wafer by adsorption affinity.
As shown in Figure 1, vacuum tweezer always has been equipped with and find time pipeline (20) and be connected in the vacuum cups (10) of pipeline of external vacuum pump bonded assembly.Aforementioned vacuum cups (10) is made by plastics or polytetrafluoroethylmaterial material, has adsorption section (2) at its flat front surface, this adsorption section (2) is provided with the homing vector portion of dark 0.1mm, and the oblong that configured in parallel is set in this homing vector is again supported platform (2b, 2c) and sucking hole (2a).Aforementioned sucking hole (2a) has the corresponding diameter of spacing with aforementioned support platform (2b, 2c).
In addition, above-mentioned support platform (2b, 2c) has identical height with above-mentioned homing vector portion, and configuration coequally, thereby is to establish because of the issuable damage to wafer of very strong adsorption affinity when adsorbing wafer for preventing.By aforementioned sucking hole (2a) institute suction air,, lead to above-mentioned vacuum pipe (20) by the internal pipeline of above-mentioned vacuum cups (10).
Utilizing such vacuum tweezer to transmit the occasion of wafer, as shown in Figure 2, after the adsorption section of the vacuum cups (10) of aforementioned vacuum tweezer will being attached to the back side of wafer (30), by being attached to the switch (not shown) on the vacuum tweezer, vacuumize, by above-mentioned sucking hole (2a), Yi Bian aspirated air, Yi Bian chip sucking is attached to aforementioned adsorption section (2).
Because of the suction nozzle (10) of this existing vacuum tweezer is made of plastics or polytetrafluoroethylene, because improper use tends to make the suction nozzle bending.Thereby, under the unloaded situation of vacuum cups (10),, when the absorption semiconductor wafer, destroyed vacuum state and adsorptivity is descended because front surface is not flat.
Because the destruction of vacuum state, when adsorptivity drops to predetermined value when following, just exist in the way of transmitting adsorbed wafer to fall, make the problem of wafer breakage.
And, because of aforesaid vacuum tweezer, only establish an adsorption section (2), so the weak strength of adsorption affinity not only also exists because the problem that aforementioned vacuum cups (10) bending descends its adsorption affinity greatly at its suction nozzle (10).
Have again, only establish a sucking hole, also have the situation that sucking hole blocked by pollutantss such as dusts and the problem that adsorption affinity is descended because of aforesaid vacuum tweezer.
Thereby the present invention's purpose is, for solving aforesaid problems, provides a kind of and at the flat front surface of vacuum cups the vacuum tweezer that the adsorption affinity of wafer is improved in three adsorption sections is set.
Another object of the present invention is to make vacuum cups to have " Y " shape structure, even provide a kind of because of the crooked institute of suction nozzle causes vacuum state destroyed, by the vacuum tweezer of part adsorption section absorption semiconductor wafer.
Feature according to the present invention who is used to finish aforementioned purpose, a kind of vacuum tweezer that is used to transmit semiconductor wafer, it is characterized in that, comprise the vacuum cups that is " Y " shape (10) with flat extension (11a, 11b) that the flat housing (11c) of front surface that is connected with the pipeline of finding time (20) of vacuum pump and two prolong from this housing and at least three adsorption sections (12,14,16) of being located at the flat front surface portion of aforementioned vacuum cups (10).
In this vacuum tweezer, above-mentioned at least three adsorption sections (12,14,16) have at least two separately and support platform and a sucking hole.
In this vacuum tweezer, above-mentioned support platform has and the corresponding height of the degree of depth of above-mentioned adsorption section, and is designed to oblong.
In this vacuum tweezer, above-mentioned three (12,14,16) adsorption sections are corresponding with above-mentioned housing (11c) and extension (11a, 11b) respectively and be provided with.
In this vacuum tweezer, above-mentioned vacuum tweezer (10) is made by polytetrafluoroethylene and plastic material.
According to aforesaid vacuum tweezer, above-mentioned vacuum cups has " Y " shape structure, and has at least three adsorption sections, thereby, even, also can adsorb semiconductor wafer fully by the part adsorption section because the suction nozzle bending causes vacuum state destroyed.
Fig. 1 is the planar view of suction nozzle (tip) structure of the existing vacuum tweezer of expression.
