CN103965695A - Conductive printing ink containing micro-nano composite metal packing - Google Patents
Conductive printing ink containing micro-nano composite metal packing Download PDFInfo
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- CN103965695A CN103965695A CN201210555154.8A CN201210555154A CN103965695A CN 103965695 A CN103965695 A CN 103965695A CN 201210555154 A CN201210555154 A CN 201210555154A CN 103965695 A CN103965695 A CN 103965695A
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Abstract
The invention discloses a conductive printing ink containing micro-nano composite metal packing. The conductive printing ink is characterized by comprising 10 to 60% of main conductive packing, 1 to 10% of accessory conductive packing, 1 to 5% of a binder, 1 to 5% of an additive and 30 to 85% of a main solvent. According to the invention, micro-nano composite technology is employed, so close packing of micro-scale and nano-scale metal particles is realized, contact areas among the metal particles are increased, and conductivity and current-carrying capability of a printed circuit are improved; the conductive printing ink provided by the invention can be used for printing and preparing conductive circuits on a plurality of substrates, and a prepared circuit layer has good conductivity, excellent adhesion and high hardness, can realize regulation and control of electrons and has wide application prospects in fields like electron devices and integrated circuit boards.
Description
Technical field
The present invention relates to a kind of electrically conductive ink that contains micro-nano composition metal filler, particularly printing conductive inks is prepared circuit layer, belongs to printed wiring and manufactures field.
Background technology
Electrically conductive ink is a kind of specific function ink that contains conductive compositions, on the basis of traditional printing technique, can realize the quick manufacture of conduction portion in electronic apparatus.Electrically conductive ink can be widely used in the aspects such as printing touch, toy for children circuit, silicon solar battery electrode, sensor, electrode contacts, radio-frequency antenna, plating, multilayer circuit board grout at present.
One of core starting material of electrically conductive ink or printed electronics circuit.In recent years, the ground such as America and Europe, Japan, Korea S and China Taiwan are rising a revolutionary circuit board fabrication technology---printed electronics circuit (PrintedElectronic Circuit), adopt functional ink directly on printing plate, to print out electronic circuit, as printing conductive inks on flexible organic film obtains conducting wire, printed semiconductor ink obtains transistor or memory component etc.The printed electronics circuit of this new generation is the assembly that has comprised electronics junction circuit and element, can substitute traditional printed circuit board function of mounting related components again.
Electrically conductive ink is mainly made up of following four parts: (1) conductive filler material: the main part (comprising metal-powder, metal oxide, nonmetal and other composite powders) that conduction is provided; (2) binder: become membrane portions (mainly containing synthetic resins, photosensitive resin, low melting point synthetic glass etc.); (3) additive (also claiming auxiliary agent): regulate and be suitable for (mainly containing dispersion agent, conditioning agent, thickening material, softening agent, lubricant, inhibitor etc.) such as printing and film forming; (4) solvent (mainly containing aromatic hydrocarbons, alcohol, ketone, alcohol ether etc.) composition.Wherein conductive filler material is the Core Feature composition of electrically conductive ink.
Current, comprise on market sell and electronic industry in the electrically conductive ink that uses, its core conductive compositions is mainly micron order metallic particles, its particle shape mainly contain circular and sheet (referring to the preparation method of a Tong Li state CN101429358A electrically conductive ink, the CN1741198 high-temperature sintering silver paste and its preparation methods such as Wang Zisen; Citing document).In recent years, along with the progress of nanotechnology, realize the scale preparation of metal nano material, therefore, there is electrically conductive ink (Beijing University of Chemical Technology, Wei Jie, king's Yue CN101348634A photo-curing ink-jet nano conductive printing ink and preparation method thereof and the using method taking nano-metal particle as functional stuffing; The CN101522557A such as Lee Zong Ze of LG Co., Ltd. of Korea S, for the preparation method of the ink of ink jet printing and the metal nanoparticle that wherein used; Citing document).
