CN107768287A - A kind of method and apparatus for test wafer - Google Patents
A kind of method and apparatus for test wafer Download PDFInfo
- Publication number
- CN107768287A CN107768287A CN201711066894.4A CN201711066894A CN107768287A CN 107768287 A CN107768287 A CN 107768287A CN 201711066894 A CN201711066894 A CN 201711066894A CN 107768287 A CN107768287 A CN 107768287A
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- wafer
- carrying platform
- wafer carrying
- load
- bearing surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
This disclosure relates to a kind of method and apparatus for test wafer.Present disclose provides a kind of device for test wafer, including：Wafer carrying platform, for carrying wafer to be tested；Supporting construction, coupled with the wafer carrying platform；Wherein, the supporting construction can rotate the wafer carrying platform so that the load-bearing surface of the wafer carrying platform is in non-horizontal directions.The disclosure additionally provides a kind of method for test wafer, including：The wafer carrying platform is rotated by the supporting construction coupled with wafer carrying platform so that the load-bearing surface of the wafer carrying platform is rotated in non-horizontal directions, wherein the wafer carrying platform is used to carry wafer to be tested.
Description
Technical field
This disclosure relates to semiconductive member arts, it particularly relates to a kind of method and apparatus for test wafer.
Background technology
Semiconductor technology is advanced by leaps and bounds, it is necessary to carry out wafer acceptance testing (Wafer before packaging in recent years
Acceptance Test, WAT).And tested for WAT, the probe in probe card in generally use WAT boards is carried out.Surveying
Try on wafer during chip, because probe will be repeated several times the testing cushion of contact measured chip, probe pinpoint and testing cushion
Friction can form residual charge in detecting probe surface.In addition, the electric signal transmission in test process also can be residual in detecting probe surface introducing
Remaining electric charge, these residual charges can cause particulate or other attachments to be present in WAT board internal environments or adsorb in probe
And crystal column surface, so as to influence test of the probe to chip to be measured, in some instances it may even be possible to cause the test of wafer abnormal.Therefore, it is necessary to
A kind of new technology is proposed to solve above-mentioned one or more problems of the prior art.
The content of the invention
One purpose of the disclosure is the particulate or other attachments reduced in WAT board internal environments, so as to improve
The precision of wafer measurement.
According to an aspect of this disclosure, there is provided a kind of device for test wafer, it is characterised in that including：It is brilliant
Circle plummer, for carrying wafer to be tested；Supporting construction, coupled with the wafer carrying platform；Wherein, the supporting construction energy
Enough rotate the wafer carrying platform so that the load-bearing surface of the wafer carrying platform is in non-horizontal directions.
According to another aspect of the disclosure, there is provided a kind of device for test wafer, it is characterised in that including：
Wafer carrying platform, for carrying wafer to be tested；Supporting construction, coupled with the wafer carrying platform；Wherein, the supporting construction
The wafer carrying platform can be rotated so that the load-bearing surface of the wafer carrying platform is rotated to towards terrestrial positioning.
According to the another aspect of the disclosure, there is provided a kind of method for test wafer, it is characterised in that including：By
The wafer carrying platform is rotated with the supporting construction of wafer carrying platform coupling so that the load-bearing surface rotation of the wafer carrying platform
To in non-horizontal directions, wherein the wafer carrying platform is used to carry wafer to be tested.
According to another aspect of the present disclosure, there is provided a kind of method for test wafer, it is characterised in that including：By
The wafer carrying platform is rotated with the supporting construction of wafer carrying platform coupling so that the load-bearing surface rotation of the wafer carrying platform
To towards terrestrial positioning, wherein the wafer carrying platform is used to carry wafer to be tested.
By referring to the drawings to the detailed description of the exemplary embodiment of the disclosure, the further feature of the disclosure and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing of a part for constitution instruction describes embodiment of the disclosure, and is used to solve together with the description
Release the principle of the disclosure.
Referring to the drawings, according to following detailed description, the disclosure can be more clearly understood, wherein：
Fig. 1 is the unitary construction figure of the system for measuring wafer shown.
Fig. 2 is to show wafer carrying platform carrying wafer and in the signal with being moved in horizontal plane substantially perpendicular directions
Figure.
Fig. 3 is to show to be revolved the load-bearing surface of wafer carrying platform and its chassis according to one embodiment, supporting construction
Go to the schematic diagram in non-horizontal directions.
Fig. 4 a are shown in the state of load-bearing surface is horizontally oriented, and are provided with chassis along using load-bearing surface as x-
The schematic diagram of multiple moving tracks of x, y, z direction of principal axis in the rectangular coordinate system in space that y plane is established；Fig. 4 b are to show holding
Carry surface be in in the state of the direction of horizontal plane along x, y, z direction of principal axis multiple moving tracks schematic diagram.
