CN108306129A - 电连接器组合 - Google Patents

电连接器组合 Download PDF

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Publication number
CN108306129A
CN108306129A CN201810025903.3A CN201810025903A CN108306129A CN 108306129 A CN108306129 A CN 108306129A CN 201810025903 A CN201810025903 A CN 201810025903A CN 108306129 A CN108306129 A CN 108306129A
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China
Prior art keywords
electric connector
metal shell
hole
circuit board
chip
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Pending
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CN201810025903.3A
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English (en)
Inventor
林庆其
罗振伟
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Publication date
Application filed by Lotes Guangzhou Co Ltd filed Critical Lotes Guangzhou Co Ltd
Priority to CN201810025903.3A priority Critical patent/CN108306129A/zh
Priority to US15/892,705 priority patent/US10333256B2/en
Publication of CN108306129A publication Critical patent/CN108306129A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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    • H01R12/70—Coupling devices
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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    • H01R12/70—Coupling devices
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    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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Abstract

本发明公开了一种电连接器组合，包括：一电路板，其设有至少一芯片；一电连接器，电性连接于所述电路板的一端，且用以与一对接连接器相对接；一金属壳体，包覆于所述电路板和所述电连接器***，所述金属壳体贯穿设有至少一通孔，每一所述通孔设有一防水层，所述防水层使液体不能从所述金属壳体外部向内部通过且使气体能够在所述金属壳体的内部和外部之间通过，从而达到防水和散热的目的，从而避免了所述电连接器和所述芯片因温度过高或者液体进入而导致功能失效，保证了所述电连接器和所述芯片自身信号传输的可靠性，提高了所述电连接器和所述芯片的使用寿命。