Connecting terminal between metallic particles is more, and contact area is larger, and its conductivity is better.Micron particles is because its size is larger, and the gap between its particle is corresponding increase also, therefore, increase its intergranular contact area, and the one, particle shape changes sheet into by circle, and the 2nd, the proportion of increase particle; Nanometer grade gold metal particles not only can significantly increase contact area, and due to its small-size effect, can reduce the fusing point of metal, can be melted into one by low-temperature sintering, and electroconductibility obviously improves.But nano-metal particle manufacturing cost is too high at present, is also not suitable for doing conductive filler material by nano metal completely.
The present invention proposes using micron metal particle as main conductive filler material, nano-metal particle, as additional conductive filler, under lower sintering temperature, utilizes the melting of nano metal filler by integral micron metal particle adhesion, realize lower metal content, show good conductive performance.
Summary of the invention
The object of this invention is to provide a kind of electrically conductive ink that contains micro-nano composition metal filler, this electrically conductive ink can adopt different mode of printings to undertake the printing of and form circuit on different base materials.Compound by micron order metallic particles and nanometer grade gold metal particles, realize tightly packed between metallic particles, increase the contact area between metallic particles, improve conductive performance and the current capacity of printed circuit; Utilize the low-melting advantage of nano metal, can, under lower sintering temperature, realize excellent conductivity.
The present invention realizes in the following way, and a kind of electrically conductive ink that contains micro-nano composition metal filler, is characterized in that: be made up of following component and mass percent:
Main conductive filler material: 10～60%
Auxiliary conductive filler material: 1～10%
Binder: 1～10%
Additive: 1～5%
Main body solvent: 30～85%
Above-mentioned each constituent mass percentage composition sum is 100%
Described main conductive filler material is made up of micron order metallic particles, and wherein metal can be but be not limited to gold and silver, copper, aluminum metal particle, and its particle size range is 0.1 μ m～10 μ m.
Described auxiliary conductive filler material is by nano level metal granulometric composition, and wherein metal can be but be not limited to gold and silver, copper, aluminum metal particle, and its particle size range is 1nm～100nm.
Described binder includes but not limited to it is polyacrylic acid, polymethyl acrylic acid, polyvinylpyrrolidone, polyoxyethylene glycol, polyvinyl alcohol, resol, Synolac, epoxy resin, vinylbenzene and copolymer-maleic anhydride, vinylbenzene and acrylic copolymer, vinylformic acid and acrylate copolymer, polyvinyl formal, butene dioic acid resin, polyamide resin, vinyl chloride-vinyl acetate resin, butyl etherified melamine resin, polyvinyl butyral acetal, Mierocrystalline cellulose, mixed polysaccharide, silicone resin, one or both in Sudan Gum-arabic.
Described additive comprises flow agent, pH value conditioning agent, tensio-active agent etc.
Described main body solvent can be but be not limited to ethanol, ethylene glycol, Virahol, glycol ether, triglycol, ethylene glycol monomethyl ether, ethylene glycol ethyl ether, butyl glycol ether, ethylene glycol phenyl ether, ethylene glycol benzyl oxide, health alcohol, morpholine, diethylene glycol methyl ether, diethylene glycol ethyl ether, butyl carbitol, triglycol methyl ether, Pyranton, trolamine, tetramethylene sulfone, methyl-sulphoxide, N-Methyl pyrrolidone, N,N-DIMETHYLACETAMIDE, Trivalin SF acetic ester, oleum lini, high-boiling point kerosene, tridecanol, tung oil, common gummy oil, tetradecyl alcohol, tetramethylolmethane, soybean oil, rosinol, virtue camphor tree Terpineol 350, dioctyl phthalate (DOP), vinyl acetic monomer, N-BUTYL ACETATE, pimelinketone, dimethylbenzene, bicyclohexyl, hexanaphthene, propyl carbinol, butanone, deionized water, hydroxyethyl-pyrrolidone, dimethyl phthalate, oxyethane, Sorbitol Powder, salad oil, plam oil, one or both in spearmint oil.