Fig. 5 is to show to be rotated to load-bearing surface and chassis towards ground according to another embodiment, supporting construction
The schematic diagram of positioning.
Fig. 6 is to show the flow chart according to an embodiment of the invention for being used to measure the operation of the method for wafer.
Fig. 7 is to show the flow chart for being used to measure the operation of the method for wafer according to another embodiment of the invention.
Fig. 8 is the stream for showing each operation being used to measure in the method for wafer according to still another embodiment of the invention
Cheng Tu.
Pay attention to, in embodiments described below, be used in conjunction with same reference between different accompanying drawings sometimes
Come the part for representing same section or there is identical function, and omit its repeat specification.In this manual, using similar mark
Number and letter represent similar terms, therefore, once be defined in a certain Xiang Yi accompanying drawing, then in subsequent accompanying drawing do not need pair
It is further discussed.
In order to make it easy to understand, position, size and scope of each structure shown in accompanying drawing etc. etc. does not indicate that reality sometimes
Position, size and scope etc..Therefore, disclosed invention is not limited to position, size and scope disclosed in accompanying drawing etc. etc..
Embodiment
The various exemplary embodiments of the disclosure are described in detail now with reference to accompanying drawing.It should be noted that：Unless have in addition
Body illustrates that the unlimited system of part and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
Scope of disclosure.
The description only actually at least one exemplary embodiment is illustrative to be never used as to the disclosure below
And its application or any restrictions that use.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as authorizing part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, the other examples of exemplary embodiment can have different values.
Fig. 1 is the unitary construction figure of the test system 1 for measuring wafer shown.As shown in figure 1, in test system 1
In, the device for measuring wafer can include wafer carrying platform 108 and supporting construction 110.Wherein wafer carrying platform 108 can
For carrying wafer 112 to be tested, and supporting construction 110 can couple with wafer carrying platform 108, and supporting construction 110
Being capable of rotating wafer plummer 108 so that the load-bearing surface of wafer carrying platform is in non-horizontal directions.In wafer carrying platform 108
Load-bearing surface rotate in the state of non-horizontal directions, tested by the probe 116 docked with plummer 108 and held in wafer
Wafer to be tested 112 on the load-bearing surface of microscope carrier 108.
In one embodiment, supporting construction 110 being capable of rotating wafer plummer 108 so that the wafer carrying platform 108
Load-bearing surface rotate to position with the horizontal the angle more than 10 degree.In another embodiment it is preferred that support knot
Structure 110 being capable of rotating wafer plummer 108 so that the load-bearing surface of the wafer carrying platform 108 rotates to basic with horizontal plane
Upper vertical direction.Wafer carrying platform 108 load-bearing surface be in horizontal plane substantially perpendicular directions in the state of, by
The wafer to be tested 112 that probe 116 is tested on the load-bearing surface of wafer carrying platform 108, as shown in Figure 1.
Compared with load-bearing surface to be routinely positioned as to situation in the horizontal direction in the prior art, pass through in the disclosure
Load-bearing surface is positioned as non-horizontal directions, with the horizontal the angle more than 10 degree or preferably positioned load-bearing surface
For with horizontal plane substantially perpendicular directions, and tested using the probe 116 of the positioned adjacent of correspondingly adjustment position,
Particulate and other attachments in board internal environment can be greatly reduced.Due to the reduction of particulate loading in test environment,
Electrical contact between probe and wafer to be measured is less influenceed by particulate, therefore can greatly improve the accurate of wafer sort
Degree.In addition, it can also correspondingly reduce the extra cost brought of particulate in cleaning test environment and avoid cleaning band
The damage of probe or wafer.
The test system 1 can also include test machine 102 and connected measuring head 104, and the measuring head 104 can be with
Probe card (not shown) connects, and wherein probe card can include multiple probes 116, and one or more of probes 116 can be with
Docked with wafer carrying platform 108 and carry out wafer sort.The test system 1 can also include mechanical arm 114, load interface (load
Port) 106 and wafer transfer box (foup) (not shown), wherein being sent to dress in the wafer transfer box for including multiple wafers
After carrying interface 106, mechanical arm 114 can pick up wafer 112 to be tested from wafer transfer box, and by the wafer to be tested
112 are placed on the load-bearing surface of wafer carrying platform 108.The specific description referred to below for Fig. 2.