Description

电连接器组合
技术领域
本发明涉及一种电连接器组合，尤指一种具备散热和防水功能的电连接器组合。
背景技术
现有技术中的一种电连接器组合，用以与主板上的一插座连接器相对接以达到电性连接的目 的，所述电连接器组合包括一电路板，所述电路板的一端焊接有一电连接器以与所述插座连 接器相对接，所述电路板的另一端焊接有一线缆以与所述电连接器电性连接，所述电路板上 还安装有多个芯片，一金属壳体包覆且固定于所述电连接器、所述电路板以及所述线缆的外 围。
当所述电连接器与所述插座连接器相对接时，所述芯片因受导体阻抗影响，并且随 着所述芯片运行的速度越来越快，所述芯片运行所需的功率也加大的情况下，所述电连接器 和所述芯片容易发热，并且所述电连接器和所述芯片持续产生的热量聚集于所述金属壳体内 部无法被有效散出，进而导致所述电连接器和所述芯片持续受高温而影响信号传输的可靠 性，甚至导致所述电连接器和所述芯片功能失效，并且由于所述金属壳体温度过高，使用者 在操作或触摸所述金属壳体时，使用者在温度的感觉上会更加强烈，如此将造成使用者在使 用上的不适感，从而影响使用者使用。
因此，有必要设计一种新的电连接器组合，以克服上述问题。
发明内容
针对背景技术所面临的问题，本发明的目的在于提供一种散热和防水效果好，并且保 证可靠的信号传输的电连接器组合。
为了达到上述目的，本发明采用如下技术方案：
一种电连接器组合，其特征在于，包括：一电路板，其设有至少一芯片；一电连接器，电性连接于所述电路板的一端，且用以与一对接连接器相对接；一金属壳体，包覆于所述电路板和所述电连接器***，所述金属壳体贯穿设有至少一通孔，每一所述通孔设有一防水层，所述防水层使液体不能从所述金属壳体外部向内部通过且使气体能够在所述金属壳体的内部 和外部之间通过。
进一步，所述防水层为采用Gore-Tex材料制成的网格状结构。
进一步，所述防水层设于所述通孔靠近所述电路板的一端。
进一步，一屏蔽层镀设于所述防水层上，所述屏蔽层使气体能够在所述金属壳体的内 部和外部之间通过。
进一步，所述金属壳体正对所述芯片上方的位置未开设所述通孔。
进一步，一导热片设于所述金属壳体与所述芯片之间，所述芯片通过所述导热片与所 述金属壳体进行热传导。
进一步，所述金属壳体正对所述电连接器上方的位置设有所述通孔。
进一步，一绝缘件套设于所述电连接器靠近所述电路板的一侧，所述金属壳体包覆于 所述绝缘件***，且正对所述绝缘件上方的位置设有所述通孔。
进一步，一塑胶外壳包覆于所述金属壳体***，所述塑胶外壳对应所述金属壳体的所 述通孔位置贯穿设有至少一开口，所述开口与所述通孔相连通。
进一步，一线缆，具有多个芯线焊接于所述电路板的相对另一端，一注塑件包覆于多 个所述芯线***，所述金属壳体包覆于所述绝缘件***，且正对所述注塑件上方的位置设有 所述通孔。
与现有技术相比，本发明电连接器组合具有以下有益效果：
所述金属壳体贯穿设有至少一通孔，每一所述通孔设有一防水层，所述防水层使得所述电 连接器和所述芯片产生的热量能够经由所述通孔排到外部环境与外界空气进行热交换，从而 达到散热的目的，并且所述防水层使得外部环境中的液体无法经由所述通孔进入所述电连接 器和所述芯片，从而达到防水的目的，从而避免了所述电连接器和所述芯片因温度过高或者 液体进入而导致功能失效，保证了所述电连接器和所述芯片自身信号传输的可靠性，提高了 所述电连接器和所述芯片的使用寿命。
为了达到上述目的，本发明还可以采用如下技术方案：
一种电连接器组合，其特征在于，包括：一电路板，其设有至少一芯片；一电连接器，电性连接于所述电路板的一端，且用以与一对接连接器相对接；一金属壳体，包覆于所述电路板和所述电连接器***，所述金属壳体贯穿设有至少一通孔，每一所述通孔设有一防水层和 一屏蔽层，所述防水层使液体不能从所述金属壳体外部向内部通过且使气体能够在所述金属 壳体的内部和外部之间通过，并且所述屏蔽层使气体能够在所述金属壳体的内部和外部之间 通过。