An electrically conductive ink that contains micro-nano composition metal filler, comprises step and is:
(1) in main body solvent, add binder, flow agent, pH adjusting agent and tensio-active agent according to mass ratio, stir 30min, mix, obtain binder solution;
(2) in binder solution, add respectively main and auxiliary conductive filler material according to mass ratio, continue to stir, obtain the electrically conductive ink of micro-nano composition metal filler;
(3) electrically conductive ink of preparing is undertaken the printing of and formed circuit layer on different base material by different mode of printings.
Wherein, in described step (1)
Described flow agent is the one in polyacrylic ester, cellaburate, polymethyl siloxane and fluorocarbon, for example: commodity FY-506.
Described pH value conditioning agent is the one in ammoniacal liquor, sodium hydroxide, trolamine, sodium phosphate and azanol.
Described tensio-active agent is the one in lipid acid, fatty acid ester, Sodium dodecylbenzene sulfonate, sodium lauryl sulphate, polyoxyethylene alkylamide, polysiloxane, polysorbate and Sodium perfluorooctanoate.
The ratio of described various additives is 1～5%
In described step (2)
Weight ratio between described main conductive filler material and auxiliary conductive filler material is not less than 4: 1.
It is the shapes such as spherical, sheet, disk, triangle that the particle shape of described conductive filler material can be, but not limited to.
Ratio between described conductive filler material (comprising main conductive filler material and auxiliary conductive filler material) and binder is not less than 5: 1 in described step (3)
Described mode of printing comprises the traditional printing modes such as silk screen printing, offset printing, flexo and spray printing.
Described electrically conductive ink can carry out property regulation according to printed substrate, base material that can suitable printing after adjusting includes but not limited to polyimide, polyester, polyvinyl chloride, epoxy, pottery, papery, tetrafluoro, glass, half glass, bi-maleimide modified cyanate resin (BT), polyimide resin (PI), diphenylene ether resin (PPO), maleic anhydride imines, styrene resin (MS), poly-cyanate ester resin, polyolefin resin (TESLIN), polyether ketone resin, the flexibilities such as polysulfone resin and rigidity, silicon nitride, aluminium nitride, aluminum oxide, metal, glass etc.
The present invention has following beneficial effect:
1, adopt micro-nano compounding technology, nano-sized metal particles can be filled between micron order metallics, has increased greatly the contact area between particle and particle, and printing is made after circuit layer and can greatly be strengthened and lead its conductivity.
2, utilize the exclusive low-melting feature of nano metal, nano particle can melt at lower temperature, play the effect of the large particle diameter micron metal of link, thereby conducting wire is more level and smooth more continuously on the circuit layer of moulding, conductivity is better, and has good sticking power and hardness.
3, electrically conductive ink preparation technology of the present invention is simple, reduces production costs, and is convenient to large-scale production.
Embodiment
Embodiment 1:
The silk-screen electrically conductive ink that micro-nano is compound, specifically composition: 3.5g polymethyl acrylic acid, 0.5g flow agent, 1.0gpH value conditioning agent and 1.5g tensio-active agent are joined in 20g hexanaphthene, stir 30min, mix; Be that the sheet metal copper of 5 μ m and circular metal silver that 4g particle diameter is 20nm join in above-mentioned solution by 20g particle diameter, continue to stir, be mixed with electrically conductive ink; Use the vertical screen printer of the white HD-3050 of reaching that this electrically conductive ink is printed onto on TESLIN film, sintering 10min under 150 DEG C of conditions, the thickness that records circuit layer is 11 μ m, sheet resistance is 252m Ω/, hardness is 3H, sticking power is that (0A indicates without sticking power 4A, 1A, 2A, 3A, 4A, 5A represents that sticking power strengthens successively, sticking power optimal tables is shown 5A).