With reference now to Fig. 4 a.Fig. 4 a are shown in the state of load-bearing surface is horizontally oriented, the bottom of wafer carrying platform
It is provided with along the multiple of x, y, z direction of principal axis in the rectangular coordinate system in space established using load-bearing surface as x-y plane and moves on disk
The schematic diagram of track, Fig. 4 b show to be under the direction with horizontal plane in load-bearing surface, multiple movements of x, y, z direction of principal axis
The schematic diagram of track.Specifically, as shown in fig. 4 a, the chassis 404 of wafer carrying platform 402 can be provided with along rectangular space coordinate
Multiple moving tracks (as shown in the dotted line in Fig. 4 a) of the x, y, z direction of principal axis of system, wherein the rectangular coordinate system is held with wafer
The load-bearing surface of microscope carrier 402 is the rectangular coordinate system that x-y plane is established.Multiple drives can be installed below each moving track
Dynamic motor, for driving x, y, z direction of principal axis of the wafer carrying platform 402 along rectangular coordinate system to be moved on each track.
In one embodiment, the position of plummer 402 can adjust along the direction of x-axis 406, y-axis 408, z-axis 410, make its position quilt
It is adjusted to be adapted for the position then operated, as shown in fig. 4 a.
It is to be understood that the x, the direction of y-axis shown in Fig. 4 a and Fig. 4 b are merely exemplary rather than restricted, may be used also
To be formed the x-axis and y-axis in the plane residing for the load-bearing surface of wafer carrying platform 402 using any suitable direction.
Referring back to Fig. 2.Fig. 2 is to show wafer carrying platform carrying wafer and in the side substantially vertical with horizontal plane
The schematic diagram moved up.In the embodiment described in the disclosure, during test wafer, as described in Figure 2, wafer is held
Microscope carrier 202 can be configured as below multiple moving tracks along x, y, z direction of principal axis as being set in the chassis shown in Fig. 4 a
Motor drives, and makes on its in the plurality of moving track moving track, the edge side substantially vertical with horizontal plane
To first position is moved to receive wafer 208 to be tested and be carried on the load-bearing surface 206 of wafer carrying platform 202.
Specifically, the wafer carrying platform 202 in initial position (as shown in Fig. 2 bottoms) can be along indicated by arrow 210 and water
Plane substantially perpendicular directions is moved to first position (position as shown at the top of Fig. 2), and at the first position, wafer is held
Microscope carrier 202 can be configured as receiving wafer 208 to be tested from mechanical arm 204.The wafer carrying platform 202 can include can on
Flexible bolster stake 214 down.In the exemplary embodiment, the bolster stake 214 is preferably the shape of cylinder.The bolster stake
The size of 214 loading end is preferably less than the size of wafer 208 to be tested, as shown in Figure 2.In the exemplary embodiment, should
Bolster stake 214 can flex outward out from the main body of wafer carrying platform 202, until suitable position, then the bolster stake 214 can
To receive the wafer 208 to be tested picked up by mechanical arm from mechanical arm 204.Then the bolster stake 214 can inwardly stretch back
Accepted into the main body of wafer carrying platform 202, and by wafer 208 on the load-bearing surface 206 of plummer 202.Then, carry
The wafer carrying platform 202 of wafer 208 can be configured as being driven by motor, on chassis a moving track, edge
The second place is moved to from first position with horizontal plane substantially perpendicular directions, for then at wafer carrying platform 202
In the state of the second place, plummer 202 is rotated by the supporting construction of plummer coupling so that wafer carrying platform 202 is held
Surface is carried to rotate in non-horizontal directions.Specifically, in one exemplary embodiment, the wafer carrying in first position
Platform 202 can along it is indicated by arrow 212, be moved down into horizontal plane substantially perpendicular directions and to be adapted for revolving in next step
Turn the second place of operation.
It is to be understood that the shape and size of the wafer carrying platform, bolster stake and mechanical arm shown in Fig. 2 are only to show
Example property rather than restricted, is not limited to wafer carrying platform, bolster stake and the machine using other any suitable shapes and size
Tool arm realizes the disclosure.
Fig. 3 is to show that supporting construction rotates to the load-bearing surface of wafer carrying platform and its chassis in non-horizontal directions
Schematic diagram.Supporting construction 312 can be configured as rotating wafer plummer 302 and chassis 304 so that load-bearing surface 306
Non-horizontal directions (or being more than 10 degree with the angle of horizontal direction) is rotated to, it is to be measured on load-bearing surface 306 for testing
Try wafer 308.Correspondingly, the position of probe 310 can be adjusted, and can be docked with load-bearing surface 306 to measure.
