CN109427627B - 液处理装置和液处理方法 - Google Patents
液处理装置和液处理方法 Download PDFInfo
- Publication number
- CN109427627B CN109427627B CN201810958419.6A CN201810958419A CN109427627B CN 109427627 B CN109427627 B CN 109427627B CN 201810958419 A CN201810958419 A CN 201810958419A CN 109427627 B CN109427627 B CN 109427627B
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- pump
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- valve
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- 239000007788 liquid Substances 0.000 title claims abstract description 130
- 238000000034 method Methods 0.000 title claims abstract description 120
- 239000000758 substrate Substances 0.000 claims description 56
- 230000007423 decrease Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 89
- 239000012530 fluid Substances 0.000 description 43
- 238000004140 cleaning Methods 0.000 description 40
- 238000011144 upstream manufacturing Methods 0.000 description 22
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 19
- 229910021641 deionized water Inorganic materials 0.000 description 16
- 238000010586 diagram Methods 0.000 description 13
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013020 steam cleaning Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017163230A JP6983008B2 (ja) | 2017-08-28 | 2017-08-28 | 液処理装置および液処理方法 |
JP2017-163230 | 2017-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109427627A CN109427627A (zh) | 2019-03-05 |
CN109427627B true CN109427627B (zh) | 2024-03-22 |
Family
ID=65514558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810958419.6A Active CN109427627B (zh) | 2017-08-28 | 2018-08-22 | 液处理装置和液处理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6983008B2 (zh) |
KR (1) | KR102591343B1 (zh) |
CN (1) | CN109427627B (zh) |
TW (1) | TWI791037B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7312656B2 (ja) * | 2019-09-24 | 2023-07-21 | 株式会社Screenホールディングス | 基板処理装置 |
CN112864044A (zh) * | 2019-11-28 | 2021-05-28 | 上海新微技术研发中心有限公司 | 化学品的循环管路流量控制***及其控制方法 |
KR102585284B1 (ko) * | 2020-12-28 | 2023-10-05 | 세메스 주식회사 | 액 공급 유닛 및 액 공급 방법 |
JP2022131885A (ja) * | 2021-02-26 | 2022-09-07 | 株式会社Screenホールディングス | 処理液循環方法、及び、基板処理方法 |
JP2022161268A (ja) | 2021-04-08 | 2022-10-21 | 株式会社Screenホールディングス | 処理液流通方法、及び、処理液供給装置 |
WO2023204048A1 (ja) * | 2022-04-21 | 2023-10-26 | 東京エレクトロン株式会社 | 液供給システム、液処理装置および液供給方法 |
JP2024058341A (ja) | 2022-10-14 | 2024-04-25 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH119920A (ja) * | 1997-06-26 | 1999-01-19 | Hitachi Electron Eng Co Ltd | 液体循環処理装置 |
CN101236893A (zh) * | 2007-01-31 | 2008-08-06 | 东京毅力科创株式会社 | 基板处理方法和基板处理装置 |
KR20110065340A (ko) * | 2009-12-09 | 2011-06-15 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치, 기판 처리 방법, 및 이 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 기록 매체 |
JP2011142300A (ja) * | 2009-12-09 | 2011-07-21 | Tokyo Electron Ltd | 基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体 |
JP2011224510A (ja) * | 2010-04-22 | 2011-11-10 | Honda Motor Co Ltd | 液体供給装置 |
TW201139728A (en) * | 2010-01-15 | 2011-11-16 | Ckd Corp | Vacuum control system and vacuum control method |
JP2015041751A (ja) * | 2013-08-23 | 2015-03-02 | 東京エレクトロン株式会社 | 液処理装置 |
TW201613012A (en) * | 2014-09-18 | 2016-04-01 | Screen Holdings Co Ltd | Substrate processing device |
TW201639067A (zh) * | 2014-12-16 | 2016-11-01 | 東京威力科創股份有限公司 | 基板液體處理裝置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10247614A (ja) * | 1997-03-04 | 1998-09-14 | Fujitsu Ltd | 処理装置 |
JP5255660B2 (ja) * | 2011-01-18 | 2013-08-07 | 東京エレクトロン株式会社 | 薬液供給方法及び薬液供給システム |
JP5951384B2 (ja) * | 2012-07-20 | 2016-07-13 | 東京エレクトロン株式会社 | 温度制御システムへの温調流体供給方法及び記憶媒体 |
JP6385714B2 (ja) | 2014-05-16 | 2018-09-05 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理装置の洗浄方法及び記憶媒体 |
-
2017
- 2017-08-28 JP JP2017163230A patent/JP6983008B2/ja active Active
-
2018
- 2018-08-14 TW TW107128250A patent/TWI791037B/zh active
- 2018-08-22 CN CN201810958419.6A patent/CN109427627B/zh active Active
- 2018-08-22 KR KR1020180098037A patent/KR102591343B1/ko active IP Right Grant
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH119920A (ja) * | 1997-06-26 | 1999-01-19 | Hitachi Electron Eng Co Ltd | 液体循環処理装置 |
CN101236893A (zh) * | 2007-01-31 | 2008-08-06 | 东京毅力科创株式会社 | 基板处理方法和基板处理装置 |
KR20110065340A (ko) * | 2009-12-09 | 2011-06-15 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치, 기판 처리 방법, 및 이 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 기록 매체 |
JP2011142300A (ja) * | 2009-12-09 | 2011-07-21 | Tokyo Electron Ltd | 基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体 |
TW201139728A (en) * | 2010-01-15 | 2011-11-16 | Ckd Corp | Vacuum control system and vacuum control method |
TW201333260A (zh) * | 2010-01-15 | 2013-08-16 | Ckd Corp | 真空控制系統及真空控制方法 |
JP2011224510A (ja) * | 2010-04-22 | 2011-11-10 | Honda Motor Co Ltd | 液体供給装置 |
JP2015041751A (ja) * | 2013-08-23 | 2015-03-02 | 東京エレクトロン株式会社 | 液処理装置 |
TW201613012A (en) * | 2014-09-18 | 2016-04-01 | Screen Holdings Co Ltd | Substrate processing device |
TW201639067A (zh) * | 2014-12-16 | 2016-11-01 | 東京威力科創股份有限公司 | 基板液體處理裝置 |
Also Published As
Publication number | Publication date |
---|---|
TW201919770A (zh) | 2019-06-01 |
CN109427627A (zh) | 2019-03-05 |
JP2019041039A (ja) | 2019-03-14 |
KR102591343B1 (ko) | 2023-10-18 |
KR20190024722A (ko) | 2019-03-08 |
JP6983008B2 (ja) | 2021-12-17 |
TWI791037B (zh) | 2023-02-01 |
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Inventor after: One big temple Inventor after: Wu Yechong Inventor after: Kamimura Fumihiro Inventor after: Zhengjun Li Yuan Inventor after: Xu Zhongyuxiong Inventor after: Naka Takeshi Inventor before: One big temple Inventor before: Niao Yechong Inventor before: Kamimura Fumihiro Inventor before: Zhengjun Li Yuan Inventor before: Xu Zhongyuxiong Inventor before: Naka Takeshi |
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