Embodiment 2:
The offset printing electrically conductive ink that micro-nano is compound, specifically composition: 5.0g butene dioic acid resin, 1.5g flow agent, 1.5g pH value conditioning agent and 1.0g tensio-active agent are joined in 25g oxyethane, stir 30min, mix; Be that the disk metallic aluminium of 8 μ m and circular metal silver that 5g particle diameter is 30nm join in above-mentioned solution by 25g particle diameter, continue to stir, be mixed with electrically conductive ink; Use Heidelberg print despot's PM52 offset press by this ink printing to 250g/m2 enamelled paper, sintering 30min under 150 DEG C of conditions, the thickness that records circuit layer is 2 μ m, sheet resistance is 285m Ω/, hardness is 3H, sticking power is 5A.
Embodiment 3:
The spray printing electrically conductive ink that micro-nano is compound, specifically composition: 3g vinylbenzene and acrylic copolymer, 0.8g flow agent, 0.8g pH value conditioning agent and 0.7g tensio-active agent are joined in 30g Pyranton, stir 30min, mix; The triangle metal circular metal copper golden and that 3g particle diameter is 10nm that is 2 μ m by 15g particle diameter joins in above-mentioned solution, continues to stir, and is mixed with electrically conductive ink; Use the dull and stereotyped jet printer of safe prestige by this ink printing to PVC film, sintering 3min under 200 DEG C of conditions, the thickness that records circuit layer is 1 μ m, sheet resistance is 180m Ω/, hardness is 4H, sticking power is 5A.
Embodiment 4
Micro-nano compound silk-screen electrically conductive ink, specifically composition: 3.0g Synolac, 0.6g flow agent, 0.6g pH value conditioning agent and 0.8g tensio-active agent are joined in 20g hexanaphthene, the mixing of butyl carbitol solution, stir 30min, mix; The sheet metal circular metal silver golden and that 5g particle diameter is 80nm that is 10 μ m by 24g particle diameter joins in above-mentioned solution, continues to stir, and is mixed with electrically conductive ink; Use white reach the vertical screen printer of HD-3050 by this ink printing to sheet glass, sintering 10min under 150 DEG C of conditions, the thickness that records circuit layer is 10 μ m, sheet resistance is 16.5m Ω/, hardness is 3H, sticking power is 5A.
Embodiment 5
The offset printing electrically conductive ink that micro-nano is compound, concrete composition: 6.0g resol, 0.9g flow agent, 1.2g pH value conditioning agent and 1.3g tensio-active agent are joined in 35g N-Methyl pyrrolidone, N,N-DIMETHYLACETAMIDE mixing solutions, stir 30min, mix; Be that the disk metallic copper of 9 μ m and circular metal silver that 6.0g particle diameter is 100nm join in above-mentioned solution by 28g particle diameter, continue to stir, be mixed with electrically conductive ink; Use Heidelberg print despot's PM52 offset press by this ink printing to 200g/m2 enamelled paper, sintering 30min under 150 DEG C of conditions, the thickness that records circuit layer is 2.5 μ m, sheet resistance is 112m Ω/, hardness is 3H, sticking power is 4A.
Embodiment 6
The spray printing electrically conductive ink that micro-nano is compound, specifically composition: 3g butyl etherified melamine resin, 0.6g flow agent, 0.8g pH value conditioning agent and 0.6g tensio-active agent are joined in 24g Pyranton, stir 30min, mix; The circular metal circular metal silver golden and that 3.5g particle diameter is 1.0nm that is 0.1 μ m by 16g particle diameter joins in above-mentioned solution, continues to stir, and is mixed with electrically conductive ink; Use safe prestige flat-plate ink jet printer by this ink printing to EPSON fine fleece waterproof RC printing paper, sintering 25min under 200 DEG C of conditions, the thickness that records circuit layer is 2.5 μ m, sheet resistance is 86m Ω/, hardness is 3H, sticking power is 5A.