In some embodiments it may be preferred that supporting construction 312 can rotate plummer 302 so that load-bearing surface 306 revolves
Go to horizontal plane substantially perpendicular directions, as shown in Figure 3.Specifically, by with plummer 302 and plummer 302
The supporting construction 310 that chassis 304 couples rotates the plummer 302, makes the load-bearing surface 306 of plummer 302 from along level side
To rotating to along the vertical direction substantially vertical with horizontal plane so that the wafer 308 on load-bearing surface 306 with level
Direction laterally adjacent to probe 310 test fetching.In the exemplary embodiment, the rotation can be opened from horizontal direction
Begin to rotate so that load-bearing surface 306 and the angle of horizontal direction are more than 10 degree.In the exemplary embodiment, the rotation can be
Arrive from horizontal direction vertical direction along 90 degree counterclockwise.
Compared with load-bearing surface to be routinely positioned as to situation in the horizontal direction in the prior art, by it is above-mentioned will carrying
Surface be positioned as non-horizontal directions or preferably can vertically greatly reduce particulate in board internal environment with
And other attachments, and the degree of accuracy of wafer sort can be significantly improved.
Although the load-bearing surface only for plummer rotates to the situation with horizontal plane substantially perpendicular directions above
It is described in detail it should be appreciated that the disclosure is not limited to the situation of the vertical direction, can also include the carrying table
Face rotates to the situation of other non-horizontal directions, for example, the angle between load-bearing surface and horizontal direction arrives in about 10 degree
In the range of 170 degree.
In Fig. 3 exemplary embodiment, the supporting mechanism 312 can be pivoted structure, be included in pivot rotation
The first articulated part 314 that the end of rotation structure couples with chassis 304, and the at the other end of the pivoted structure
Two articulated parts 316, the wherein pivoted structure can rotate around the second articulated part 316, and chassis 304 can be around the first pivot
Fitting 314 rotates.Wherein, the first articulated part 314 and the second articulated part 316 may be used as the pivot point pivoted so that
Connected structure (for example, supporting construction 312 and chassis 304) can be rotated around it.The pivot of the supporting construction 312
Axle rotational structure enables the load-bearing surface of wafer carrying platform 302 coupled with it to rotate to non-horizontal directions or rotate to
From the horizontal by the position of the angle more than 10 degree.In certain embodiments, the articulated part of the first articulated part 314 and second
Corresponding snap part can be included in 316, for by the main body of postrotational pivoted structure or wafer carrying platform 302
Chassis is fixed to suitable position.
It is to be understood that the construction and mechanism of the supporting construction 312 are not limited to shown in Fig. 3, can use commonly used in the art
Any appropriate structure.
In addition, also including vacuum absorption device (not shown) in test system, accepted in wafer 308 to be tested to carrying
After surface 306, the vacuum absorption device touch the side of wafer using vacuum cup, and evacuates vacuum cup by air pump
In air, to cause vacuum cup absorption to secure the above wafer, to avoid causing wafer stress deformation or come off.Cause
This, by well known vacuum absorption device in the prior art, during supporting construction 312 drives plummer 302 to rotate, treats
Test wafer 308 can be firmly secured on load-bearing surface 306, taken off without the effect because of gravity or other stress
Fall.
Fig. 4 b show to be under the direction with horizontal plane in load-bearing surface, multiple moving tracks of x, y, z direction of principal axis
Schematic diagram.During test wafer, it is in and level as shown in Figure 3 rotating to the load-bearing surface of wafer carrying platform
After the vertical direction in face, supporting construction can be fixed to inactive state, while can further adjust supporting construction and be propped up
The position of the wafer carrying platform of support so that wafer carrying platform is adjusted to be suitable to the position to be measured that probe is tested.Specifically, with
Similarly, as shown in Figure 4 b, the chassis 404 of wafer carrying platform 402 can be provided with the x, y, z along rectangular coordinate system in space to Fig. 4 a
Multiple moving tracks of direction of principal axis.Multiple motors can be installed below each track, for driving wafer carrying platform
402 move along x, y, z direction of principal axis on each track.In one embodiment, in the carrying table of wafer carrying platform 402
Face is rotated to after vertical direction, can be with the chassis 404 of fixed support structure and fixed plummer 402, the position of plummer 402
Putting can be adjusted along the direction of x-axis 406, y-axis 408, z-axis 410, be adjusted to its position and treated suitable for what probe was tested
Location is put.
It should be appreciated that the position that the above-mentioned moving track along x, y, z direction of principal axis adjusts wafer carrying platform is equally applicable to hold
Surface is carried to be in the embodiment of other non-horizontal directions.