Fig. 2 is the figure that expression utilizes the vacuum tweezer absorption chip back surface (back side) of Fig. 1 to transmit.
Fig. 3 is the planar view that is used for the sucker structure of the vacuum tweezer that semiconductor wafer transmits according to an embodiment of the invention.
10: vacuum tweezer
12,14,16: the adsorption section
20: the pipeline of finding time
Describe embodiments of the invention in detail below with reference to Fig. 3.
Fig. 3 represents the structure of vacuum tweezer of the present invention, for having the structure member of identical function with known vacuum tweezer shown in Figure 1, uses the same numeral mark.
With reference to Fig. 3, the vacuum cups of novel evacuated tweezers of the present invention (10) has " Y " shape structure, and the flat front surface portion of this vacuum cups (10) has the structure that three adsorption sections (12,14,16) are set at least.
Again according to Fig. 3, above-mentioned vacuum tweezer possesses and the pipeline of finding time (20) the bonded assembly vacuum cups (10) of being located at exterior vacuum pump, and it is flat housing (11c) and the structure that is " Y " shape from flat two extensions (11a, 11b) that this housing prolongs out that this vacuum cups (10) has front surface.Aforementioned vacuum cups (10) is made by polytetrafluoroethylene or plastic material.
In addition, above-mentioned vacuum cups (10) is provided with three adsorption sections (12,14,16) in its flat planar portions, in the adsorption section that has the oval-shaped homing vector portion that is designed to dark 0.1mm separately, is provided with rectangular support platform abreast.Be provided with in aforementioned adsorption section and have and aforementioned oblong is supported the sucking hole of the corresponding diameter of spacing between the platform.
In the present embodiment, though represented two structures of supporting platform to be set,, can form the rectangular support platform more than two according to the area of adsorption section in the adsorption section.Also have,, do circular homing vector of adsorption section or oblong, no matter any shape all is applicable to the present invention though aforementioned adsorption section is designed to oval-shaped homing vector portion.
Specifically, be provided with in the adsorption section of the housing of being located at above-mentioned vacuum cups (10) (11c) with the rectangular support platform of two shown in label 12b, the 12c with a sucking hole shown in the label 12a; Be provided with the rectangular support platform of two shown in label 14b, the 14c with a sucking hole shown in the label 14a in the adsorption section of being located at above-mentioned extension (11a) (14); Be provided with the rectangular support platform of two shown in label 16b, the 16c with a sucking hole shown in the label 16a in the adsorption section of being located at aforementioned extension (11b) (16).
Thereby, corresponding with above-mentioned housing (11c) above-mentioned three adsorption sections are set respectively with extension (11a, 11b), the sucking hole of each adsorption orifice is interconnected, and with the plumbing connection of finding time.
According to foregoing vacuum tweezer of the present invention, at the flat front surface of vacuum cups three adsorption sections are set at least, thereby can improve adsorption affinity wafer.
In addition, because of vacuum cups has " Y " shape structure, even, also can adsorb semiconductor wafer fully by the part adsorption section because the vacuum cups bending causes vacuum state destroyed.
Have, owing to be provided with three adsorption sections at vacuum cups, even the sucking hole of one of them adsorption section is blocked by certain material, other adsorption section still has enough inhalation powers, the transmission wafer that still can not fall again.
Claims (5)
1. vacuum tweezer that is used to transmit semiconductor wafer, it is characterized in that, comprise the vacuum cups that is " Y " shape (10) with flat extension (11a, 11b) that the flat housing (11c) of front surface that is connected with the pipeline of finding time (20) of vacuum pump and two prolong from this housing and
Be located at least three adsorption sections (12,14,16) of the flat front surface portion of aforementioned vacuum cups (10).
2. according to the vacuum tweezer of claim 1, it is characterized in that above-mentioned at least three adsorption sections (12,14,16) have at least two separately and support platform and a sucking hole.
3. according to the vacuum tweezer of claim 2, it is characterized in that above-mentioned support platform has and the corresponding height of the degree of depth of above-mentioned adsorption section, and is designed to oblong.
4. according to the vacuum tweezer of claim 1 or 2, it is characterized in that above-mentioned three (12,14,16) adsorption sections are corresponding with above-mentioned housing (11c) and extension (11a, 11b) respectively and be provided with.