Embodiment 7
The flexo electrically conductive ink that micro-nano is compound, specifically composition: 5g polyoxyethylene glycol, 0.6g flow agent, 0.8g pH value conditioning agent and 0.6g tensio-active agent are joined in 34g hexanaphthene, propyl carbinol, butanone mixing solutions, stir 30min, mix; Be that the sheet metal aluminium of 6 μ m and circular metal silver that 5g particle diameter is 100nm join in above-mentioned solution by 30g particle diameter, continue to stir, be mixed with electrically conductive ink; Use Beiren BFR-500 printing press by this ink printing to EPSON fine fleece waterproof RC printing paper, sintering 20min under 180 DEG C of conditions, the thickness that records circuit layer is 2.5 μ m, sheet resistance is 252m Ω/, hardness is 3H, sticking power is 5A.
Claims (15)
1. an electrically conductive ink that contains micro-nano composition metal filler, is characterized in that: be made up of following component and mass percent:
Main conductive filler material: 10～60%
Auxiliary conductive filler material: 1～10%
Binder: 1～10%
Additive: 1～5%
Main body solvent: 30～85%.
Above-mentioned each constituent mass percentage composition sum is 100%
2. the electrically conductive ink that contains micro-nano composition metal filler according to claim 1, it is characterized in that: described main conductive filler material is made up of micron order metallic particles, wherein metal can be but be not limited to gold and silver, copper, aluminum metal particle, and its particle size range is 0.1m～10 μ m.
3. the electrically conductive ink that contains micro-nano composition metal filler according to claim 1, it is characterized in that: described auxiliary conductive filler material is by nano level metal granulometric composition, wherein metal can be but be not limited to gold and silver, copper, aluminum metal particle, and its particle size range is 1nm～100nm.
4. the electrically conductive ink that contains micro-nano composition metal filler according to claim 1, it is characterized in that: described binder includes but not limited to polyacrylic acid, polymethyl acrylic acid, polyvinylpyrrolidone, polyoxyethylene glycol, polyvinyl alcohol, resol, Synolac, epoxy resin, vinylbenzene and copolymer-maleic anhydride, vinylbenzene and acrylic copolymer, vinylformic acid and acrylate copolymer, polyvinyl formal, butene dioic acid resin, polyamide resin, vinyl chloride-vinyl acetate resin, butyl etherified melamine resin, polyvinyl butyral acetal, Mierocrystalline cellulose, mixed polysaccharide, silicone resin, one or both in Sudan Gum-arabic.
5. the electrically conductive ink that contains micro-nano composition metal filler according to claim 1, is characterized in that: described additive comprises flow agent, pH value conditioning agent and tensio-active agent.
6. the electrically conductive ink that contains micro-nano composition metal filler according to claim 1, is characterized in that: described main body solvent can be but be not limited to ethanol, ethylene glycol, Virahol, glycol ether, triglycol, ethylene glycol monomethyl ether, ethylene glycol ethyl ether, butyl glycol ether, ethylene glycol phenyl ether, ethylene glycol benzyl oxide, health alcohol, morpholine, diethylene glycol methyl ether, diethylene glycol ethyl ether, butyl carbitol, triglycol methyl ether, Pyranton, trolamine, tetramethylene sulfone, methyl-sulphoxide, N-Methyl pyrrolidone, N,N-DIMETHYLACETAMIDE, Trivalin SF acetic ester, oleum lini, high-boiling point kerosene, tridecanol, tung oil, common gummy oil, tetradecyl alcohol, tetramethylolmethane, soybean oil, rosinol, virtue camphor tree Terpineol 350, dioctyl phthalate (DOP), vinyl acetic monomer, N-BUTYL ACETATE, pimelinketone, dimethylbenzene, bicyclohexyl, hexanaphthene, propyl carbinol, butanone, deionized water, hydroxyethyl-pyrrolidone, dimethyl phthalate, oxyethane, Sorbitol Powder, salad oil, plam oil, one or more in spearmint oil.
7. the electrically conductive ink that contains micro-nano composition metal filler according to claim 1, is characterized in that: comprising step is:
(1) in main body solvent, add binder, flow agent, pH value conditioning agent and tensio-active agent according to mass ratio, stir 30min, mix, obtain binder solution;
(2) in above-mentioned binder solution, add respectively main and auxiliary conductive filler material according to mass ratio, continue to stir, obtain the electrically conductive ink of micro-nano composition metal filler;
(3) electrically conductive ink of above-mentioned preparation is undertaken the printing of and formed circuit layer on different base material by different mode of printings.