Fig. 5 is to show to be rotated to load-bearing surface and chassis according to another embodiment of the disclosure, supporting construction
Towards the schematic diagram of terrestrial positioning.In one embodiment, held by the supporting construction rotating wafer coupled with wafer carrying platform 502
Microscope carrier 502 so that the load-bearing surface 506 of wafer carrying platform 502 rotates to be used towards terrestrial positioning, wherein wafer carrying platform 502
In carrying wafer 508 to be tested.Arrangement by such load plane towards terrestrial positioning, can equally greatly reduce in machine
Particulate and other attachments in platform internal environment, and the degree of accuracy of wafer sort can be significantly improved.
As shown in figure 5, the supporting construction 512 as an entirety can rotate the He of wafer carrying platform 502 coupled with it
Chassis 504 so that load-bearing surface 506 rotates to face-down positioning, i.e., towards terrestrial positioning, and with the angle base of horizontal direction
In sheet in the range of 90 degree to 180 degree.Specifically, as shown in figure 5, with the supporting construction 312 in Fig. 3 similarly, the branch
Support structure 512 can be pivoted structure.The supporting construction 512 can be that support is tied with the difference of supporting construction 312
Structure 512 can include hinge arrangement 518 so that supporting construction can be bent via hinge arrangement 518, forms two parts, i.e.,
Structure 512-A and structure 512-B.As shown in figure 5, such pivoted structure 512-A and 512-B passes through hinge arrangement 518
Vertically, so that load-bearing surface 506 rotates to is in 90 degree of scopes for arriving 180 degree with the angle of horizontal direction
It is interior, can be especially 180 degree.A part of 512-A of the pivoted structure can have and the coupling of chassis 504 at its one end
The first articulated part 514 connect, chassis 504 can rotate around first articulated part 514.In another part of the pivoted structure
There can be the second articulated part 516 in 512-B, structure 512-B can rotate around the second articulated part 516.First articulated part
514 and second can include corresponding snap part in articulated part 516, for by the main body of postrotational pivoted structure or
The chassis 504 of wafer carrying platform 502 is fixed to suitable position.
It should be appreciated that wafer carrying platform 502, chassis 504, load-bearing surface 506, wafer 508 in Fig. 5 with institute in Fig. 3
The component shown is identical, and in rotating to the load plane 506 of wafer carrying platform 502 towards terrestrial positioning shown in Fig. 5
The operation of other in addition to rotation in embodiment, with shown in Fig. 1-Fig. 4 and above-mentioned holding the wafer carrying platform
It is identical to carry the operation that surface is rotated in the embodiment in non-horizontal directions, therefore repeats no more here.
Fig. 6 is to show the flow chart according to an embodiment of the invention for being used to measure the operation in the method for wafer.
In one exemplary embodiment, this method can include operation 602：Institute is rotated by the supporting construction coupled with wafer carrying platform
State wafer carrying platform so that the load-bearing surface of the wafer carrying platform is rotated in non-horizontal directions, wherein the wafer is held
Microscope carrier is used to carry wafer to be tested.
Fig. 7 is the flow for showing the operation being used to measure in the method for wafer according to another embodiment of the invention
Figure.In one exemplary embodiment, this method can include operation 702：Revolved by the supporting construction coupled with wafer carrying platform
Turn the wafer carrying platform so that the load-bearing surface of the wafer carrying platform is rotated to towards terrestrial positioning, wherein the wafer
Plummer is used to carry wafer to be tested.
Fig. 8 is to show each concrete operations in the method for being used to measure wafer according to another embodiment of the invention
Flow chart.In this illustrative embodiment, this method can include operation 802-810.At operation 802, by motor
Driving wafer carrying platform makes edge and horizontal plane substantially perpendicular directions on its in multiple moving tracks moving track
First position is moved to, to receive wafer to be tested and be carried on the load-bearing surface of wafer carrying platform.In operation 804
Place, made by motor driving wafer carrying platform on its in multiple moving tracks moving track along basic with horizontal plane
Upper vertical direction is moved to the second place from first position.At operation 806, the shape of the second place is in wafer carrying platform
Under state, by supporting construction rotating wafer plummer so that the load-bearing surface of wafer carrying platform is in non-horizontal directions.Operating
At 808, rotated in the load-bearing surface of wafer carrying platform after non-horizontal directions, fixed support structure, by motor
Driving wafer carrying platform moves along x, y, z direction of principal axis so that wafer carrying platform is adjusted to treat location suitable for what probe was tested
Put.At operation 810, in the state of the load-bearing surface of wafer carrying platform is in non-horizontal directions, tested by probe
Wafer to be tested on the load-bearing surface.