进一步，所述防水层为采用Gore-Tex材料制成的网格状结构。
进一步，所述屏蔽层为采用金属材料制成的网格状结构。
进一步，所述屏蔽层相对于所述防水层更靠近所述电路板。
进一步，所述金属壳体正对所述芯片上方的位置未开设所述通孔。
进一步，一导热片设于所述金属壳体与所述芯片之间，所述芯片通过所述导热片与所 述金属壳体进行热传导。
进一步，所述金属壳体正对所述电连接器上方的位置设有所述通孔。
进一步，一绝缘件套设于所述电连接器靠近所述电路板的一侧，所述金属壳体包覆于 所述绝缘件***，且正对所述绝缘件上方的位置设有所述通孔。
进一步，一塑胶外壳包覆于所述金属壳体***，所述塑胶外壳对应所述金属壳体的所 述通孔位置贯穿设有至少一开口，所述开口与所述通孔相连通。
进一步，一线缆，具有多个芯线焊接于所述电路板的相对另一端，一注塑件包覆于多 个所述芯线***，所述金属壳体包覆于所述绝缘件***，且正对所述注塑件上方的位置设有 所述通孔。
与现有技术相比，本发明电连接器组合还具有以下有益效果：
所述金属壳体贯穿设有至少一通孔，每一所述通孔设有一防水层和一屏蔽层，所述防水层具 备散热和防水的功能，避免了所述电连接器和所述芯片因温度过高或者液体进入而导致功能 失效，并且所述屏蔽层具备散热的功能，避免了所述电连接器和所述芯片因温度过高而导致 功能失效，同时所述屏蔽层增强了所述金属壳体对于所述电连接器和所述芯片的屏蔽效果， 进一步保证了所述电连接器和所述芯片自身信号传输的可靠性，进一步提高了所述电连接器 和所述芯片的使用寿命。
为了达到上述目的，本发明还可以采用如下技术方案：
一种壳体，其特征在于：所述壳体贯穿设有至少一通孔，所述通孔设有一防水层，所述防水 层一侧设有可导电的一屏蔽层，所述防水层使液体不能从所述壳体外部向内部通过且使气体 能够在所述壳体的内部和外部之间通过，并且所述屏蔽层使气体能够在所述壳体的内部和外 部之间通过。
与现有技术相比，本发明壳体还具有以下有益效果：
所述防水层可让外界空气在所述壳体的内部与外部之间流通，并且使得外部环境中的液体无 法进入所述壳体的内部，所述屏蔽层让外界空气在所述壳体的内部与外部之间流通，并且所 述屏蔽层可导电，用以增强所述壳体的防电磁干扰能力。
【附图说明】
图1为本发明第一实施例的电连接器组合和对接连接器的立体图；
图2为图1中a部分的放大图；
图3为图1中电连接器组合的立体分解图；
图4为图3中电连接器组合旋转180°的立体图；
图5为图4中电连接器的立体分解图；
图6为图1中电连接器组合沿A-A方向的剖视图；
图7为图6中b部分的放大图；
图8本发明第二实施例的电连接器组合的剖视图；
图9为图8中c部分的放大图。
具体实施方式的附图标号说明：
电连接器组合100 电路板1 芯片11 电连接器2
绝缘本体21 插接腔211 导电端子22 接地片23
弹性卡扣件24 遮蔽壳体25 线缆3 芯线31
金属壳体4 通孔41 绝缘件5 注塑件6
防水层7 屏蔽层8 导热片9 塑胶外壳10
开口101 对接连接器200
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
如图1和图2所示，为本发明第一实施例的电连接器组合100，包括：一电路板1； 一电连接器2，电性连接于所述电路板1的一端，且沿前后方向与一对接连接器200相对接； 一线缆3，焊接于所述电路板1的相对另一端，且与所述电连接器2电性连接；以及一金属壳 体4，包覆于所述电连接器2、所述电路板1、以及所述线缆3的***。
如图1、图3和图6所示，所述电路板1上安装有至少一芯片11，在本实施例中， 所述芯片11有多个且分别设于所述电路板1的上表面和下表面(在其它实施例中，所述芯片 11也可以仅具有一个)。