8. the electrically conductive ink that contains micro-nano composition metal filler according to claim 7, it is characterized in that: in described step (1), flow agent is the one in polyacrylic ester, cellaburate, polymethyl siloxane and fluorocarbon, for example: commodity FY-506.
9. the electrically conductive ink that contains micro-nano composition metal filler according to claim 7, is characterized in that: in described step (1), pH value conditioning agent is the one in ammoniacal liquor, sodium hydroxide, trolamine, sodium phosphate and azanol.
10. the electrically conductive ink that contains micro-nano composition metal filler according to claim 7, is characterized in that: in described step (1), tensio-active agent is the one in lipid acid, fatty acid ester, Sodium dodecylbenzene sulfonate, sodium lauryl sulphate, polyoxyethylene alkylamide, polysiloxane, polysorbate and Sodium perfluorooctanoate.
11. electrically conductive inks that contain micro-nano composition metal filler according to claim 7, is characterized in that: the mass ratio in described step (2) between main conductive filler material and auxiliary conductive filler material is not less than 4: 1.
12. electrically conductive inks that contain micro-nano composition metal filler according to claim 7, is characterized in that: in described step (2), to can be, but not limited to be the shapes such as spherical, sheet, disk, triangle to the particle shape of conductive filler material.
13. electrically conductive inks that contain micro-nano composition metal filler according to claim 7, is characterized in that: the ratio between described conductive filler material and binder is not less than 5: 1.
14. electrically conductive inks that contain micro-nano composition metal filler according to claim 7, is characterized in that: described mode of printing comprises the traditional printing modes such as silk screen printing, offset printing, flexo and spray printing.
15. according to the electrically conductive ink that contains micro-nano composition metal filler described in claim 1 or 7, it is characterized in that: described electrically conductive ink can carry out property regulation according to printed substrate, can suitable polyimide after adjusting, polyester, polyvinyl chloride, epoxy, pottery, papery, tetrafluoro, glass, half glass, bi-maleimide modified cyanate resin (BT), polyimide resin (PI), diphenylene ether resin (PPO), maleic anhydride imines, styrene resin (MS), poly-cyanate ester resin, polyolefin resin (TESLIN), polyether ketone resin, the flexibilities such as polysulfone resin and rigidity, silicon nitride, aluminium nitride, aluminum oxide, metal, the printed substrates such as glass.
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104877464A (en) * | 2015-05-08 | 2015-09-02 | 哈尔滨工业大学深圳研究生院 | Composite nano silver particle conductive ink and preparation method and printing application thereof |
| CN105670384A (en) * | 2016-03-31 | 2016-06-15 | 广东南海启明光大科技有限公司 | Nano silver gravure ink and preparation method thereof |
| CN105778626A (en) * | 2016-05-27 | 2016-07-20 | 佛山市智巢电子科技有限公司 | Nanometer metal powder ink for ink-jet printing and preparation method thereof |
| CN107663438A (en) * | 2016-07-29 | 2018-02-06 | 余琬琴 | High-adhesion conductive copper colloid and screen printing application method thereof |
| CN107793864A (en) * | 2017-10-30 | 2018-03-13 | 汪涛 | A kind of preparation method of conducting paint composite |
| CN107841177A (en) * | 2017-10-30 | 2018-03-27 | 汪涛 | A kind of conducting paint composite |
| CN109021711A (en) * | 2018-08-02 | 2018-12-18 | 苏州蓝沛光电科技有限公司 | It is a kind of for manufacturing the ink of the touch screen containing metal mesh structure |