Word "front", "rear", " top ", " bottom " in specification and claim, " on ", " under " etc., if deposited
If, it is not necessarily used to describe constant relative position for descriptive purposes.It should be appreciated that the word so used
Language is interchangeable in appropriate circumstances so that embodiment of the disclosure described herein, for example, can with this institute
Those of description show or other are orientated in other different orientations and operated.
As used in this, word " exemplary " means " being used as example, example or explanation ", not as will be smart
" model " really replicated.It is not necessarily to be interpreted in any implementation of this exemplary description more excellent than other implementations
It is choosing or favourable.Moreover, the disclosure is not by above-mentioned technical field, background technology, the content of the invention or embodiment
Given theory that is any stated or being implied is limited.
As used in this, word " substantially " mean comprising by design or manufacture the defects of, device or element appearance
Any small change caused by difference, environment influence and/or other factorses.Herein, wafer carrying platform can " substantially " be referred to
Load-bearing surface and horizontal direction angle in the range of about 80 degree to 100 degree (90 degree ± 10 degree).
As used herein, word " non-horizontal directions " means the load-bearing surface of wafer carrying platform and the angle of horizontal direction
In the range of more than 10 degree.
Foregoing description can indicate to be " connected " or " coupling " element together or node or feature.As used herein
, unless otherwise expressly noted, " connection " means an element/node/feature with another element/node/feature in electricity
Above, mechanically, in logic or otherwise it is directly connected (or direct communication).Similarly, unless otherwise expressly noted,
" coupling " mean an element/node/feature can with another element/node/feature in a manner of direct or be indirect in machine
On tool, electrically, in logic or otherwise link to allow to interact, even if the two features may be not direct
Connection is also such.That is, " coupling " is intended to encompass the direct link of element or further feature and linked indirectly, including profit
With the connection of one or more intermediary elements.
In addition, just to the purpose of reference, can also be described below it is middle use certain term, and thus not anticipate
Figure limits.For example, unless clearly indicated by the context, be otherwise related to the word " first " of structure or element, " second " and it is other this
Class numeral word does not imply order or sequence.
It should also be understood that the word of "comprises/comprising" one is as used herein, illustrate pointed feature, entirety, step be present
Suddenly, operation, unit and/or component, but it is not excluded that in the presence of or the one or more of the other feature of increase, entirety, step, behaviour
Work, unit and/or component and/or combinations thereof.
It should be appreciated by those skilled in the art that the border between aforesaid operations is merely illustrative.Multiple operations
Single operation can be combined into, single operation can be distributed in additional operation, and operate can at least portion in time
Divide and overlappingly perform.Moreover, alternative embodiment can include multiple examples of specific operation, and in other various embodiments
In can change operation order.But others are changed, variations and alternatives are equally possible.Therefore, the specification and drawings
It should be counted as illustrative and not restrictive.
In addition, embodiment of the present disclosure can also include the example below：
A kind of 1. device for test wafer, it is characterised in that including：
Wafer carrying platform, for carrying wafer to be tested；
Supporting construction, coupled with the wafer carrying platform；
Wherein, the supporting construction can rotate the wafer carrying platform so that the load-bearing surface of the wafer carrying platform
In non-horizontal directions.
2. the device according to 1, it is characterised in that the supporting construction be configured as by probe test in the crystalline substance
The load-bearing surface of the wafer carrying platform is set to be in non-horizontal in the state of wafer to be tested on the load-bearing surface of circle plummer
Direction.
3. the device according to 1, it is characterised in that the supporting construction can rotate the wafer carrying platform so that
The load-bearing surface of the wafer carrying platform is in and horizontal plane substantially perpendicular directions.
4. the device according to 1, it is characterised in that the supporting construction can rotate the wafer carrying platform so that
The load-bearing surface of the wafer carrying platform is in the position from the horizontal by the angle more than 10 degree.
5. the device according to 2, it is characterised in that the wafer carrying platform includes chassis, being provided with the chassis
Along using the more of the x, y, z direction of principal axis in the rectangular coordinate system in space that the load-bearing surface of the wafer carrying platform is established as x-y plane
Individual moving track.
6. the device according to 5, it is characterised in that multiple driving electricity are provided with below the multiple moving track
Machine, for driving wafer carrying platform to be moved along x, y, z direction of principal axis on the moving track.
7. the device according to 1, it is characterised in that the supporting construction is pivoted structure, is included in the pivot
The end of axle rotational structure is with the first articulated part of chassis coupling and at the other end of the pivoted structure
The second articulated part, wherein the pivoted structure can rotate around second articulated part, and the chassis can be around
The first articulated part rotation.
8. the device according to 2, it is characterised in that wafer to be tested is picked up by mechanical arm from wafer transfer box, and
And the wafer to be tested is placed on the load-bearing surface of wafer carrying platform by the mechanical arm.