所述金属壳体4包覆固定于所述电路板1的***，使得所述电路板1收容于所述金属壳体4内，以避免所述电路板1受到外部环境的干扰。
如图5和图6所示，所述电连接器2符合USB TYPE C规格，其包括：一绝缘本体 21，所述绝缘本体21前端凹设有一插接腔211用以容纳所述对接连接器200；两排导电端子 22焊接于所述电路板1的前端，两排所述导电端子22分别排布于所述插接腔211上下两侧且呈中心对称设置；一接地片23插设于两排所述导电端子22之间；二弹性卡扣件24收容于所述绝缘本体21两侧且伸入所述插接腔211，所述弹性卡扣件24与所述接地片23相抵接；以及一遮蔽壳体25包覆于所述绝缘本体21的***。
如图1、图3和图6所示，一绝缘件5套设于所述遮蔽壳体25的后端，并且所述金 属壳体4包覆固定于所述绝缘件5的***，使得所述电连接器2的前端伸出所述金属壳体4， 从而方便所述电连接器2与所述对接连接器200相对接。
所述线缆3具有多个芯线31焊接于所述电路板1的后端，且与所述电连接器2电性连接，一注塑件6包覆于多个所述芯线31的***，以固定多个所述芯线31。
当所述电连接器2与所述对接连接器200相对接时，由于电流过大，使得所述电连接器2在对接过程中容易发热产生热量，并且所述芯片11工作时因受导体阻抗影响而容易发 热，进而导致温度升高产生热量，而所述电连接器2和所述芯片11产生的热量均聚集于所述 金属壳体4内。
如图1、图6和图7所示，所述金属壳体4贯穿设有至少一通孔41，所述通孔41 沿竖直方向贯穿所述金属壳体4，所述通孔41用以将所述电连接器2和所述芯片11产生的热 量排出所述金属壳体4外。
在本实施例中，所述通孔41具有多个并且设于所述金属壳体4的顶壁和底壁(在其它实施例中，所述通孔41也可以仅具有一个)，使得所述电连接器2和所述芯片11产生的热量能够充分从所述通孔41中排出。
所述金属壳体4正对所述芯片11上方的位置未开设所述通孔41，所述金属壳体4的底壁接触所述芯片11的上表面，使得所述芯片11与所述金属壳体4之间具有充分的接触面 积，保证了所述芯片11产生的热量能够充分传导至所述金属壳体4。
所述金属壳体4正对所述绝缘件5和所述注塑件6上方和下方的位置均设有所述通孔41，使得所述电连接器2和所述芯片11产生的热量能够充分从所述通孔41中排出。
每一所述通孔41设有一防水层7，所述防水层7为采用Gore-Tex材料制成的网格状结构，所述防水层7设于所述通孔41靠近所述电路板1的一端(在其它实施例中，所述防水层7也可以贴附于所述金属壳体4的内侧并且遮盖所述通孔41，或者每一所述通孔41也可以设有多个所述防水层7)，所述防水层7使液体不能从所述金属壳体4外部向内部通过且使气体能够在所述金属壳体4的内部和外部之间通过。
如图1、图3和图4所示，组装时，先将所述电连接器2和所述线缆3的所述芯线 31分别焊接于所述电路板1的两端，然后将所述绝缘件5套设于所述电连接器2的***，最 后将所述金属壳体4套设于所述线缆3、所述电路板1和所述绝缘件5的***，使得所述金属 壳体4接触所述芯片11，从而完成所述电连接器2组件的组装。
如图8至图9所示，为本发明第二实施例的电连接器组合100，该实施例附图中与第一实施例中标号相同的结构，本实施例不再作重复描述，并且其与第一实施例的电连接器 组合100的不同之处主要在于，本实施例中：
每一所述通孔41设有一防水层7和一屏蔽层8，所述屏蔽层8为采用金属材料制成的网格 状结构(在其它实施例中，所述屏蔽层8也可以采用金属涂层，并且通过化学镀或者电镀的方 式镀设于所述防水层7上，例如由镀银纤维的织物构成，镀银纤维的制备方法主要有两种： 一种是采用高分子材料表面金属化技术，在纺织纤维表面镀一层纯银膜而得到的镀银纤维， 另一种是通过在纤维成型过程中添加超细银粒子而制得的纳米镀银纤维)，所述屏蔽层8使气 体能够在所述金属壳体4的内部和外部之间通过。