| CN110012617A (en) * | 2019-04-03 | 2019-07-12 | 东莞塘厦裕华电路板有限公司 | A kind of via-hole of circuit board production method |
| CN110317495A (en) * | 2018-03-29 | 2019-10-11 | 精工爱普生株式会社 | Ink-jet composition and record object |
| CN110922895A (en) * | 2019-12-16 | 2020-03-27 | 广东南海启明光大科技有限公司 | Preparation process of conductive chemical coating liquid and preparation method of electric conductor |
| CN111180107A (en) * | 2020-01-06 | 2020-05-19 | 青岛理工大学 | Preparation method for electric field driven injection of micro-nano 3D printing nano silver paste |
| CN113422084A (en) * | 2021-04-30 | 2021-09-21 | 上海交通大学 | Titanium alloy surface micro-nano particle composite electric conduction enhancement structure and preparation method thereof |
| CN114025489A (en) * | 2021-10-27 | 2022-02-08 | 深圳市贝加电子材料有限公司 | Micro-etching solution for copper surface treatment, application of micro-etching solution in PCB (printed circuit board) manufacturing process and PCB production flow |
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| CN101580660A (en) * | 2009-06-26 | 2009-11-18 | 无锡晶睿光电新材料有限公司 | Electrically conductive printing ink for printing circuit strips on flexible circuit board |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101580660A (en) * | 2009-06-26 | 2009-11-18 | 无锡晶睿光电新材料有限公司 | Electrically conductive printing ink for printing circuit strips on flexible circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104877464A (en) * | 2015-05-08 | 2015-09-02 | 哈尔滨工业大学深圳研究生院 | Composite nano silver particle conductive ink and preparation method and printing application thereof |
| CN105670384A (en) * | 2016-03-31 | 2016-06-15 | 广东南海启明光大科技有限公司 | Nano silver gravure ink and preparation method thereof |
| CN105778626A (en) * | 2016-05-27 | 2016-07-20 | 佛山市智巢电子科技有限公司 | Nanometer metal powder ink for ink-jet printing and preparation method thereof |
| CN107663438A (en) * | 2016-07-29 | 2018-02-06 | 余琬琴 | High-adhesion conductive copper colloid and screen printing application method thereof |
| CN107793864A (en) * | 2017-10-30 | 2018-03-13 | 汪涛 | A kind of preparation method of conducting paint composite |
| CN107841177A (en) * | 2017-10-30 | 2018-03-27 | 汪涛 | A kind of conducting paint composite |
| CN110317495A (en) * | 2018-03-29 | 2019-10-11 | 精工爱普生株式会社 | Ink-jet composition and record object |
| CN109021711A (en) * | 2018-08-02 | 2018-12-18 | 苏州蓝沛光电科技有限公司 | It is a kind of for manufacturing the ink of the touch screen containing metal mesh structure |
| CN109021711B (en) * | 2018-08-02 | 2021-06-18 | 苏州蓝沛光电科技有限公司 | Printing ink for manufacturing touch screen with metal-containing grid structure |
| CN110012617A (en) * | 2019-04-03 | 2019-07-12 | 东莞塘厦裕华电路板有限公司 | A kind of via-hole of circuit board production method |
| CN110922895A (en) * | 2019-12-16 | 2020-03-27 | 广东南海启明光大科技有限公司 | Preparation process of conductive chemical coating liquid and preparation method of electric conductor |
| CN111180107A (en) * | 2020-01-06 | 2020-05-19 | 青岛理工大学 | Preparation method for electric field driven injection of micro-nano 3D printing nano silver paste |
| CN113422084A (en) * | 2021-04-30 | 2021-09-21 | 上海交通大学 | Titanium alloy surface micro-nano particle composite electric conduction enhancement structure and preparation method thereof |
| CN113422084B (en) * | 2021-04-30 | 2023-02-03 | 上海交通大学 | Titanium alloy surface micro-nano particle composite electric conduction enhancement structure and preparation method thereof |
| CN114025489A (en) * | 2021-10-27 | 2022-02-08 | 深圳市贝加电子材料有限公司 | Micro-etching solution for copper surface treatment, application of micro-etching solution in PCB (printed circuit board) manufacturing process and PCB production flow |
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