9. the device according to 6, it is characterised in that the motor is configured as driving the wafer carrying platform to make
On its in the multiple moving track moving track first is moved to along with horizontal plane substantially perpendicular directions
Put, to receive wafer to be tested and be carried on the load-bearing surface of the wafer carrying platform.
10. the device according to 9, it is characterised in that the motor be additionally configured to driving carry it is to be tested
The wafer carrying platform of wafer, make on its in the multiple moving track moving track along substantially vertical with horizontal plane
Direction be moved to the second place from the first position, in the state of the wafer carrying platform is in the second place,
The supporting construction is configured as rotating the wafer carrying platform so that the load-bearing surface of the wafer carrying platform is in non-horizontal
Direction.
11. the device according to 8, it is characterised in that the wafer carrying platform also includes bolster stake, the bolster stake energy
Enough to be flexed outward out from the main body of wafer carrying platform, to receive wafer to be tested from mechanical arm, then the bolster stake can be to
Interior stretch is returned in the main body of wafer carrying platform, by wafer carrying to be tested to load-bearing surface.
12. the device according to 6, it is characterised in that rotated in the load-bearing surface of the wafer carrying platform in non-
After horizontal direction, the supporting construction and the chassis are fixed, and the motor is configured as driving the wafer to hold
Microscope carrier moves along the x, y, z direction of principal axis so that the wafer carrying platform is adjusted to be suitable to the position to be measured that probe is tested.
A kind of 13. device for test wafer, it is characterised in that including：
Wafer carrying platform, for carrying wafer to be tested；
Supporting construction, coupled with the wafer carrying platform；
Wherein, the supporting construction can rotate the wafer carrying platform so that the load-bearing surface of the wafer carrying platform
Rotate to towards terrestrial positioning.
A kind of 14. method for test wafer, it is characterised in that including：
The wafer carrying platform is rotated by the supporting construction coupled with wafer carrying platform so that the wafer carrying platform is held
Carry surface to rotate in non-horizontal directions, wherein the wafer carrying platform is used to carry wafer to be tested.
15. the method according to 14, it is characterised in that also include, be in non-in the load-bearing surface of the wafer carrying platform
In the state of horizontal direction, by be tested wafer of the probe test on the load-bearing surface of the wafer carrying platform.
16 method according to 14, it is characterised in that the crystalline substance is rotated by the supporting construction coupled with wafer carrying platform
Circle plummer so that the load-bearing surface of the wafer carrying platform, which rotates to, to be in and horizontal plane substantially perpendicular directions.
17. the method according to 14, it is characterised in that the crystalline substance is rotated by the supporting construction coupled with wafer carrying platform
Circle plummer so that the load-bearing surface of the wafer carrying platform is rotated in the position from the horizontal by the angle more than 10 degree
Put.
18. the method according to 15, it is characterised in that the wafer carrying platform includes chassis, setting on the chassis
Have along using the x, y, z direction of principal axis in the rectangular coordinate system in space that the load-bearing surface of the wafer carrying platform is established as x-y plane
Multiple moving tracks.
19. the method according to 18, it is characterised in that multiple driving electricity are provided with below the multiple moving track
Machine, for driving wafer carrying platform to be moved along x, y, z direction of principal axis on the moving track.
20. the method according to 14, it is characterised in that the supporting construction is pivoted structure, is included in described
First articulated part of the end of pivoted structure with chassis coupling and the other end in the pivoted structure
Second articulated part at place, wherein the pivoted structure can rotate around second articulated part, and the chassis can
Rotated around first articulated part.
21. the method according to 15, it is characterised in that also include, picked up by mechanical arm from wafer transfer box to be tested
Wafer, and the wafer to be tested is placed on the load-bearing surface of wafer carrying platform.
22. the method according to 19, it is characterised in that also include, the wafer carrying platform is driven by the motor
Make to be moved to first along with horizontal plane substantially perpendicular directions on its in the multiple moving track moving track
Position, to receive wafer to be tested and be carried on the load-bearing surface of the wafer carrying platform.
23. the method according to 22, in addition to, drive the wafer carrying platform to make it described by the motor
Edge is moved to horizontal plane substantially perpendicular directions from the first position on a moving track in multiple moving tracks
The second place, in the state of being in the second place in the wafer carrying platform, institute is rotated by the supporting construction
State wafer carrying platform so that the load-bearing surface of the wafer carrying platform is in non-horizontal directions.
24. the method according to 21, it is characterised in that the wafer carrying platform also includes bolster stake, and methods described is also
Including being flexed outward out by the bolster stake from the main body of wafer carrying platform, to receive wafer to be tested, Ran Houyou from mechanical arm
The bolster stake is inwardly flexible to be returned in the main body of wafer carrying platform, by wafer carrying to be tested to load-bearing surface.
25. the method according to 19, it is characterised in that also include, rotated in the load-bearing surface of the wafer carrying platform
After non-horizontal directions, the fixed supporting construction, by the motor drive the wafer carrying platform along the x,
Y, z-axis direction is moved so that the wafer carrying platform is adjusted to be suitable to the position to be measured that probe is tested.
A kind of 26. method for test wafer, it is characterised in that including：
The wafer carrying platform is rotated by the supporting construction coupled with wafer carrying platform so that the wafer carrying platform is held
Carry surface to rotate to towards terrestrial positioning, wherein the wafer carrying platform is used to carry wafer to be tested.
Although some specific embodiments of the disclosure are described in detail by example, the skill of this area
Art personnel it should be understood that above example merely to illustrate, rather than in order to limit the scope of the present disclosure.It is disclosed herein
Each embodiment can in any combination, without departing from spirit and scope of the present disclosure.It is to be appreciated by one skilled in the art that can be with
A variety of modifications are carried out to embodiment without departing from the scope of the present disclosure and spirit.The scope of the present disclosure is limited by appended claims
It is fixed.
Claims (10)
- A kind of 1. device for test wafer, it is characterised in that including：Wafer carrying platform, for carrying wafer to be tested；Supporting construction, coupled with the wafer carrying platform；Wherein, the supporting construction can rotate the wafer carrying platform so that the load-bearing surface of the wafer carrying platform is in Non-horizontal directions.
- 2. device according to claim 1, it is characterised in that the supporting construction be configured as by probe test in institute Stating makes in the state of the wafer to be tested on the load-bearing surface of wafer carrying platform the load-bearing surface of the wafer carrying platform be in non- Horizontal direction.
- 3. device according to claim 1, it is characterised in that the supporting construction can rotate the wafer carrying platform, So that the load-bearing surface of the wafer carrying platform is in and horizontal plane substantially perpendicular directions.
- 4. device according to claim 1, it is characterised in that the supporting construction can rotate the wafer carrying platform, So that the load-bearing surface of the wafer carrying platform is in the position from the horizontal by the angle more than 10 degree.
- A kind of 5. device for test wafer, it is characterised in that including：Wafer carrying platform, for carrying wafer to be tested；Supporting construction, coupled with the wafer carrying platform；Wherein, the supporting construction can rotate the wafer carrying platform so that the load-bearing surface rotation of the wafer carrying platform To towards terrestrial positioning.
- A kind of 6. method for test wafer, it is characterised in that including：The wafer carrying platform is rotated by the supporting construction coupled with wafer carrying platform so that the carrying table of the wafer carrying platform Face is rotated in non-horizontal directions, wherein the wafer carrying platform is used to carry wafer to be tested.
- 7. according to the method for claim 6, it is characterised in that also include, be in the load-bearing surface of the wafer carrying platform In the state of non-horizontal directions, by be tested wafer of the probe test on the load-bearing surface of the wafer carrying platform.
- 8. according to the method for claim 6, it is characterised in that as described in the supporting construction rotation coupled with wafer carrying platform Wafer carrying platform so that the load-bearing surface of the wafer carrying platform, which rotates to, to be in and horizontal plane substantially perpendicular directions.
- 9. according to the method for claim 6, it is characterised in that as described in the supporting construction rotation coupled with wafer carrying platform Wafer carrying platform so that the load-bearing surface of the wafer carrying platform is rotated in from the horizontal by the angle more than 10 degree Position.
- A kind of 10. method for test wafer, it is characterised in that including：The wafer carrying platform is rotated by the supporting construction coupled with wafer carrying platform so that the carrying table of the wafer carrying platform Face is rotated towards terrestrial positioning, wherein the wafer carrying platform is used to carry wafer to be tested.
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|---|---|---|---|
| CN201711066894.4A CN107768287B (en) | 2017-11-03 | 2017-11-03 | Method and device for testing wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711066894.4A CN107768287B (en) | 2017-11-03 | 2017-11-03 | Method and device for testing wafer |
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| CN107768287A true CN107768287A (en) | 2018-03-06 |
| CN107768287B CN107768287B (en) | 2020-02-14 |
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| CN201711066894.4A Active CN107768287B (en) | 2017-11-03 | 2017-11-03 | Method and device for testing wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114743912A (en) * | 2022-04-22 | 2022-07-12 | 南京中安半导体设备有限责任公司 | Wafer loading device and wafer detection equipment |
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| CN107768287B (en) | 2020-02-14 |
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