所述屏蔽层8相对于所述防水层7更靠近所述电路板1，所述防水层7和所述屏蔽层8设于所述通孔41的相对两端(在其它实施例中，所述防水层7和所述屏蔽层8也可以互相贴合且设于所述通孔41的一端)。
一导热片9设于所述金属壳体4与所述芯片11之间，所述芯片11通过所述导热片 9与所述金属壳体4进行热传导。
在本实施例中，所述金属壳体4的材质为铝合金，所述导热片9的材质为导热硅胶片，所述导热片9分别接触所述金属壳体4和所述芯片11，所述导热片9的导热率大于所述金属壳体4的导热率，可将所述电连接器2和所述芯片11产生的热量经由所述导热片9快速传导至所述金属壳体4，避免热量聚集于所述金属壳体4内部而影响所述芯片11的性能，同时也避免所述电连接器2的温度升高而影响所述电连接器2的性能。
一塑胶外壳10包覆于所述金属壳体4的***，所述塑胶外壳10可防止使用者直接接触到发烫的所述金属壳体4，从而方便使用者使用所述电连接器组合100。
所述塑胶外壳10对应所述金属壳体4的所述通孔41位置贯穿设有至少一开口101，所述开口101沿竖直方向贯穿所述塑胶外壳10，所述开口101用以将所述电连接器2和所述芯片11产生的热量排出所述塑胶外壳10外。
在本实施例中，所述开口101具有多个并且设于所述塑胶外壳10的顶壁和底壁(在其它实施例中，所述开口101也可以设有所述防水层7和所述屏蔽层8，并且所述开口101也可以仅具有一个)，所述开口101与所述通孔41相连通，并且所述开口101与所述通孔41 正对设置，使得所述电连接器2和所述芯片11产生的热量能够充分从所述开口101中排出。
在另一实施中，其与第二实施例的区别主要在于：所述金属壳体4可替换为采用塑胶材料制成的壳体，所述屏蔽层8可导电，用以增强所述壳体的防电磁干扰能力。在本实施例的基础上，所述壳体外还可以未套设有所述塑胶外壳10，使得所述壳***于所述连接器组 合100的最外侧。
综上所述，本发明电连接器组合有下列有益效果：
(1)所述金属壳体4贯穿设有所述通孔41，每一所述通孔41设有所述防水层7，所述防水层7使得所述电连接器2和所述芯片11产生的热量能够经由所述通孔41排到外部环境与外界 空气进行热交换，从而达到散热的目的，并且所述防水层7使得外部环境中的液体无法经由 所述通孔41进入所述电连接器2和所述芯片11，从而达到防水的目的，从而避免了所述电连 接器2和所述芯片11因温度过高或者液体进入而导致功能失效，保证了所述电连接器2和所 述芯片11自身信号传输的可靠性，提高了所述电连接器2和所述芯片11的使用寿命。
(2)每一所述通孔41还设有所述屏蔽层8，所述屏蔽层8具备散热的功能，避免了所述电连接器2和所述芯片11因温度过高而导致功能失效，同时所述屏蔽层8增强了所述金属壳体4对于所述电连接器2和所述芯片11的屏蔽效果，进一步保证了所述电连接器2和所述芯片11自身信号传输的可靠性，进一步提高了所述电连接器2和所述芯片11的使用寿命。
(3)所述防水层7设于所述通孔41靠近所述电路板1的一端，可避免所述防水层7裸露于外部环境中造成损坏，提高了所述防水层7的使用寿命。
(4)所述屏蔽层8相对于所述防水层7更靠近所述电路板1，所述防水层7可避免 外部环境中的液体进入从而对所述屏蔽层8造成损坏，提高了所述屏蔽层8的使用寿命。
(5)所述金属壳体4正对所述芯片11上方的位置未开设所述通孔41，使得所述芯片11与所述金属壳体4之间具有充分的接触面积，进一步使得所述芯片11产生的热量能够通 过所述金属壳体4排出。
以上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明之专利范围，所 以，凡运用本创作说明书及图示内容所为之等效技术变化，均包含于本创作之专利范围内。

Claims (21)

1.一种电连接器组合，其特征在于，包括：
一电路板，其设有至少一芯片；
一电连接器，电性连接于所述电路板的一端，且用以与一对接连接器相对接；
一金属壳体，包覆于所述电路板和所述电连接器***，所述金属壳体贯穿设有至少一通孔，每一所述通孔设有一防水层，所述防水层使液体不能从所述金属壳体外部向内部通过且使气体能够在所述金属壳体的内部和外部之间通过。
2.如权利要求1所述的电连接器组合，其特征在于：所述防水层为采用Gore-Tex材料制成的网格状结构。
3.如权利要求1所述的电连接器组合，其特征在于：所述防水层设于所述通孔靠近所述电路板的一端。
4.如权利要求1所述的电连接器组合，其特征在于：一屏蔽层镀设于所述防水层上，所述屏蔽层使气体能够在所述金属壳体的内部和外部之间通过。
5.如权利要求1所述的电连接器组合，其特征在于：所述金属壳体正对所述芯片上方的位置未开设所述通孔。
6.如权利要求5所述的电连接器组合，其特征在于：一导热片设于所述金属壳体与所述芯片之间，所述芯片通过所述导热片与所述金属壳体进行热传导。
7.如权利要求1所述的电连接器组合，其特征在于：所述金属壳体正对所述电连接器上方的位置设有所述通孔。
8.如权利要求7所述的电连接器组合，其特征在于：一绝缘件套设于所述电连接器靠近所述电路板的一侧，所述金属壳体包覆于所述绝缘件***，且正对所述绝缘件上方的位置设有所述通孔。
9.如权利要求1所述的电连接器组合，其特征在于：一塑胶外壳包覆于所述金属壳体***，所述塑胶外壳对应所述金属壳体的所述通孔位置贯穿设有至少一开口，所述开口与所述通孔相连通。
10.如权利要求1所述的电连接器组合，其特征在于：一线缆，具有多个芯线焊接于所述电路板的相对另一端，一注塑件包覆于多个所述芯线***，所述金属壳体正对所述注塑件上方的位置设有所述通孔。
11.一种电连接器组合，其特征在于，包括：
一电路板，其设有至少一芯片；
一电连接器，电性连接于所述电路板的一端，且用以与一对接连接器相对接；
一金属壳体，包覆于所述电路板和所述电连接器***，所述金属壳体贯穿设有至少一通孔，每一所述通孔设有一防水层和一屏蔽层，所述防水层使液体不能从所述金属壳体外部向内部通过且使气体能够在所述金属壳体的内部和外部之间通过，并且所述屏蔽层使气体能够在所述金属壳体的内部和外部之间通过。
12.如权利要求11所述的电连接器组合，其特征在于：所述防水层为采用Gore-Tex材料制成的网格状结构。
13.如权利要求11所述的电连接器组合，其特征在于：所述屏蔽层为采用金属材料制成的网格状结构。
14.如权利要求11所述的电连接器组合，其特征在于：所述屏蔽层相对于所述防水层更靠近所述电路板。
15.如权利要求11所述的电连接器组合，其特征在于：所述金属壳体正对所述芯片上方的位置未开设所述通孔。
16.如权利要求15所述的电连接器组合，其特征在于：一导热片设于所述金属壳体与所述芯片之间，所述芯片通过所述导热片与所述金属壳体进行热传导。
17.如权利要求11所述的电连接器组合，其特征在于：所述金属壳体正对所述电连接器上方的位置设有所述通孔。
18.如权利要求17所述的电连接器组合，其特征在于：一绝缘件套设于所述电连接器靠近所述电路板的一侧，所述金属壳体包覆于所述绝缘件***，且正对所述绝缘件上方的位置设有所述通孔。
19.如权利要求11所述的电连接器组合，其特征在于：一塑胶外壳包覆于所述金属壳体***，所述塑胶外壳对应所述金属壳体的所述通孔位置贯穿设有至少一开口，所述开口与所述通孔相连通。
20.如权利要求11所述的电连接器组合，其特征在于：一线缆，具有多个芯线焊接于所述电路板的相对另一端，一注塑件包覆于多个所述芯线***，所述金属壳体正对所述注塑件上方的位置设有所述通孔。
21.一种壳体，其特征在于：所述壳体贯穿设有至少一通孔，所述通孔设有一防水层，所述防水层一侧设有可导电的一屏蔽层，所述防水层使液体不能从所述壳体外部向内部通过且使气体能够在所述壳体的内部和外部之间通过，并且所述屏蔽层使气体能够在所述壳体的内部和外部之间通过。
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