5. according to the vacuum tweezer of claim 1, it is characterized in that above-mentioned vacuum tweezer (10) is made by polytetrafluoroethylene and plastic material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR51500/95 | 1995-12-18 | ||
| KR1019950051500A KR0163548B1 (en) | 1995-12-18 | 1995-12-18 | A vacuum tweezer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1152534A true CN1152534A (en) | 1997-06-25 |
Family
ID=19441100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96105164A Pending CN1152534A (en) | 1995-12-18 | 1996-05-23 | Vacuum tweezers |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH09174477A (en) |
| KR (1) | KR0163548B1 (en) |
| CN (1) | CN1152534A (en) |
| DE (1) | DE19625846A1 (en) |
| GB (1) | GB2308347B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894783A (en) * | 2010-06-03 | 2010-11-24 | 中国电子科技集团公司第四十五研究所 | Chip absorption and turnover device for semiconductor special equipment |
| CN102601798A (en) * | 2012-03-15 | 2012-07-25 | 深圳市华星光电技术有限公司 | Vacuum holding device and vacuum holding method |
| CN105619432A (en) * | 2016-03-28 | 2016-06-01 | 苏州倍特罗智能科技有限公司 | Structure with three durable suckers |
| CN109904103A (en) * | 2019-03-27 | 2019-06-18 | 苏州新美光纳米科技有限公司 | A kind of silicon dice transfer device and silicon test device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100457339B1 (en) * | 1997-09-30 | 2005-01-17 | 삼성전자주식회사 | Semiconductor wafer transfer arm to easily correct fork and avoid particles |
| KR100492993B1 (en) * | 1997-12-12 | 2005-08-05 | 삼성전자주식회사 | Apparatus for wafer moving without wafer sliding |
| CN102233548B (en) * | 2010-04-29 | 2013-04-17 | 中芯国际集成电路制造(上海)有限公司 | Vacuum pipette |
| SG194266A1 (en) * | 2012-05-02 | 2013-11-29 | Laville Pte Ltd | Device and method for cleaning and processing natural extracts |
| CN105619433A (en) * | 2016-03-28 | 2016-06-01 | 苏州倍特罗智能科技有限公司 | Structure with three suckers |
| DE102020103411A1 (en) | 2020-02-11 | 2021-08-12 | Schaeffler Technologies AG & Co. KG | Handling device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4773687A (en) * | 1987-05-22 | 1988-09-27 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Wafer handler |
| FR2656598B1 (en) * | 1989-12-29 | 1992-03-27 | Commissariat Energie Atomique | DEVICE FOR LOADING AND UNLOADING FLAT OBJECTS INTO A STORAGE CASSETTE. |
| US5280979A (en) * | 1991-06-20 | 1994-01-25 | Recif, S.A. | Tip for a vacuum pipette with improved electrostatic discharge properties |
-
1995
- 1995-12-18 KR KR1019950051500A patent/KR0163548B1/en not_active IP Right Cessation
-
1996
- 1996-05-23 CN CN96105164A patent/CN1152534A/en active Pending
- 1996-06-04 GB GB9611634A patent/GB2308347B/en not_active Expired - Fee Related
- 1996-06-20 JP JP16022496A patent/JPH09174477A/en active Pending
- 1996-06-27 DE DE19625846A patent/DE19625846A1/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894783A (en) * | 2010-06-03 | 2010-11-24 | 中国电子科技集团公司第四十五研究所 | Chip absorption and turnover device for semiconductor special equipment |
| CN102601798A (en) * | 2012-03-15 | 2012-07-25 | 深圳市华星光电技术有限公司 | Vacuum holding device and vacuum holding method |
| CN105619432A (en) * | 2016-03-28 | 2016-06-01 | 苏州倍特罗智能科技有限公司 | Structure with three durable suckers |
| CN109904103A (en) * | 2019-03-27 | 2019-06-18 | 苏州新美光纳米科技有限公司 | A kind of silicon dice transfer device and silicon test device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9611634D0 (en) | 1996-08-07 |
| DE19625846A1 (en) | 1997-06-19 |
| JPH09174477A (en) | 1997-07-08 |
| KR0163548B1 (en) | 1999-02-01 |
| KR970053297A (en) | 1997-07-31 |
| GB2308347A (en) | 1997-06-25 |
| GB2308347B (en) | 1997-11-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |